US3448023A - Belt type electro-chemical (or electrolytic) grinding machine - Google Patents
Belt type electro-chemical (or electrolytic) grinding machine Download PDFInfo
- Publication number
- US3448023A US3448023A US521987A US3448023DA US3448023A US 3448023 A US3448023 A US 3448023A US 521987 A US521987 A US 521987A US 3448023D A US3448023D A US 3448023DA US 3448023 A US3448023 A US 3448023A
- Authority
- US
- United States
- Prior art keywords
- pulley
- belt
- electrolyte
- electrolytic
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
Definitions
- a recess is provided in the one pulley and the one pulley is additionally provided with openings through the periphery thereof.
- An electrolyte is introduced into the recess of the one pulley and flows, impelled at least in part by centrifugal force, radially outwardly through the openings in the periphery of the one pulley and through the perforate abrasive belt against the workpiece.
- Means are provided for applying a unidirectional electrical potential difference between the workpiece and the abrasive belt.
- This invention relates to electrolytic grinding and, more particularly, relates to an apparatus for carrying out belttype electrolytic grinding operations with the electrolyte being applied through a contact wheel.
- the objects of this invention include the following:
- FIGURE 1 is a somewhat schematic side view of a typical machine embodying the invention.
- FIGURE 2 is a sectional view of the machine shown in FIGURE 1 taken on the line IIII of FIGURE 1.
- FIGURE 3 is a partially sectional and partially end elevational view of the contact wheel or pulley.
- FIGURE 4 is a section taken on the line IVIV of FIGURE 3.
- FIGURE 5 is a section generally similar to FIGURE 4 showing a modification.
- FIGURE 6 is a section taken on the line VI-V-I of FIGURE 5.
- FIGURE 7 is an oblique, fragmentary view of one 2 form of the contact wheel showing the random arrangement of openings through the peripheral surface thereof.
- FIGURE 8 is a section generally similar to that of FIGURE 4 and showing a still further modification, the section being further indicated by the line VIII-VIII in FIGURE 9.
- FIGURE 9 is a sectional view taken on the line 1XIX of FIGURE 8.
- FIGURE 10 is a view similar to FIGURE 7 and showing a modified form of the contact wheel in which the openings are arranged in axially aligned rows and each of said rows is depressed in a trough or groove.
- FIGURES 11 and 12 are illustrative alternate sectional illustrations of the belt adaptable to the practice of the invention.
- invention comprises (1) providing a perforate abrasive belt having an electrically conductive portion, (2) utilizing a hollow, perforate contact wheel for backing said belt with respect to the work, (3) introducing an electrolyte into the interior of said contact wheel and (4) imposing onto said electrolyte within the contact wheel sufficient pressure to cause it to flow radially outwardly at a substantial rate through both the periphery of said wheel and through said abrasive belt.
- the electrolyte may be introduced into the contact wheel either (1) under only sufiicient pressure to cause suitable flow thereof and the pressure primarily efiYecting its radially out-ward flow may be created, by centrifugal force or otherwise, after said electrolyte enters within the contact wheel or (2) the electrolyte may be subjected at the time of its entry into the contact wheel to a sufficient externally developed pressure to cause it to flow radially outwardly either independently of centrifugal force or only supplemented thereby.
- the apparatus of the invention particularly constitutes various specific means for controlling said electrolyte, for creating pressure thereon if desired after it enters into the contact wheel and for confiningsaid electrolyte to a desired portion of the periphery of the contact Wheel. While in one form of the invention the entire interior of the contact wheel defines the electrolyte receiving zone, in other forms of the invention the electrolyte receiving zone is defined within the contact wheel by other means occupying only a portion of the space therewithin.
- Centrifugal force is in some cases utilized for effecting outward flow of electrolyte
- external pressure is in another form of the invention applied to the electrolyte within the zone defined as above mentioned for assisting centrifugal force in urging the flow of electrolyte radially outwardly through the wheel and abrasive belt and in still another form of the invention means are provided within said zone itself for generating a pressure by which centrifugal force is assisted in urging the flow of electrolyte radially outwardly through the contact wheel and the abrasive belt.
- FIGURES 1 and 2 a machine of generally conventional nature to which the apparatus of the invention has been applied. While it will be evident as the description proceeds that the invention may be applied to a considerable variety of such machines, it will be convenient for the purpose of disclosing the invention to utilize and refer to the machine shown in FIGURES 1 and 2 and, accordingly, such reference will be made.
- FIGURES 1 and 2 there is shown, as one convenient form of work feeding means, a horizontally positioned feeding conveyor belt 1 arranged over pulleys 2 and 3, one of which will ordinarily be driven by any convenient means, not shown, and the other will be an idler. Said pulleys are supported upon frame structure generally indicated at 4 which may be of any convenient form. A platen 6 is arranged under the belt 1 for supporting said belt firmly with respect to the hereinafter described abrasive belt.
- the conveyor belt 1 is electrically conductive so that electrical potential can be applied to the workpieces supported thereon.
- Other work-feeding mechanisms such as a reciprocating feed table, or a succession of metal plates fixed to a conveyor belt, can be used instead of the belt 1.
