US3510364A - Contact structure for a thermoelectric device - Google Patents
Contact structure for a thermoelectric device Download PDFInfo
- Publication number
- US3510364A US3510364A US714603A US3510364DA US3510364A US 3510364 A US3510364 A US 3510364A US 714603 A US714603 A US 714603A US 3510364D A US3510364D A US 3510364DA US 3510364 A US3510364 A US 3510364A
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- US
- United States
- Prior art keywords
- contact
- silicon
- legs
- hafnium
- thermoelectric device
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Links
- 229910000676 Si alloy Inorganic materials 0.000 description 15
- 239000000203 mixture Substances 0.000 description 12
- CEPICIBPGDWCRU-UHFFFAOYSA-N [Si].[Hf] Chemical compound [Si].[Hf] CEPICIBPGDWCRU-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910052735 hafnium Inorganic materials 0.000 description 6
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
Definitions
- thermoelectric device whose thermocouple legs consist of silicon alloys has these legs contacted and interconnected by structure made of a hafnium-silicon alloy with about 1 to atom percent hafnium and about 99 to 85 atom percent silicon.
- the composition contains 7.5 atom percent hafnium and 92.5 percent silicon.
- our invention relates to contact structures for use as contact pieces and contact bridges in thermoelectric devices, preferably thermogenerators, in which these structures are bonded to thermocouple legs made of semicon ducting silicon alloy such as silicon-germanium alloy.
- our invention is related to those described in the copending applications Ser. No. 599,934, filed Dec. 7, 1966, Pat. No. 3,441,812 and Ser. No. 556,211, filed June 8, 1966, both assigned to the assignee of the present invention.
- the contact structure may serve as a terminal for attaching an electric lead to a thermocouple leg, or it may form a contact bridge between the two thermoelectrically different legs of each couple. Since, as a rule, many such couples are combined to a battery, the contact structure should have approximately the same thermal coefficient of expansion as the semiconducting silicon alloy of which the legs are made so that a variation in temperature does not cause excessive mechanical tension. The contact structure is also supposed to have good mechanical qualities, particularly great strength. It should be resistant to chemically aggressive atmospheres. When using the contact structure as a contact bridge within a thermogenerator, it is also desirable that the bridge structure have good electrical and thermal conductivity since the thermogenerator efficiency depends upon these qualities.
- thermoelectric device particularly a thermogenerator, whose contact structures, used in the above-described manner conjointly satisfy the various desiderata just mentioned.
- the contact structure to be bonded to a thermocouple leg of semiconducting silicon alloy is formed of a hafnium-silicon alloy in which the mixing ratio of hafnium and silicon corresponds at least approximately to a eutectic or dystectic, composition.
- a dystectic composition has those proportions of two or more metals which produce the highest constant melting point, and a eutectic composition has those proportions of two or more metals which produce the lowest constant melting point.
- a mixing ratio of this type is particularly favorable for the purpose of the invention because it affords obtaining and using the material of the contact structure either in form of a microscopic mixture of the pure crystals of the respective two components or as a stoichiometric compound.
- Dystectic compositions are additionally of advantage if the contact structure is to have "ice a particularly high melting point.
- the electrical and thermal conductivity of the alloy is decisive in the selection of the mixing ratio preferred for a particular contact piece or contact bridge. That is, both the electrical and the thermal conductivity should be as high as feasible.
- the hafnium-silicon alloy of which the contact structure is constituted consists of the composition Hf Si with 0 x 0.l5.
- the composition is formed substantially of hafnium in an amount ranging from small but effective traces, such as about 1 atom percent, up to 15 atom percent, the balance being 99 to atom percent silicon.
- alloy composition Hf ,,,si which has been found to exhibit particularly good electrical and thermal conductivity values.
- a contact piece or contact bridge according to the invention not only satisfies all of the above-mentioned desiderata but also offers other advantageous properties. It has a high stability with respect to temperature and changes in temperature. Due to its metallic component, it also exhibits great hardness and great breaking strength. This makes the contact structures particularly Well suitable for thermogenerators, i.e. thermocouple batteries which directly convert heat into electricity. Tests have shown that the contact junctions can readily be operated at temperatures up to more than 1000 C. so that thermogenerators equipped with such contact structures attain a better efliciency than those having contact structures of materials as heretofore available. It has also been found that the hafnium contained in the contact structure according to the invention does not have a detrimental doping effect upon the germanium-silicon alloy of which the thermocouple legs are constituted.
