US3198875A - Housing for semi-conductor rectifier - Google Patents

Housing for semi-conductor rectifier Download PDF

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Publication number
US3198875A
US3198875A US275968A US27596863A US3198875A US 3198875 A US3198875 A US 3198875A US 275968 A US275968 A US 275968A US 27596863 A US27596863 A US 27596863A US 3198875 A US3198875 A US 3198875A
Authority
US
United States
Prior art keywords
base
ring
soldered
housing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US275968A
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English (en)
Inventor
Keller Eduard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Germany
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Application granted granted Critical
Publication of US3198875A publication Critical patent/US3198875A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Definitions

  • the object of the present invention is to provide an improved construction for housing semiconductor devices in which no glass parts are used. Rather, the housing parts are made entirely from metal and ceramic, and the improved construction has been found to overcome the disadvantage above explained in conjunction with the use of metal-glass parts. In this manner, a substantially greater safety will be attained when the semi-conductor device is subjected to high order mechanical stresses. Moreover, the heretofore used glass-Kovar fusions with their long, step-shaped Kovar parts have led to springy or permanent displacements and twisting of the bolt which passes into the interior of the housing.
  • the housing comprises an electrically conductive metal housing part forming a base. Upstanding on this base is a hollow cylinder made from a suitable ceramic such as aluminum oxide, and at the upper end of the cylinder a metallic ring is soldered on, this ring including an inner part which is soldered to and serves to secure a connecting bolt in place which passes downwardly into the housing, Located within and soldered to the inner wall of the ceramic cylinder is a funnel-shaped electrically conductive metallic member, the wall of this member being convergent in the downward direction and terminating in an annular flat terminal base which rests upon the semiconductor disc element. This annular terminal base part of the funnelshaped member also serves to secure in place the lower end of an annular flexible stranded cable, the upper end of this flexible cable being secured to the lower end of the connecting bolt entering the housing from above.
  • the housing structure includes a metallic base part 1 made from electrically conductive material such as copper and which is provided with an upper flange part 1a and a lower threaded bolt portion 11) by which the housing can be mounted on a suitable support, not illustrated.
  • a hollow cylinder 2 Seated on the flange portion 1a of the base is a hollow cylinder 2 which is made from a suitable ceramic material such as aluminum oxide.
  • the lower end of cylinder 2 is soldered to the upper part of a metallic ring-shaped element 3 which surrounds and is in contact with the outer surface of the ceramic cylinder 2, and the lower part of ring 3 which is spaced from the surface of cylinder 2 is in turn soldered to the flange part 1a of the base.
  • a suitable metal for ring 3 is Kovar which has been previously mentioned.
  • a second ring-shaped metallic member 4 which can also be made from Kovar is located at the upper end of the ceramic cylinder 2.
  • This ring-shaped member 4 includes an outer flanged part 4a which is soldered to the upper end of cylinder 2 and a downwardly and inwardly tapering part 4b which extends downwardly into the in terior of cylinder 2 and is there soldered to the outer surface of a copper connecting bolt 5.
  • funnel-shaped ring 6 Located within the ceramic cylinder 2 below the funnel-shaped ring part 4b is another funnel-shaped ring 6 which tapers downwardly and inwardly.
  • the upper part 6a of ring 6 is soldered to the interior surface of cylinder 2, and the lower part of ring 6 terminates in an annular base part 611 having a fiat bottom face which rests upon the upper face of the semiconductor disc element 7.
  • This base part 6b is soldered to the upper face of the semiconductor disc 7 to ensure a good current transfer characteristic.
  • annular base part 6b is so configured as to provide an upwardly facing annular groove within which is received and secured the lower end of the annular flexible connecting sleeve or cable 8 made from braided copper strands, the upper end of this annular connecting cable being secured within an annular groove 5a provided in the lower end face of connecting bolt 5.
  • the connections between the braided cable 8 and the bolt 5 and base part 6b of member 6 may be made by clamping, or by soldering, or both.
  • the semiconductor apparatus is of the so-called controlled type.
  • the semiconductor disc 7 is seen to be provided with a centrally located control electrode 10 to which is connected a lead-in wire 9, the latter passing upwardly through the interior of the annular braided cable 8 and a centrally located bore 5b in connecting bolt 5.
  • the funnel-shape of ring part 6 will result in a firm connection of the ceramic housing part 2 and the electrical connecting train with the semiconductor disc element 7.
  • the design of ring part 6 is advantageous since it can be manufactured with great precision by punching or pressing. It becomes possible therefore to design a ring part 6 in such manner that it will exert a predetermined pressure upon the semiconductor disc element 7.
  • the ring part 6 because of its funnel-shaped configuration is well able to absorb tension and compression forces which arise from centrifugal forces as well as shocks.
  • the mass acceleration forces of the heavy copper strands in cable 8 are kept in check, and the semiconductor disc element 7 is relieved from the effects of these forces.
  • the improved structural arrangement for the housing makes it possible to solder at the same time all soldering points which are located within the housing.
  • Copper is the most suitable material for the funnelshaped member 6 because its coefficient of thermal expansion is more than twice as large as that for the ceramics which are used, and especially aluminum oxide. In view of the fact that almost no pressure will be exerted on the rectifier disc '7 when the solder hardens, there will occur even a certain tensile stress when it cools ofi" further to room temperature.
  • the improved housing construction results in the advantage that during a rising temperature, the low tensile stress which exists at room temperature will change to a state where mechanical stresses do not exist at all.
  • a semiconductor device comprising a metallic housing part forming a base, a semiconductor element in the form of a disc mounted on said base, a hollow cylinder of ceramic material upstanding on said base and secured thereto and surrounding said semiconductor element, a connecting bolt extending downwardly into said ceramic cylinder, a first funnelshaped ring member having a downwardly convergent portion located within said ceramic cylinder, said convergent portion being soldered at its lower end to said connecting bolt and the upper end of said first ring member being soldered to the upper end of said ceramic cylinder thereby to close off the space between said ceramic cylinder and connecting bolt, a second funnel-shaped ring member located within said ceramic cylinder, the upper part of said second funnel-shaped ring being soldered to the inner Wall of said ceramic cylinder and said second ring being convergent in the downward direction and terminating in a flat annular base in electrical contact with the upper face of said semiconductor disc element, and a flexible annular copper cable within said second funnel-shaped ring, the upper end of said