- a perforate abrasive belt 7 Arranged above the conveyor belt 1 is a perforate abrasive belt 7 which is positioned around and supported by a pair of pulleys 8 and 9, one thereof being a driving pulley and the other being an idler.
- the lower pulley 8 which here is also the contact wheel, is driven by a motor 11 but in other instances the upper pulley may be the driven pulley.
- Adjustment mechanism 12 of any convenient type, which in this instance is air driven but which in some cases may be mechanical, is provided for adjusting the vertical position of the upper pulley with respect to the lower pulley whereby to adjust the tightness of the belt 7.
- a hood or casing 13 is placed over the belt 7 to confine the spray which would otherwise fly unrestrictedly from the belt.
- the belt will be formed in any convenient manner so that it will have an electrically conductive layer and nonconductive abrasive grit protruding from the layer as illustrated somewhat schematically in FIGURES 11 and 12.
- a belt (FIGURE 11) is desirably comprised of a noncoductive flexible backing 33, such as a woven textile, having nonconductive abrasive grains 34 adhered thereto, as by an adhesive.
- a conductive layer 35 is applied only to the front surface of the backing, same being applied thereto in such a manner that the abrasive grains protrude through said conductive layer.
- a conductive layer 37 (FIGURE 12) can be applied to the back surface of the backing and the two conductive layers can be connected by conductive connections 38 which extend through the textile layer.
- Other types of belts such as those made with a metal backing can be used or the grain may be adherently embedded into the conductive layer rather than being adhered to the backing.
- the abrasive grains may be of any desired kind, such as diamond bort, which are of appreciably less electrical conductivity than the electrolyte used.
- Such grains will hereinafter be referred to for convenience as nonconductive but it will be understood that this is a relative term and does not preclude a grit having same electrical conductivity providing only that it is of sufficiently less conductivity than that of the electrolyte as not appreciably to impair, or short, the flow of electrical current through the electrolyte.
- Many spectific belt designs will he obviously available and any thereof may be used within the terms of the invention providing only they include a conductive layer as above indicated and carry nonconductive (as above defined) abrasive grains thereon.
- Especially satisfactory belt designs are disclosed in the application of Dyer et al., Ser. No. 392,741, filed Aug. 28, 1964, now US. Pat. 3,334,041 and Duke et al., Ser. No. 408,521, filed Nov. 3, 1964, now US. Pat. 3,377,264.
- the present invention contemplates introduction of said electrolyte into the interior of the contact wheel or pulley against which the work is held and said electrolyte is then caused to flow radially outwardly from said pulley through the belt arranged thereon and into the space between said abrasive belt and the workpiece.
- FIGURES 3 and 4 there is shown one means for accomplishing this operation.
- the pulley 8 is here arranged on a shaft 16 which shaft is driven by suitable means, as belts, from the motor 11 and is supported by a suitable bearing 15 in the upright member 10, said bearing being fully insulated electrically from said upright member 10.
- the pulley 8 is keyed to the shaft 16 in any convenient manner, such as by the key 17.
- the pulley 8 is provided with a series of peripheral perforations 19 which can be arranged in a variety of patterns.
- the perforations 19 may be in a random arrangement (FIGURE 7), may be in rows (FIGURES 4, 5 and 8) or may communicate with longitudinally aligned grooves 21 (FIGURE 10) in the periphery of the pulley in order to provide continuous communication between said openings and thereby a continuous supply of electrolyte across the width of the belt.
- the shaft 16 has a central passageway 22 communicating with the interior of said pulley 8 through the radial passageway 23 and communicating at its other end with a manifold 24 into which fluid, such as an electrolyte, is received from the conduit 26. Electrolyte is supplied to said conduit 26 from any convenient source, not shown.
- a slip ring 18 and brush 20 may be provided to supply electrical potential to the pulley and belt.
- the pulley 8 is held firmly onto the shaft 16 by any convenient means, such as by the nut 27 urging said pulley against the shoulder 28.
- the shield 29 is preferably provided closely adjacent the pulley 8 at its upper side and extending around as much as possible of the portion of the periphery of said pulley which is not contacted by the belt.
- a bracket 31 extending from an appropriate point on member 10 holds said shield 29 in place.
- a suitable collecting structure such as a trough 32, is disposed for receiving the electrolyte from whence it flows to and through suitable recycling means such as a return tank T, suitable filtering means F if desired and a pump P, and thence back to the conduit 26.
- a suitable electrolyte is supplied to the conduit 26 and flows from said conduit through the passageways '22 and 23 to the interior 48.
- suflicient centrifugal force is developed with respect to said electrolyte that it will be urged radially outwardly through the penings 19, thence through the interstices of the belt 7 into the region between said belt and a workpiece on the conveyor belt 1.
- Electrical potential of suitable value usually between about and volts DC, is applied from any convenient source 33 to the belt 7 and to the platen 6.
- the feeding conveyor 1 may be started and workpieces W supplied thereto.
