M426143 * 五、新型說明： 【新型所屬之技術領域】 本創作係關於-種封裝基板及其封裝結構；具體而言，本 創作係關於一種透過增加溝槽以増加附著性之封裝基板及其 封裝結構。 ’ 【先前技術】 為追求更省電、高舒適及人性化的生活環境，在許多應用 層面中’無論是筆記型電腦、電視、電子看板或汽車用配和 業者嘗試開魏賊生活更為便_光源。在實際應用中，發 光二極體(LED)係為相的光源元件，其具有長效、省電性且 不易發解諸錄點，已逐步取代傳賴源並廣泛應用於 各種領域。 〜、 -般而言，發光二極體的製程包括遙晶、封裝、組裝及測 試。為增加發光二極體的亮度及發光鱗，除了鑽研高效 核心光源外，封裝技術域之顯為重^舉铜言，封 源的發光效率，較佳的封裝技術能夠將光“折 在傳統的表面黏貼式(SMD)發光二極體封裝流程 ^發光晶片固定於基板上，接著安裝線路，再來是膠體封裝， 構=^後3:與電路板進行結合。然而，傳統的基板結 構賴如聽結合後，容細外力影響而降 附著力不夠，導致膠體自基板表面剝I使 3 具體而言，發光二極體裝置的發光率與製程良率有直接的 相關性。然而，在發光二極體裝置的整體製程申，良率取決於 封裝品質是否良好。但在封裝過程中，雜絲板之間容易產 生剝離。現行業者嘗試不同的膠體或基板的結構，但仍然 上述缺點。 … 【新型内容】 本創作之目的在於提出一種封裝基板能透過增加溝槽以增 強附著性。 a 本創作之目的在於提出一種封裝結構能透過改善基板結構 以提南製程良率。 本創作之一方面在於提供一種封裝結構。於一實施例中， 封裝結構包含基板、f子元件及雜。基板具有複數個溝槽部 设置於第一表面之相對兩侧，具有相對於第一表面之第二表 面。電子元件設置於第-表面’膠體覆蓋電子元件及基板，並 膠體填充該等溝槽部。 此外，膠體包含第一膠體部及第二膠體部，其中第一膠體 部填充溝槽部以增加膠體與基板之附著力，及第二膠體部覆蓋 第一表面並呈半球狀突起。需說明的是，該等溝槽部德成對設 置於第一表面之相對兩側，且每一個溝槽部之垂直截面可以為 錐型、矩形、或T型。 在一實施例中，各溝槽部為矩形通孔，且矩形通孔之長邊 平行並靠近於基板之侧邊。於實際應用中，膠體覆蓋基板並填 充該等矩形通孔，進而增加膠體與基板的附著力。 加強缪體與基板之_附著性，進而達顺 I夠 ==僅 结構改良就能提概品質= 關於本創作之優點與精神可以 圖式得到進一步的瞭解。 【實施方式】 ==:=:= 藉由以下的創作詳述及所附 根據本創狀-實施例為封裝基板。於此實施例中，該封 裝基板能夠提升封裝製程良率。 請參照圖卜圖1係繪示本創作封裝基板之實施例示意圖。 如圖1所示，封裝基板i包含有第—基板祕，其中第一基板 10A具有複數個第-溝槽部1〇〇A設置於第一表自⑴之相對 兩侧，並具有相對於第-表面⑴之第二表面222。在此實施 例中，第-基板10A之材質可選自金屬、高分子材料或陶瓷 材料，但不以此為限。 具體而言，於此實施财，該等第—溝槽部觀成對設 置於第-表面111之相對兩側。如圖！所示，第—基板1〇A 具有側邊12 ’在靠近每一個侧邊12處設置有成對的第一溝槽 部100A。在此實施例中，第一溝槽部1〇〇A為矩形通孔，且 矩形通孔之長邊103平行並靠近於第一基板1〇A之側邊12。 在此實施例中，第一溝槽部100A係於第一基板1〇A射出成型 M426143 時，透過不同機械加工方式而形成。由於機械加工可以設計出 不同形狀的結構，故第—溝槽部100A除具有矩形通孔的結構 外’本創作進一步提出其他形狀的溝槽部以使基板更能夠達到 提高封裝良率之目的。 5月參照圖2，圖2所示為本創作另一實施例之封裝基板上 視圖。如圖2所示，封裝基板1包含第二基板10B，其中第二 基板10B具有複數個第二溝槽部川⑽設置於第一表面U1之 相對兩侧。 需說明的是，該等第二溝槽部100B係成對設置於第一表面 ⑴之相對兩側。如圖2所示，第二基板1〇Β具有侧邊12，在 靠近每一個側邊12處設置有成對的第二溝槽部i〇OB。各第二 溝槽部100B為圓形通孔，且設置於第一表面lu之相對兩側 的該等圓形通孔之圓心連接線13較佳穿過第二基板10B之中 心14 〇 無論是圖1或圖2中之實施例，由於第一溝槽部100A或第 二溝槽部100B係鄰近第一基板l〇A或第二基板10B之側邊 ^ ’因此不會影響到設置於基板中央之複數個發光元件(圖未 示）。此外，圖1或圖2中所繪示之實施例之第一基板1〇Α或 第二基板10B能夠配合膠體(圖未示)及發光元件(圖未示)結合 成發光裝置。 請參照圖3，圖3係繪示本創作封裝結構之實施例截面圖。 如圖3所示，封裝結構2包含基板10、膠體20及電子元件30。 基板ίο具有複數個溝槽部1〇〇設置於第一表面m之相對兩 側，並具有相對於第一表面111之第二表面222。電子元件3〇 6 M426143 設置於第-表面ill ’及膠體2〇覆蓋絲板1〇並填充該等溝 槽部1〇〇。 4 在此實施例中，電子元件30係為發光二極體，但在其他實 施例中’電子70件可岐其他形式的發光元件。值得注意的 是，膠體20覆蓋於電子元件3〇而能夠保護電子元件，因 而能提高電子元件30之完整性。 如圖3所示，溝槽部100為通孔，貫穿基板1〇之第—表面 111及第二表面222。具體而言，溝槽部1〇〇可以是圖工或圖 2中之第-溝槽部l〇A或第二溝槽部1〇B。也就是說，溝槽部 100係為矩形通孔或圓形通孔。需說明的是，通孔於第一表面 111之第一口徑101不大於通孔於第二表面222之第二口徑 102。在此實施例中’第一口徑1〇1與第二口徑1〇2相同。但 在其他實施例中，第二口徑102係大於第一口徑1〇1。具體而 言’溝槽部100之垂直截面為矩形。但在其他實施例中，溝槽 部之垂直截面可以是錐型或T型。換句話說，連接第一口徑 101與第二口徑102之側壁106可以是平滑壁面，也 轉折之曲面或角面。 ~ 此外，第一口徑101之中點與第二口徑102之中點之連線 係平行於基板10之第-表面之法線。具體而言，溝槽部膽 係鉛直向下延伸穿過基板10，使第一表面lu及第二表面Μ) 相通。在實際應用中，膠體2〇自第二表面222之第二口徑⑺2 進行;瞿注，並配合模具(圖未示)覆蓋於第一表面，以形成 膠體20之較佳形狀。在此實施例中·，膠體2〇的形狀較佳係為 半球狀，但不以此為限。 7 需說明的是’踢體20包含第-膠體部21Q及第二膠體部 220 ’其中第-膠體部21〇填充每一個溝槽部1〇(U乂增加膠體 2〇與基板10之附著力，而第二膠體部22〇覆蓋第一表面m 並呈半球狀突起。具體而言，溝槽部1〇〇之側壁1〇6延伸線較 佳切齊於第二膠體部22〇之半球體垂直於第一表面⑴之外 緣’使得溝槽部100能夠增強基板10與膠體20之間的附著力。 舉例而§，由於溝槽部100係靠近於第二膠體部22〇之半 球體外緣’並增加與第-膠體部21〇之接觸面積，因此在膠體 2〇及基板10之間能夠具有較佳的接合性及附著力。一般而 言，基板上之膠體較容易自基板之表面脫落，導致電子元件 3〇受到影響’而不良品就會增加’使得封裝良率降低。因此， 透過溝槽部100的設計，填充於溝槽部1〇〇之第一膠體部21〇 與基板之間能夠有較多的接觸面積，使膠體20接合性及附著 力相對增加，且第二膠體部220能夠保護電子元件30，進而 提升封裝良率。此外’基板10具有溝槽部1〇〇以增加基板面 積或加長滲透路徑，使得外部水氣不容易滲透至基板中心，以 使電子元件保持乾燥，進而提升良率。 本創作提出其他變化實施例，以具體敘明本創作之目的。 請參照圖4，圖4係繪示本創作封裝結構之實施例示意圖。如 圖4所示，封裝結構2包含有第三基板1〇c、膠體2〇及電子 元件30，其中膠體20覆蓋第三基板1〇c及電子元件3〇。第 三基板10C具有複數個第三溝槽部i〇〇c。 值得注意的是’該些第三溝槽部100C具有傾斜側壁1〇4， 傾斜側壁HH與第-表面111之法線具有夾角1()5，且成對設 M426143 置的該些第三溝槽部100C之該些傾斜側壁104具有相同之傾 斜角。需說明的是，設置於第一表面111之相對兩側之成對設 置的該些第三溝槽部100C之該些傾斜側壁1〇4係朝相對方向 傾斜。