Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
  • C03C27/06—Joining glass to glass by processes other than fusing
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B82—NANOTECHNOLOGY
  • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
  • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B82—NANOTECHNOLOGY
  • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
  • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
  • C03C27/005—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing with compositions containing more than 50% lead oxide by weight
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
  • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
  • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
  • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
  • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
  • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
  • H01J29/86—Vessels; Containers; Vacuum locks
  • H01J29/863—Vessels or containers characterised by the material thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J31/00—Cathode ray tubes; Electron beam tubes
  • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
  • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
  • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
  • H01J31/123—Flat display tubes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
  • H01J5/20—Seals between parts of vessels
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
  • H01J5/20—Seals between parts of vessels
  • H01J5/22—Vacuum-tight joints between parts of vessel
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
  • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
  • H01J9/26—Sealing together parts of vessels
  • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display

Definitions

• the present invention relates to a composition that may be used for sealing applications in the manufacture of electronic displays.
• the composition includes organic vehicles that may be removed upon low temperature firing in air or inert atmospheres.
• a further embodiment of this invention is a sealing process comprising (a) depositing a bead or patterned layer of the composition of claim 1 on a first substrate, (b) volatilizing the solvent and/or organic vehicle, (c) bringing a second substrate into contact with the bead or patterned layer, and (d) firing the bead or patterned layer.
• the organic vehicle in the composition is thermally fugitive and/or pyrolyzes at low temperature. While pyrolysis usually involves the transformation of a material into other substances through the application of heat alone in the absence of oxidation, the organic vehicle as used herein is fugitive in air at a temperature of 430° C. or less. In particular embodiments where oxygen is excluded, such as an atmosphere of nitrogen or other inert atmosphere, the organic vehicle is also fugitive at a temperature of 430° C. or less.
• Glass frits typically contain finely ground inorganic materials mixed with fluxes, which are transformed into a glass or enamel upon heating. Suitable glass frits include those that contain materials such as PbO, B 2 O 3 , Al 2 O 3 , SiO 2 and ZnO, and may be obtained commercially from suppliers such as Viox, Asahi and DuPont.
• the median particle size (d50) of the glass frit is about 1 to about 100 microns ( ⁇ m), is preferably about 1 to about 50 microns, and is more preferably about 1 to about 25 microns.
• composition will contain a suitable low boiling solvent, representative examples of which include an ester alcohol, hexane, heptane, toluene, methylene chloride, ethyl acetate, butyl acetate, methyl ethyl ketone and xylenes.
• a suitable low boiling solvent representative examples of which include an ester alcohol, hexane, heptane, toluene, methylene chloride, ethyl acetate, butyl acetate, methyl ethyl ketone and xylenes.
• the components of the composition may be present therein in amounts, by total weight of the composition, as follows: organic vehicle—about 1 to about 20 parts by weight (pbw) or about 5 to about 15 pbw, glass frit—about 60 to about 100 pbw or about 65 to about 95 pbw, solvent—about 1 to about 40 pbw or about 10 to about 25 pbw, and (when present as an optional component) filler—about 1 to about 5 pbw or about 1.5 to about 3 pbw; where the pbw may, but need not, add to 100.
• organic vehicle about 1 to about 20 parts by weight (pbw) or about 5 to about 15 pbw
• glass frit about 60 to about 100 pbw or about 65 to about 95 pbw
• solvent about 1 to about 40 pbw or about 10 to about 25 pbw
• filler about 1 to about 5 pbw or about 1.5 to about 3 pbw; where the pbw may, but need not, add
• compositions can be used in bonding glass surfaces to each other for use, for example, in field emission devices or lighting devices. They provide highly reliable glass-to-glass seals, for example, in electronic display applications such as in flat panel displays, which contain electronic device elements such electron field emitters.
• front and back glass substrate plates that together make up the outer structure of the display are sealed together with a sealing composition.
• the enclosed cavity between the glass plates containing other elements of the display is evacuated to a low gaseous pressure.
• the front and back glass substrate plates are also the anode and cathode of the display.
• the sealing composition is applied near the outer edges of the anode and cathode glass substrate plates as a printed or extruded thick film paste deposit.
• the sealing composition may be applied on the anode or cathode substrate only, and then the two substrate plates are brought in contact. Incorporation of an organic vehicle in the composition is necessary to enable proper deposit of the composition as a thick film paste in the desired location.
• the substrate plates may be brought together before or after volatilization of the organic vehicle and/or solvent, and the firing of the sealing composition. Volatilization of the organic vehicle and/or solvent may be performed by evaporation at ambient temperature or by drying at a low temperature such as about 125° C. Fired compositions may be refired to accomplish sealing.
• low temperature elimination of the organic vehicle is particularly important in the case of field emission displays (FEDs) that comprise acicular emitting substances such as acicular carbon, e.g. single-wall or multi-wall carbon nanotubes (CNTs), as emitter elements.
• FEDs field emission displays
• acicular emitting substances such as acicular carbon, e.g. single-wall or multi-wall carbon nanotubes (CNTs)
• CNTs carbon nanotubes
• Other components of displays or other electronic devices can also be susceptible to degradation at elevated temperature, particularly in the presence of oxygen.
• a sealing composition that is processed at lower temperatures, and/or that requires no oxygen, for adequate removal of the organic vehicle offers a strong practical advantage in display manufacture.
• composition of this invention provide a high vacuum seal between plates of glass such that the resulting cavity between the plates can be pumped down to about 10 ⁇ 7 torr vacuum or lower.
