US3324269A - Contact bank for a switching device - Google Patents

Contact bank for a switching device Download PDF

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Publication number
US3324269A
US3324269A US505845A US50584565A US3324269A US 3324269 A US3324269 A US 3324269A US 505845 A US505845 A US 505845A US 50584565 A US50584565 A US 50584565A US 3324269 A US3324269 A US 3324269A
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Prior art keywords
layer
contact
anodised
nickel
contact elements
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Expired - Lifetime
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US505845A
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English (en)
Inventor
Roy Dick La
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Thales Nederland BV
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Thales Nederland BV
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Priority to US655249A priority Critical patent/US3496073A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/12—Anodising more than once, e.g. in different baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H19/00—Switches operated by an operating part which is rotatable about a longitudinal axis thereof and which is acted upon directly by a solid body external to the switch, e.g. by a hand
    • H01H19/54—Switches operated by an operating part which is rotatable about a longitudinal axis thereof and which is acted upon directly by a solid body external to the switch, e.g. by a hand the operating part having at least five or an unspecified number of operative positions
    • H01H19/56—Angularly-movable actuating part carrying contacts, e.g. drum switch
    • H01H19/58—Angularly-movable actuating part carrying contacts, e.g. drum switch having only axial contact pressure, e.g. disc switch, wafer switch
    • H01H19/585—Angularly-movable actuating part carrying contacts, e.g. drum switch having only axial contact pressure, e.g. disc switch, wafer switch provided with printed circuit contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads

