US20130184794A1 - Architectures for an Implantable Stimulator Device Having a Plurality of Electrode Driver Integrated Circuits with Shorted Electrode Outputs - Google Patents

Architectures for an Implantable Stimulator Device Having a Plurality of Electrode Driver Integrated Circuits with Shorted Electrode Outputs Download PDF

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Publication number
US20130184794A1
US20130184794A1 US13/741,116 US201313741116A US2013184794A1 US 20130184794 A1 US20130184794 A1 US 20130184794A1 US 201313741116 A US201313741116 A US 201313741116A US 2013184794 A1 US2013184794 A1 US 2013184794A1
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US
United States
Prior art keywords
electrode
pulses
integrated circuit
integrated circuits
programmed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/741,116
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English (en)
Inventor
Emanuel Feldman
Jordi Parramon
Paul J. Griffith
Jess Shi
Robert Tong
Goran Marnfeldt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boston Scientific Neuromodulation Corp
Original Assignee
Boston Scientific Neuromodulation Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boston Scientific Neuromodulation Corp filed Critical Boston Scientific Neuromodulation Corp
Priority to US13/741,116 priority Critical patent/US20130184794A1/en
Assigned to BOSTON SCIENTIFIC NEUROMODULATION CORPORATION reassignment BOSTON SCIENTIFIC NEUROMODULATION CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FELDMAN, EMANUEL, GRIFFITH, PAUL J., MARNFELDT, GORAN, PARRAMON, JORDI, SHI, JESS, TONG, ROBERT
Priority to AU2013209855A priority patent/AU2013209855B2/en
Priority to JP2014553361A priority patent/JP5875706B2/ja
Priority to EP23160858.9A priority patent/EP4218918A1/fr
Priority to ES13702540.9T priority patent/ES2653264T3/es
Priority to EP17186448.1A priority patent/EP3281670B1/fr
Priority to EP13702540.9A priority patent/EP2804664B1/fr
Priority to ES17186448T priority patent/ES2943718T3/es
Priority to PCT/US2013/021703 priority patent/WO2013109603A1/fr
Publication of US20130184794A1 publication Critical patent/US20130184794A1/en
Priority to US15/063,072 priority patent/US9656081B2/en
Priority to US15/491,492 priority patent/US10363422B2/en
Priority to US16/443,609 priority patent/US11207521B2/en
Priority to US17/457,366 priority patent/US12151106B2/en
Abandoned legal-status Critical Current

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
    • A61N1/36125—Details of circuitry or electric components
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A61N1/0526—Head electrodes
    • A61N1/0529—Electrodes for brain stimulation
    • A61N1/0534—Electrodes for deep brain stimulation
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
    • A61N1/36128—Control systems
    • A61N1/36146—Control systems specified by the stimulation parameters
    • A61N1/36167—Timing, e.g. stimulation onset
    • A61N1/36171—Frequency
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • timing channel 176 1 (corresponding to array 102 ) is used to provide the cathodic and anodic pulses respectively at electrode E 1 (for example) and Ec (the case electrode) at a particular frequency (f 1 ), pulse width (pw 1 ), and amplitude (a 1 ).
  • timing channel 176 1 passes therapeutic current pulses between electrodes Ec and E 1 , with Ec comprising the current source, and E 1 the corresponding current sink.
  • Timing channel 176 2 (corresponding to array 103 ) likewise is used to provide cathodic and anodic pulses respectively at electrode E 7 (for example) and Ec, but with a different frequency (f 2 ), and with a particular pulse width (pw 2 ), and amplitude (a 2 ).
  • timing channels 176 1 and 176 2 will stimulate different regions on one (e.g., right) side of the brain.
  • FIG. 6B describes one algorithm 500 for setting V+ to an optimal level in the improved system 290 .
  • the algorithm can start ( 501 ) at any time the IPG is operating and providing pulses, but in one example starts when therapy setting have been adjusted in some fashion. This can occur, for example, when the patient or clinician has used an external controller to change the frequencies, durations, or amplitudes of the pulses, or has chosen new electrodes for stimulation.