- the workpieces As the workpieces enter into the zone directly under the low point of the belt 7 so that they are contacted by the abrasive grains on saidbelt, they will also be acted upon by electro-chemical current carried between said workpiece and said belt through the electrolyte and the desired electro-chemical erosion will take place.
- the specific mechanics of the electrical erosion are already well known to the industry, are sufliciently published in Keeleric Patent No. 2,826,540 and need no detailed description.
- the hood 29 prevents electrolyte from being thrown upwardly through the periphery of the pulley 8 in a manner which could cause undesirable splashing around the machine.
- said hood may be omitted insofar as the basic operation of the apparatus is concerned without detracting from the broader aspects of the invention.
- the force impelling the electrolyte radially outwardly is wholly centrifugal force if the lower pulley 8 is not filled with electrolyte or such centrifugal force may be supplemented by a pump pressure if the lower pulley is so filled. In either case, such force is effective through out the entire periphery of the lower pulley "8, excepting as same would be stopped by the shield 29.
- FIGURES 5 and 6 of the drawings there is shown an example of one means by which a centrifugally impelled electrolyte is substantially confined within a relatively narrow zone of the periphery of said pulley and is, accordingly, confined more closely to the area of the workpiece. This will provide a more efficient use of the electrolyte and much less splashing of same around the interior of the machine.
- the embodiment of FIGURES 5 and 6 represents primarily a refinement of the invention to obtain a more precise control over the flow of electrolyte.
- an open end pulley 8a corresponding functionally to the pulley 8 of FIGURES 'l to 4, inclusive.
- Said pulley 8a is provided preferably with openings 19a, which are arranged in any desired pattern as above described and correspond functionally to the openings 19 of the pulley 8.
- Pulley 8a is mounted on a shaft 41 by a hub 42 and held by suitable fastening means indicated generally at 43.
- Said shaft 41 is supported by suitable means, not shown, but which may be similar to the means holding shaft 16 in FIGURE 4, and is driven by the motor 11.
- a bracket 44 Extending into the open end of said pulley 8a is a bracket 44 supported as convenient from the frame of the machine and on which is supported an angle iron 46 on which is mounted a squeegee 47.
- the squeegee 47 is caused to bear against the internal surface 48 of the pulley 8a, either by its own resilience or, if desired, by a leaf spring 49, sufliciently firmly to minimize the passage of electrolyte between said squeegee and said internal surface 48.
- the squeegee be made of a resilient material, such as rubber, synthetic rubber, plastic or other elastomer, suitably resistant to chemical attack by the electrolyte.
- a conduit 51 extends into the pulley and along the inner surface 48 thereof in front of the squeegee 47 whereby the fluid can be flowed into the interior of the pulley close to the periphery thereof.
- a second squeegee may, if desired, be provided to contact the interior surface of the pulley on the opposite side of the conduit 51 from the squeegee 47 so that the flow of the fluid will be further restricted.
- FIGURES 8 and 9 there is shown a still further form of the invention wherein means are provided within the lower pulley by which pressure is generated and applied directly to the internal surface of said pulley.
- a pulley 8b occupying the same position as the pulley 8 in the form of the invention shown in FIGURES 1 to 4, inclusive, and mounted for rotation upon 'a shaft 41 which is driven by the motor .11 and received within a hub 42 for supporting the pulley 8b.
- the pulley 8b and its means of support and rotation is the same as that above described in connection with FIGURES 5 and 6.
- the bracket 44 supports a pump structure 66 which consists of a pump housing 67 in which are contained a pair of pump gears 68 and 69.
- a manifold 74 is connected to the lower portion of said pump housing and defines a chamber 73 therewithin which is -in communication with a lower portion of the inside surface 48 of the pulley 8b.
- the circumferential ends of the chamber 73 are closed by any convenient means, here rollers 76 and 77, preferably resilient and the ends of said chamber 73 are closed by the end plates 78 and 79 which bear both 7 against the ends of said rollers and against the inside surface 48 of the pulley 8b.
- the discharge openings of said pump are connected to the chamber 73.
- the pump gears 68 and 69 may be driven from any convenient source, which may be the shaft 41.
- the shaft 81 from the gear 68 has a noncircular portion 82 which is received into a similar noncircular opening 83 in the end of the shaft 41.
- electrolyte is introduced through the conduit 71 into the pump structure 66. Suitable pressure is created thereon by said pump and the fluid is .then discharged directly into the chamber 73. From said chamber it passes through the openings 19b in said pulley 8b in the region thereof adjacent at a given moment the chamber 73 and thence through the portion of the belt adjacent thereto and into the region between said belt and a workpiece.
- Electro-chemical grinding apparatus of the abrasive belt type comprising:
- a pair of spaced pulleys supporting and driving said abrasive belt, one of said pulleys being located in such a position that a workpiece can contact said abrasive belt at such a point thereon that said one pulley constitutes a backing for said belt;
- said means for concentrating said electrolyte includes mechanical means for confining said electrolyte within a region substantially adjacent said point of contact.
- said mechanical means includes a shield substantially covering the upper half of said one pulley for maintaining the electrolyte discharged upwardly through the periphery of said one pulley substantially within the region adjacent said point of contact.