Definitions

  • the invention relates to a contact bank for a switching device and to a method for making the same.
  • a contact bank for a switching device is built by mounting each of the contact elements separately onto the switching device. If these contact elements are not adjacent, as will generally be the case in digitalising switches, the contact elements are either countersunk into a layer of isolating material, or parts of isolating material are mounted between non-adjacent contact elements, care being taken that the surfaces of the contact elements and that of the isolating material are in the same plane.
  • Contact banks of this type have various disadvantages. Their construction requires much work and is, therefore, relatively expensive. It is very difiicult to build small switches in this way, and yet in many cases, for instance in building digitalising switches, small dimensions are highly desirable.
  • the isolating material wears more rapidly than the material of the contact elements, which causes the switching devices to become obsolete very soon.
  • the unevenness of the contact banks caused by wear will make the contact devices vibrate, so that no reliable contact can be established.
  • the pulverised material which is produced by the wear of the isolating parts of the contact bank will smudge the contact elements and this is prejudicial to the reliability of the contact between the contact arrangements and the contact bank.
  • the contact bank comprises a number of metal contact elements which, in the form of a precipitation of metal, are fixedly connected to an aluminium surface carrying these contact elements, the part of the aluminium surface situated beyond the contact elements being covered by an anodised layer, at any rate in so far as the area over which any contact arrangement cooperating with the contact bank moves durin g the relative motion of contact arrangement and contact bank is concerned.
  • the anodised layer is not only an excellent isolator but is, moreover, very resistant to wear. Consequently it is possible for the surface of the anodised layer and the surface of the contact elements to remain in the same plane without any unevenness after these surfaces have been made even and smooth by grinding, polishing or lapping, so that during a relatively long life of the switching device all unevenness in the region of the separations between the anodised surface and the contact surface will be avoided. For this reason the contact bank according to the invention constitutes an important improvement in rapidly moving switching devices.
  • the contact bank described above can be produced by the following method. Firstly the aluminium surface which is to carry the contact bank is made even and anodised. Then the anodised surface is covered by a photosensitive layer of a type that can be used in making printing plates, and this photosensitive layer is exposed under a negative which is a representation of the contact elements that are to be made in the bank. Then the exposed surface is developed in a developer suitable for the layer used, as a result of which the photosensitive layer is removed from the anodised layer on the places where the contact elements are to come.
  • the surface is immersed in a fluid that dissolves the anodised layer but does not affect aluminium, and finally the parts of the surface where the original anodised layer is removed are covered by a metal precipitation in a chemical bath suitable for this purpose, for instance an electroplating bath.
  • a photosensitive material which can only be dissolved by the developer after it has been exposed to light as well as a photosensitive material which can be dissolved by the developer but hardens under the influence of light can be used.
  • the negative In the second case the negative must show the contact elements as dark patches on a diaphanous background, whilst in the first case these contact elements must be represented as diaphanous patches on a dark background.
  • the precipitation of the contact metal can be elfected by electrolysis as well as by reduction.
  • Nickel for instance, because of its excellent resistance to wear, is a very good material for carrying a contact surface. It is, however, not a simple problem to produce a nickel layer which effectively adheres to an aluminium surface. For this purpose the aluminium surface is generally first covered with zinc, but the zinc baths used for this purpose are basic and consequently affect the anodised layer.
  • a further development of the invention has been undertaken and this has led to an excellent embodiment of a contact bank according to the invention and a special method for making this bank.
  • the metal contact elements are connected to the aluminium supporting surface by means of an anodised layer with increased porosity, which covers said surface at those places where the contact elements are present, the contact elements being connected to the aluminium-surface through the pores in the layer with increased porosity.
  • anodised layer with increased porosity which covers said surface at those places where the contact elements are present, the contact elements being connected to the aluminium-surface through the pores in the layer with increased porosity.
  • FIG. 1 shows a partial section of a contact 'elernent'in a contact bank according to the invention.
  • FIG. 2 shows a top view of a number of concentric contact banks for a digitalising switch which can be made according to the invention.
  • FIG. 1 shows a partial section of a small part of a contact bank according to the invention.
  • the part is situated at either side of the separation between an isolated part and a contact element, and is greatly enlarged.
  • the actual thickness of thepart shown is not more than 25
  • the contact bank is carried by an aluminium plate, the upper surface of which carries the reference 1. Beyond the contact elements this plate is covered by an anodised layer carrying the reference 2 and consisting of aluminium-oxide. The thickness of this layer is about 20
  • the contact element, only a small part of which is shown, consists of two layers, the layer 6 and the layer 3.
  • the layer 3 consists of an electrolytical precipitation of semibright nickel. This material is very strong and tough and constitutes an excellent supporting surface for a contact surface.
  • the contact resistance of a contact point with a nickel surface can sometimes, for no identifiable reason, suddenly increase considerably.
  • the nickel layer 3 is made so that its upper surface is slightly lower than that of the anodised layer 2.
  • the thickness of the nickel layer is about 12a while the total thickness of the porous anodised layer and the nickel layer together is 15;!
  • This nickel layer is covered by a thin layer 6 consisting of an electrolytical plating of hard gold with a thickness of about in.
  • Hard gold is an excellent contact material. Owing to its hardness it wears only very slightly. Because of the fact that it is carried by a nickel supporting layer no deformations will occur.
  • the gold layer is made slightly too thick. Afterwards the contact bank is polished or lapped, causing the anodised layer and the gold layer to be given a common plane surface, so that no unevenness will occur at the boundary between a contact element and the anodised layer.
  • the correct dimensions can be maintained within very small limits.
  • the accuracy of the dimensions and the situations of the boundaries between contacts and isolating surface are mainly determined by the negative under which the photosensitive layer is exposed when making the contact bank.
