US2935664A - Cooler for heat removal on a semi-conductor cell built into a container - Google Patents

Cooler for heat removal on a semi-conductor cell built into a container Download PDF

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Publication number
US2935664A
US2935664A US664723A US66472357A US2935664A US 2935664 A US2935664 A US 2935664A US 664723 A US664723 A US 664723A US 66472357 A US66472357 A US 66472357A US 2935664 A US2935664 A US 2935664A
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US
United States
Prior art keywords
container
cooler
semi
cooling
depressions
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Expired - Lifetime
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US664723A
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English (en)
Inventor
Scharli Otto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
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Bbc Brown Boveri & Cie
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Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
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Publication of US2935664A publication Critical patent/US2935664A/en
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Definitions

  • This invention relates to semi-conductor cells, and is particularly concerned with the provision of means for dissipating heat from a semi-conductor cell built into a container.
  • the invention concerns a cooler for the removal of heat from a semi-conductor cell built into a container which comprises a metallic wall for the removal of heat from the container.
  • the invention consists in that a cooling body is soldered (or otherwise is secured in heat-conductive relation) to the wall area lying outside the container, which body consists essentially of a base plate and, projecting therefrom, a plurality of cooling wings provided with elongated depressions, these depressions being arranged alternately slanting in such away that they are arranged obliquely in opposite directions and side by side from one cooling wing to the next.
  • FIG. 1 is a side elevational view of a form of construction embodying principles of the invention
  • Fig. 2 is a front view of one of the appended wings of the cooler, showing the arrangement of the depressions therein, and indicating in dotted lines the relationship thereto of the depressions in the adjacent wing of the cooler;
  • Fig. 3 is a generally diagrammatic side elevational view with certain parts in phantom illustrating the elastic means for lifting the container from the cooler upon melting of the temperature-responsive solder connection.
  • FIG 1 designates a container in which a semiconductor cell 2 is disposed and to which said cell is soldered together with the metallic wall 3.
  • the metallic wall itself preferably is composed, for example, of the vacuum enclosure 3a, consisting of Kovar and a copper disk 3b soldered on with hard solder. This metallic wall is exposed to the heating by the semi-conductor cell 2 lying closely adjacent and it therefore requires an intense cooling in order to avoid exceeding a maximum temperature.
  • Kovar I mean an alloy, sold by Westinghouse Electric 00., having approximately the same softening temperature coefiicient as that of glass.
  • FIG. 2 vprints, 7, 7, in the form of pressed-in depressions.
  • Figure 2 shows a cooling wing with the depressions 7 placed obliquely.
  • the adjacent wings likewise exhibit like depressions, the'direc'tions of which are, however, opposite to those of the first-mentioned wing, so that the depressions are crosswise relative to each other.
  • Cooling airstreaming in laterally is blown, from a source (not shown) of air under pressure, against the cooling wings.
  • the depressions effect an intense whirling of the cooling air, approximately corresponding to the arrows, through which a very intense heat transfer again occurs from the cooling surfaces to the air.
  • the turbulency of the air results in a cooling power of 0.5-1 kw., expressed as a weight per unit power of a cooler of 1 kg.
  • the flow of cooling air requires only a pressure equal to a 20 mm. column of water above atmospheric pressure to achieve the necessary cooling.
  • the resulting temperature difference between the entering air and the hottest place of the cooler, namely at the base plate amounts to about 20 degrees C. This slight temperature drop makes possible above all the intense cooling of the very temperature-sensitive germanium rectifier cells.
  • cooling wings can be prepared from a continuous hand without waste; they can be produced including the depressions by stamping, and therefore very cheaply. If desired the wings may beplaced adjacent each other for simultaneous soldering to the base plate.
  • the cooler in its simple prismatic form can be used as a supporting construction part and be assembled as such with additional coolers and rectifier cells soldered on them into a larger structural unit.
  • the rectifier is soldered on the cooling aggregate as an additional part.
  • a solder whose melting point lies below the highest permissible operating temperature.
  • the container may be lifted from the cooler as soon as the solder melts. In this way an automatic current interruption in thermal overload is attained.
  • the container 1 is soldered to the base plate 5 which in turn supports the cooling wings 6.
  • Base plate 5 is secured to the rigid supporting frame.
  • the container unit is connected to the elastic spring element 10 which is also connected to the rigid support and normally tends to bias the container unit upwardly. When the temperatureresponsive solder melts, the container unit is released and is displaced upwardly by the spring 10. If one electrical terminal should include the base plate 5, then it will be apparent that the electrical circuit to the rectifier cell will be broken when the container is moved upwardly relative to the base plate by the spring 10.
  • the temperature-responsive solder connection between the container 1 and the base plate 5 has been identified by the reference numeral 11.
  • Means for cooling a metallic container having a semiconductor cell therein and secured to the bottom wall thereof comprising a horizontal base plate secured to the external lower surface of said container, and a plurality of spaced vertical cooling wings secured at their upper ends to the lower surface of said base plate, said cooling wings having a plurality of obliquely arranged depressions therein, said cooling wings being substantially parallel and arranged with the depressions in one wing alternately slanting with respect to the depressions in the next adjacent wing whereby said depressions etfect 3 a whirling action to the cooling air passing between said References Cited in the file of this patent wings to achieve efiective heat transfer from said base UNITED STATES PATENTS plate.

