Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/34—Sputtering
  • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
  • C23C14/3421—Cathode assembly for sputtering apparatus, e.g. Target using heated targets
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/34—Sputtering
  • C23C14/3457—Sputtering using other particles than noble gas ions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Definitions

• E. Blechschmidt (Ann. d. Phys. 81, (1926), p 1016) states that the cathode disintegration is not accelerated by heating the electrodes, so long as the heating does not extend beyong the gas space.
• the means for forming a thin metallic film comprise heated electrodes of a thickness or greatest cross-sectional dimension is from three-tenths of to approximately equal to the mean free path of the atoms formed by disintegration of the cathode.
• the electrodes are formed of thin metal strips wires or the like.
• the heating of the electrodes may be effected in known manner, e. g. by electric resistance heating, high-frequency heating or the like. More simply the heating may be effected by adapting the cross section of the electrodes to the strength of the dull emission current until the desired rise in temperature of the electrodes is obtained by the bombardment of the ions.
• the heated electrodes produce a restricted hot area in their immediate neighbourhood which considerably increases the mean free path of the metal atoms in this area as compared with their mean free path elsewhere. Owing to the increased mean free path in this hot area, the diiiusion of metal atoms back to the cathode is diminished, whilst, at the same time the thermally energized gas molecules owing to their increased tendency to ionization are urged to return to the cathode. Moreover an increase in the intensity of disintegration is obtained as-a result of the unusually small radius of curvature of the surface of the electrodes, and their higher temperature, which ensures that stems which have difiused back to the cathode, are again projected therefrom.
• a very sensitive article such as a wax plate, absorbs less heat when thin electrodes at red heat are employed, than when the electrodes are water cooled and of larger diameter, and therefore at a lower temperature.
• the above effect is not due to thermal vaporization, since intensive disintegration occurs at temperatures at which the electrode substance has no efiective vapour pressure. That the employment of slender electrodes produces a previously unobserved efiect is evident from the following:
• Example 1 With a pressure of 0.1 mm. of mercury at which the mean free path of gold atoms is about 0.3 mm., a large number of gold wires, 0.3 mm. in diameter, and spaced at intervals of 20 mm. apart, are employed as electrodes. Using carbon dioxide as the filling gas, the optimum disintegration occurs at 1050 volts. If the pressure be reduced'to 0.03 mm. of mercury, the intensity of disintegration, at 1460 volts, is only half that originally obtained, though the current density remains the same.
• Example 2 With a pressure of 0.25 mm. of mercury, at which the mean free path of silver atoms is about 0.4 mm., silver wires with a diameter of 0.23 mm. and spaced at intervals of 40 mm. were employed as the electrodes. Using an atmosphere of hydrogen a high velocity of disintegration was obtained.
• Example 3 An acetate film is silvered by using fine silver wires, 0.3 mm. in diameter, as electrodes and hydrogen at a pressure of 0.09 mm. of mercury as the filling gas. At this pressure the mean free path of the silver atoms is about 1 mm. The voltage is 1400,'and the current mA. The film is taken out of the apparatus at the end of 4 minutes and the thickness 01. the layer is found; to be v By wag of comparison, it may be observed that;
• said eiectrodes is from three-tenths of to approximately equal to the mean free path of the atoms formed by disintegration of the cathode;

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Organic Chemistry (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Physics & Mathematics (AREA)
• Plasma & Fusion (AREA)
• Analytical Chemistry (AREA)
• Physical Vapour Deposition (AREA)
• Inert Electrodes (AREA)
• Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=9857083

Family Applications (1)

Country Status (4)

• 1931
  • 1931-02-10 DE DEB148272D patent/DE649360C/de not_active Expired
• 1932
  • 1932-03-23 GB GB8677/32A patent/GB390319A/en not_active Expired
  • 1932-03-24 FR FR766586D patent/FR766586A/fr not_active Expired
  • 1932-04-12 US US604856A patent/US2028853A/en not_active Expired - Lifetime

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