- said mechanical means includes a pair of circumferentially spaced, rotatable rollers disposed within said recess and defining said region therebetween, said rollers having resilient surfaces contacting the internal wall of said one pulley for confining the electrolyte in the region between said rollers.
- said mechanical means includes squeegee means mounted within said recess and extending into contact with the internal wall of said one pulley whereby the electrolyte will be prevented from moving with the internal wall of said one pulley as it rotates so that the electrolyte will flow out of said recess substantially adjacent said point of contact.
- said means for introducing electrolyte into said recess includes a discharge conduit positioned within said recess substantially adjacent the internal wall of said one pulley, said discharge conduit being positioned closely adjacent to but circumferentially spaced from said squeegee means, said discharge conduit and said squeegee means defining a space therebetween substantially adjacent said point of contact.
- said means for concentrating said electrolyte includes pantition means cooperating with the periphery of said one pulley for defining a confined space within said one pulley, said confined space being in substantial radial alignment with the point of contact of said workpiece against said abrasive belt, and wherein said means introduces said electrolyte into said confined space.
- An apparatus further including pump means within said one pulley for subjecting electrolyte within said one pulley to a substantial booster pressure and urging same under said pressure radially outwardly against the periphery of said one pulley, whereby said electrolyte will flow radially outwardly impelled in part by centrifugal force and in part by said booster pressure through the periphery of said one pulley and through the perforate abrasive belt against said workpiece.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52198766A | 1966-01-20 | 1966-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3448023A true US3448023A (en) | 1969-06-03 |
Family
ID=24078961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US521987A Expired - Lifetime US3448023A (en) | 1966-01-20 | 1966-01-20 | Belt type electro-chemical (or electrolytic) grinding machine |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3448023A (de) |
| JP (1) | JPS4823598B1 (de) |
| CH (1) | CH461657A (de) |
| GB (1) | GB1148187A (de) |
Cited By (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3619400A (en) * | 1969-12-15 | 1971-11-09 | Norton Co | Electrodeposited metal formation |
| US3739535A (en) * | 1971-03-03 | 1973-06-19 | Red Lee Metal Finishing Co Inc | Fluid cooled hub assembly for a contact wheel |
| US4140598A (en) * | 1976-06-03 | 1979-02-20 | Hitachi Shipbuilding & Engineering Co., Ltd. | Mirror finishing |
| US4328083A (en) * | 1979-02-24 | 1982-05-04 | Hitachi Shipbuilding And Engineering Co., Ltd. | Apparatus for mirror-finishing a cylindrical |
| US4596640A (en) * | 1977-06-14 | 1986-06-24 | Inoue-Japax Research, Incorporated | Shaping method and apparatus using an axially moving continuous elongated tool |
| US4642943A (en) * | 1985-11-21 | 1987-02-17 | Taylor Jr Joseph R | Belt abrading apparatus and method |
| US5284554A (en) * | 1992-01-09 | 1994-02-08 | International Business Machines Corporation | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
| US5782679A (en) * | 1996-09-23 | 1998-07-21 | Hunter; David T. | Metal abrasive belt and method of making same |
| US20020119286A1 (en) * | 2000-02-17 | 2002-08-29 | Liang-Yuh Chen | Conductive polishing article for electrochemical mechanical polishing |
| US20020130034A1 (en) * | 2000-02-23 | 2002-09-19 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
| US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
| US20030094364A1 (en) * | 1998-12-01 | 2003-05-22 | Homayoun Talieh | Method and apparatus for electro-chemical mechanical deposition |
| US20030136684A1 (en) * | 2002-01-22 | 2003-07-24 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| US20030209448A1 (en) * | 2002-05-07 | 2003-11-13 | Yongqi Hu | Conductive polishing article for electrochemical mechanical polishing |
| US20040023610A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20040020789A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20040050817A1 (en) * | 1999-11-29 | 2004-03-18 | Lizhong Sun | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
| US20040053560A1 (en) * | 2002-09-16 | 2004-03-18 | Lizhong Sun | Control of removal profile in electrochemically assisted CMP |
| US20040072445A1 (en) * | 2002-07-11 | 2004-04-15 | Applied Materials, Inc. | Effective method to improve surface finish in electrochemically assisted CMP |
| US20040082289A1 (en) * | 2000-02-17 | 2004-04-29 | Butterfield Paul D. | Conductive polishing article for electrochemical mechanical polishing |
| US20040082288A1 (en) * | 1999-05-03 | 2004-04-29 | Applied Materials, Inc. | Fixed abrasive articles |