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US664723A 1956-06-29 1957-06-10 Cooler for heat removal on a semi-conductor cell built into a container Expired - Lifetime US2935664A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH817746X 1956-06-29

Publications (1)

Publication Number Publication Date
US2935664A true US2935664A (en) 1960-05-03

Family

ID=4539112

Family Applications (1)

Application Number Title Priority Date Filing Date
US664723A Expired - Lifetime US2935664A (en) 1956-06-29 1957-06-10 Cooler for heat removal on a semi-conductor cell built into a container

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US (1) US2935664A (de)
CH (1) CH344786A (de)
GB (1) GB817746A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147802A (en) * 1961-08-04 1964-09-08 Astro Dynamics Inc Heat radiator
US3147801A (en) * 1961-02-09 1964-09-08 Astro Dynamics Inc Heat radiator
US3527292A (en) * 1967-12-15 1970-09-08 Washington Eng Ltd Recirculating thermosyphonic heat exchangers
US5224538A (en) * 1991-11-01 1993-07-06 Jacoby John H Dimpled heat transfer surface and method of making same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL288523A (de) * 1961-08-04 1900-01-01
NL258020A (de) * 1960-02-09

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2017201A (en) * 1931-11-27 1935-10-15 Modine Mfg Co Condenser tube
GB521285A (en) * 1937-11-15 1940-05-16 Martin Larsen Improvements in or relating to plate heat exchanging apparatus
US2730663A (en) * 1953-03-20 1956-01-10 Gen Electric Unilaterally conductive device
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2017201A (en) * 1931-11-27 1935-10-15 Modine Mfg Co Condenser tube
GB521285A (en) * 1937-11-15 1940-05-16 Martin Larsen Improvements in or relating to plate heat exchanging apparatus
US2730663A (en) * 1953-03-20 1956-01-10 Gen Electric Unilaterally conductive device
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147801A (en) * 1961-02-09 1964-09-08 Astro Dynamics Inc Heat radiator
US3147802A (en) * 1961-08-04 1964-09-08 Astro Dynamics Inc Heat radiator
US3527292A (en) * 1967-12-15 1970-09-08 Washington Eng Ltd Recirculating thermosyphonic heat exchangers
US5224538A (en) * 1991-11-01 1993-07-06 Jacoby John H Dimpled heat transfer surface and method of making same

Also Published As

Publication number Publication date
CH344786A (de) 1960-02-29
GB817746A (en) 1959-08-06

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