US20040175257A1 - Capacitive proximity sensor for detecting component belts, component feeding device and method for detecting component belts - Google Patents

Capacitive proximity sensor for detecting component belts, component feeding device and method for detecting component belts Download PDF

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Publication number
US20040175257A1
US20040175257A1 US10/486,097 US48609704A US2004175257A1 US 20040175257 A1 US20040175257 A1 US 20040175257A1 US 48609704 A US48609704 A US 48609704A US 2004175257 A1 US2004175257 A1 US 2004175257A1
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Prior art keywords
sensor
component
capacitive proximity
disposed
detected
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Abandoned
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US10/486,097
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English (en)
Inventor
Dirk Pallas
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Siemens AG
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Siemens AG
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Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PALLAS, DIRK
Publication of US20040175257A1 publication Critical patent/US20040175257A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K17/955—Proximity switches using a capacitive detector

Definitions

  • Capacitive proximity sensor for detecting component tapes for detecting component tapes, component feeding device and method for detecting component tapes
  • the invention relates to a capacitive proximity sensor for detecting component tapes, a component feeding device and a method for detecting component tapes in which the component tapes to be detected are detected by means of a field.
  • the invention further relates to a component detection device for component feeding devices, a component feeding device and a method for feeding components by means of a component feeding device.
  • the components to be inserted are transported by means of feeding devices to pick-up positions from which they can be unloaded and inserted on a printed circuit board e.g. using a revolver head.
  • the components are often disposed in component tapes. These are provided with a cover tape which is peeled back in the feeding device at least at the component pick-up position in order to enable the components to be unloaded.
  • a cover tape which is peeled back in the feeding device at least at the component pick-up position in order to enable the components to be unloaded.
  • a large number of components are disposed in each component tape, it may also happen during operation that a component tape becomes empty and a new component tape has to be made available to the feeding device. In this case the end of the old component tape is joined to the start of the new component tape, e.g. using a splicing element which can be a metal strip.
  • splice sensors are already known from EP 967 851 or EP 859 543. These concepts each teach a splice sensor which is mounted on the feeding device. However, the distance between the splice sensor and the pick-up position is very great, with the result that serious inaccuracies occur in determining the components still present in the component tape or in determining the position of the joint in the component tapes.
  • a light barrier for example in a component feeding channel in the component feeding device, an opening is formed in two opposite walls of said feeding channel so that an optical measuring path of the light barrier can be routed through the opening.
  • Components transported along the feeding channel can be detected by this means if they interrupt the measuring path of the light barrier.
  • detecting components by means of a light barrier has several disadvantages. For example, when using a light barrier as a detector for the components, an optical measuring path must always be provided. This can be provided either by implementing two mutually aligned openings in opposite walls of the feeding channel or by implementing one opening and appropriately mounting a reflex mirror on the feeding channel wall opposite said opening.
  • the object of the present invention is therefore to create a sensor for detecting component tapes, a component feeding device and a method for detecting component tapes in which detection can be performed inexpensively and with a high degree of accuracy.
  • the capacitive proximity sensor according to the invention can be manufactured easily and inexpensively, as at least two conductive sensor surfaces can be easily and inexpensively implemented, e.g. by etching, on an electrically non-conducting substrate, e.g. printed circuit board material.
  • the capacitive proximity sensor according to the invention can also be implemented with very small dimensions, so that it can be disposed in a feeding channel in the component feeding device in close proximity to, or directly at, the component pick-up position. This allows the joint between two component tapes to be detected in close proximity to, or directly at, the pick-up position, thereby enabling precise insertion of the end of the empty component tape and the start of the spliced-on component tape. Because of the small or non-existent distance of the sensor in the component feeding device from the pick-up position, a high degree of detection accuracy is ensured.
  • the relative permittivity of the substrate material is selected such that optimum detection of components and/or splicing elements is possible, it being critical for success according to the invention that a low permittivity is selected, i.e. much lower than for normal printed circuit board material which has a relative permittivity ⁇ r of between 10 and 20.
  • the material from which the substrate is made has a dielectric constant or relative permittivity ⁇ r of between 3 and 4. This ensures that optimum transmission of the electrical signals applied to one sensor surface to the other sensor surface can take place.