| US20040163946A1 (en) * | 2000-02-17 | 2004-08-26 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US20040170753A1 (en) * | 2000-12-18 | 2004-09-02 | Basol Bulent M. | Electrochemical mechanical processing using low temperature process environment |
| US20040173461A1 (en) * | 2003-03-04 | 2004-09-09 | Applied Materials, Inc. | Method and apparatus for local polishing control |
| US20040182721A1 (en) * | 2003-03-18 | 2004-09-23 | Applied Materials, Inc. | Process control in electro-chemical mechanical polishing |
| US20050000801A1 (en) * | 2000-02-17 | 2005-01-06 | Yan Wang | Method and apparatus for electrochemical mechanical processing |
| US20050016868A1 (en) * | 1998-12-01 | 2005-01-27 | Asm Nutool, Inc. | Electrochemical mechanical planarization process and apparatus |
| US20050061674A1 (en) * | 2002-09-16 | 2005-03-24 | Yan Wang | Endpoint compensation in electroprocessing |
| US20050092621A1 (en) * | 2000-02-17 | 2005-05-05 | Yongqi Hu | Composite pad assembly for electrochemical mechanical processing (ECMP) |
| US20050124262A1 (en) * | 2003-12-03 | 2005-06-09 | Applied Materials, Inc. | Processing pad assembly with zone control |
| US20050121141A1 (en) * | 2003-11-13 | 2005-06-09 | Manens Antoine P. | Real time process control for a polishing process |
| US20050161341A1 (en) * | 2000-02-17 | 2005-07-28 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
| US20050178743A1 (en) * | 2002-09-16 | 2005-08-18 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
| US20050178666A1 (en) * | 2004-01-13 | 2005-08-18 | Applied Materials, Inc. | Methods for fabrication of a polishing article |
| US20050194681A1 (en) * | 2002-05-07 | 2005-09-08 | Yongqi Hu | Conductive pad with high abrasion |
| US20050233578A1 (en) * | 2004-01-29 | 2005-10-20 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US20060006073A1 (en) * | 2004-02-27 | 2006-01-12 | Basol Bulent M | System and method for electrochemical mechanical polishing |
| US20060021974A1 (en) * | 2004-01-29 | 2006-02-02 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US20060032749A1 (en) * | 2000-02-17 | 2006-02-16 | Liu Feng Q | Contact assembly and method for electrochemical mechanical processing |
| US20060070885A1 (en) * | 1999-09-17 | 2006-04-06 | Uzoh Cyprian E | Chip interconnect and packaging deposition methods and structures |
| US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
| US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US20060166500A1 (en) * | 2005-01-26 | 2006-07-27 | Applied Materials, Inc. | Electroprocessing profile control |
| US20060163074A1 (en) * | 2002-09-16 | 2006-07-27 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| US20060196778A1 (en) * | 2005-01-28 | 2006-09-07 | Renhe Jia | Tungsten electroprocessing |
| US20060229007A1 (en) * | 2005-04-08 | 2006-10-12 | Applied Materials, Inc. | Conductive pad |
| US20060231414A1 (en) * | 2000-02-17 | 2006-10-19 | Paul Butterfield | Contacts for electrochemical processing |
| US20060249398A1 (en) * | 2005-05-06 | 2006-11-09 | Becker Manfred G | Electrolytic microfinishing of metallic workpieces |
| US7137879B2 (en) * | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20070051635A1 (en) * | 2000-08-10 | 2007-03-08 | Basol Bulent M | Plating apparatus and method for controlling conductor deposition on predetermined portions of a wafer |
| US20070096315A1 (en) * | 2005-11-01 | 2007-05-03 | Applied Materials, Inc. | Ball contact cover for copper loss reduction and spike reduction |
| US20070128851A1 (en) * | 2001-01-05 | 2007-06-07 | Novellus Systems, Inc. | Fabrication of semiconductor interconnect structures |
| US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US20080014709A1 (en) * | 2006-07-07 | 2008-01-17 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
| US7323095B2 (en) | 2000-12-18 | 2008-01-29 | Applied Materials, Inc. | Integrated multi-step gap fill and all feature planarization for conductive materials |
| US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
| US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20080237048A1 (en) * | 2007-03-30 | 2008-10-02 | Ismail Emesh | Method and apparatus for selective electrofilling of through-wafer vias |
| US20090065365A1 (en) * | 2007-09-11 | 2009-03-12 | Asm Nutool, Inc. | Method and apparatus for copper electroplating |
| US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
| US20090280243A1 (en) * | 2006-07-21 | 2009-11-12 | Novellus Systems, Inc. | Photoresist-free metal deposition |
| US20100224501A1 (en) * | 2000-08-10 | 2010-09-09 | Novellus Systems, Inc. | Plating methods for low aspect ratio cavities |
| US20110054397A1 (en) * | 2006-03-31 | 2011-03-03 | Menot Sebastien | Medical liquid injection device |
| US20140202797A1 (en) * | 2011-09-30 | 2014-07-24 | Inventio Ag | Reducing over-traction in an elevator |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004108358A2 (en) * | 2003-06-06 | 2004-12-16 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2680938A (en) * | 1949-11-09 | 1954-06-15 | Osborn Mfg Co | Apparatus for conditioning metal sheets and the like |