如圖4所示，第三基板i〇c包含最靠近側邊12之第一 傾斜侧壁108，第一傾斜侧壁1〇8與第一表面U1之交會處較 佳鄰近設置於第二膠體部220之半球面垂直於第一表面1U之 邊緣，使得第三溝槽部100C能夠增強第三基板1〇c與膠體2〇M426143 * V. New description: [New technical field] This creation is about a kind of package substrate and its package structure; specifically, the present invention relates to a package substrate and its package which are added by adding grooves structure. '[Previous technology] In pursuit of a more energy-saving, high-comfort and humane living environment, in many application levels, whether it is a notebook computer, TV, electronic signage or car supplier, it is more convenient to try to open a Wei thief life. _light source. In practical applications, the light-emitting diode (LED) is a phase light source component, which has long-lasting, power-saving and difficult to decompose recording points, and has gradually replaced the source of the source and is widely used in various fields. ~, In general, the process of LEDs includes teleconnection, packaging, assembly and testing. In order to increase the brightness and illuminating scale of the light-emitting diode, in addition to delving into the high-efficiency core light source, the packaging technology field is obviously a heavy-word copper, the luminous efficiency of the sealed source, and the better packaging technology can fold the light on the traditional surface. Adhesive (SMD) LED package process ^ The illuminating chip is fixed on the substrate, and then the circuit is installed, followed by the colloidal package, and the structure is combined with the circuit board. However, the traditional substrate structure is like listening. After the combination, the influence of the external force is insufficient, and the adhesion is insufficient, which causes the colloid to be stripped from the surface of the substrate. 3 Specifically, the luminosity of the light-emitting diode device is directly related to the process yield. However, in the light-emitting diode The overall process of the body device, the yield depends on whether the package quality is good. However, in the packaging process, the strips are easily peeled off. The current industry has tried different colloid or substrate structures, but still the above disadvantages. Contents] The purpose of this creation is to propose a package substrate that can enhance the adhesion by adding grooves. a The purpose of this creation is to propose a package structure that can pass through The substrate structure is to improve the yield of the process. One aspect of the present invention is to provide a package structure. In one embodiment, the package structure includes a substrate, a f sub-element, and a dummy. The substrate has a plurality of trench portions disposed on the first surface. The opposite sides have a second surface opposite to the first surface. The electronic component is disposed on the first surface 'colloidal covering electronic component and the substrate, and the colloid fills the groove portion. Further, the colloid includes the first colloid portion and the first portion a second colloid portion, wherein the first colloid portion fills the groove portion to increase adhesion between the colloid and the substrate, and the second colloid portion covers the first surface and is hemispherical protrusion. It should be noted that the groove portions are paired The first section is disposed on opposite sides of the first surface, and the vertical section of each of the groove portions may be tapered, rectangular, or T-shaped. In an embodiment, each of the groove portions is a rectangular through hole, and the rectangular through hole is The long sides are parallel and close to the side of the substrate. In practical applications, the colloid covers the substrate and fills the rectangular through holes, thereby increasing the adhesion of the colloid to the substrate. Strengthening the adhesion between the body and the substrate, And Dashun I is enough == Only structural improvement can improve the quality = The advantages and spirit of this creation can be further understood. [Implementation] ==:=:= With the following creation details and According to the present invention, the package substrate is used. In this embodiment, the package substrate can improve the package process yield. Referring to FIG. 1 , a schematic diagram of an embodiment of the package substrate is