• the composition, when fired in the manner described herein, will have a glossy surface. A composition that fires out with a matt surface appearance is less likely to provide acceptable sealing of the glass plates.
• Organic vehicles for use in the following examples are prepared as described below. These OVs are different mixtures of PAMS, butylated PAMS and polymethacrylate oligomers, primarily dimers and trimers, as shown in Table 1. TABLE 1 Organic Vehicle 2-1 2-2 3 1-1 Butylated Butylated Methacrylate Type PAMS PAMS PAMS Oligomers Percent dimer 60% >95% >90% ⁇ 1% Percent trimer 40% ⁇ 3% 10% >95% Viscosity (Poise) 4.0 26 71 6.0
• OV 1-1 Several variations of OV 1-1 are made and evaluated. They differ in their ratios of dimer to trimer as shown in Table 2: TABLE 2 Organic Vehicle 1-1 1-2 1-3 Percent dimer 60% 78% 65% Percent trimer 40% 22% 35% Viscosity (Poise) 4.0 1.0 3.5
• OVs 1-1, 1-2, 1-3, 2-1, 2-2 and 3, as obtained from DuPont (Wilmington Del.), are prepared according to the following procedures, as more particularly described in U.S. Pat. No. 5,344,592 and U.S. Pat. No. 5,397,383:
• AMS Alpha-methylstyrene
• AMS Alpha-methylstyrene
• AMS alpha-methylstyrene
• AlCl3 0.7 g, 5.2 mmole
• dichloromethane 1.0 L, dried over 3 ⁇ molecular sieves
• 4 L beaker a drybox at room temperature.
• 1 L AMS about 0.2 L dichloromethane is added to make up for the solvent evaporated due to the reaction exotherm.
• the reaction mixture is deactivated with 0.3 L methanol, washed three times with water, dried over calcium chloride, filtered and volatiles stripped first using a rotary evaporator and then high vacuum.
• the reaction product from Preparation 1 is fractionally distilled to yield the dimeric form of AMSID, and is collected for use as a starting material for this preparation.
• a mixture of 1,1,3-trimethyl-3-phenylindan (53 g, 0.255 mole), 2-chloro-2-methylpropane (41.6 g, 0.449 mole), AlCl 3 (0.5 g, 3.76 mmole) and dichloromethane (60 mL, dried over 3 ⁇ molecular sieves) is stirred for three days at room temperature in a drybox.
• reaction mixture is deactivated with 10 mL methanol, diluted with 100 mL dichloromethane, washed four times with water, dried over calcium chloride, filtered and volatiles stripped first using a rotary evaporator and then high vacuum.
• AMS (100 mL, 0.77 mole) is added slowly with stirring over 45 min to a mixture of AlCl 3 (0.2 g, 1.50 mmole) and 1,2-dichloroethane (100 mL) at 60-90° C. under nitrogen. After 1 h, GC showed no unreacted AMS, 79% indan dimer and 15% indan trimer isomers in the reaction system. The mixture is cooled down to room temperature. AlCl 3 (0.5 g, 3.75 mmole) and 2-chloro-2-methylpropane (10 mL, 0.119 mole) are added with stirring. After 3 hours, the reaction mixture is deactivated with 40 ml methanol, washed three times with water, dried over calcium chloride, filtered and volatiles stripped first using a rotary evaporator and then high vacuum.
• Methylmethacrylate (8 g) and methylethyl ketone (5 g) are charged into the reactor equipped with stirrer, reflux condenser, thermocouple, under nitrogen positive pressure, and heated at 80° C.
• diaquabis (borondifluorodiphenylglyoxymato) cobaltate (II), Co(DPG-BF2) 2 , (KG-10618) (0.1 g) in methylethyl ketone (10 g) is added.
• methylmethacrylate (40 g) and Vazo 52 (4 g) in methylethyl ketone (13 g) are fed concurrently into the reactor over 240 and 300 min., respectively.
• Tables 3 and 4 summarize the content of the compositions prepared for Examples 1 ⁇ 10 as various formulations of sealing compositions incorporating thermally fugitive OVs. These compositions are made into thick film pastes and tested for sealing performance between plates of soda-lime glass.
• compositions use glass frits obtained from Viox Corporation (Seattle Wash.) that contained PbO, B 2 O 3 , Al 2 O 3 , SiO 2 , and ZnO.
• the Viox frit number 24935 additionally contained PbF 2 .
• the PbO content is greater than 50% by weight.
• Viox frit number 24927 used in Examples 1, 3, 4 and 5 has a median particle size of 5 ⁇ m. Viox frit number 24927 with median particle sizes of 1.7 ⁇ m, 5 ⁇ m and 10 ⁇ m is also evaluated for corresponding performance.
• the Cab-O-Sil M® fumed silica used is from the Cabot Corporation (Boston Mass.).
• compositions use glass frits obtained from DuPont (Wilmington Del.) that contain 77.0% PbO, 12.5% B 2 O 3 , 1.4% Al 2 O 3 and 9.1% SiO 2 . These compositions are made by a procedure similar to that set forth above for Example 1 ⁇ 10. TABLE 5 Example Number 11 12 13 14 Ingredient Wt. % Wt. % Wt. % Wt. % DuPont frit 81.8 81.8 77.9 74.4 Cab-O-Sil ® fumed 0 0 1.0 1.8 silica OV 1-1 9.1 9.1 8.7 8.3 Texanol ® solvent 9.1 9.1 12.4 15.5 Total 100.00 100.00 100.00 100.00 100.00 100.00
• Table 6 summarizes the content of the compositions prepared for Examples 15 ⁇ 18 as various formulations of sealing compositions incorporating thermally fugitive OVs. These compositions are made into thick film pastes and tested for sealing performance between plates of soda-lime glass.
• Table 7 summarizes the content of the compositions prepared for Examples 19 ⁇ 22 as various formulations of sealing compositions incorporating thermally fugitive OVs. These compositions are made into thick film pastes and tested for sealing performance between plates of soda-lime glass.
• Each of the sealing compositions made as described above is printed through an 80 mesh screen in a 1.0′′ ⁇ 1.0′′ “window frame” pattern on to 2.0′′ ⁇ 2.0′′ soda-lime glass substrates.
• the samples are then dried in air at about 125° C. for 15 minutes.
• the screen printing is repeated a second and additional times on top of the dried prints, resulting in a thicker final print.
• the sealing composition is extruded through a 12 gauge orifice onto the soda-lime glass substrates. Some of these tests are carried out on 5′′ ⁇ 5′′ soda-lime glass substrates. Additional trials are run with the composition printed or extruded as a thick film paste onto glass coated with indium tin oxide (ITO). All samples with printed or extruded thick film paste are then dried in air at about 125° C. for 15 minutes.
• ITO indium tin oxide
• firing occurs at a lower temperature (280° C. to 400° C.) to eliminate the bulk of the low firing organic vehicle.
• the low temperature firing may be carried out in air.
• the preferred mode is to carry out the firing in an inert atmosphere such as nitrogen to minimize oxidation of other components of the device being fabricated, when such components are an integral part of the glass plates which are being sealed together.
• firing occurs at a higher temperature (360° C. to 480° C.) in an inert atmosphere (such as nitrogen) to sinter the glass frit and create a hermetic seal between the glass substrates.
• a higher temperature 360° C. to 480° C.
• an inert atmosphere such as nitrogen
• the sintering or higher temperature firing is carried out in an inert atmosphere to minimize oxidation of other components of the device being fabricated, when such components are an integral part of the glass plates, which are being sealed together.
• the tolerance for low levels (1-1,000 ppm) of oxygen in this firing step is solely dependent on the sensitivity of the other components of the device to oxygen.

