M355237 五、新型說明： ' 【新型所屬之技術領域】 3 t本創作係有關於一種矽晶片自動對正置中機構，特別 疋‘種可適用於對正不同尺寸的如石夕晶片的基板，避免 基板置放在靠置平台上時所產生的偏移或公差的對正 中機構。 【先前技術】 曰太陽$板之主要構成部件為太陽能石夕晶片，太陽能石夕 :既輕且薄，於自動化製造與檢測過程中，倘稍有不 5縫即破損、缺角’甚至是肉眼無法察覺之微細 製程與檢測的良^竭姐可％避免，以提升太陽能石夕晶片 及皮貞壓汲取 謂279，係揭露式進订。請參考本國專利 -曾 ’、 種太&此*梦晶片檢測機台輸遂穿詈之 式進行承載的方式，太陽二 向：:隹f 環轉動，將太陽能石夕晶片以預定方 3士 _ 工或檢測等相關製造流程，且在輸送傳輸 二以傳輸，的太陽能 太是!太陽能達定輸二： 太能石夕晶片之間的摩捧力 了此曰口“與 移，而使得太陽能碎晶片的致太陽能珍晶片滑 不良。 、，…法精準，導致製程上的 另外’請參考圖3，係f示習知之石夕晶片對正機構的 M355237 示意圖。其係以機械手臂等機構搬送太陽能石夕晶片s至一 導正座G時，藉由導正座G周圍的斜面G1，使太陽能石夕 晶片S順著斜面G1而滑入導正槽G2中，而導正槽G2的 位置與大小係為所欲的對正位置；然而，若是太陽能矽晶 片S在置放時超出斜面G1太多，而斜置在斜面G1外時， 將會導致太陽能矽晶片S無法滑入導正槽G2進行對正， 更可能造成破損、缺角或是導致更嚴重的製程不良，因此 具有製程上的風險。 【新型内容】 因此，本創作的目的係在於解決上述問題而提供一種 對不同尺寸基板進行對正置中工作，並避免基板置放在靠 置平台上時所產生的偏移或公差的對正置中裝置，藉以提 高製程良率。 故，為達上述目的，本創作係提出一種矽晶片自動對 正置中機構，包括：一基座；設置在該基座上的一升降裝 置；設置在該升降裝置上，並藉由該升降裝置進行升降的 一移動平台；設置在該移動平台上的一第一平移裝置，其 兩端以其中心可朝一第一方向做往復移動；軸向相互垂直 地設置在該第一平移裝置上的一第二平移裝置，其兩端以 其中心可朝與該第一方向垂直的一第二方向做往復移 動；一對正裝置，具有一對第一夾爪及一對第二夾爪，該 對第一夾爪係分別與該第一平移裝置的兩端連接，該對第 二夾爪係與該第二平移裝置連接；以及連接若干穿經該移 動平台而固定在該基座的支柱頂端的一靠置平台，該對第 一夾爪及該對第二夾爪係圍繞該靠置平台而設置。 M355237 較佳者，該對第一夾爪與該對第二夾爪係呈階梯狀， 具有一第一平面及一第二平面，該第二平面係較低於該第 一平面。 較佳者，該等平面上設置有若干夾持件，且每一夾持 件係包括一柱體及一緩衝體，該緩衝體係繞設在該柱體的 一部分。 較佳者，每一平移裝置具有一固定螺桿及一調整螺 帽，該固定螺桿係固設於平移裝置的其中一端，而調整螺 帽係可轉動地螺設在該固定螺桿的另一端，並供平移裝置 的另一端靠抵，藉由調整螺帽以微調各平移裝置兩端相對 靠近後的間距，以符合夾靠基板之所需。 較佳者，該對第一夾爪係分別以一調整塊與該第一平 移裝置的兩端連接，且該第二平移裝置的兩端係分別以一 調整塊與該移動平台連接。 - 藉由上述的結構，不但可以達到對不同尺寸基板進行 對正置中工作的功效，更可以對對正裝置的各夾爪進行相 對於靠置平台的微調，以避免基板（如太陽能矽晶片）置 放在靠置平台上時所產生的偏移或公差，進而提升製程良 率。 本創作上述之目的及優點，不難從下述所選用實施例 之詳細說明與附圖中，獲得深入瞭解。 當然，本創作在某些另件上，或另件之安排上容許有 所不同，但所選用之實施例，則於本說明書中，予以詳細 說明，並於附圖中展示其構造。 【實施方式】 5 M355237M355237 V. New description: ' 【New technology field】 3 t This author is about a kind of automatic alignment mechanism for tantalum wafers, especially for substrates that are suitable for different sizes such as Shi Xi wafers. A centering mechanism that avoids offsets or tolerances that occur when the substrate is placed against the platform. [Prior Art] The main component of the solar panel is solar stone wafer, solar stone eve: light and thin, in the process of automated manufacturing and testing, if there is a slight gap, it is broken, not angled, or even the naked eye. Can not be aware of the fine process and the test of the good ^ exhaustive sister can be avoided, in order to enhance the solar stone eve chip and skin pressure 汲 谓 279, the system is exposed. Please refer to the national patent - Zeng', Tiao Tai & this * dream wafer inspection machine, the type of transmission, the way of carrying, the sun two-way:: 隹f ring rotation, the solar stone eve chip to the predetermined side 3 _ Work or inspection and other related manufacturing processes, and in the transmission and transmission of the second to transmit, the solar energy is too! Solar energy is set to lose two: Tai Neng Shi Xi wafer between the holdings of this mouthwash "and shift, and make solar energy The solar wafers of the shredded wafers are slippery. The method is accurate, which leads to another process on the process. Please refer to Figure 3 for a schematic diagram of the M355237 of the Shishi wafer alignment mechanism. It is transported by a robotic arm or the like. When the solar ray s wafer s to the pedestal G, the solar slab wafer S slides into the guiding groove G2 along the inclined surface G1 by the inclined surface G1 around the guiding seat G, and the position and size of the guiding groove G2 It is the desired alignment position; however, if the solar raft wafer S is placed too far