  • the sensor surfaces can be disposed in a single plane. This makes it even easier to integrate the capacitive proximity sensor into a component feeding device.
  • the sensor surfaces are implemented in a meander or interdigitated pattern, thereby increasing the capacitance of the capacitive proximity sensor and therefore improving its sensitivity.
  • the capacitive proximity sensor symmetrically about an axis of symmetry, one sensor surface extending over the entire capacitive proximity sensor and at least another two sensor surfaces being provided which are symmetrically disposed relative to one another about the axis of symmetry.
  • the capacitive proximity sensor according to the invention is particularly suitable for detecting component tapes or components in the component tapes or splicing elements connecting component tapes, as the combination of the low dielectric constant of the sensor's substrate material and the spatial arrangement of the sensor surfaces on the substrate provides millimeter range detection for component tapes.
  • the dielectric constant is specifically between 3 and 4 and the detection distance is between 0.1 and 25 mm.
  • the sensor can be adapted to suit the type of component tapes to be detected by varying these two parameters, i.e. the dielectric constant of the substrate material on the one hand and the spatial arrangement of the sensor surfaces on the other.
  • the capacitance of the sensor can be maximized, thereby increasing the sensitivity.
  • differential detection of the objects to be detected is possible. This enables environmental effects such as atmospheric humidity, temperature and pressure to be eliminated from the measurement result.
  • sensors which are suitable for differential measurement to detect the direction in which the objects to be detected pass the sensor.
  • the sensor surface disposed facing the other two sensor surfaces in particular can be connected to a ground terminal through which a reference potential is applied to the sensor which improves the elimination of disturbance variables.
  • Particularly suitable is a sensor which is essentially implemented twice as long as the objects to be detected in the longitudinal detection direction.
  • a component feeding device which has a sensor according to the invention, said sensor being disposed in close proximity to the pick-up position.
  • the sensor can be integrated, for example, in the feeding channel in which the component tapes are guided.
  • an evaluation device by which the output signal of the sensor can be e.g. digitally processed. It is also possible for the evaluation device to be constituted by a microcomputer present in the component feeding device.
  • the component feeding device according to the invention can be implemented in such a way that the coupling elements used or suitable for joining component tapes can be connected to ground during detection of said coupling elements, thereby making a more precise measurement possible.
  • a symmetrically designed capacitive proximity sensor it is additionally possible to perform a differential measurement, as claimed, for example, in claim 20 , in which disturbances such as variations in atmospheric pressure, temperature or humidity can be taken into account when analyzing the detected field, thus providing a more accurate measurement result.
  • the component detection device it is possible to detect, in a contactless manner by means of an electromagnetic sensor, components which are being transported by means of component feeding devices in a feeding rail to an unloading point of the component feeding device, or splicing elements joining component tapes to one another, said electromagnetic sensor being linked to a control device.
  • a signal is emitted by the control device if the number of components in the feeding channel falls below a predetermined minimum number or the splicing element is detected.
  • the electromagnetic sensor can be a coil, for example. It is possible to dispose this coil under the feeding channel.
  • the control device can have an excitation device which can bring the coil into resonance with the feeding rail if the number of components in the feeding channel falls below the minimum. This allows particularly sensitive detection of components in the feeding channel in a contactless manner. The components present in the feeding channel are taken into account when resonance is produced in the coil. If the number of components in the feeding channel falls too sharply, the conditions for resonance cease to be present, and the corresponding signal is emitted by the control device.
  • the coil can be, for example, an elongated flat toroidal coil disposed along the feeding device.
  • a plurality of potential surfaces disposed under the feeding channel can also be used as the sensor, any variation in the voltage present between the potential surfaces being detected by the control device. On the basis of the voltage variation it is possible to evaluate whether the number of components in the feeding channel has fallen below the minimum, the components being detected on the basis of their dielectric properties.
  • the potential surfaces can be successively disposed, for example, under the feeding channel in a well in the feeding rail in the feeding direction. It is also possible to implement the potential surfaces facing one another in an interdigitated manner, so that a rectangular or curvilinear meander-shaped interspace remains between the potential surfaces.
  • the electromagnetic sensor can be disposed on two different sides along the feeding channel, both the upper and lower side of the feeding channel as well as an arrangement along the lateral surfaces of the feeding channels being possible options. It is also possible to dispose the electromagnetic sensor on two different adjacent sides along the feeding channel.