| US2997437A (en) * | 1958-09-09 | 1961-08-22 | Thompson Ramo Wooldridge Inc | Abrasive machine and method |
| US3162588A (en) * | 1961-04-17 | 1964-12-22 | Hammond Machinery Builders Inc | Belt type electrolytic grinding machine |
| US3238114A (en) * | 1960-06-06 | 1966-03-01 | Gen Electric | Cathode for electrolytic erosion of metal |
-
1966
- 1966-01-20 US US521987A patent/US3448023A/en not_active Expired - Lifetime
-
1967
- 1967-01-06 GB GB996/67A patent/GB1148187A/en not_active Expired
- 1967-01-17 CH CH82267A patent/CH461657A/de unknown
- 1967-01-20 JP JP42003686A patent/JPS4823598B1/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2680938A (en) * | 1949-11-09 | 1954-06-15 | Osborn Mfg Co | Apparatus for conditioning metal sheets and the like |
| US2997437A (en) * | 1958-09-09 | 1961-08-22 | Thompson Ramo Wooldridge Inc | Abrasive machine and method |
| US3238114A (en) * | 1960-06-06 | 1966-03-01 | Gen Electric | Cathode for electrolytic erosion of metal |
| US3162588A (en) * | 1961-04-17 | 1964-12-22 | Hammond Machinery Builders Inc | Belt type electrolytic grinding machine |
Cited By (115)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3619400A (en) * | 1969-12-15 | 1971-11-09 | Norton Co | Electrodeposited metal formation |
| US3739535A (en) * | 1971-03-03 | 1973-06-19 | Red Lee Metal Finishing Co Inc | Fluid cooled hub assembly for a contact wheel |
| US4140598A (en) * | 1976-06-03 | 1979-02-20 | Hitachi Shipbuilding & Engineering Co., Ltd. | Mirror finishing |
| US4596640A (en) * | 1977-06-14 | 1986-06-24 | Inoue-Japax Research, Incorporated | Shaping method and apparatus using an axially moving continuous elongated tool |
| US4328083A (en) * | 1979-02-24 | 1982-05-04 | Hitachi Shipbuilding And Engineering Co., Ltd. | Apparatus for mirror-finishing a cylindrical |
| US4642943A (en) * | 1985-11-21 | 1987-02-17 | Taylor Jr Joseph R | Belt abrading apparatus and method |
| US5284554A (en) * | 1992-01-09 | 1994-02-08 | International Business Machines Corporation | Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces |
| US5782679A (en) * | 1996-09-23 | 1998-07-21 | Hunter; David T. | Metal abrasive belt and method of making same |
| US7341649B2 (en) * | 1998-12-01 | 2008-03-11 | Novellus Systems, Inc. | Apparatus for electroprocessing a workpiece surface |
| US20030094364A1 (en) * | 1998-12-01 | 2003-05-22 | Homayoun Talieh | Method and apparatus for electro-chemical mechanical deposition |
| US20050016868A1 (en) * | 1998-12-01 | 2005-01-27 | Asm Nutool, Inc. | Electrochemical mechanical planarization process and apparatus |
| US7425250B2 (en) | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
| US7014538B2 (en) | 1999-05-03 | 2006-03-21 | Applied Materials, Inc. | Article for polishing semiconductor substrates |
| US20040082288A1 (en) * | 1999-05-03 | 2004-04-29 | Applied Materials, Inc. | Fixed abrasive articles |
| US20060070885A1 (en) * | 1999-09-17 | 2006-04-06 | Uzoh Cyprian E | Chip interconnect and packaging deposition methods and structures |
| US7077725B2 (en) | 1999-11-29 | 2006-07-18 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
| US20040050817A1 (en) * | 1999-11-29 | 2004-03-18 | Lizhong Sun | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
| US20050000801A1 (en) * | 2000-02-17 | 2005-01-06 | Yan Wang | Method and apparatus for electrochemical mechanical processing |
| US20060032749A1 (en) * | 2000-02-17 | 2006-02-16 | Liu Feng Q | Contact assembly and method for electrochemical mechanical processing |
| US20040082289A1 (en) * | 2000-02-17 | 2004-04-29 | Butterfield Paul D. | Conductive polishing article for electrochemical mechanical polishing |
| US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
| US20040163946A1 (en) * | 2000-02-17 | 2004-08-26 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7569134B2 (en) | 2000-02-17 | 2009-08-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US20040020789A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20040266327A1 (en) * | 2000-02-17 | 2004-12-30 | Liang-Yuh Chen | Conductive polishing article for electrochemical mechanical polishing |
| US7422516B2 (en) | 2000-02-17 | 2008-09-09 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20060231414A1 (en) * | 2000-02-17 | 2006-10-19 | Paul Butterfield | Contacts for electrochemical processing |
| US20040023610A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7137868B2 (en) | 2000-02-17 | 2006-11-21 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US20050092621A1 (en) * | 2000-02-17 | 2005-05-05 | Yongqi Hu | Composite pad assembly for electrochemical mechanical processing (ECMP) |
| US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7344431B2 (en) | 2000-02-17 | 2008-03-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US20050161341A1 (en) * | 2000-02-17 | 2005-07-28 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