- contact pieces and bridges according to the invention contain a component of the semiconductor material of which the legs are made. For that reason, the semiconductor body of a leg can be directly alloyed onto a contact structure according to the invention without any discernible impairment of the electrical semiconductor properties.
- the semiconductor body of the leg For contacting the semiconductor body of the leg with a contact piece or bridge according to the invention, the semiconductor body of the leg need only be placed upon the contact area which for this purpose is provided on' the contact structure, and can then be joined with the structure by fusing the leg onto the structure.
- thermogenerator illustrated in section and by way of example on the accompanying drawing.
- thermogenerator is equipped with a heat exchanger 1 for a gaseous medium at the hot contact junction side of the thermocouple battery, and with a heat exchanger 2 to be traversed by a liquid medium at the cold junction side of the battery.
- the visible portion of the thermogenerator battery comprises two thermocouple legs 3 and 4 which are both made of germanium-silicon alloy.
- One of the legs is doped for p-type conductivity by having a corresponding dopant content of boron, gallium or indium, for example.
- the other leg is doped for n-type conductivity, for example with phosphorus, arsenic or antimony.
- thermocouple legs of semiconducting germanium-silicon
- other semiconducting silicon alloys are also applicable, for example an ironsilicon alloy.
- Two contact pieces 6, 7 and a bridge member 5 which interconnects the two legs 3 and 4 are made of the abovedescribed hafnium-silicon alloy. They are isolated from the respective heat exchangers by an electrically insulating but thermally conducting layer 9 or 10, such as a coating of aluminum oxide.
- the contact pieces 6 and 7 are joined with electrical cables 11 and 12.
- the contact bonding is effected in the following manner.
- the contact pieces 6, 7 and the bridge 5 of hafniumsilicon alloy are first separately produced in the appropriate shapes. Then the thermocouple legs are placed upon the contact areas 8 which for this purpose are provided on the contact structures, these areas being properly prepared, for example by grinding. Thereafter, the legs 3' and 4 are fused onto the contact structures or are soldered thereto.
- thermocouple legs and contact structures as well as with respect to the particular design and shape of the thermoelectric device in which the contact structures of hafniumsilicon alloy are to be used, thus being amenable to embodiments other than particularly illustrated and described herein, without departing from the essential features of our invention and within the scope of the claims annexed hereto.
- thermoelectric device having thermocouple legs of semiconducting silicon alloy and an electrical contact bonded to said legs, said contact being formed of a hafnium-silicon alloy whose hafnium-silicon mixing ratio corresponds substantially to a eutectic or dystectic composition.
- thermoelectric device containing from about 1 atom percent to 15 atom percent hafnium, the remainder being substantially all of silicon.
- thermoelectric device having thermocouple legs of semiconducting silicon alloy and an electrical contact bonded to said legs, said contact being formed of a hafnium-silicon alloy having substantially the composition Hf Si wherein x is greater than zero and less than 0.15.
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
y 1970 e. OESTERHELT E L 3,510,364
CONTACT STRUCTURE FOR A THERMOELECTRIC DEVICE Filed March 20, 1968 United States Patent US. Cl. 136239 5 Claims ABSTRACT OF THE DISCLOSURE A thermoelectric device whose thermocouple legs consist of silicon alloys has these legs contacted and interconnected by structure made of a hafnium-silicon alloy with about 1 to atom percent hafnium and about 99 to 85 atom percent silicon. Preferably the composition contains 7.5 atom percent hafnium and 92.5 percent silicon.
Our invention relates to contact structures for use as contact pieces and contact bridges in thermoelectric devices, preferably thermogenerators, in which these structures are bonded to thermocouple legs made of semicon ducting silicon alloy such as silicon-germanium alloy. In this respect, our invention is related to those described in the copending applications Ser. No. 599,934, filed Dec. 7, 1966, Pat. No. 3,441,812 and Ser. No. 556,211, filed June 8, 1966, both assigned to the assignee of the present invention.
In such thermoelectric devices, the contact structure may serve as a terminal for attaching an electric lead to a thermocouple leg, or it may form a contact bridge between the two thermoelectrically different legs of each couple. Since, as a rule, many such couples are combined to a battery, the contact structure should have approximately the same thermal coefficient of expansion as the semiconducting silicon alloy of which the legs are made so that a variation in temperature does not cause excessive mechanical tension. The contact structure is also supposed to have good mechanical qualities, particularly great strength. It should be resistant to chemically aggressive atmospheres. When using the contact structure as a contact bridge within a thermogenerator, it is also desirable that the bridge structure have good electrical and thermal conductivity since the thermogenerator efficiency depends upon these qualities.