  • the component detection device has a feeding rail.
  • a recess which is used as the feeding channel for the components.
  • the feeding channel is provided with a cover except at an unloading point so that a component delivered to said unloading point can be removed from the feeding rail by means of a handling device, the components being transported along the feeding rail in the feeding direction e.g. by means of a tape or directly in the feeding channel.
  • a sensor is mounted below the feeding channel. This sensor can be disposed, for example, in a cutout in the feeding rail. The sensor extends in the feeding direction below the feeding channel.
  • an elongated flat toroidal coil can be used as a sensor.
  • this toroidal coil is linked to a control device (not shown).
  • the toroidal coil can be brought into resonance under the feeding channel in the feeding rail by the control device.
  • the control device can output the signal indicating that the number of components in the feeding channel is less than a predefined minimum.
  • a capacitive sensor as the sensor, two or more potential surfaces being disposed below the feeding channel to provide said sensor.
  • steady-state voltages or predetermined oscillations are impressed on these potential surfaces and the voltages or oscillations present on the potential surfaces after application or impressing are simultaneously detected. From the difference between the impressed voltage or oscillation and the detected voltage or oscillation it is possible to determine whether a sufficient number of components are present in the feeding channel. For this purpose, for example, a predetermined minimum difference between the impressed signal and the detected signal can be specified. It is also possible to detect changes, particularly capacitance variations which are attributable to variations in permittivity in the measurement field or space of the sensor. This is the case, for example, when components and/or splicing elements pass through the sensor's measurement field.
  • the arrangement according to the first preferred embodiment of the invention is also suitable for use with an ultrasonic sensor as the sensor for the component detection device according to the invention, said ultrasonic sensor being disposed at the location shown in the figure under the feeding channel of the feeding rail.
  • the ultrasonic sensor can be tuned, for example, to a component-filled feeding rail or feeding channel or to an empty feeding channel.
  • the reflection of the sound waves in the ultrasonic range is varied by the presence or absence of the components. Using the control device it is possible to analyze this variation and, if the number of components is less than a predetermined minimum in the feeding channel, to emit the signal.
  • a second preferred embodiment of the component detection device differs from the first preferred embodiment in that sub-sensors are disposed on two different sides of the feeding channel, the different sides of the feeding channel possibly being opposite sides as well as adjacent sides of the feeding channel.
  • This embodiment according to the invention is particularly suitable for using a plurality of potential surfaces and as a capacitive sensor for detecting components, as this arrangement between the sub-sensors and/or the potential surfaces provides a more homogeneous field distribution than that provided by the first preferred embodiment of the component detection device according to the invention.
  • a third preferred embodiment of the component detection device according to the invention differs from the second preferred embodiment of the component detection device according to the invention in that at least one of the two sub-sensors is comprised of more than one piece on one side of the feeding channel.
  • This is implemented in the third preferred embodiment of the component detection device according to the invention by a four-part sub-sensor disposed below the feeding channel.
  • this embodiment lends itself particularly to the use of a magnetoresistive sensor.
  • a permanent magnet or a field coil for example, by which a magnetic or electromagnetic field can be generated.
  • the feeding rail there is disposed a plurality of Hall sensors which detect the changed flux density of the field generated by the permanent magnet or field coil in response to the components moved along the feeding channel.
  • the Hall sensors are linked to the control device to enable the detected field variation to be analyzed so that the signal can be emitted by the control device if the number of components in the feeding channel falls below a predetermined minimum number.
  • This component feeding device has a framework. Disposed on said framework is a feeding rail as described in greater detail above in connection with the embodiments of the component detection device according to the invention.
  • the feeding rail basically extends from an unloading point at which components 200 transported along the feeding channel in the feeding direction can be removed from the component feeding device by a handling device, the components being supplied from a magazine which is disposed in a magazine housing of the component feeding device according to the invention.
  • the sensor of the component detection device according to the invention is preferably disposed under the feeding channel in the proximity of the unloading point for the components of the component feeding device according to the invention.
  • the other arrangements for the electromagnetic sensor explained in connection with the different embodiments of the component detection device according to the invention are also possible.
