US2702271A - Process for the deposition of gold or gold alloys - Google Patents
Process for the deposition of gold or gold alloys Download PDFInfo
- Publication number
- US2702271A US2702271A US300126A US30012652A US2702271A US 2702271 A US2702271 A US 2702271A US 300126 A US300126 A US 300126A US 30012652 A US30012652 A US 30012652A US 2702271 A US2702271 A US 2702271A
- Authority
- US
- United States
- Prior art keywords
- gold
- nitro
- bath
- deposition
- hydrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 11
- 230000008021 deposition Effects 0.000 title claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title description 15
- 239000010931 gold Substances 0.000 title description 15
- 229910052737 gold Inorganic materials 0.000 title description 14
- 229910001020 Au alloy Inorganic materials 0.000 title description 10
- 239000003353 gold alloy Substances 0.000 title description 9
- IDCPFAYURAQKDZ-UHFFFAOYSA-N 1-nitroguanidine Chemical compound NC(=N)N[N+]([O-])=O IDCPFAYURAQKDZ-UHFFFAOYSA-N 0.000 claims description 7
- CMUOJBJRZUHRMU-UHFFFAOYSA-N nitrourea Chemical compound NC(=O)N[N+]([O-])=O CMUOJBJRZUHRMU-UHFFFAOYSA-N 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 239000000243 solution Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 13
- 239000001257 hydrogen Substances 0.000 description 13
- 229910052739 hydrogen Inorganic materials 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 8
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 6
- 238000000576 coating method Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 150000002828 nitro derivatives Chemical class 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- -1 aliphatic organic compound Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- the noble metals are the most capable of retaining considerable quantifies of hydrogen.
- the present invention comprises a process for the deposition of gold or gold alloys by electroplating, and a bath for carrying out said process, which permit of avoiding the drawbacks due to the production of hydrogen at the cathode, by preventing said hydrogen to be retained by the coating formed.
- This process consists in passing, as in already known processes, an electric current through an aqueous bath containing in solution an alkaline aurocyanide, the object' to be plated being at the cathode. It is characterized by the use of a bath containing, in the dissolved state, a nitrated derivative of an aliphatic organic compound of low molecular weight.
- the bath according to the invention consists of an aqueous solution containing an alkaline aurocyanide; it is characterized by the fact that it contains, in a dissolved state, a nitrated derivative of an aliphatic organic compound of low molecular weight, such, for instance, as nitro-guanidine and nitro-urea, which are particularly 2,702,271 Patented Feb. 15, '1955 suitable. Either may be used at a concentration of only 5 to 10 grams per litre of bath. It is then found that all the hydrogen produced at the cathode reacts with one or the other of these compounds.
- the thick gold or gold alloy deposits thus obtained are flexible and ductile, free from internal stresses; they do not scale off or break, even when their thickness reaches several tens of microns. On the other hand, these deposits, if quickly heated to a temperature exceeding 400 C., do not deteriorate and blister.
- Example 1 One prepares a gilding bath having the following composition:
- the yield computed in relation to the current consumed, is about 35%
- a bath according to claim 4 containing 5 to 10 grams per litre of the said nitro compound.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH718573X | 1952-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2702271A true US2702271A (en) | 1955-02-15 |
Family
ID=4531336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US300126A Expired - Lifetime US2702271A (en) | 1952-04-28 | 1952-07-21 | Process for the deposition of gold or gold alloys |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US2702271A (fr) |
| CH (1) | CH286122A (fr) |
| DE (1) | DE923406C (fr) |
| FR (1) | FR1067619A (fr) |
| GB (1) | GB718573A (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2978390A (en) * | 1957-07-22 | 1961-04-04 | Bell Telephone Labor Inc | Gold plating solutions |
| US3475290A (en) * | 1965-05-07 | 1969-10-28 | Suwa Seikosha Kk | Bright gold plating solution and process |
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| US3856638A (en) * | 1971-08-20 | 1974-12-24 | Auric Corp | Bright gold electroplating bath and method of electroplating bright gold |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH615464A5 (en) * | 1976-06-01 | 1980-01-31 | Systemes Traitements Surfaces | Special compositions and particular additives for gold electrolysis baths and their use |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1903860A (en) * | 1930-04-25 | 1933-04-18 | Ig Farbenindustrie Ag | Preparation of metallic coatings |
-
1952
- 1952-04-28 CH CH286122D patent/CH286122A/fr unknown
- 1952-07-21 US US300126A patent/US2702271A/en not_active Expired - Lifetime
- 1952-09-23 GB GB23795/52A patent/GB718573A/en not_active Expired
- 1952-12-11 FR FR1067619D patent/FR1067619A/fr not_active Expired
- 1952-12-14 DE DES31495A patent/DE923406C/de not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1903860A (en) * | 1930-04-25 | 1933-04-18 | Ig Farbenindustrie Ag | Preparation of metallic coatings |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2978390A (en) * | 1957-07-22 | 1961-04-04 | Bell Telephone Labor Inc | Gold plating solutions |
| US3475290A (en) * | 1965-05-07 | 1969-10-28 | Suwa Seikosha Kk | Bright gold plating solution and process |
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| US3856638A (en) * | 1971-08-20 | 1974-12-24 | Auric Corp | Bright gold electroplating bath and method of electroplating bright gold |
Also Published As
| Publication number | Publication date |
|---|---|
| DE923406C (de) | 1955-02-10 |
| FR1067619A (fr) | 1954-06-17 |
| GB718573A (en) | 1954-11-17 |
| CH286122A (fr) | 1952-10-15 |
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