TWM339663U - Heat dissip ation plate - Google Patents
Heat dissip ation plate Download PDFInfo
- Publication number
- TWM339663U TWM339663U TW097205649U TW97205649U TWM339663U TW M339663 U TWM339663 U TW M339663U TW 097205649 U TW097205649 U TW 097205649U TW 97205649 U TW97205649 U TW 97205649U TW M339663 U TWM339663 U TW M339663U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipating
- blade
- heat dissipating
- plate
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 24
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 210000000078 claw Anatomy 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 206010039740 Screaming Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
- F28F3/046—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element the deformations being linear, e.g. corrugations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020070011348U KR20090000383U (ko) | 2007-07-10 | 2007-07-10 | 방열판 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM339663U true TWM339663U (en) | 2008-09-01 |
Family
ID=41297906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097205649U TWM339663U (en) | 2007-07-10 | 2008-04-02 | Heat dissip ation plate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3140067U (ja) |
| KR (1) | KR20090000383U (ja) |
| TW (1) | TWM339663U (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100919760B1 (ko) * | 2009-01-23 | 2009-10-14 | 김진헌 | 집광구조 엘이디 조명장치 |
| CN109915915A (zh) * | 2019-04-15 | 2019-06-21 | 珠海格力电器股份有限公司 | 出气栅及设有其的电暖器 |
| KR102739515B1 (ko) * | 2021-09-30 | 2024-12-10 | 주식회사 이머티리얼랩 | 열원과 밀착력이 향상된 방열체 및 이의 제조방법 |
-
2007
- 2007-07-10 KR KR2020070011348U patent/KR20090000383U/ko not_active Ceased
- 2007-12-18 JP JP2007009700U patent/JP3140067U/ja not_active Expired - Fee Related
-
2008
- 2008-04-02 TW TW097205649U patent/TWM339663U/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP3140067U (ja) | 2008-03-13 |
| KR20090000383U (ko) | 2009-01-14 |
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