  • One embodiment of the electromagnetic sensor according to the invention is particularly suitable for capacitive detection of components or splicing elements in the feeding channel.
  • the sensor has two sub-sensors which are essentially disposed facing one another in an interdigitated pattern so as to leave a meander-shaped interspace in one sensor plane between the sub-sensors. Because of the intermeshing of the two sub-sensors, the sensor is very sensitive to permittivity variations in its vicinity. The sensor is therefore suitable for sensitive detection of tiny components in the feeding channel.
  • the common feature of all the embodiments according to the invention is that, in order to detect components in the feeding channel of a component feeding device, no openings need to be provided in the feeding rail or feeding rail cover to enable components to be detected in said feeding channel. This is advantageous particularly in the case of small or very small components, as the openings for these components can only be manufactured with the required precision at very high cost.
  • FIGS. 1 a and 1 b show a first embodiment of the capacitive proximity sensor according to the invention
  • FIGS. 2 a and 2 b show a second embodiment of the capacitive proximity sensor according to the invention
  • FIGS. 3 a and 3 b show further embodiments of the capacitive proximity sensor according to the invention.
  • FIG. 4 shows an axially symmetrical embodiment of the capacitive proximity sensor according to the invention.
  • FIG. 5 shows a further axially symmetrical embodiment of the capacitive proximity sensor according to the invention.
  • two or more sensor surfaces are for example etched onto a substrate such as FR4 or printed circuit board material.
  • the substrate in conjunction with the sensor surfaces forms a capacitive sensor or a capacitive coupling element.
  • the sensor according to the invention is simple and inexpensive to manufacture, easily contacted electrically and can be integrated or mounted for example in a tape channel of a feeding module for placement systems on the upper or and/or lower side.
  • the sensor according to the invention is made approximately as wide as the component tape sprocket holes 210 used to transport the component tape by means of a pin wheel whose pins engage in the holes 210 .
  • the sensor is disposed for example below or above the position of these holes 210 in the tape channel of the feeding module. As soon as a splice at which a splicing element is located passes the sensor according to the invention, either data transmission between the sensor surfaces of the capacitive proximity sensor according to the invention is disturbed or an oscillator connected to the transmitter surfaces of the capacitive proximity sensor is influenced.
  • an evaluation device which can be designed as a discrete circuit and/or can be implemented by means of programming in a computer present in the feeding module or in the placement system.
  • the type of material of the object to be detected is essentially irrelevant. It is merely necessary for the material of the object to be detected to have a different relative dielectric constant than that of the component tape material.
  • FIGS. 1 a and 1 b show a preferred embodiment of the inventive capacitive proximity sensor 110 and its arrangement relative to a tape channel of a feeding device (not shown) for component tapes 310 , 320 , the sensor 110 according to the invention having two sensor surfaces each of interdigitated comb design and with the teeth facing one another so as to leave a clearance between the teeth in each case.
  • the sensor surfaces of the sensor 110 are disposed on a substrate (not shown) in this manner.
  • FIG. 1 a illustrates the position of the sensor 110 according to the invention relative to a component tape 200 that can be transported in the tape channel 310 , 320 of the feeding module.
  • the component tape 200 has sprocket holes 210 along its longitudinal direction, and component pockets in which components 240 can be accommodated.
  • the inventive capacitive proximity sensor 110 is disposed in the lower section 320 of the feeding channel 310 , 320 . This enables in particular components 240 in the component tape 200 to be easily detected. It is also possible to dispose the sensor 110 above the component tape 200 on/in the feeding channel 310 , 320 .
  • FIGS. 2 a and 2 b illustrate an embodiment of the capacitive proximity sensor according to the invention which is suitable for detecting splicing elements 230 used to join two component tapes 200 , the inventive capacitive sensor 120 being disposed in the region of the sprocket holes 210 of the component tape 200 on the upper side 310 and/or the lower side 320 of the tape channel of a component feeding module, as the splicing element 230 is also mounted on the sprocket holes 210 of the component tape 200 .
  • This provides easy detection of the splicing element 230 by means of the inventive capacitive proximity sensor 120 according to this embodiment.
