US12402273B2 - Liquid cooled electronic device - Google Patents

Liquid cooled electronic device

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Publication number
US12402273B2
US12402273B2 US18/287,333 US202218287333A US12402273B2 US 12402273 B2 US12402273 B2 US 12402273B2 US 202218287333 A US202218287333 A US 202218287333A US 12402273 B2 US12402273 B2 US 12402273B2
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United States
Prior art keywords
liquid cooled
unit
guide rail
power supply
chassis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US18/287,333
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English (en)
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US20240196561A1 (en
Inventor
Fangyu Liu
Yuefeng WU
Yang Gao
Qian Chen
Hongyan Ning
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen MicroBT Electronics Technology Co Ltd
Original Assignee
Shenzhen MicroBT Electronics Technology Co Ltd
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Publication date
Application filed by Shenzhen MicroBT Electronics Technology Co Ltd filed Critical Shenzhen MicroBT Electronics Technology Co Ltd
Assigned to SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD. reassignment SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, QIAN, GAO, YANG, LIU, Fangyu, NING, Hongyan, WU, Yuefeng
Publication of US20240196561A1 publication Critical patent/US20240196561A1/en
Application granted granted Critical
Publication of US12402273B2 publication Critical patent/US12402273B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Definitions

  • the present application relates to a technical field of heat dissipation via liquid cooling, and in particular, to a liquid cooled electronic device.
  • heat dissipation via liquid cooling has been gradually applied to the electronic device with a high power density.
  • a common method for heat dissipation via liquid cooling includes first removing a cooling fan on an electronic device that adopts heat dissipation through air cooling, and then immersing the electronic device in a cooling liquid of a liquid cooling apparatus.
  • the liquid cooling apparatus is provided with a liquid inlet at a lower portion thereof and a liquid outlet at an upper portion thereof.
  • the liquid inlet and the liquid outlet are in communication with a circulating pump and a cooling source apparatus to form a circulation loop.
  • the cooling liquid circulates in the circulation loop to absorb heat from the electronic device and then release the heat at the cooling source apparatus, thereby completing heat dissipation of the electronic device via liquid cooling.
  • Embodiments of the present application provide a liquid cooled electronic device.
  • the liquid cooled electronic device includes a chassis unit.
  • a first accommodating space extending in a first direction is formed within the chassis unit.
  • a liquid cooled computing unit and a liquid cooled power supply unit are arranged in the first accommodating space.
  • the liquid cooled computing unit and the liquid cooled power supply unit are inserted into the first accommodating space through a first guide rail and a second guide rail respectively.
  • the first guide rail and the second guide rail are arranged in parallel in the first direction. That is, the liquid cooled computing unit and the liquid cooled power supply unit may be arranged in parallel via the parallel arrangement of the first guide rail and the second guide rail.
  • a limiting structure is additionally arranged between the insertion groove and the insertion guide rail, and the limiting structure is configured for adjusting a length with which the insertion guide rail is slidably inserted into the insertion groove in the first direction; and wherein the limiting structure is movably mounted to the insertion guide rail, or the limiting structure is movably mounted to the insertion groove.
  • an amount of the liquid cooled power supply unit is at least one (1), and an amount of the liquid cooled computing unit is at least two (2); and one liquid cooled power supply unit is connected to at least two liquid cooled computing units, wherein,
  • the liquid cooled computing unit comprises a computing board, a heat dissipation plate is arranged on at least one side of the computing board, and a pair of mounting guide grooves are provided on two ends of the heat dissipation plate in the first direction; and wherein the first guide rail comprises a pair of mounting guide rails arranged opposite to each other, and the pair of mounting guide rails are configured to be slidably inserted into the pair of mounting guide grooves.
  • the second guide rail comprises a pair of limiting guide grooves arranged opposite to each other, and the pair of limiting guide grooves are configured for slidable insertion of two side walls of the liquid cooled power supply unit.
  • a base plate unit is mounted to the first end of the chassis unit, and a flow hole is provided on the base plate unit for the cooling liquid to flow through.
  • the liquid cooled computing unit is electrically connected to the liquid cooled power supply unit via a copper bar;
