US1993623A - Electrodeposition of platinum metals - Google Patents

Electrodeposition of platinum metals Download PDF

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Publication number
US1993623A
US1993623A US621754A US62175432A US1993623A US 1993623 A US1993623 A US 1993623A US 621754 A US621754 A US 621754A US 62175432 A US62175432 A US 62175432A US 1993623 A US1993623 A US 1993623A
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US
United States
Prior art keywords
palladium
electrolyte
metal
anode
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US621754A
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English (en)
Inventor
Raper Alan Richardson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntington Alloys Corp
Original Assignee
International Nickel Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Nickel Co Inc filed Critical International Nickel Co Inc
Application granted granted Critical
Publication of US1993623A publication Critical patent/US1993623A/en
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals

Definitions

  • This invention relates to an improved method for the electrodeposition or platinum group metals like palladium and to a bath. for use in carryingoutsaidmethod.- m.
  • an electrolyte containing a complex nitrite of a platinum metal such as palladonitrite oi an alkali metal or an alkaline earth metal in solution inwater and also containing an alkali or alkaline earth metal halide, like a chloride or constant the: platinum ehlorlde,,treatingthis'withJasolution Y 'Qabout26 of sodiumnitrite which isfa quantity suflicient to 'convert' the pallad Share-iin the solution to palladonitritefboilin'githebromidev oi an alkali metal oralkaline earth metal.
  • a complex nitrite of a platinum metal such as palladonitrite oi an alkali metal or an alkaline earth metal in solution inwater and also containing an alkali or alkaline earth metal halide, like a chloride or constant the: platinum ehlorlde,,treatingthis'withJasolution Y 'Qabout26 of sodiumnitrite
  • the 'palladonitrite o th w o mor el hciiii ite th hest r be replaced by a mixture or twofor more such halides.
  • the sodium salts may be replaced by slum or lithium salts or by, for example,
  • the palladium It h b f und th t th p s of p tration may be varied from that set'iorth but with higher palladium concentrationi it preferred to use sodium salts rather than those" of potassium, for example, since the former are more soluble.
  • the halides may be varied in quantity, but it is preferred to keep their concentration between the limits of about 10 to grams per liter.
  • the anodes are preferably made of hardrolled palladium sheet. Cast palladium anodes are practically as good while soft annealed palladium sheet may also be used. Soft annealed sheets, however, tend to dissolve non-uniformly. giving a much greater quantity of anode sludge than hard rolled or cast material and such sheets are consequently not so economical in use.
  • the anodes should be made of practically pure'metal in order to obtain the best results and tomvent contamination or the electrolyte.
  • the anodes may be placed in, for example, unbleached calico bags.
  • the electrolyte should be operated above room tempera-' ture, preferably at temperatures of from 40 degrees to degrees 0., to obtain the best deposits but the solutions work well at higher or lower temperatures than these.
  • the current density may conveniently be maintained at about 0.1 ampere per square declmeter and at this density the current efilciencies of the anodic and cathodic processes are both very high, being in the order or 95 to 100 per cent.
  • the current density may rise to about 0.5 amperes per square decimeter it desired.
  • the iollowing may be given:
  • the process is particularly suitable for the deposition of palladium on silver, it .mayalso be used for the deposition of palladium on surfaces of gold, copper, brass, bronze, palladium, and nickelsilver. Surfaces such as those of nickel, iron, and steel should first be coated with copper or silver or both from a bath of an alkali metal cyanide. 1! base metals such as copper are to be plated and the electrolytes cont i bromides, it is found to be advisable to work at room temperatures, since at a temperature of about 40 C. local action occurs when the base metal is placed in the electrolyte and dark nonadherent deposits are obtained.
  • the base metal is given a preliminary strike 01 palladium from one or the known ammoniacal solu- 1.
  • the method of depositing palladium electrolytically which comprises establishing a bath containing a palladium anode soluble in an electrolyte containing palladonitrite 01 an "alkali" metal, making the article to be plated the oathode, and passing a current through said soluble palladium anode, said electrolyte and said article to be plated whereby palladium metal is electrodeposited on the article to be plated and the electrolyte anodically dissolves the palladium anode during the electrolysis at a rate substantially equal to that at which palladium is deposited cathodically on articles immersed in the electrolyte.
  • the method oi depositing palladium electrolytically which comprises establishing a bath containing a soluble palladium anode and an electrolyte containing palladonitrite of an alkali metal and a halide 01 an "alkali" metal, making the article to be plated the cathode, and passing a current through said soluble palladium anode, said electrolyte and said article to be plated whereby palladium metal is electrodeposited on the article to be plated and the electrolyte anodically dissolves the palladium anode during the electrolysis at a rate substantially equal to that at which palladium is deposited cathodically on articles immersed in the electro- 3.
  • the method of depositing palladium electrolytically which comprises establishing a bath containing a soluble, hard-rolled, palladium sheet anode and an electrolyte containing palladonltrite 01 an alkali metal, making the article to be plated the cathode, and passing a current through said soluble, hard-rolled palladium sheet anode, said electrolyte and said article to be plated whereby palladium metal is electrodeposited on the article to be plated and the electrolyte anodically dissolves the hard-rolled, palladium sheet anode during the electrolysis at a rate substantially equal to that at which hardrolled, palladium sheet is deposited cathodically on articles immersed in the electrolyte.
  • the method of depositing palladium electrolytically which comprises establishing a bath containing 'palladonitrite of an alkali metal, adjusting the concentration of palladonitrite in the electrolyte to give about 10 grams of palladium per liter, making the article to be plated the cathode, and passing a current through said soluble palladium anode, said electrolyte and said article to be plated whereby palladium metal is electrodeposited on the article to be plated and the electrolyte anodically dissolves the palladium anode during the electrolysis at a rate substantially equal to that at which palladium is deode, and passing a current through said soluble palladium anode, said electrolyte and said article to be plated whereby palladium metal is electrodeposited on the article to be plated and the electrolyte anodically dissolves the palladium anode during the electrolysis at a rate substantially equal to that at which palladium is deposited cathoc'ieally on articles immersed