shown in FIG. 1 . The package substrate i includes a first substrate, wherein the first substrate 10A has a plurality of first groove portions 1A disposed on opposite sides of the first table from (1) and having a surface relative to the first surface (1) The second surface 222. In this embodiment, the material of the first substrate 10A may be selected from a metal, a polymer material, or a ceramic material, but is not limited thereto. The groove portions are disposed in pairs on opposite sides of the first surface 111. As shown! As shown, the first substrate 1A has side edges 12' disposed adjacent to each of the side edges 12 with a pair of first groove portions 100A. In this embodiment, the first groove portion 1A is a rectangular through hole, and the long sides 103 of the rectangular through holes are parallel and close to the side 12 of the first substrate 1A. In this embodiment, the first groove portion 100A is formed by different machining methods when the first substrate 1A is injection molded M426143. Since the machining can design different shapes of the structure, the first groove portion 100A has a structure of a rectangular through hole. The present invention further proposes a groove portion of another shape to make the substrate more capable of improving the package yield. Referring to Figure 2 in May, Figure 2 is a top view of a package substrate of another embodiment of the present invention. As shown in FIG. 2, the package substrate 1 includes a second substrate 10B, wherein the second substrate 10B has a plurality of second groove portions (10) disposed on opposite sides of the first surface U1. It should be noted that the second groove portions 100B are disposed on opposite sides of the first surface (1). As shown in Fig. 2, the second substrate 1 has a side edge 12, and a pair of second groove portions i?OB are disposed near each of the side edges 12. Each of the second groove portions 100B is a circular through hole, and the center line of the circular through holes 13 disposed on opposite sides of the first surface lu preferably passes through the center 14 of the second substrate 10B. In the embodiment of FIG. 1 or FIG. 2, since the first trench portion 100A or the second trench portion 100B is adjacent to the side of the first substrate 10A or the second substrate 10B, it does not affect the substrate. A plurality of light-emitting elements in the center (not shown). In addition, the first substrate 1A or the second substrate 10B of the embodiment shown in FIG. 1 or FIG. 2 can be combined with a colloid (not shown) and a light-emitting element (not shown) to form a light-emitting device. Please refer to FIG. 3. FIG. 3 is a cross-sectional view showing an embodiment of the present invention. As shown in FIG. 3, the package structure 2 includes a substrate 10, a colloid 20, and an electronic component 30. The substrate ίο has a plurality of groove portions 1 〇〇 disposed on opposite sides of the first surface m and having a second surface 222 opposite to the first surface 111. The electronic component 3 〇 6 M426143 is disposed on the first surface ill ′ and the colloid 2 〇 covers the wire plate 1 〇 and fills the groove portions 1 〇〇. 4 In this embodiment, electronic component 30 is a light emitting diode, but in other embodiments 'electronic 70 can be used in other forms of light emitting component. It is to be noted that the colloid 20 covers the electronic component 3 to protect the electronic component, thereby improving the integrity of the electronic component 30. As shown in Fig. 3, the groove portion 100 is a through hole penetrating through the first surface 111 and the second surface 222 of the substrate 1A. Specifically, the groove portion 1A may be the first groove portion 10A or the second groove portion 1B in Fig. 2 or Fig. 2 . That is, the groove portion 100 is a rectangular through hole or a circular