  • An embodiment of the present application provides a liquid cooled electronic device.
  • the liquid cooled electronic device includes a chassis unit.
  • a first accommodating space extending in a first direction is formed within the chassis unit.
  • a liquid cooled computing unit and a liquid cooled power supply unit are arranged in the first accommodating space.
  • the liquid cooled computing unit and the liquid cooled power supply unit are inserted into the first accommodating space through a first guide rail and a second guide rail respectively.
  • the first guide rail and the second guide rail are arranged in parallel in the first direction. That is, the liquid cooled computing unit and the liquid cooled power supply unit may be arranged in parallel through parallel arrangement of the two guide rails.
  • FIG. 2 is a schematic structural diagram of a liquid cooled electronic device being placed in a liquid cooling apparatus according to some embodiments of the present application.
  • FIG. 3 is a schematic diagram of a relative position relationship between a first accommodating space and a second accommodating space according to some embodiments in of the present application.
  • FIG. 5 is a schematic structural diagram of a control panel being inserted into a chassis panel according to some embodiments of the present application.
  • FIG. 6 is a partial enlarged view of FIG. 5 .
  • FIG. 7 is a schematic structural diagram of a liquid cooled computing unit according to some embodiments of the present application.
  • FIG. 9 is a schematic structural diagram of a base plate unit according to some embodiments of the present application.
  • FIG. 1 is a schematic structural diagram of a liquid cooled electronic device according to some embodiments of the present application.
  • the liquid cooled electronic device 100 includes a chassis unit 10 , a liquid cooled computing unit 20 , and a liquid cooled power supply unit 30 .
  • the chassis unit 10 is circumferentially closed relative to a first direction (which is, for example, a direction as shown by “X” in FIG. 1 ).
  • a first accommodating space 11 extending in the first direction is formed within the chassis unit 10 (as shown in FIG. 3 and FIG. 4 ).
  • At least one liquid cooled computing unit 20 is arranged in the first accommodating space 11 .
  • At least one liquid cooled power supply unit 30 is arranged in the first accommodating space 11 .
  • the liquid cooled power supply unit 30 is electrically connected to the liquid cooled computing unit 20 , for supplying power to the liquid cooled computing unit 20 .
  • a first guide rail and a second guide rail (for example, mounting guide rails 13 as shown in FIG. 8 ) are respectively arranged within the chassis unit 10 at positions corresponding to the first accommodating space 11 .
  • the first guide rail is configured for insertion of the liquid cooled computing unit 20
  • the second guide rail is configured for insertion of the liquid cooled power supply unit 30 .
  • the first guide rail and the second guide rail extend in parallel in the first direction, so that the liquid cooled computing unit 20 and the liquid cooled power supply unit 30 are parallelly arranged.
  • FIG. 2 is a schematic structural diagram of a liquid cooled electronic device being placed in a liquid cooling apparatus according to some embodiments of the present application.
  • the liquid cooled electronic device of some embodiments of the present application is placed in the liquid cooling apparatus 200 for heat dissipation via liquid cooling.
  • the liquid cooling apparatus 200 is provided with a cooling liquid inlet 201 and a cooling liquid outlet 202 .
  • the cooling liquid inlet 201 and the cooling liquid outlet 202 are further in communication with a circulating pump and a cooling source apparatus (which are not shown in the figure) to form a circulation loop.
  • a direction of a circulation flow of the cooling liquid is shown by a direction of hollow arrows in FIG. 2 . It may be learned from FIG.
  • the cooling liquid enters from a lower portion of the liquid cooled electronic device, flows through an upper portion of the liquid cooled electronic device, and then flows out from the cooling liquid outlet 202 .
  • one or more heating elements within the liquid cooled electronic device exchange heat with the cooling liquid circulating around, that is, the cooling liquid absorbs the heat.
  • the cooling liquid which has absorbed the heat, then releases the heat at the cooling source apparatus.
  • the cooling liquid after releasing the heat, enters the liquid cooling apparatus via the cooling liquid inlet due to action of the external circulating pump. Such a cycle is repeated, ensuring a normal requirement for heat dissipation of the liquid cooled electronic device is satisfied.
  • the first direction may be, for example, a vertical direction.
  • the chassis unit is circumferentially closed relative to the first direction, and the first accommodating space 11 extending in the first direction is formed.