  • This negative can be made in the form of a reproduction in reduced dimensions of a drawing on a considerably larger scale which may have a high relative accuracy.
  • This method permits the manufacture of contact banks of very small dimensions and of very great accuracy. This is especially important in digitalising switches which are to digitalise the position of a shaft or of an object which can be moved along a straight or an otherwise shaped trajectory.
  • a reasonably accurate digitalising of such a position will require eight to ten adjacent or concentric contact banks. If these contact banks are made according to classic methods they become very cumbersome. Digitalising switches with concentric contact banks according to the invention have, however, been made in which the difference between the radii of two adjacent concentric contact banks is not more than 2 to 2.5 millimeters. A combination of ten such concentric contact banks for a digitalising switch that permits an angular position to be digitalised with an accuracy which is better than 0.5 degrees, can be built in an embodiment according to the invention on a plate with a diameter with is not much larger than five to six centimeters. This clearly shows the advantages of the method according to the invention.
  • FIG. 2 shows representations of the contact elements of four concentrical contact banks of a digitalising switch according to the invention that can be arranged on one single plate.
  • a contact bank according to the invention one begins with an aluminium surface, for instance the surface of an aluminium plate. This surface is ground and/ or polished or lapped in order to make it flat and very smooth. Then this surface is anodised.
  • the anodised layer thus obtained should be fairly com- 'pact in order that it may constitute an excellent isolator in the switch and will not be covered by a metal layer when the contact elements are manufactured by plating.
  • this anodised layer should be fairly thick; its thickness should be equal to the total thickness of all the layers which will be incorporated in each space reserved for a contact element.
  • anodised layer of at least 20 thickness can only be manufactured if it has a small amount of porosity. It can be made in a bath containing a few percentages of oxalic acid to which a voltage of about 70 v. is applied. After this layer has been manufactured it is cleaned and then covered with a photosensitive layer of a type which are used in making printing plates. After this photosensitive layer has been applied to the anodised layer it is exposed under a negative that is a representation of the contact elements to be made, after which it is developed, so that on the places where the contact elements will be located the photosensitive layer is removed. Two types of material are available for such photosensitive layers.
  • One type is naturally soluble in the developer but becomes insoluble under the influence of light. If such a photosensitive layer is used the negative must show the contacts as dark patches on a diaphanous background.
  • the other type of photosensitive layer is naturally insoluble and becomes soluble under the influence of light. If this type of layer is used the contacts must be shown on the negative as diaphanous patches on a dark background,
  • the advantage of this material for the photosensitive layer is that it can be successively exposed under various negatives, causing the sum of the parts shown on the negatives to become soluble.
  • the result of the development is an anodised aluminium surface which is covered with a protective layer except on those parts where the contact elements are to be located.
  • This surface is treated with a solution which removes the anodised layer but leaves the aluminium in its original state.
  • An excellent solution for this purpose is a solution of sodium-dichromate and phosphoric acid in water at a temperature of about degrees Celsius. This solution removes the anodised layer completely in those places where it is no longer covered by the photosensitive layer. As soon as the anodised layer has been removed from, and the aluminium surface is uncovered on these places, the plate is cleaned anew and is again anodised in a bath which affects the anodised layer while it is being produced. The effect on the newly anodised layer is the creation of pores.
  • a suitable bath for this purpose is a 30 percent solution of phosphoric acid at a temperature of about 40 degrees Celsius.
  • this bath also affects the original anodised layer but because the porous anodised layer need only be a very thin one and the making of this porous layer consequently takes only a short time, the original anodised layer is only very slightly affected.
  • the duration of this second anodising operation is such that a layer of the required thickness is manufactured.
  • a phosphoric acid solution as electrolyte does not guarantee a sufiicient porosity. For this reason it is desirable to leave the plate in the bath for a certain length of time after the current has been switched off. This substantially increases porosity.
  • the metal for the contact elements is precipitated, This can be effected by electrolysis as well as by reduction.
  • the nickel plating is so made that its upper surface is slightly below that of the anodised layer, and afterwards a layer of hard gold is precipitated, for instance electrolytically, on the nickel supporting surface.
  • Hard gold is an excellent contact material and it is very resistant to wear so that a contact bank with hard gold contacts remains reliable for long periods of use.
  • the layer of hard gold is made sufficiently thick that it slightly protrudes beyond the original anodised surface. After the precipitation of the gold the two surfaces are equalised by polishing or lapping, so that even the slightest unevenness near the boundary between a contact and the anodised layer is eliminated.
  • aluminium is not a very good construction material, It can be easily bent, and as soon as the surface layer has been removed, for instance in an effort to plane the plate, it will in some cases become warped.
  • the aluminium surface is only part of an aluminium layer, such as an aluminium foil which is fixedly connected, for instance by bonding, to a plate of a stronger construction material, such as steel.
  • the aluminium surface will be fiat but in some applications it may be necessary to provide a curved surface for supporting the contact elements.
  • a flat negative can be used to form the pattern of contact element areas in the photosensitive layer.
  • a switch contact bank comprising an aluminum surfaced support member having a plurality of electrically conductive contact elements thereon and an anodized layer on said support surface between adjacent individual contact elements, wherein said contact elements comprise a layer of nickel in deposited relation to said support member and a layer of gold in overlying deposited relation to said nickel layer.
  • a switch contact bank according to claim 2 in which said elements are arranged in concentric circular paths.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)
  • Push-Button Switches (AREA)
  • Manufacture Of Switches (AREA)
US505845A 1964-11-02 1965-11-01 Contact bank for a switching device Expired - Lifetime US3324269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US655249A US3496073A (en) 1964-11-02 1967-03-02 Method for making a contact bank for a switching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6412706A NL6412706A (fr) 1964-11-02 1964-11-02