through hole. It should be noted that the first aperture 101 of the through hole on the first surface 111 is not greater than the second aperture 102 of the through hole on the second surface 222. In this embodiment, the first aperture 1〇1 is the same as the second aperture 1〇2. In other embodiments, however, the second aperture 102 is greater than the first aperture 1〇1. Specifically, the vertical section of the groove portion 100 is a rectangle. However, in other embodiments, the vertical section of the groove portion may be tapered or T-shaped. In other words, the side walls 106 connecting the first aperture 101 and the second aperture 102 may be smooth walls or curved or angled surfaces. Further, the line connecting the midpoint of the first aperture 101 to the midpoint of the second aperture 102 is parallel to the normal to the first surface of the substrate 10. Specifically, the groove portion of the biliary system extends vertically downward through the substrate 10 to communicate the first surface lu and the second surface Μ. In a practical application, the colloid 2 is carried out from the second aperture (7) 2 of the second surface 222; and is coated with a mold (not shown) over the first surface to form a preferred shape of the colloid 20. In this embodiment, the shape of the colloid 2 is preferably hemispherical, but is not limited thereto. 7 It should be noted that the 'the kick body 20 includes the first colloid portion 21Q and the second colloid portion 220'. wherein the first colloid portion 21 is filled with each of the groove portions 1〇 (U乂 increases the adhesion of the colloid 2〇 to the substrate 10) And the second colloid portion 22 covers the first surface m and is a hemispherical protrusion. Specifically, the sidewall 1〇6 extension line of the groove portion 1〇〇 is preferably aligned with the hemisphere of the second colloid portion 22〇 The outer edge ' perpendicular to the first surface (1) enables the groove portion 100 to enhance the adhesion between the substrate 10 and the colloid 20. For example, §, since the groove portion 100 is close to the outer edge of the hemisphere of the second colloid portion 22 'And increase the contact area with the first colloidal portion 21, so that it can have better bonding and adhesion between the colloid 2〇 and the substrate 10. In general, the colloid on the substrate is more likely to fall off the surface of the substrate. As a result, the electronic component 3 is affected and the defective product is increased, so that the package yield is lowered. Therefore, the first colloid portion 21 and the substrate filled in the groove portion 1 are passed through the design of the groove portion 100. Can have more contact area between the two, so that the colloid 20 is splicable and attached The relative increase, and the second colloid portion 220 can protect the electronic component 30, thereby improving the package yield. Further, the substrate 10 has a groove portion 1〇〇 to increase the substrate area or lengthen the penetration path, so that external moisture does not easily penetrate into the substrate. The center is used to keep the electronic components dry, thereby improving the yield. The present invention proposes other modified embodiments to specifically clarify the purpose of the present creation. Referring to FIG. 4, FIG. 4 is a schematic diagram showing an embodiment of the present invention. As shown in FIG. 4, the package structure 2 includes a third substrate 1c, a colloid 2, and an electronic component 30, wherein the colloid 20 covers the third substrate 1c and the electronic component 3. The third substrate 10C has a plurality of The three groove portions i 〇〇 c. It is noted that the third groove portions 100C have inclined side walls 1 〇 4, and the inclined side walls HH have an angle 1 () 5 with the normal to the first surface 111, and are paired The