beyond the slope G1 when placed, and obliquely outside the slope G1, the solar raft wafer S cannot slide into the guide groove G2. Correction, more likely to cause damage The lack of angle or the result of a more serious process defect has a risk in the process. [New content] Therefore, the purpose of the present invention is to solve the above problems and provide a method of facing the center of different sizes of substrates and avoiding the substrate. The alignment centering device is placed on the abutment platform to improve the process yield. Therefore, in order to achieve the above purpose, the present invention proposes a 矽 wafer automatic alignment centering mechanism, including a pedestal; a lifting device disposed on the pedestal; a moving platform disposed on the lifting device and elevating and lowering by the lifting device; a first translating device disposed on the moving platform, The two ends are reciprocally movable in a first direction with their centers; a second translating device axially disposed perpendicular to each other on the first translating device, the two ends of which have a center perpendicular to the first direction a second direction of reciprocating movement; a pair of positive devices having a pair of first jaws and a pair of second jaws, the pair of first jaws being respectively coupled to the ends of the first translation device And the pair of second jaws are coupled to the second translating device; and a pair of abutment platforms connected to the top of the strut of the base through the moving platform, the pair of first jaws and the pair of second Preferably, the jaws are disposed around the abutment platform. Preferably, the pair of first jaws and the pair of second jaws are stepped, having a first plane and a second plane, the second plane Lower than the first plane. Preferably, the planes are provided with a plurality of clamping members, and each clamping member comprises a cylinder and a buffer body, and the buffer system is disposed around a portion of the cylinder. Preferably, each translating device has a fixing screw and an adjusting nut fixed to one end of the translating device, and the adjusting nut is rotatably screwed on the other end of the fixing screw. And the other end of the translating device is abutted, and the nut is adjusted to finely adjust the distance between the two ends of each translating device to meet the requirement of sandwiching the substrate. Preferably, the pair of first jaws are respectively connected to both ends of the first displacement device by an adjustment block, and the two ends of the second translation device are respectively connected to the mobile platform by an adjustment block. - With the above structure, not only can the effect of the alignment work on the different size substrates be achieved, but also the trimming of the jaws of the alignment device can be finely adjusted relative to the abutment platform to avoid the substrate (such as a solar wafer). The offset or tolerance generated when placed on the abutment platform, thereby increasing the process yield. The above objects and advantages of the present invention will be readily understood from the following detailed description of the embodiments of the invention. Of course, the present invention may be different in some of the parts, or the arrangement of the parts, but the selected embodiments are described in detail in the present specification, and the construction thereof is shown in the drawings. [Embodiment] 5 M355237