  • the first accommodating space 11 is configured for accommodating and mounting of the liquid cooled computing unit and the liquid cooled power supply unit.
  • the amount of liquid cooled computing unit and the amount of liquid cooled power supply unit should each be at least one (1).
  • the liquid cooled computing unit is slidably inserted into the first accommodating space 11 via the first guide rail.
  • the liquid cooled power supply unit is slidably inserted into the first accommodating space 11 via the second guide rail.
  • the first guide rail and the second guide rail are arranged in parallel in the first direction.
  • the liquid cooled computing unit and the liquid cooled power supply unit are in parallel with each other. That is, the liquid cooled computing unit and the liquid cooled power supply unit are both vertically inserted into the first accommodating space 11 from an end of the chassis unit (for example, an upper end of the chassis unit).
  • an end of the chassis unit for example, an upper end of the chassis unit.
  • a structure of the chassis unit is characterized in, for example, that a cross section of the chassis unit perpendicular to the first direction is a square or a rectangle.
  • the liquid cooled computing unit and the liquid cooled power supply unit are wrapped within the chassis unit, so that the liquid cooled electronic device has good integrity. Since the chassis unit may be integrally formed through a molding process, accuracy of the first guide rail and the second guide rail may be guaranteed, so that an assembling error is reduced, which is convenient for manufacturing and assembling.
  • the cooling liquid flows in from the first end of the chassis unit and flows out from the second end of the chassis unit.
  • the second accommodating space is formed within the second end of the chassis unit.
  • the chassis unit has the overflow through hole provided on the side wall on which the second accommodating space is formed.
  • the first end of the chassis unit is the lower end in the figure
  • the second end of the chassis unit is the upper end in the figure.
  • the cooling liquid flows in the chassis unit from the lower end and then flows out through the overflow through hole at the upper end.
  • the cooling liquid may directly flow out via the overflow through hole without completely immersing the liquid cooled electronic device.
  • the cooling liquid may achieve technical effects of lowering the height of the cooling liquid within the liquid cooling apparatus and reducing an used amount of the cooling liquid, thereby saving costs.
  • the second accommodating space may also be configured to accommodate an electrical transitioning apparatus that is used to electrically connect the liquid cooled computing unit with the liquid cooled power supply unit.
  • a height of the second accommodating space in the first direction (that is, the vertical direction), a position of the overflow through hole in the second accommodating space, and a number of the overflow through holes may be determined according to an actual need, which are not redundantly described herein.
  • a panel unit 40 (as shown in FIG. 2 ) is mounted at the second end of the chassis unit 10 .
  • the panel unit 40 includes a chassis panel 41 and a control panel 42 .
  • the control panel 42 is inserted into the chassis panel 41 in the first direction, so that the control panel 42 is located in the second accommodating space 12 .
  • a height of the control panel 42 relative to the chassis panel 41 in the first direction is adjustable.
  • the panel unit is mounted at the second end of the chassis unit.
  • the panel unit includes the chassis panel and the control panel.
  • the chassis panel 41 is, for example, flat and is configured for covering the second end of the chassis unit.
  • the control panel 42 is then inserted into the chassis panel 41 in the first direction.
  • the control panel 42 has a control element and the like mounted thereon.
  • the control panel 42 is located in the second accommodating space, and an insertion length of the control panel 42 relative to the chassis panel 41 in the first direction is adjustable. That is, in some embodiments of the present application, a length with which the control panel 42 is inserted into the second accommodating space is adjustable, so that the control element and the like on the control panel 42 may be protected with such an arrangement described above.
  • the height of the control panel 42 relative to the chassis panel 41 in the first direction may be adjusted such that the control panel 42 is moved away from the cooling liquid.
  • the control panel 42 is pulled away by a certain length in the first direction so that the control panel 42 is above a liquid surface of the cooling liquid.
  • the control panel 42 is cooled by surrounding air, and the control element and the like on the control panel 42 may be protected from damage caused by the cooling liquid that is at the higher temperature.
  • the height of the control panel relative to the chassis panel in the first direction is adjustable.