| US20020119286A1 (en) * | 2000-02-17 | 2002-08-29 | Liang-Yuh Chen | Conductive polishing article for electrochemical mechanical polishing |
| US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US7207878B2 (en) | 2000-02-17 | 2007-04-24 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
| US6962524B2 (en) | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7285036B2 (en) | 2000-02-17 | 2007-10-23 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical polishing |
| US6988942B2 (en) | 2000-02-17 | 2006-01-24 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6991528B2 (en) * | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7278911B2 (en) | 2000-02-17 | 2007-10-09 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
| US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
| US20020130034A1 (en) * | 2000-02-23 | 2002-09-19 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
| US7378004B2 (en) | 2000-02-23 | 2008-05-27 | Novellus Systems, Inc. | Pad designs and structures for a versatile materials processing apparatus |
| US8236160B2 (en) | 2000-08-10 | 2012-08-07 | Novellus Systems, Inc. | Plating methods for low aspect ratio cavities |
| US20100224501A1 (en) * | 2000-08-10 | 2010-09-09 | Novellus Systems, Inc. | Plating methods for low aspect ratio cavities |
| US7754061B2 (en) | 2000-08-10 | 2010-07-13 | Novellus Systems, Inc. | Method for controlling conductor deposition on predetermined portions of a wafer |
| US20070051635A1 (en) * | 2000-08-10 | 2007-03-08 | Basol Bulent M | Plating apparatus and method for controlling conductor deposition on predetermined portions of a wafer |
| US7323095B2 (en) | 2000-12-18 | 2008-01-29 | Applied Materials, Inc. | Integrated multi-step gap fill and all feature planarization for conductive materials |
| US20040170753A1 (en) * | 2000-12-18 | 2004-09-02 | Basol Bulent M. | Electrochemical mechanical processing using low temperature process environment |
| US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
| US20070128851A1 (en) * | 2001-01-05 | 2007-06-07 | Novellus Systems, Inc. | Fabrication of semiconductor interconnect structures |
| US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
| US7137879B2 (en) * | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7311592B2 (en) | 2001-04-24 | 2007-12-25 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
| US20030136684A1 (en) * | 2002-01-22 | 2003-07-24 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| US6837983B2 (en) | 2002-01-22 | 2005-01-04 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| US20030209448A1 (en) * | 2002-05-07 | 2003-11-13 | Yongqi Hu | Conductive polishing article for electrochemical mechanical polishing |
| US20050194681A1 (en) * | 2002-05-07 | 2005-09-08 | Yongqi Hu | Conductive pad with high abrasion |
| US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20040072445A1 (en) * | 2002-07-11 | 2004-04-15 | Applied Materials, Inc. | Effective method to improve surface finish in electrochemically assisted CMP |
| US6991526B2 (en) | 2002-09-16 | 2006-01-31 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
| US20060228992A1 (en) * | 2002-09-16 | 2006-10-12 | Manens Antoine P | Process control in electrochemically assisted planarization |
| US7070475B2 (en) | 2002-09-16 | 2006-07-04 | Applied Materials | Process control in electrochemically assisted planarization |
| US7628905B2 (en) | 2002-09-16 | 2009-12-08 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US20050178743A1 (en) * | 2002-09-16 | 2005-08-18 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
| US20080051009A1 (en) * | 2002-09-16 | 2008-02-28 | Yan Wang | Endpoint for electroprocessing |
| US7112270B2 (en) | 2002-09-16 | 2006-09-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US7294038B2 (en) | 2002-09-16 | 2007-11-13 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
| US20060237330A1 (en) * | 2002-09-16 | 2006-10-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US7790015B2 (en) | 2002-09-16 | 2010-09-07 | Applied Materials, Inc. | Endpoint for electroprocessing |
| US20040053560A1 (en) * | 2002-09-16 | 2004-03-18 | Lizhong Sun | Control of removal profile in electrochemically assisted CMP |
| US20050061674A1 (en) * | 2002-09-16 | 2005-03-24 | Yan Wang | Endpoint compensation in electroprocessing |
| US20060163074A1 (en) * | 2002-09-16 | 2006-07-27 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US20040173461A1 (en) * | 2003-03-04 | 2004-09-09 | Applied Materials, Inc. | Method and apparatus for local polishing control |
| US20080017521A1 (en) * | 2003-03-18 | 2008-01-24 | Manens Antoine P | Process control in electro-chemical mechanical polishing |
| US20040182721A1 (en) * | 2003-03-18 | 2004-09-23 | Applied Materials, Inc. | Process control in electro-chemical mechanical polishing |
| US20050121141A1 (en) * | 2003-11-13 | 2005-06-09 | Manens Antoine P. | Real time process control for a polishing process |