實施』作藉以達到上述目的之技術手段，茲以下列 =合圖示於下文作詳細說明，俾令釣上深J 明同h•參考圖1及圖2，係分別表示依據本創作—给 =的結構圖以及局部結構圖。本實 乍“ ::中一機構1係包括-基座2、-升降裝置3、= j +移裝置5、-第二平移裝置6、 -罪置平台8以及至少四支柱9，其中，支丄： 端係連結在基座2，另-端則連結在靠置 銘 5動及平：4係可移動地穿設於四支柱9間，且第:平移= 及弟一平移裝置1係裝設在移動平台4上。 =裝置3係設置在移動平台4與基座2之間，以基 n固定端，用以升降移動平台〇較佳“ ^二降氣塵缸，但在本創作中並不以此為限 地m :移灰置5及第二平移裝置1係軸向相互垂直 5二置平台8之間，且第-平移裝置 可在—第—方向作往復運動，第二平移 Ϊ第H以其中心可在一第二方向做往復運動，其 中弟一方向係垂直於第二方向。 第一平移裝置5係設置在移動平台4上，且在盆 調整塊A向上與對正裝置7連接;其中，調整塊1 :為：=，其底部及頂部分別具有一長圓形 I:第ST向入方?係平行於第-平移裝置 移梦詈5⑽Γ 士螺桂或疋螺釘將調整塊Α固定在第-平 因:bl效媸Α裴置7上。而由於固定孔A1呈長圓形， 因此调玉塊A可以進行其轴向方向的微調，並同時 1 ^ .M355237 裝置7。較佳者，第一平移裝置5係為一雙動氣壓缸， 但在本創作中並不以此為限。 #而第二平移裝置6係設置在第一平移裝置5的上方， 且f一平移褒置6移動的第二方向與第—平移裝置5移動 的第一方向垂J： ’亦即第一平移裝i 5與第二平移裝置6 的轴向方向係相互垂直。在第二平移裝置6與移動平台4 之間亦設置一調整塊A，其功能與設置在第一平移裝置5 的作用相同，故不在此贅述。 秒衣置5The technical means for achieving the above objectives are described in detail below with the following = together with the drawings. The structure diagram and the partial structure diagram. The embodiment of the present invention includes a base 2, a lifting device 3, a j + moving device 5, a second translation device 6, a sin platform 8, and at least four pillars 9, wherein丄: The end is connected to the base 2, and the other end is connected to the base 5 and flat: the 4 series is movably worn between the four pillars 9 and the: translation = and the brother-translation device 1 is installed It is arranged on the mobile platform 4. The device 3 is arranged between the mobile platform 4 and the base 2, and is fixed at the base n for lifting and lowering the mobile platform, preferably a "two-down gas cylinder, but in the present creation Not limited to this m: the ashing device 5 and the second translation device 1 are axially perpendicular to each other between the two two platforms 8, and the first-translation device can reciprocate in the -first direction, the second translation The ΪH can reciprocate in a second direction with its center, wherein the direction of the brother is perpendicular to the second direction. The first translation device 5 is disposed on the mobile platform 4, and is connected to the alignment device 7 in the basin adjustment block A; wherein, the adjustment block 1: is: =, and the bottom and the top respectively have an oblong shape I: The ST-input side is parallel to the first-translation device and the nightmare 5(10) 士 螺 桂 疋 or 疋 screw fixes the adjustment block 第 on the first-level factor: bl effect device 7. Since the fixing hole A1 has an oblong shape, the jade block A can be finely adjusted in the axial direction thereof, and at the same time 1 ^ .M355237 device 7. Preferably, the first translation device 5 is a double-action pneumatic cylinder, but this is not limited in this creation. And the second translation device 6 is disposed above the first translation device 5, and the second direction in which the translation device 6 moves is perpendicular to the first direction in which the first translation device 5 moves: J: The axial direction of the mounting device 5 and the second translating device 6 are perpendicular to each other. An adjustment block A is also disposed between the second translation device 6 and the mobile platform 4, and its function is the same as that of the first translation device 5, and therefore will not be described herein. Second clothes set 5