It is an object of our invention to devise a thermoelectric device, particularly a thermogenerator, whose contact structures, used in the above-described manner conjointly satisfy the various desiderata just mentioned.
We have discovered that this is achieved if the contact structure to be bonded to a thermocouple leg of semiconducting silicon alloy is formed of a hafnium-silicon alloy in which the mixing ratio of hafnium and silicon corresponds at least approximately to a eutectic or dystectic, composition. A dystectic composition has those proportions of two or more metals which produce the highest constant melting point, and a eutectic composition has those proportions of two or more metals which produce the lowest constant melting point.
A mixing ratio of this type is particularly favorable for the purpose of the invention because it affords obtaining and using the material of the contact structure either in form of a microscopic mixture of the pure crystals of the respective two components or as a stoichiometric compound. Dystectic compositions are additionally of advantage if the contact structure is to have "ice a particularly high melting point. As a rule, the electrical and thermal conductivity of the alloy is decisive in the selection of the mixing ratio preferred for a particular contact piece or contact bridge. That is, both the electrical and the thermal conductivity should be as high as feasible. From these viewpoints and in accordance with our invention, the hafnium-silicon alloy of which the contact structure is constituted consists of the composition Hf Si with 0 x 0.l5. That is, the composition is formed substantially of hafnium in an amount ranging from small but effective traces, such as about 1 atom percent, up to 15 atom percent, the balance being 99 to atom percent silicon. Particularly well suitable within this range is the alloy composition Hf ,,,si which has been found to exhibit particularly good electrical and thermal conductivity values.
A contact piece or contact bridge according to the invention not only satisfies all of the above-mentioned desiderata but also offers other advantageous properties. It has a high stability with respect to temperature and changes in temperature. Due to its metallic component, it also exhibits great hardness and great breaking strength. This makes the contact structures particularly Well suitable for thermogenerators, i.e. thermocouple batteries which directly convert heat into electricity. Tests have shown that the contact junctions can readily be operated at temperatures up to more than 1000 C. so that thermogenerators equipped with such contact structures attain a better efliciency than those having contact structures of materials as heretofore available. It has also been found that the hafnium contained in the contact structure according to the invention does not have a detrimental doping effect upon the germanium-silicon alloy of which the thermocouple legs are constituted.
It should be recognized that contact pieces and bridges according to the invention contain a component of the semiconductor material of which the legs are made. For that reason, the semiconductor body of a leg can be directly alloyed onto a contact structure according to the invention without any discernible impairment of the electrical semiconductor properties.
For contacting the semiconductor body of the leg with a contact piece or bridge according to the invention, the semiconductor body of the leg need only be placed upon the contact area which for this purpose is provided on' the contact structure, and can then be joined with the structure by fusing the leg onto the structure.
The invention will be further described with reference to an embodiment of a thermogenerator illustrated in section and by way of example on the accompanying drawing.
The illustrated thermogenerator is equipped with a heat exchanger 1 for a gaseous medium at the hot contact junction side of the thermocouple battery, and with a heat exchanger 2 to be traversed by a liquid medium at the cold junction side of the battery. The visible portion of the thermogenerator battery comprises two thermocouple legs 3 and 4 which are both made of germanium-silicon alloy. One of the legs is doped for p-type conductivity by having a corresponding dopant content of boron, gallium or indium, for example. The other leg is doped for n-type conductivity, for example with phosphorus, arsenic or antimony.
While we prefer forming the thermocouple legs of semiconducting germanium-silicon, other semiconducting silicon alloys are also applicable, for example an ironsilicon alloy.
Two contact pieces 6, 7 and a bridge member 5 which interconnects the two legs 3 and 4 are made of the abovedescribed hafnium-silicon alloy. They are isolated from the respective heat exchangers by an electrically insulating but thermally conducting layer 9 or 10, such as a coating of aluminum oxide. The contact pieces 6 and 7 are joined with electrical cables 11 and 12. For a suitable method of producing the silicon-oxide coatings 9, 10 reference may be had to the above-mentioned copending application Ser. No. 556,211.
