US3396042A - Chemical gold plating composition - Google Patents

Chemical gold plating composition Download PDF

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Publication number
US3396042A
US3396042A US134106A US13410661A US3396042A US 3396042 A US3396042 A US 3396042A US 134106 A US134106 A US 134106A US 13410661 A US13410661 A US 13410661A US 3396042 A US3396042 A US 3396042A
Authority
US
United States
Prior art keywords
gold
salt
palladous
bath
ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US134106A
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English (en)
Inventor
Duva Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sel Rex Corp
Original Assignee
Sel Rex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sel Rex Corp filed Critical Sel Rex Corp
Priority to US134106A priority Critical patent/US3396042A/en
Priority to GB29612/62A priority patent/GB956922A/en
Priority to CH940562A priority patent/CH405868A/fr
Priority to DE19621446259 priority patent/DE1446259B2/de
Application granted granted Critical
Publication of US3396042A publication Critical patent/US3396042A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Definitions

  • the invention is not limited in scope by explaining a theory upon which the operation is believed to depend. It is believed that when the simpler soluble Pd salts such as palladous chloride or sulfate are employed in the bath of the invention, a complex palladous salt (providing Pd++ ions) is formed in said bath which may be similar in structure to the P salt, for example. In the event that a great excess of free CN ions exists in said bath no deposition takes place. It is believed that this effect is due to the formation of a very stable Pd complex which does not provide Pd ions. The ratio of the Pd salt to free CN- ions should therefore be maintained high enough to provide Pd++ ions which are necessary for the deposition of the gold.
  • aqueous solution consisting essentially of 0.5-30 g./l. of a soluble gold cyanide, 0.01 to 30 g./l. of a soluble palladous salt, absent sufficient CN ions to prevent deposition induced by said palladous salt, and sufficient alkali to provide a pH of 8-11.
  • composition as claimed in claim 2 in which the palladous salt is (NH Pd(NO 5.
  • the composition as claimed in claim 2 in which the palladous salt is disodium palladous tetrachloride.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US134106A 1961-08-28 1961-08-28 Chemical gold plating composition Expired - Lifetime US3396042A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US134106A US3396042A (en) 1961-08-28 1961-08-28 Chemical gold plating composition
GB29612/62A GB956922A (en) 1961-08-28 1962-08-01 Chemical gold plating
CH940562A CH405868A (fr) 1961-08-28 1962-08-07 Procédé de placage d'or par voie chimique et composition de placage pour la mise en oeuvre de ce procédé
DE19621446259 DE1446259B2 (de) 1961-08-28 1962-08-28 Wässriges, alkalisches Vergoldungsbad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US134106A US3396042A (en) 1961-08-28 1961-08-28 Chemical gold plating composition

Publications (1)

Publication Number Publication Date
US3396042A true US3396042A (en) 1968-08-06

Family

ID=22461795

Family Applications (1)

Application Number Title Priority Date Filing Date
US134106A Expired - Lifetime US3396042A (en) 1961-08-28 1961-08-28 Chemical gold plating composition

Country Status (4)

Country Link
US (1) US3396042A (fr)
CH (1) CH405868A (fr)
DE (1) DE1446259B2 (fr)
GB (1) GB956922A (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
US3607352A (en) * 1968-11-29 1971-09-21 Enthone Electroless metal plating
US3862850A (en) * 1973-06-08 1975-01-28 Ceramic Systems Electroless gold plating on refractory metals
US3993808A (en) * 1971-08-13 1976-11-23 Hitachi, Ltd. Method for electroless plating gold directly on tungsten or molybdenum
US4091128A (en) * 1976-10-08 1978-05-23 Ppg Industries, Inc. Electroless gold plating bath
US4340451A (en) * 1979-12-17 1982-07-20 Bell Telephone Laboratories, Incorporated Method of replenishing gold/in plating baths
US4550036A (en) * 1984-10-18 1985-10-29 Hughes Aircraft Company Electroless silver plating process and system
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US5178918A (en) * 1986-07-14 1993-01-12 Robert Duva Electroless plating process
US6086946A (en) * 1996-08-08 2000-07-11 International Business Machines Corporation Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2719821A (en) * 1951-07-19 1955-10-04 Charles R Campana Gold alloy plating bath

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2719821A (en) * 1951-07-19 1955-10-04 Charles R Campana Gold alloy plating bath

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
US3607352A (en) * 1968-11-29 1971-09-21 Enthone Electroless metal plating
US3993808A (en) * 1971-08-13 1976-11-23 Hitachi, Ltd. Method for electroless plating gold directly on tungsten or molybdenum
US3862850A (en) * 1973-06-08 1975-01-28 Ceramic Systems Electroless gold plating on refractory metals
US4091128A (en) * 1976-10-08 1978-05-23 Ppg Industries, Inc. Electroless gold plating bath
US4340451A (en) * 1979-12-17 1982-07-20 Bell Telephone Laboratories, Incorporated Method of replenishing gold/in plating baths
US4550036A (en) * 1984-10-18 1985-10-29 Hughes Aircraft Company Electroless silver plating process and system
US5178918A (en) * 1986-07-14 1993-01-12 Robert Duva Electroless plating process
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
US6086946A (en) * 1996-08-08 2000-07-11 International Business Machines Corporation Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby

Also Published As

Publication number Publication date
GB956922A (en) 1964-04-29
DE1446259A1 (de) 1968-11-14
CH405868A (fr) 1966-01-15
DE1446259B2 (de) 1970-12-17

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Legal Events

Date Code Title Description
AS Assignment

Owner name: OXY METAL INDUSTRIES CORPORATION

Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084

Effective date: 19741220

AS Assignment

Owner name: HOOKER CHEMICALS & PLASTICS CORP.

Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885

Effective date: 19801222

AS Assignment

Owner name: OCCIDENTAL CHEMICAL CORPORATION

Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054

Effective date: 19820330

AS Assignment

Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827

Effective date: 19830915

AS Assignment

Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY

Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733

Effective date: 19830930