對正裝置7則具有一對第一夾爪71以及一對第二夾 爪72 ’係圍繞靠置平台8而設置。每—夾爪]、7 階梯狀，具有—第—平面⑴、721以及較下方的一第二 平面 712、722,在每一平面 711、712、721、722 上 有多個夾持件73。 夾持件73係為-柱冑731 &一緩衝體732所組 ^衝體732係包圍住柱體731的一部分，而相對應如石夕晶 片的基板（圖未示）置放在靠置平έ 8上的位置 係用以靠抵㈣晶片的基板，故其材質係為如 ，膠的祕材質，避免在靠抵如⑦晶片的基板時造成損 劳。另外，本.創作並不以此為限，因此夾持件73 一單一的缓衝單元。 為 置6的兩端上。因此，藉由第—平移裝置5的帶動 一對弟4爪71係設置在第—平移|置5的調整塊 上，亦即在第-平㈣置5兩端上的各調整塊A，係分 別地設置在第-平移裝置5卿正裝置7的各第 71之間。㈣地’-對第二夾爪72係設置在第 置6上，亦即各第二夾爪72係分別地設置 ^ 使 M355237 Ϊ ΓΛ 平移裝置5的移動方向切靠置平 口 8為中心作相對運動；相同地，藉由第二平繼千6 的帶動，使'一對第二夾爪72在與第一平 ^ :向垂直的第二平台裝置6的移動方向上，以靠置平t8 為中心作相對運動。 十口《 由上述的結構’當㈣晶片的基板（圖未示） #置平台8上時，第一平移裝置5及第 ^即㈣對正裝置7進行基板的對正置中工作，亦即第f 及第二平移裝置6分別地帶動對正裝置7的一 L : 及一對第二夾爪72,以靠置平台8為中心 對』詈：動1以夾持件73靠抵基板周圍’以進行基板的 對正置中工作。 再者由U在基座2與移動平台4之間的升降裝 可以升降移動平台4，進而升降對正裝置7的一 Γ夹爪71及一對第二夾爪72 ’再加上各夾爪7卜72係 主階梯狀’因此在料裝置3將對正裝置7的各夾爪7卜 ’即以較下方的第二平面712、似上的爽持件 3抵罪較小尺寸的基板，以進行對正置中工作；而當升 降裝置3降下對正裝置7的各夹爪71、72時，即以第一 =面川、721上的夹持件73抵靠較大尺寸的基板，以進 置中工作；藉此’達到對不同尺寸基板進行對正置 作的功效，進而提升石夕晶片的製程良率。 一另外，請參考圖2,在第二平移裝置6中，更具有一 口定螺杯61、一凋整螺帽62及二移動座Μ (如圖2所 不）’各移動座63係設置在第二平移裝置6的兩端，該固 疋螺桿61的-端係固定於其中一移動座63，而該調整螺 M355237 帽62係可轉動地螺設在固定螺桿61的另一端；藉由調整 螺帽6 2以微調兩移動座6 3相對靠近後的間距，以符合夾 靠基板之所需。相同地，第一平移裝置5亦具有上述與第 二平移裝置6相同裝置的固定螺桿、調整螺帽與移動座 (圖未示），其結構與功能均與第二平移裝置6的固定螺 桿61、調整螺帽62與移動座63相同，故不在此贅述。 因此，藉由各平移裝置的固定螺桿及調整螺帽，可以 對對正裝置的各夾爪進行相對於靠置平台的微調，以避免 基板置放在靠置平台上時所產生的偏移或公差，進而提升 製程的良率。 以上所述實施型態之揭示係用以說明本創作，並非用 以限制本創作，故舉凡數值之變更或等效元件之置換仍應 隸屬本創作之範疇。 由以上詳細說明，可使熟知本項技藝者明暸本創作的 確可達成前述目的，實已符合專利法之規定，爰提出專利 申請。 M355237 【圖式簡單說明】 圖1係表示依據本創作一實施例的結構圖； 圖2係表示依據本創作一實施例的局部結構圖；以及 圖3 係表示習知負壓汲取模式的示意圖。 【主要元件符號說明】The alignment device 7 has a pair of first jaws 71 and a pair of second jaws 72' disposed about the abutment platform 8. Each of the jaws, 7 steps, has a - plane (1), 721 and a lower second plane 712, 722, and a plurality of grips 73 on each of the planes 711, 712, 721, 722. The clamping member 73 is a column 731 & a buffer body 732 is formed by a portion of the column 731, and a substrate (not shown) corresponding to the stone substrate is placed on the substrate. The position on the flat plate 8 is used to abut the substrate of the (four) wafer, so the material is such as a secret material of the glue, which avoids damage caused by the substrate against the 7 wafer. In addition, the present creation is not limited thereto, so the holding member 73 has a single buffer unit. Set on both ends of the 6th. Therefore, by the first translation device 5, the pair of brothers 4 claws 71 are arranged on the adjustment block of the first translational state, that is, the adjustment blocks A on the two ends of the first flat (four). They are respectively disposed between the respective 71ths of the first translation device 5. (4) Ground'-the second jaw 72 is disposed on the first position 6, that is, each of the second jaws 72 is separately disposed. The movement direction of the M355237 平移 平移 translation device 5 is centered on the flat opening 8 as a center. Movement; similarly, by the second squaring, the pair of second jaws 72 are placed in the moving direction of the second platform device 6 perpendicular to the first plane: Make a relative movement for the center. Tenth "from the above structure" when the substrate of the (four) wafer (not shown) # is placed on the platform 8, the first translation device 5 and the fourth (four) alignment device 7 perform the alignment operation of the substrate, that is, The first f and the second translating device 6 respectively drive an L of the alignment device 7 and a pair of second clamping jaws 72, centered on the abutting platform 8, and move 1 with the clamping member 73 against the substrate. 