  • FIG. 3 a shows an embodiment wherein a plurality of parallel sensor surfaces are disposed one after the other in the longitudinal direction of the component tape 200 , said sensor surfaces of the sensor 130 each being connected alternately in the transport direction of the component tape 200 to one of two connecting leads of the sensor 103 so that, viewed in the transport direction of the component tape 200 , one or more bar-like sensor surfaces disposed crosswise to the transport direction are provided with alternate sensor connection or polarity.
  • FIG. 3 b shows an inventive capacitive proximity sensor 140 provided with two sensor surfaces which extend parallel to one another in the transport direction of the component tape 200 over a plurality of sprocket holes 210 .
  • FIGS. 4 and 5 depict axially symmetrical sensor surfaces of a capacitive proximity sensor according to the invention.
  • the embodiment of the invention according to FIG. 4 has an axially symmetrical capacitive proximity sensor 150 .
  • This has a first sensor surface 151 extending in a first direction over approximately the entire length of the sensor 150 .
  • the first sensor surface 151 is symmetrical about an axis perpendicular to the first direction. It has an interdigitated or comb-like structure, the teeth or fingers essentially pointing in a second direction perpendicular to the first direction.
  • the capacitive proximity sensor 150 shown in FIG. 4 is additionally provided with a second sensor surface 152 and a third sensor surface 153 which are likewise of interdigitated or comb-like design and disposed symmetrically about the axis of symmetry of the sensor 150 in such a way that the fingers of the second sensor surface or the fingers of the third sensor surface are disposed facing those of the first sensor surface.
  • This produces a meander-shaped interspace between the fingers or teeth of the first sensor surface and the second sensor surface or third sensor surface.
  • This structure is particularly suitable for differential detection of components and/or splicing elements.
  • the measuring result can be improved still further by electrically connecting the first sensor surface 150 , as illustrated in FIG. 4, to a reference potential.
  • the first sensor surface 161 of the sensor 160 has two interdigitated or comb-like extensions in and counter to the first direction of extension which are spaced facing one another crosswise with respect to the direction of extension.
  • a second sensor surface 162 and a third sensor surface 163 are disposed within the interspace of the extensions of the first sensor surface 160 which are disposed in or counter to the first direction.
  • the second sensor surface 162 and the third sensor surface 163 are implemented and disposed symmetrically about the axis of symmetry of the sensor 160 .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Feeding Of Articles To Conveyors (AREA)
US10/486,097 2001-08-09 2002-08-08 Capacitive proximity sensor for detecting component belts, component feeding device and method for detecting component belts Abandoned US20040175257A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10139158A DE10139158C1 (de) 2001-08-09 2001-08-09 Bauelemente-Erfassungsvorrichtung, Bauelemente-Zuführvorrichtung und Verfahren zum Zuführen von Bauelementen mittels einer Bauelemente-Zuführvorrichtung
DE10139158.7 2001-08-09
PCT/EP2002/008905 WO2003015281A2 (fr) 2001-08-09 2002-08-08 Capteur de proximite capacitif destine a detecter des bandes de composants, dispositif d'alimentation de composants et procede de detection de bandes de composants

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US20040175257A1 true US20040175257A1 (en) 2004-09-09

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US10/486,097 Abandoned US20040175257A1 (en) 2001-08-09 2002-08-08 Capacitive proximity sensor for detecting component belts, component feeding device and method for detecting component belts

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US (1) US20040175257A1 (fr)