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US621754A 1931-07-11 1932-07-09 Electrodeposition of platinum metals Expired - Lifetime US1993623A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB20008/31A GB381932A (en) 1931-07-11 1931-07-11 Improvements relating to the electro-deposition of palladium

Publications (1)

Publication Number Publication Date
US1993623A true US1993623A (en) 1935-03-05

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Family Applications (1)

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US621754A Expired - Lifetime US1993623A (en) 1931-07-11 1932-07-09 Electrodeposition of platinum metals

Country Status (4)

Country Link
US (1) US1993623A (fr)
DE (1) DE587807C (fr)
FR (1) FR737752A (fr)
GB (1) GB381932A (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2457021A (en) * 1940-05-20 1948-12-21 Int Nickel Co Palladium plating
DE1182924B (de) * 1959-09-30 1964-12-03 Johnson Matthey Co Ltd Saures Bad und Verfahren zum galvanischen Abscheiden von Platin- oder Palladiumueberzuegen
US3347757A (en) * 1963-02-12 1967-10-17 Louyot Comptoir Lyon Alemand Electrolytes for the electrodeposition of platinum
US4284482A (en) * 1980-09-22 1981-08-18 Bell Telephone Laboratories, Incorporated Palladium treatment procedure
US4299670A (en) * 1980-09-22 1981-11-10 Bell Telephone Laboratories, Incorporated Palladium plating procedure and bath
US4316779A (en) * 1980-09-26 1982-02-23 Bell Telephone Laboratories, Incorporated Process for electroplating palladium on articles comprising copper
US4401527A (en) * 1979-08-20 1983-08-30 Occidental Chemical Corporation Process for the electrodeposition of palladium
DE3400139A1 (de) * 1983-01-07 1984-07-12 Omi International Corp., Warren, Mich. Galvanisches bad fuer die schnellabscheidung von palladium und ein verfahren zur galvanischen schnellabscheidung von palladium
US20140048419A1 (en) * 2011-04-27 2014-02-20 King Saud University Process for growing metal particles by electroplating with in situ inhibition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328286A (en) 1979-04-26 1982-05-04 The International Nickel Co., Inc. Electrodeposited palladium, method of preparation and electrical contact made thereby

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2457021A (en) * 1940-05-20 1948-12-21 Int Nickel Co Palladium plating
DE1182924B (de) * 1959-09-30 1964-12-03 Johnson Matthey Co Ltd Saures Bad und Verfahren zum galvanischen Abscheiden von Platin- oder Palladiumueberzuegen
US3206382A (en) * 1959-09-30 1965-09-14 Johnson Matthey Co Ltd Electrodeposition of platinum or palladium
US3347757A (en) * 1963-02-12 1967-10-17 Louyot Comptoir Lyon Alemand Electrolytes for the electrodeposition of platinum
US4401527A (en) * 1979-08-20 1983-08-30 Occidental Chemical Corporation Process for the electrodeposition of palladium
US4284482A (en) * 1980-09-22 1981-08-18 Bell Telephone Laboratories, Incorporated Palladium treatment procedure
US4299670A (en) * 1980-09-22 1981-11-10 Bell Telephone Laboratories, Incorporated Palladium plating procedure and bath
US4316779A (en) * 1980-09-26 1982-02-23 Bell Telephone Laboratories, Incorporated Process for electroplating palladium on articles comprising copper
DE3400139A1 (de) * 1983-01-07 1984-07-12 Omi International Corp., Warren, Mich. Galvanisches bad fuer die schnellabscheidung von palladium und ein verfahren zur galvanischen schnellabscheidung von palladium
US20140048419A1 (en) * 2011-04-27 2014-02-20 King Saud University Process for growing metal particles by electroplating with in situ inhibition
US9391331B2 (en) * 2011-04-27 2016-07-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Process for growing metal particles by electroplating with in situ inhibition

Also Published As

Publication number Publication date
GB381932A (en) 1932-10-11
DE587807C (de) 1933-11-09
FR737752A (fr) 1932-12-16

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