| US20050124262A1 (en) * | 2003-12-03 | 2005-06-09 | Applied Materials, Inc. | Processing pad assembly with zone control |
| US7186164B2 (en) | 2003-12-03 | 2007-03-06 | Applied Materials, Inc. | Processing pad assembly with zone control |
| US20050178666A1 (en) * | 2004-01-13 | 2005-08-18 | Applied Materials, Inc. | Methods for fabrication of a polishing article |
| US20060021974A1 (en) * | 2004-01-29 | 2006-02-02 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7390744B2 (en) | 2004-01-29 | 2008-06-24 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US20050233578A1 (en) * | 2004-01-29 | 2005-10-20 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US20060006073A1 (en) * | 2004-02-27 | 2006-01-12 | Basol Bulent M | System and method for electrochemical mechanical polishing |
| US7648622B2 (en) | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
| US7446041B2 (en) | 2004-09-14 | 2008-11-04 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
| US20080047841A1 (en) * | 2005-01-26 | 2008-02-28 | Manens Antoine P | Electroprocessing profile control |
| US20060166500A1 (en) * | 2005-01-26 | 2006-07-27 | Applied Materials, Inc. | Electroprocessing profile control |
| US7655565B2 (en) | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
| US7709382B2 (en) | 2005-01-26 | 2010-05-04 | Applied Materials, Inc. | Electroprocessing profile control |
| US20080045012A1 (en) * | 2005-01-26 | 2008-02-21 | Manens Antoine P | Electroprocessing profile control |
| US20060196778A1 (en) * | 2005-01-28 | 2006-09-07 | Renhe Jia | Tungsten electroprocessing |
| US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
| US20060229007A1 (en) * | 2005-04-08 | 2006-10-12 | Applied Materials, Inc. | Conductive pad |
| US20060249398A1 (en) * | 2005-05-06 | 2006-11-09 | Becker Manfred G | Electrolytic microfinishing of metallic workpieces |
| US8070933B2 (en) | 2005-05-06 | 2011-12-06 | Thielenhaus Microfinishing Corp. | Electrolytic microfinishing of metallic workpieces |
| US20070096315A1 (en) * | 2005-11-01 | 2007-05-03 | Applied Materials, Inc. | Ball contact cover for copper loss reduction and spike reduction |
| US20110054397A1 (en) * | 2006-03-31 | 2011-03-03 | Menot Sebastien | Medical liquid injection device |
| US7422982B2 (en) | 2006-07-07 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
| US20080014709A1 (en) * | 2006-07-07 | 2008-01-17 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
| US20080035474A1 (en) * | 2006-07-07 | 2008-02-14 | You Wang | Apparatus for electroprocessing a substrate with edge profile control |
| US20090280243A1 (en) * | 2006-07-21 | 2009-11-12 | Novellus Systems, Inc. | Photoresist-free metal deposition |
| US7947163B2 (en) | 2006-07-21 | 2011-05-24 | Novellus Systems, Inc. | Photoresist-free metal deposition |
| US8500985B2 (en) | 2006-07-21 | 2013-08-06 | Novellus Systems, Inc. | Photoresist-free metal deposition |
| US20080237048A1 (en) * | 2007-03-30 | 2008-10-02 | Ismail Emesh | Method and apparatus for selective electrofilling of through-wafer vias |
| US20090065365A1 (en) * | 2007-09-11 | 2009-03-12 | Asm Nutool, Inc. | Method and apparatus for copper electroplating |
| US20140202797A1 (en) * | 2011-09-30 | 2014-07-24 | Inventio Ag | Reducing over-traction in an elevator |
Also Published As
| Publication number | Publication date |
|---|---|
| CH461657A (de) | 1968-08-31 |
| GB1148187A (en) | 1969-04-10 |
| JPS4823598B1 (de) | 1973-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3448023A (en) | Belt type electro-chemical (or electrolytic) grinding machine | |
| US3162588A (en) | Belt type electrolytic grinding machine | |
| US4704823A (en) | Abrasive surfacing machine | |
| US3229424A (en) | Concentric motor and cooling pulley assembly for abraders and the like | |
| US2997437A (en) | Abrasive machine and method | |
| US5032238A (en) | Method of and apparatus for electropolishing and grinding | |
| US4328083A (en) | Apparatus for mirror-finishing a cylindrical | |
| US2850853A (en) | Contact wheels | |
| US3834088A (en) | Wedge flow coolant nozzle for grinding machine | |
| US3673740A (en) | Grinding method and apparatus | |
| KR20030090698A (ko) | 엣지 연마를 균일하게 조절하는 장치 | |
| US3739535A (en) | Fluid cooled hub assembly for a contact wheel | |
| US3099904A (en) | Mechanical device | |
| US1049412A (en) | Forwarding device for razor-blade-grinding machines. | |
| US1568185A (en) | Grinding machine | |
| US4710358A (en) | Apparatus for changing the surface tension of cup-like containers | |
| JPS62228364A (ja) | ライン式連続送り鏡面研磨装置 | |
| JP2678329B2 (ja) | 円筒工作物外面加工装置 | |
| JPS5835410Y2 (ja) | ホ−ニングカコウヨウトイシ | |
| JP2843156B2 (ja) | 電解バフ複合研磨装置 | |
| JPH0985612A (ja) | 研磨装置 | |
| JPS6216283Y2 (de) | ||
| JPS56139699A (en) | Specular finishing method by electrolytic composite polishing | |
| KR0115308Y1 (ko) | 봉합침 귀기등 연마기 | |
| GB416411A (en) | Improved method of, and machine for grinding, lapping, polishing or honing safety razor blades or strips for forming such blades |