The contact bonding is effected in the following manner. The contact pieces 6, 7 and the bridge 5 of hafniumsilicon alloy are first separately produced in the appropriate shapes. Then the thermocouple legs are placed upon the contact areas 8 which for this purpose are provided on the contact structures, these areas being properly prepared, for example by grinding. Thereafter, the legs 3' and 4 are fused onto the contact structures or are soldered thereto.
To those skilled in the art, it Will be obvious upon a study of this disclosure that our invention permits of different variants with respect to the compositions of the thermocouple legs and contact structures as well as with respect to the particular design and shape of the thermoelectric device in which the contact structures of hafniumsilicon alloy are to be used, thus being amenable to embodiments other than particularly illustrated and described herein, without departing from the essential features of our invention and within the scope of the claims annexed hereto.
We claim:
1. In a thermoelectric device having thermocouple legs of semiconducting silicon alloy and an electrical contact bonded to said legs, said contact being formed of a hafnium-silicon alloy whose hafnium-silicon mixing ratio corresponds substantially to a eutectic or dystectic composition.
2. An electrical contact for a thermoelectric device according to claim 1, containing from about 1 atom percent to 15 atom percent hafnium, the remainder being substantially all of silicon.
3. In a thermoelectric device having thermocouple legs of semiconducting silicon alloy and an electrical contact bonded to said legs, said contact being formed of a hafnium-silicon alloy having substantially the composition Hf Si wherein x is greater than zero and less than 0.15.
4. An electrical contact for a thermoelectIic device according to claim 3 having substantially the compoistion rJ.0'I5 o.925-
5. In a thermoelectric device according to claim 3, including said silicon-hafnium contact having an area fusion-bonded with one of said thermocouple legs.
References Cited UNITED STATES PATENTS 2,458,013 l/1949 Malmberg 317-241 2,831,787 4/1958 Emeis 317235 3,279,954 10/1966 Cody et a1 l36205 2,826,725 3/1958 Roberts 3l7--238 JAMES D. KALLAM, Primary Examiner US. Cl. X.R.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0108937 | 1967-03-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3510364A true US3510364A (en) | 1970-05-05 |
Family
ID=7529146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US714603A Expired - Lifetime US3510364A (en) | 1967-03-21 | 1968-03-20 | Contact structure for a thermoelectric device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3510364A (en) |
| DE (1) | DE1539332B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4521794A (en) * | 1980-09-30 | 1985-06-04 | Nippon Telegraph & Telephone Public Corporation | Electrode and semiconductor device provided with the electrode |
| US20150179543A1 (en) * | 2013-12-23 | 2015-06-25 | Globalfoundries Singapore Pte. Ltd. | Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2458013A (en) * | 1944-03-04 | 1949-01-04 | Asea Ab | Selenium rectifier element and method of manufacturing same |
| US2826725A (en) * | 1953-11-10 | 1958-03-11 | Sarkes Tarzian | P-n junction rectifier |
| US2831787A (en) * | 1954-07-27 | 1958-04-22 | Emeis | |
| US3279954A (en) * | 1961-06-09 | 1966-10-18 | Rca Corp | Thermoelectric device having silicongermanium alloy thermoelement |
-
1967
- 1967-03-21 DE DE19671539332 patent/DE1539332B2/en active Pending
-
1968
- 1968-03-20 US US714603A patent/US3510364A/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2458013A (en) * | 1944-03-04 | 1949-01-04 | Asea Ab | Selenium rectifier element and method of manufacturing same |
| US2826725A (en) * | 1953-11-10 | 1958-03-11 | Sarkes Tarzian | P-n junction rectifier |
| US2831787A (en) * | 1954-07-27 | 1958-04-22 | Emeis | |
| US3279954A (en) * | 1961-06-09 | 1966-10-18 | Rca Corp | Thermoelectric device having silicongermanium alloy thermoelement |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4521794A (en) * | 1980-09-30 | 1985-06-04 | Nippon Telegraph & Telephone Public Corporation | Electrode and semiconductor device provided with the electrode |
| US20150179543A1 (en) * | 2013-12-23 | 2015-06-25 | Globalfoundries Singapore Pte. Ltd. | Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures |
| US9847272B2 (en) * | 2013-12-23 | 2017-12-19 | Globalfoundries Singapore Pte. Ltd. | Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1539332A1 (en) | 1970-02-26 |
| DE1539332B2 (en) | 1971-02-04 |
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