  • Such an adjustable arrangement of the height may be an arrangement of the height that is continuously adjustable, or may be an arrangement of the height that is discretely adjustable.
  • an insertion groove extending toward the second accommodating space 12 is provided on a side of the chassis panel 41 .
  • the control panel 42 includes a fixing plate 421 that is configured to be embedded in the chassis panel 41 .
  • An insertion guide rail 424 is arranged on a side of the fixing plate 421 , and the insertion guide rail 424 is slidably inserted into the insertion groove.
  • Some embodiments of the present application disclose a possible structure for inserting the control panel into the chassis panel.
  • the slidable insertion between the control panel and the chassis panel may also be implemented by other structural forms.
  • a limiting structure 43 is additionally arranged between the insertion groove and the insertion guide rail 424 .
  • the limiting structure 43 is configured for adjusting a length with which the insertion guide rail 424 is slidably inserted into the insertion groove in the first direction.
  • the limiting structure 43 is movably mounted to the insertion guide rail 424 .
  • the limiting structure 43 is movably mounted to the insertion groove.
  • the limiting structure 43 may include, for example, a limiting member and a limiting insertion through hole that is configured for the limiting member to be inserted.
  • a limiting insertion through hole is provided on the insertion guide rail, so that the height may be adjustable by mounting the limiting member in limiting insertion through holes at different positions.
  • the limiting insertion through holes may be provided on a side wall of the insertion groove.
  • one liquid cooled power supply unit 30 is electrically connected to at least two liquid cooled computing units 20 .
  • the at least two liquid cooled computing units 20 are located on the same side of the one liquid cooled power supply unit 30 .
  • the at least two liquid cooled computing units 20 are respectively arranged on two sides of the liquid cooled power supply unit 30 .
  • one liquid cooled power supply unit is electrically connected to at least two liquid cooled computing units, and the liquid cooled computing units and the liquid cooled power supply unit may have a variety of quantitative correspondences or positional correspondences.
  • a ratio of a number of the liquid cooling power supply units to a number of the liquid cooled computing units in the liquid cooled electronic device may be 1:2, 1:3, 1:4, and the like. That is, one liquid cooled power supply unit is electrically connected to two, three, or four liquid cooled computing units respectively.
  • FIG. 4 illustrates a position relationship between one liquid cooled power supply unit and two liquid cooled computing units.
  • the two liquid cooled computing units may be both located on a same side of the liquid cooling power supply unit.
  • the two liquid cooled computing units may be respectively arranged on two sides of the liquid cooling power supply unit.
  • the liquid cooled computing unit 20 is electrically connected to the liquid cooled power supply unit 30 via a copper bar. Two ends of the liquid cooled power supply unit 30 respectively abut against the panel unit 40 and the base plate unit 50 in the first direction.
  • the liquid cooled power supply unit 30 has an external input socket 32 , and the panel unit 40 is provided with a power supply hole 44 corresponding to the external input socket 32 .
  • the two ends of the liquid cooled computing unit 20 respectively abut against a support boss 17 and a limiting block 45 in the first direction.
  • the limiting block 45 is fixed to a side of the panel unit 40 , and the support boss 17 is fixed to the first guide rail.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US18/287,333 2021-05-18 2022-05-16 Liquid cooled electronic device Active 2042-11-11 US12402273B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202121069364.7 2021-05-18
CN202121069364.7U CN215956915U (zh) 2021-05-18 2021-05-18 一种液冷电子设备
PCT/CN2022/092991 WO2022242587A1 (fr) 2021-05-18 2022-05-16 Dispositif électronique refroidi par liquide

Publications (2)

Publication Number Publication Date
US20240196561A1 US20240196561A1 (en) 2024-06-13
US12402273B2 true US12402273B2 (en) 2025-08-26

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US (1) US12402273B2 (fr)
CN (1) CN215956915U (fr)
WO (1) WO2022242587A1 (fr)

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CN215956915U (zh) * 2021-05-18 2022-03-04 深圳比特微电子科技有限公司 一种液冷电子设备
CN116841364B (zh) * 2023-08-30 2023-11-17 北京泰尧科技有限公司 一种液冷加固计算机机箱
USD1123918S1 (en) * 2024-03-05 2026-04-28 Bitdeer Semiconductor Technology Pte. Ltd. Modular liquid cooled server
CN119653697B (zh) * 2024-10-31 2025-08-01 广州宇成智能科技有限公司 一种冷却液柜

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Also Published As

Publication number Publication date
US20240196561A1 (en) 2024-06-13
CN215956915U (zh) 2022-03-04
WO2022242587A1 (fr) 2022-11-24
CA3214392A1 (fr) 2022-11-24

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