inclined sidewalls 104 of the third groove portions 100C of the M426143 have the same inclination angle. It should be noted that the third trenches are disposed in pairs on opposite sides of the first surface 111. The inclined side walls of the portion 100C 1〇4 is inclined in the opposite direction. As shown in FIG. 4, the third substrate i〇c includes the first inclined side wall 108 closest to the side 12, and the first inclined side wall 1〇8 meets the first surface U1. Preferably, the hemispherical surface disposed adjacent to the second colloid portion 220 is perpendicular to the edge of the first surface 1U, so that the third groove portion 100C can enhance the third substrate 1c and the colloid 2〇
之間的附著力，進而保護電子元件3〇。此外，相較於圖3中 之實施例，傾斜側壁104比侧壁106具有較多之表面積。亦即， 第三溝槽部1GGC比溝槽部1GG具有好之表_，使得圖4 中之實施例所示之第三溝槽部100C娜體2〇有較多的接觸 面積，故能夠增加基板10與膠體2〇之間的附著力。再者，因 第三溝槽部1，比溝槽部励具有較多之表面積，故渗透路 徑亦更為延長，更能進-頻止外部水氣料至第三基板 中心。The adhesion between them protects the electronic components 3〇. Moreover, the slanted sidewalls 104 have more surface area than the sidewalls 106 than the embodiment of FIG. That is, the third groove portion 1GGC has a better surface than the groove portion 1GG, so that the third groove portion 100C shown in the embodiment of FIG. 4 has a larger contact area, so that it can be increased. Adhesion between the substrate 10 and the colloid 2〇. Further, since the third groove portion 1 has a larger surface area than the groove portion, the permeation path is further extended, and the external water-gas material can be further advanced to the center of the third substrate.
請麥照圖 闯j你嚯不尽剧作另一變化實施例之封裝么士 構示意圖。如圖5所示’封裝結構2包含細基板1GD、膠體 2〇及電子元件3〇’其中第四基板咖包含複數個第四溝槽部 H)〇D。相較於圖3中之實施例，圖5中之實施 溝槽部勵為錐形通孔，其中錐形通孔於第一表面⑴^ -口徑101不大於錐形通孔於第二表面222之第二㈣脱。 如圖5所示’每—個第四溝槽部刚D於第—表面 口徑101小於第四溝槽部腦於第二表面2 102。此外，第—之中點與第二口徑收之^^ M426143 線係平行於第四基板l〇D之第-表面m之法線。具體而言，· 第四溝槽部l〇〇D為錐形通孔，錐形通孔係筆直穿透第四基板 10D，使得第一表面m與第二表面您相通。 土 在實際情況中，由於第-口徑1〇1小於第二口徑1〇2，所 以填充於溝槽部100之第一膠體部21〇對於第二廢體部22〇具 有增強固定的作用。因此，當基板⑴及膠體2()自側邊^受 到外力時，第二膠體部22〇較不容易自基板1G之第—表面^ 脫落。 請參照圖6，圖6係繪示本創作另一變化實施例之封裝結春 構示意圖。如圖6所示，封裝結構2包含第五基板1〇E、膠體 20及電子το件30 ’其令第五基板1〇E包含有複數個第五溝槽 部100E。相較於圖4中之實施例’目6中之實施例所示之第 五溝槽部100E為斜錐形通孔，其中斜錐形通孔於第一表面^ 之第一口徑101不大於斜錐形通孔於第二表面222之第二口徑 102。如圖6所示，每一個第五溝槽部1〇〇E於第一表面^ 之第一口徑ιοί小於第五溝槽部100E於第二表面222之第二 口徑102。此外，第一口徑101之中點與第二口徑1〇2之中點籲 之連線係與基板10之第一表面111之法線具有夾角1〇5。換 句話說，斜錐形通孔係以傾斜方式穿透第五基板1〇E，使第一 表面111與第二表面222相通。於實際情況中，該等斜錐形通 孔係透過機械加工而鑿孔而成’透過不同的傾斜角度穿透第五 基板10E，使得第五溝槽部ιοοΕ更能夠符合實際需求，進而 使第一膠體部210近似卡合於斜錐形通孔，以使第二膠體部 220完整覆蓋電子元件30。 10 進-步而論，由於每-個第五溝槽部卿E具有 104,使得第一雜部210與第五基板有較多的接觸面積， 以使谬體20與第五基板之間具有較佳的畴力。再者積 第^徑ΗΠ小於第二口徑泌所以填充於第五溝槽部_ 之第-谬體部2H)對於第二膠體部22〇具有增強固定的作用。 因此’當第五基板10E及夥體20自側邊12受到外 膠體部22〇較不容易自第五基板之第一表自m脫落。一 在圖1至圖6之實施例中’溝槽部励的結構係為通孔， 其中通孔可岐矩形通孔、圓形通孔、錐形通孔或斜雜形通 孔’但不以此為限。除此之外，本創作提出不同於通孔結構之 溝槽部1GG，以具體達顺高職良率之目的。 請參照圖7,圖7所示為本創作封裝結構之實施例示意圖。 如圖7所示，封裝結構2包含第六基板10F、膠體20及電子 凡件30 ’其中第六基板1〇F包含有複數個第六溝槽部贿。 需說明的是，第六溝槽部腳係成對設置，並以相同的圓心 角呈環形排列。此外’第六溝槽部l〇〇F之底® 1〇7絲板1〇 之第二表面222具有距離。也就是說，第六溝槽部聊之結 構係非通孔並具有底面107，其中底面1〇7介於第一表面^ 與第二表面222之間。此外，第六溝槽部100F之垂直截面形 狀為倒τ形，係由水平部130及垂直部140連接而成其中水 平部130係位於垂直部14〇與基板1〇之第二表面222之間， 且水平部130之水平截面積大於垂直部14〇之水平戴面積。 於實際應用中，第六溝槽部100F較佳設置靠近第二膠體部 220之半球面所投影在第六基板腳上範圍之内側。當第六基 M426143 板iOF或膠體20於侧邊12受到外力時，填充於第六溝槽部 100F之第一膠體部21〇能夠對第二膠體部22〇增加固定於基 板10之作用力。 在其他變化實施例令，封裝基板結構包含基板，其中基板 包含複數個溝槽部《需說明的是，每一個溝槽部不但成對設 置，且以相同的圓心呈環形排列。進而言之，此實施例之該等 溝槽部係以相He；呈賴獅湖，其巾該等溝槽部之底 面與基板之第二表面具有距離。 請參照圖8，圖8所示為本創作封裝基板之實施例上視圖。 如圖8所示’封裝基板1包含第七基板10G，其中第七基板 10G包3複數個第七溝槽部。於實際情況中，該等第七 溝槽部1GGG係成對設置，且以相同的圓心呈封閉式環形排 列’包含水平部130及垂直部140,且水平部130及垂直部14〇 之水平截面形狀係為環形。 值得注意的是，因第七溝槽部100G係以封閉式環形排列設 置於第七基板10G ’並具有水平部13()及垂直部⑽。故在灌 注膠體20後，填充於第七溝槽部1〇〇G之第一膠體部⑽能 夠對第-表面m上之第二膠體部220增加固定之作用，以防 止第二膠體部22G自第-表面m脫心具體而言，因水平部 130之水钱面積切垂直部⑽之水傾时，所以填充於 炎平邛130之第一謬體部21〇能夠對填充於垂直部⑽及第一 表面111上之膠體2〇增加固定之作用。 請參照圖9，圖9係繪示本創作另一變化實施例之封裝基 板不意圖。如圖9所示，相較於圖8中之該些第七溝槽部 12 100G’在此實施例中之複數個第人溝槽部⑽H i多邊形排 列。具體而言’該等第人溝槽部100Η較佳設置於第二膠體 (圖未不)之半球面投影於第八基板丽之範_侧，使得填 於第八溝槽部1GGH之第-膠體部能夠對第—表面川上 之第二朦體部220增加固定之作用，以防止第二膠體部22〇 第一表面111脫落。 