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  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • Neurology (AREA)
  • Engineering & Computer Science (AREA)
  • Neurosurgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biomedical Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Radiology & Medical Imaging (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Cardiology (AREA)
  • Psychology (AREA)
  • Electrotherapy Devices (AREA)
US13/741,116 2012-01-16 2013-01-14 Architectures for an Implantable Stimulator Device Having a Plurality of Electrode Driver Integrated Circuits with Shorted Electrode Outputs Abandoned US20130184794A1 (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
US13/741,116 US20130184794A1 (en) 2012-01-16 2013-01-14 Architectures for an Implantable Stimulator Device Having a Plurality of Electrode Driver Integrated Circuits with Shorted Electrode Outputs
PCT/US2013/021703 WO2013109603A1 (fr) 2012-01-16 2013-01-16 Architectures pour un dispositif stimulateur implantable présentant une pluralité de circuits intégrés de commande d'électrodes à sorties d'électrodes court-circuitées
EP17186448.1A EP3281670B1 (fr) 2012-01-16 2013-01-16 Architectures pour un dispositif stimulateur implantable ayant une pluralité de circuits intégrés avec excitateur d'électrode et sorties d'électrode court-circuitées
ES17186448T ES2943718T3 (es) 2012-01-16 2013-01-16 Arquitecturas para un dispositivo estimulador implantable con una pluralidad de circuitos integrados controladores de electrodos con salidas de electrodos en cortocircuito
JP2014553361A JP5875706B2 (ja) 2012-01-16 2013-01-16 短絡電極出力を備えた複数の電極ドライバ集積回路を有する埋込み可能刺激器デバイスのためのアーキテクチャ
EP23160858.9A EP4218918A1 (fr) 2012-01-16 2013-01-16 Architectures pour dispositif stimulateur implantable ayant une pluralité de circuits intégrés de commande d'électrode à sorties d'électrode court-circuitées
ES13702540.9T ES2653264T3 (es) 2012-01-16 2013-01-16 Arquitecturas para un dispositivo estimulador implantable que tiene una pluralidad de circuitos integrados de controlador de electrodos con salidas de electrodos en cortocircuito
AU2013209855A AU2013209855B2 (en) 2012-01-16 2013-01-16 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
EP13702540.9A EP2804664B1 (fr) 2012-01-16 2013-01-16 Architectures pour un dispositif stimulateur implantable présentant une pluralité de circuits intégrés de commande d'électrodes à sorties d'électrodes court-circuitées
US15/063,072 US9656081B2 (en) 2012-01-16 2016-03-07 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US15/491,492 US10363422B2 (en) 2012-01-16 2017-04-19 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US16/443,609 US11207521B2 (en) 2012-01-16 2019-06-17 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US17/457,366 US12151106B2 (en) 2012-01-16 2021-12-02 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261586930P 2012-01-16 2012-01-16
US13/741,116 US20130184794A1 (en) 2012-01-16 2013-01-14 Architectures for an Implantable Stimulator Device Having a Plurality of Electrode Driver Integrated Circuits with Shorted Electrode Outputs

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/063,072 Continuation US9656081B2 (en) 2012-01-16 2016-03-07 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs

Publications (1)

Publication Number Publication Date
US20130184794A1 true US20130184794A1 (en) 2013-07-18

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Family Applications (5)

Application Number Title Priority Date Filing Date
US13/741,116 Abandoned US20130184794A1 (en) 2012-01-16 2013-01-14 Architectures for an Implantable Stimulator Device Having a Plurality of Electrode Driver Integrated Circuits with Shorted Electrode Outputs
US15/063,072 Expired - Fee Related US9656081B2 (en) 2012-01-16 2016-03-07 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US15/491,492 Active 2033-05-20 US10363422B2 (en) 2012-01-16 2017-04-19 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US16/443,609 Active 2034-01-20 US11207521B2 (en) 2012-01-16 2019-06-17 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US17/457,366 Active 2033-11-10 US12151106B2 (en) 2012-01-16 2021-12-02 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs

Family Applications After (4)

Application Number Title Priority Date Filing Date
US15/063,072 Expired - Fee Related US9656081B2 (en) 2012-01-16 2016-03-07 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US15/491,492 Active 2033-05-20 US10363422B2 (en) 2012-01-16 2017-04-19 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US16/443,609 Active 2034-01-20 US11207521B2 (en) 2012-01-16 2019-06-17 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
US17/457,366 Active 2033-11-10 US12151106B2 (en) 2012-01-16 2021-12-02 Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs

Country Status (6)

Country Link
US (5) US20130184794A1 (fr)
EP (3) EP4218918A1 (fr)
JP (1) JP5875706B2 (fr)
AU (1) AU2013209855B2 (fr)
ES (2) ES2943718T3 (fr)
WO (1) WO2013109603A1 (fr)

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US20160184591A1 (en) 2016-06-30
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US11207521B2 (en) 2021-12-28
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