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  • Die Bonding (AREA)
  • Rectifiers (AREA)
US275968A 1962-05-03 1963-04-26 Housing for semi-conductor rectifier Expired - Lifetime US3198875A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH531662A CH393547A (de) 1962-05-03 1962-05-03 Gehäuse für einen Halbleitergleichrichter

Publications (1)

Publication Number Publication Date
US3198875A true US3198875A (en) 1965-08-03

Family

ID=4291538

Family Applications (1)

Application Number Title Priority Date Filing Date
US275968A Expired - Lifetime US3198875A (en) 1962-05-03 1963-04-26 Housing for semi-conductor rectifier

Country Status (4)

Country Link
US (1) US3198875A (de)
CH (1) CH393547A (de)
DE (1) DE1243783B (de)
GB (1) GB1000568A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3751577A (en) * 1972-06-12 1973-08-07 Us Army Seal for a high pressure, short arc gas lamp

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA828390A (en) * 1967-02-15 1969-11-25 Powercube Corporation Modular circuit package

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2647218A (en) * 1950-12-26 1953-07-28 Eitel Mccullough Inc Ceramic electron tube
GB714976A (en) * 1952-08-08 1954-09-08 British Thomson Houston Co Ltd Improvements relating to electric rectifiers
US2798577A (en) * 1952-08-01 1957-07-09 Eitel Mccullough Inc Metalized ceramic structure for vacuum tube envelopes and method of making the same
DE1087706B (de) * 1956-09-24 1960-08-25 Siemens Ag Flaechengleichrichteranordnung und Verfahren zu ihrer Herstellung
US2960639A (en) * 1958-07-02 1960-11-15 English Electric Valve Co Ltd Semi-conductor rectifier assemblies
FR1261798A (fr) * 1959-07-06 1961-05-19 Ass Elect Ind Perfectionnements aux appareils semi-conducteurs
US2992372A (en) * 1959-05-04 1961-07-11 Gen Electric Liquid cooled current rectifier apparatus
US3025436A (en) * 1959-08-19 1962-03-13 Itt High current rectifier
US3068382A (en) * 1960-05-23 1962-12-11 Westinghouse Electric Corp Hermetically sealed semiconductor devices
US3105926A (en) * 1961-01-28 1963-10-01 Siemens Ag Encapsuled electronic semiconductor device of the four-layer junction type, and method of its production

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2864980A (en) * 1957-06-10 1958-12-16 Gen Electric Sealed current rectifier

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2647218A (en) * 1950-12-26 1953-07-28 Eitel Mccullough Inc Ceramic electron tube
US2798577A (en) * 1952-08-01 1957-07-09 Eitel Mccullough Inc Metalized ceramic structure for vacuum tube envelopes and method of making the same
GB714976A (en) * 1952-08-08 1954-09-08 British Thomson Houston Co Ltd Improvements relating to electric rectifiers
DE1087706B (de) * 1956-09-24 1960-08-25 Siemens Ag Flaechengleichrichteranordnung und Verfahren zu ihrer Herstellung
US2960639A (en) * 1958-07-02 1960-11-15 English Electric Valve Co Ltd Semi-conductor rectifier assemblies
US2992372A (en) * 1959-05-04 1961-07-11 Gen Electric Liquid cooled current rectifier apparatus
FR1261798A (fr) * 1959-07-06 1961-05-19 Ass Elect Ind Perfectionnements aux appareils semi-conducteurs
US3025436A (en) * 1959-08-19 1962-03-13 Itt High current rectifier
US3068382A (en) * 1960-05-23 1962-12-11 Westinghouse Electric Corp Hermetically sealed semiconductor devices
US3105926A (en) * 1961-01-28 1963-10-01 Siemens Ag Encapsuled electronic semiconductor device of the four-layer junction type, and method of its production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3751577A (en) * 1972-06-12 1973-08-07 Us Army Seal for a high pressure, short arc gas lamp

Also Published As

Publication number Publication date
DE1243783B (de) 1967-07-06
CH393547A (de) 1965-06-15
GB1000568A (en) 1965-08-04

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