在圖8或®9之實施例中’由於基板之該等溝槽部係以封 閉式排列設置於基板，並具有水平部130及垂直部140。在灌 庄膠體20後，該等溝槽部使谬體2〇牢固於基板上，使電子元 件受到保護，以達到提高封裝良率之目的。 因此’本創作之封裝基板1或封裝結構2由於包含有該等 溝槽部，故能夠增加基板面積及加《渗透路徑，並透過填^於 溝槽部之賴20加·板娜體2G間 、样 部因具有水平箱及垂直_，可使填充於溝槽二: 第一膠體部210能夠對基板上之第二膠體部220加強固定的效 果。 相較於先前娜，根據本創作之封裝結構只需透過且有該 等溝槽部之基板，就能增加膠體與基板間的細面積，故能夠 ^強，體與基板之間的附著力，進而達到製程良率的提高。值 2忍的是，僅透過基板的結構改良就能提升封裝品質，並因 際需纽計不同形狀的溝槽，而毋須投人高昂成本或進行 '、頊加工，使得本創作之封裝結構具實質效益。 稭由以上較佳具體實施例之詳述’係希望能更加清楚描述 創作之特織婦，麟以上述·露的難賤實施例 M426143 圍的範 來對本創作之麟加_卜彳目反地，其 ::變及具相等性的安排於本創作所欲申請 【圖式簡單說明】 圖1所示為本創作封裝基板之實施例示意圖； 圖2所示林創似—實補之封裝基板上視圖； 圖3所示為本創作封裝結構之實施例截面圖； 圖4所示為本創作封裝結構之實施例示意圖； 圖5所不為本創作另—變化實施例之封裝結構示意圖； 圖6所不為本創作另—變化實施例之封裝結構示意圖； 圖7所不為本創作封裝結構之實施例示意圖； 圖所不為本創作封裝基板之實施例上視圖；以及 "斤示為本創作另一變化實施例之封裝基板示意圖。 【主要元件符號說明】 100H :第八溝槽部 12 :側邊 13 :圓心連接線 14 :中心 20 :膠體 1:封裝基板 2 :封裴結構 10:基板 10A :第—基板 10B :第二基板 14Please take a picture of the package of the singer. As shown in Fig. 5, the package structure 2 includes a thin substrate 1GD, a colloid 2〇, and an electronic component 3A, wherein the fourth substrate includes a plurality of fourth groove portions H)〇D. Compared with the embodiment in FIG. 3, the groove portion of FIG. 5 is a tapered through hole, wherein the tapered through hole is not larger than the tapered through hole on the second surface 222 on the first surface (1). The second (four) off. As shown in Fig. 5, each of the fourth groove portions D is smaller than the first surface diameter 101 by the fourth groove portion to the second surface 2102. In addition, the first-middle point and the second-diameter distance ^^ M426143 line are parallel to the normal to the first surface m of the fourth substrate 10D. Specifically, the fourth groove portion 10D is a tapered through hole, and the tapered through hole directly penetrates the fourth substrate 10D such that the first surface m communicates with the second surface. In the actual case, since the first-diameter 1〇1 is smaller than the second diameter 1〇2, the first colloidal portion 21〇 filled in the groove portion 100 has an effect of reinforcing and fixing the second waste body portion 22〇. Therefore, when the substrate (1) and the colloid 2 () are subjected to an external force from the side, the second colloid 22 is less likely to fall off from the first surface of the substrate 1G. Please refer to FIG. 6. FIG. 6 is a schematic diagram showing the spring structure of a package junction according to another variation of the present invention. As shown in Fig. 6, the package structure 2 includes a fifth substrate 1A, a colloid 20, and an electron 30', which causes the fifth substrate 1E to include a plurality of fifth trench portions 100E. The fifth groove portion 100E shown in the embodiment of FIG. 4 is a tapered tapered through hole, wherein the first diameter 101 of the tapered tapered through hole on the first surface is not greater than The tapered tapered through hole is at the second aperture 102 of the second surface 222. As shown in FIG. 6, the first aperture of each of the fifth groove portions 1A is smaller than the second aperture 102 of the fifth groove portion 100E of the second surface 222. Further, the connection between the midpoint of the first aperture 101 and the second aperture 1〇2 has an angle of 1〇5 with the normal to the first surface 111 of the substrate 10. In other words, the tapered tapered through hole penetrates the fifth substrate 1A in an oblique manner, so that the first surface 111 communicates with the second surface 222. In an actual case, the obliquely tapered through holes are punctured by machining to penetrate the fifth substrate 10E through different inclination angles, so that the fifth groove portion ιοοΕ can meet the actual demand, and thus the first A colloidal portion 210 is approximately snapped into the tapered tapered through hole such that the second colloid portion 220 completely covers the electronic component 30. In the case of the step-by-step, since each