'To work in the centering of the substrate. Furthermore, the lifting platform between the base 2 and the moving platform 4 can lift and lower the moving platform 4, thereby lifting and lowering the clamping jaw 71 of the alignment device 7 and the pair of second clamping jaws 72' plus the clamping jaws. 7b 72 is the main stepped shape. Therefore, the feeding device 3 will align the jaws 7 of the alignment device 7 with the lower second plane 712 and the similar holding member 3 to the smaller size substrate. When the lifting device 3 lowers the jaws 71, 72 of the alignment device 7, the holder 73 of the first = face, 721 abuts against the larger-sized substrate, Working in the middle; thereby achieving the effect of correcting the substrate of different sizes, thereby improving the process yield of the Shixi wafer. In addition, please refer to FIG. 2, in the second translation device 6, there is a fixed screw cup 61, a full nut 62 and two moving seats (not shown in FIG. 2). The two ends of the second translating device 6 are fixed to one of the movable seats 63, and the adjusting screw M355237 is rotatably screwed on the other end of the fixing screw 61; The nut 62 is used to finely adjust the distance between the two moving seats 63 to be close to the substrate. Similarly, the first translating device 5 also has the fixing screw, the adjusting nut and the moving seat (not shown) of the same device as the second translating device 6 described above, and the structure and function thereof are both fixed to the fixing screw 61 of the second translating device 6. The adjusting nut 62 is the same as the moving seat 63, and therefore will not be described here. Therefore, by means of the fixing screw and the adjusting nut of each translation device, the jaws of the alignment device can be finely adjusted relative to the abutment platform to avoid the offset generated when the substrate is placed on the abutment platform or Tolerance, which in turn increases the yield of the process. The above description of the embodiments is intended to be illustrative of the present invention and is not intended to limit the present invention, so any change in value or replacement of equivalent elements should still fall within the scope of the present invention. From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the foregoing objectives, and it has been in compliance with the provisions of the Patent Law and has filed a patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a structural view showing an embodiment of the present invention; FIG. 2 is a partial structural view showing an embodiment of the present invention; and FIG. 3 is a schematic view showing a conventional negative pressure extraction mode. [Main component symbol description]
1 矽晶片自動對正置中機構 2 基座 3 升降裝置 4 移動平台 5 第一平移裝置 6 第二平移裝置 61 固定螺桿 62 調整螺帽 63 移動座 7 對正裝置 71 第一夾爪 711 第一平面 712 第二平面 72 第二夾爪 721 第一平面 722 第二平面 73 夹持件 731 柱體 732 緩衝體 8 靠置平台 M355237 9 支柱 A 調整塊 A1 固定孔 G 導正座 G1 斜面 G2 導正槽 S 太陽能矽晶片1 矽 wafer automatic alignment center mechanism 2 pedestal 3 lifting device 4 moving platform 5 first translation device 6 second translation device 61 fixing screw 62 adjusting nut 63 moving seat 7 aligning device 71 first jaw 711 first Plane 712 Second plane 72 Second jaw 721 First plane 722 Second plane 73 Clamp 731 Cylinder 732 Buffer 8 Abutment platform M355237 9 Pillar A Adjustment block A1 Fixing hole G Guide seat G1 Slope G2 Guide groove S solar cell wafer