Publications (1)

Publication Number Publication Date
US3324269A true US3324269A (en) 1967-06-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
US505845A Expired - Lifetime US3324269A (en) 1964-11-02 1965-11-01 Contact bank for a switching device

Country Status (7)

Country Link
US (1) US3324269A (fr)
BE (1) BE671543A (fr)
CH (1) CH455008A (fr)
DE (1) DE1540237A1 (fr)
FR (1) FR1454652A (fr)
GB (1) GB1122187A (fr)
NL (1) NL6412706A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609257A (en) * 1969-02-12 1971-09-28 Ricoh Kk Slide switch
US4360411A (en) * 1978-03-31 1982-11-23 Societe De Vente De L'aluminium Pechiney Aluminum electrical contacts and method of making same
WO1993013295A1 (fr) * 1991-12-20 1993-07-08 George Testea Systeme de moteur rotatif
US6248964B1 (en) 1999-03-30 2001-06-19 Bourns, Inc. Thick film on metal encoder element

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2646311B1 (fr) * 1989-04-24 1994-04-08 Pechiney Recherche Substrats metalliques isoles et procede de fabrication desdits substrats
DE20207165U1 (de) 2002-05-07 2002-08-14 Sick AG, 79183 Waldkirch Kabelanschluss für einen Sensor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
US3225269A (en) * 1955-01-03 1965-12-21 Willis G Worcester Electrical apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3225269A (en) * 1955-01-03 1965-12-21 Willis G Worcester Electrical apparatus
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609257A (en) * 1969-02-12 1971-09-28 Ricoh Kk Slide switch
US4360411A (en) * 1978-03-31 1982-11-23 Societe De Vente De L'aluminium Pechiney Aluminum electrical contacts and method of making same
US4408110A (en) * 1978-03-31 1983-10-04 Societe De Vente De L'aluminium Pechiney Aluminum electrical contacts and method of making same
WO1993013295A1 (fr) * 1991-12-20 1993-07-08 George Testea Systeme de moteur rotatif
US6248964B1 (en) 1999-03-30 2001-06-19 Bourns, Inc. Thick film on metal encoder element

Also Published As

Publication number Publication date
NL6412706A (fr) 1966-05-03
DE1540237A1 (de) 1970-01-02
FR1454652A (fr) 1966-02-11
GB1122187A (en) 1968-07-31
BE671543A (fr) 1966-02-14
CH455008A (de) 1968-04-30

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