of the fifth groove portions E has 104, the first portion 210 has a larger contact area with the fifth substrate, so that the body 20 and the fifth substrate have Preferred domain strength. Further, the first diameter ΗΠ is smaller than the second diameter, so that the first body portion 2H filled in the fifth groove portion _ has an effect of reinforcing and fixing the second gel portion 22A. Therefore, when the fifth substrate 10E and the body 20 are subjected to the outer rubber portion 22 from the side 12, it is less likely to fall off from the first table of the fifth substrate. In the embodiment of FIGS. 1 to 6, the structure of the groove portion is a through hole, wherein the through hole can be a rectangular through hole, a circular through hole, a tapered through hole or a diagonally shaped through hole, but not Limited. In addition, this creation proposes a groove portion 1GG different from the through-hole structure to specifically achieve the goal of high-quality yield. Please refer to FIG. 7. FIG. 7 is a schematic diagram of an embodiment of the creation package structure. As shown in FIG. 7, the package structure 2 includes a sixth substrate 10F, a colloid 20, and an electronic component 30'. The sixth substrate 1A includes a plurality of sixth trenches. It should be noted that the sixth groove portion is disposed in pairs and arranged in a ring shape at the same central angle. Further, the second surface 222 of the bottom portion of the sixth groove portion 10F has a distance. That is, the sixth groove portion has a non-through hole and has a bottom surface 107, wherein the bottom surface 1〇7 is interposed between the first surface ^ and the second surface 222. In addition, the vertical cross-sectional shape of the sixth groove portion 100F is an inverted τ shape, which is formed by the horizontal portion 130 and the vertical portion 140. The horizontal portion 130 is located between the vertical portion 14 〇 and the second surface 222 of the substrate 1 〇. And the horizontal cross-sectional area of the horizontal portion 130 is greater than the horizontal wearing area of the vertical portion 14〇. In a practical application, the sixth groove portion 100F is preferably disposed near the hemispherical surface of the second gel portion 220 and projected on the inner side of the sixth substrate. When the sixth base M426143 plate iOF or the colloid 20 is subjected to an external force on the side edge 12, the first gel portion 21''' which is filled in the sixth groove portion 100F can increase the force applied to the substrate 10 to the second gel portion 22. In other variations, the package substrate structure includes a substrate, wherein the substrate includes a plurality of groove portions. It is to be noted that each of the groove portions is not only disposed in pairs but also arranged in a ring shape in the same center. Further, the groove portions of this embodiment are in phase He; in Lai Shi Lake, the bottom surface of the groove portion of the towel has a distance from the second surface of the substrate. Please refer to FIG. 8. FIG. 8 is a top view of an embodiment of the original package substrate. As shown in Fig. 8, the package substrate 1 includes a seventh substrate 10G, wherein the seventh substrate 10G includes a plurality of seventh groove portions. In the actual case, the seventh groove portions 1GGG are disposed in pairs, and are arranged in a closed circular shape with the same center, including the horizontal portion 130 and the vertical portion 140, and the horizontal portion of the horizontal portion 130 and the vertical portion 14〇 The shape is a ring shape. It is to be noted that the seventh groove portion 100G is disposed in the closed loop arrangement on the seventh substrate 10G' and has the horizontal portion 13() and the vertical portion (10). Therefore, after the gel body 20 is poured, the