EP (1) EP1415397B1 (fr)
KR (1) KR20040025745A (fr)
CN (1) CN1311633C (fr)
DE (1) DE10139158C1 (fr)
WO (1) WO2003015281A2 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050270273A1 (en) * 2003-06-13 2005-12-08 Victor Marten Sensor for capacitive touch pad pointing device
US20080238449A1 (en) * 2007-03-27 2008-10-02 Denso Corporation Fluid sensor and impedance sensor
US20100290885A1 (en) * 2009-05-13 2010-11-18 Accu-Assembly Incorporated Detecting component carrier tape splicing
US20120227259A1 (en) * 2011-02-24 2012-09-13 Cypress Semiconductor Corporation Single layer touch sensor
US20130193989A1 (en) * 2010-09-10 2013-08-01 Brose Fahrzeugteile Gmbh & Co. Kg, Hallstadt Capacitive distance sensor
US20140111436A1 (en) * 2008-04-30 2014-04-24 Apple Inc. Multi-touch sensor patterns and stack-ups
US9292138B2 (en) 2013-02-08 2016-03-22 Parade Technologies, Ltd. Single layer sensor pattern
CN105530007A (zh) * 2014-10-20 2016-04-27 福特全球技术公司 定向接近开关总成
US9389258B2 (en) 2011-02-24 2016-07-12 Parade Technologies, Ltd. SLIM sensor design with minimum tail effect
US9542042B2 (en) 2011-02-24 2017-01-10 Parade Technologies, Ltd. Scanning a single-layer capacitive sense array
US9658726B2 (en) 2014-07-10 2017-05-23 Cypress Semiconductor Corporation Single layer sensor pattern
US10236562B2 (en) * 2016-11-11 2019-03-19 Acer Incorporated Separated and optimization sensor pad design for dual mode LTE application
US10317715B2 (en) * 2012-07-24 2019-06-11 Tpk Touch Solutions(Xiamen) Inc. Touch panel and a manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010000585A1 (de) * 2010-03-01 2011-09-01 Krones Ag Transportstrecke und Verfahren zur Füllstandsermittlung einer Transportstrecke

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519922A (en) * 1965-12-16 1970-07-07 Nash & Harrison Ltd Apparatus for detecting abrupt change in the thickness of sheet material
US3643706A (en) * 1969-08-18 1972-02-22 Wyott Corp Proximity control apparatus
US4191894A (en) * 1976-11-18 1980-03-04 Mitsubishi Denki Kabushiki Kaisha Proximity detector
US4258326A (en) * 1978-04-17 1981-03-24 VEB Polygraph Leipzig, Kombinat fur polygraphische Maschinen und Ausrustungen Capacitive detection of absent and/or double sheets in the sheet transport path of a printing machine
US4261440A (en) * 1979-06-26 1981-04-14 Otis Elevator Company Automatically compensating object detection circuit
US5130672A (en) * 1987-04-22 1992-07-14 Watkiss Automation Limited Apparatus and method for sensing the presence of moving objects
US5447068A (en) * 1994-03-31 1995-09-05 Ford Motor Company Digital capacitive accelerometer
US5650730A (en) * 1995-05-09 1997-07-22 Automated Quality Technologies Inc. Label detection and registration system
US5762252A (en) * 1997-04-30 1998-06-09 Eastman Kodak Company Detector for regions of excess thickness in a moving web and web transport system including such detector
US5992233A (en) * 1996-05-31 1999-11-30 The Regents Of The University Of California Micromachined Z-axis vibratory rate gyroscope
US6065341A (en) * 1998-02-18 2000-05-23 Denso Corporation Semiconductor physical quantity sensor with stopper portion
US6230566B1 (en) * 1999-10-01 2001-05-15 The Regents Of The University Of California Micromachined low frequency rocking accelerometer with capacitive pickoff
US6532824B1 (en) * 1999-07-09 2003-03-18 Tokin Corporation Capacitive strain sensor and method for using the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2363069A1 (de) * 1973-12-19 1975-07-03 Merten Kg Pulsotronic Elektronisches, beruehrungslos wirkendes schaltgeraet
JPS60169719A (ja) * 1984-02-14 1985-09-03 Nippon Soken Inc 物理量検出装置
US5738323A (en) * 1996-09-03 1998-04-14 Micron Electronics, Inc. Positioner for overhanging components
JP4197549B2 (ja) * 1998-06-24 2008-12-17 富士機械製造株式会社 電気部品供給装置およびプリント回路板組立方法
DE19956630A1 (de) * 1999-11-25 2001-05-31 Merten Gmbh & Co Kg Kapazitiver Tastschalter

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519922A (en) * 1965-12-16 1970-07-07 Nash & Harrison Ltd Apparatus for detecting abrupt change in the thickness of sheet material