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• General Chemical & Material Sciences (AREA)
• Geochemistry & Mineralogy (AREA)
• Life Sciences & Earth Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Ceramic Engineering (AREA)
• Nanotechnology (AREA)
• Physics & Mathematics (AREA)
• Crystallography & Structural Chemistry (AREA)
• Manufacturing & Machinery (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Mathematical Physics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Composite Materials (AREA)
• Sealing Material Composition (AREA)
• Glass Compositions (AREA)
• Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)

Priority Applications (2)

Applications Claiming Priority (3)

Related Child Applications (1)

Publications (1)

Family

ID=35652559

Family Applications (2)

Family Applications After (1)

Country Status (6)

Cited By (2)

Families Citing this family (3)

Citations (10)

Family Cites Families (9)

• 2005
  • 2005-09-23 WO PCT/US2005/034191 patent/WO2006044109A1/fr not_active Ceased
  • 2005-09-23 EP EP05805648A patent/EP1807370A1/fr not_active Withdrawn
  • 2005-09-23 US US11/233,804 patent/US20070194687A1/en not_active Abandoned
  • 2005-09-23 JP JP2007533659A patent/JP4880606B2/ja not_active Expired - Fee Related
  • 2005-09-23 KR KR1020077009187A patent/KR20070054741A/ko not_active Ceased
  • 2005-09-23 CN CN2005800325248A patent/CN101027257B/zh not_active Expired - Fee Related
• 2010
  • 2010-01-19 US US12/689,792 patent/US8053258B2/en not_active Expired - Fee Related

Patent Citations (10)

Also Published As

Similar Documents

Legal Events