first gel portion (10) filled in the seventh groove portion 1〇〇G can add a fixing effect to the second gel portion 220 on the first surface m to prevent the second gel portion 22G from being self-contained. Specifically, when the water surface area of the horizontal portion 130 is cut by the water in the vertical portion (10), the first body portion 21〇 filled in the Yanping raft 130 can be filled in the vertical portion (10) and The colloid 2 on the first surface 111 acts to increase the fixation. Please refer to FIG. 9. FIG. 9 is a schematic diagram of a package substrate according to another variation of the present invention. As shown in Fig. 9, the plurality of first groove portions (10) H i are arranged in a polygonal shape in comparison with the seventh groove portions 12 100G' in Fig. 8 . Specifically, the hemispherical surface of the first colloidal portion 100 Η is preferably disposed on the second spherical surface of the second substrate, so that the first groove portion 1GGH is filled in the first groove portion 1GGH. The gel portion can add a fixing effect to the second body portion 220 on the first surface to prevent the second surface portion 111 of the second gel portion 22 from coming off. In the embodiment of Fig. 8 or 9, the groove portions of the substrate are arranged in a closed arrangement on the substrate, and have a horizontal portion 130 and a vertical portion 140. After filling the colloid 20, the grooves make the body 2〇 secure on the substrate, so that the electronic components are protected to achieve the purpose of improving the package yield. Therefore, the package substrate 1 or the package structure 2 of the present invention includes the groove portions, so that the substrate area can be increased and the "permeation path can be added, and the space can be filled through the groove portion. The sample has a horizontal box and a vertical _, and can be filled in the groove 2: the first gel portion 210 can strengthen the fixing effect on the second gel portion 220 on the substrate. Compared with the prior art, according to the package structure of the present invention, only the substrate having the groove portions can be used to increase the fine area between the colloid and the substrate, so that the adhesion between the body and the substrate can be strong. In turn, the process yield is improved. The value 2 bears that the improvement of the package quality can be improved only through the structural improvement of the substrate, and the groove of different shapes is required in the future, and it is not necessary to inject high cost or perform processing, so that the package structure of the creation has Substantial benefits. The straw is detailed by the above-mentioned preferred embodiments. It is hoped that the creation of the special weavers will be more clearly described. Lin’s use of the above-mentioned D. , the:: change and equal arrangement in this creative application [simplified description of the drawings] Figure 1 shows a schematic diagram of the embodiment of the creation of the package substrate; Figure 2 shows the Lin Chuang-solid package substrate FIG. 3 is a cross-sectional view showing an embodiment of the present invention; FIG. 4 is a schematic view showing an embodiment of the present invention; FIG. 6 is a schematic diagram of a package structure of a different embodiment of the present invention; FIG. 7 is a schematic view of an embodiment of the present package structure; the figure is not a top view of the embodiment of the original package substrate; and " A schematic diagram of a package substrate according to another variation of the present invention. [Main component symbol description] 100H: eighth groove portion 12: side 13: center connection line 14: center 20: colloid 1: package substrate 2: sealing structure 10: substrate 10A: first substrate 10B: second substrate 14