US3643706A (en) * 1969-08-18 1972-02-22 Wyott Corp Proximity control apparatus
US4191894A (en) * 1976-11-18 1980-03-04 Mitsubishi Denki Kabushiki Kaisha Proximity detector
US4258326A (en) * 1978-04-17 1981-03-24 VEB Polygraph Leipzig, Kombinat fur polygraphische Maschinen und Ausrustungen Capacitive detection of absent and/or double sheets in the sheet transport path of a printing machine
US4261440A (en) * 1979-06-26 1981-04-14 Otis Elevator Company Automatically compensating object detection circuit
US5130672A (en) * 1987-04-22 1992-07-14 Watkiss Automation Limited Apparatus and method for sensing the presence of moving objects
US5447068A (en) * 1994-03-31 1995-09-05 Ford Motor Company Digital capacitive accelerometer
US5650730A (en) * 1995-05-09 1997-07-22 Automated Quality Technologies Inc. Label detection and registration system
US5992233A (en) * 1996-05-31 1999-11-30 The Regents Of The University Of California Micromachined Z-axis vibratory rate gyroscope
US5762252A (en) * 1997-04-30 1998-06-09 Eastman Kodak Company Detector for regions of excess thickness in a moving web and web transport system including such detector
US6065341A (en) * 1998-02-18 2000-05-23 Denso Corporation Semiconductor physical quantity sensor with stopper portion
US6532824B1 (en) * 1999-07-09 2003-03-18 Tokin Corporation Capacitive strain sensor and method for using the same
US6230566B1 (en) * 1999-10-01 2001-05-15 The Regents Of The University Of California Micromachined low frequency rocking accelerometer with capacitive pickoff

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7580030B2 (en) * 2003-06-13 2009-08-25 Semtech Corporation Sensor for capacitive touch pad pointing device
US20050270273A1 (en) * 2003-06-13 2005-12-08 Victor Marten Sensor for capacitive touch pad pointing device
US20080238449A1 (en) * 2007-03-27 2008-10-02 Denso Corporation Fluid sensor and impedance sensor
US20140111436A1 (en) * 2008-04-30 2014-04-24 Apple Inc. Multi-touch sensor patterns and stack-ups
US20100290885A1 (en) * 2009-05-13 2010-11-18 Accu-Assembly Incorporated Detecting component carrier tape splicing
US8269973B2 (en) * 2009-05-13 2012-09-18 Accu-Assembly Incorporated Detecting component carrier tape splicing
US20130193989A1 (en) * 2010-09-10 2013-08-01 Brose Fahrzeugteile Gmbh & Co. Kg, Hallstadt Capacitive distance sensor
US10677579B2 (en) 2010-09-10 2020-06-09 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Bamberg Capacitive distance sensor
US9702682B2 (en) * 2010-09-10 2017-07-11 Brose Fahrzeugteile Gmbh & Co. Kg, Bamberg Capacitive distance sensor
US20120227259A1 (en) * 2011-02-24 2012-09-13 Cypress Semiconductor Corporation Single layer touch sensor
US9389258B2 (en) 2011-02-24 2016-07-12 Parade Technologies, Ltd. SLIM sensor design with minimum tail effect
US9542042B2 (en) 2011-02-24 2017-01-10 Parade Technologies, Ltd. Scanning a single-layer capacitive sense array
US9952737B2 (en) * 2011-02-24 2018-04-24 Parade Technologies, Ltd. Single layer touch sensor
US10317715B2 (en) * 2012-07-24 2019-06-11 Tpk Touch Solutions(Xiamen) Inc. Touch panel and a manufacturing method thereof
US10901256B2 (en) * 2012-07-24 2021-01-26 Tpk Touch Solutions (Xiamen) Inc. Touch panel module, touch device and manufacturing method thereof
US9292138B2 (en) 2013-02-08 2016-03-22 Parade Technologies, Ltd. Single layer sensor pattern
US9658726B2 (en) 2014-07-10 2017-05-23 Cypress Semiconductor Corporation Single layer sensor pattern
CN105530007A (zh) * 2014-10-20 2016-04-27 福特全球技术公司 定向接近开关总成
US10236562B2 (en) * 2016-11-11 2019-03-19 Acer Incorporated Separated and optimization sensor pad design for dual mode LTE application

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KR20040025745A (ko) 2004-03-25
EP1415397B1 (fr) 2012-10-24
CN1568571A (zh) 2005-01-19
EP1415397A2 (fr) 2004-05-06
WO2003015281A2 (fr) 2003-02-20
DE10139158C1 (de) 2003-04-17
CN1311633C (zh) 2007-04-18
WO2003015281A3 (fr) 2003-09-18

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