US3601889A - Method of manufacturing thin film resistor elements - Google Patents

Method of manufacturing thin film resistor elements Download PDF

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Publication number
US3601889A
US3601889A US802384A US3601889DA US3601889A US 3601889 A US3601889 A US 3601889A US 802384 A US802384 A US 802384A US 3601889D A US3601889D A US 3601889DA US 3601889 A US3601889 A US 3601889A
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US
United States
Prior art keywords
resistor
temperature coefficient
intermediate layers
film
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US802384A
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English (en)
Inventor
Ryoichi Kaneoya
Minoru Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
NTT Inc
Original Assignee
Fujitsu Ltd
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Nippon Telegraph and Telephone Corp filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of US3601889A publication Critical patent/US3601889A/en
Assigned to NIPPON TELEGRAPH & TELEPHONE CORPORATION reassignment NIPPON TELEGRAPH & TELEPHONE CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). EFFECTIVE ON 07/12/1985 Assignors: NIPPON TELEGRAPH AND TELEPHONE PUBLIC CORPORATION
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/232—Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal

Definitions

  • the method is characterized in that intermediate layers consisting of a metal having a temperature coefficient different from the temperature coefficient of a resistor film and capable of preventing diffusion of the soldering material and readily solderable terminal metal layers are provided on terminal parts of the resistor film and the temperature coefficient ofresistanee is minutely adjusted by removing RESISTOR ELEMENTS 3 Claims, 2 Drawing Figs. i
  • PATENTEU was] lSTi 3 501 8 METHOD OF MANUFACTURING THIN FILM RESISTOR ELEMENTS
  • This invention relates to a method of manufacturing thin film-resistor elements capable of obtaining the desired temperature coefficient of resistance and more particularly to a method of minutely adjusting the temperature coefficient of resistance of a resistor element in a thin film circuitry.
  • FIG. 1 is a sectional view of a resistor element of this invention and FIG. 2 is a plan view of said resistor element.
  • a resistor film 2 is formed on a substrate 1 consisting of a glazed ceramic by vacuum deposition or cathode sputtering and further intermediate layers 3 and terminal metal layers 4 are formed on the two ends of film 2.
  • Intermediate layers 3 operate to increase the mechanical adhesive strength of terminal metal layers 4 and prevent diffusion of soldering materials for attaching connecting leads or outer leads. According to this invention, these intermediate layers 3, by being provided as shown in the drawings, further facilitate adjustment of the temperature coefficient of resistance.
  • Intermediate layers 3 consist of a metal having a temperature coefiicient different from the temperature coefficient of resistance film 2 and are overlapped on the two ends of resistor film 2 as shown.
  • terminal metal layers 4 consist of a solderable metal of a low sheet resistivity value.
  • the equivalent circuit can be formed by connecting R, and R in parallel to one another and connecting R in series to R3 and R Ordinarily, is related with R as R R and a resistor.
  • the substrate was kept at a temperature of 350 C. and resistor film 2 of Ni-Cr (80 percent-20 percent) was deposited to a thickness of 400A and intermediate layers 3 of chromium were deposited to a thickness of 1000A and further terminal metal layers 4 of palladium were deposited to a thickness of 5000 A.
  • said chromium layers have a resistivity of about 20 #9 cm. and a temperature coefficient of resistance of 1700 p.p.m./C.
  • the temperature coefficient of resistance a as described above, can be expressed as follows ignoring the resistance of palladium:
  • a method of manufacturing thin film resistor elements which comprises providing, on a substrate base, a resistor film, intermediate metal layers, and readily solderable terminal layers, said intermediate layers having a temperature coefficient different from that of said resistor film and capable of preventing diffusion of soldering material, said readily solderable terminal layers being provided on terminal parts of said resistor film and minutely adjusting the temperature coefficient of resistance by removing parts of said intermediate layers.
  • the intermediate layers consisting of a metal having a temperature coefficient different from the temperature coefficient of a resistor film and capable of preventing diffusion of the soldering material, are overlapped and widely coated on terminal parts of the resistor film; readily solderable terminal metal layers are provided on said intermediate layers so that parts of said intermediate layers that are not overlapped on said resistor film may be exposed and the temperature coefficient of the resistor element is minutely adjusted by removing parts of said exposed intermediate layers.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
US802384A 1968-02-27 1969-02-26 Method of manufacturing thin film resistor elements Expired - Lifetime US3601889A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1243868 1968-02-27

Publications (1)

Publication Number Publication Date
US3601889A true US3601889A (en) 1971-08-31

Family

ID=11805288

Family Applications (1)

Application Number Title Priority Date Filing Date
US802384A Expired - Lifetime US3601889A (en) 1968-02-27 1969-02-26 Method of manufacturing thin film resistor elements

Country Status (3)

Country Link
US (1) US3601889A (de)
DE (1) DE1908394B2 (de)
GB (1) GB1221612A (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3913222A (en) * 1974-05-13 1975-10-21 Spectrol Electronics Corp Method of manufacturing a trimmer potentiometer
FR2611402A1 (fr) * 1987-02-27 1988-09-02 Fluke Mfg Co John Resistance composite et son procede de fabrication
US4907341A (en) * 1987-02-27 1990-03-13 John Fluke Mfg. Co., Inc. Compound resistor manufacturing method
US6347175B1 (en) 1999-07-14 2002-02-12 Corning Incorporated Solderable thin film
US20050258513A1 (en) * 2004-05-24 2005-11-24 International Business Machines Corporation Thin-film resistor and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160096785A (ko) * 2015-02-05 2016-08-17 삼성디스플레이 주식회사 광 변조 장치 및 그 구동 방법, 그리고 영상 표시 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB522660A (en) * 1937-12-18 1940-06-24 Fides Gmbh Improvements in or relating to electrical resistances
US2748234A (en) * 1952-10-14 1956-05-29 British Insulated Callenders Electric resistors
US2786925A (en) * 1952-12-31 1957-03-26 Sprague Electric Co Metal film resistor
US3423260A (en) * 1966-03-21 1969-01-21 Bunker Ramo Method of making a thin film circuit having a resistor-conductor pattern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB522660A (en) * 1937-12-18 1940-06-24 Fides Gmbh Improvements in or relating to electrical resistances
US2748234A (en) * 1952-10-14 1956-05-29 British Insulated Callenders Electric resistors
US2786925A (en) * 1952-12-31 1957-03-26 Sprague Electric Co Metal film resistor
US3423260A (en) * 1966-03-21 1969-01-21 Bunker Ramo Method of making a thin film circuit having a resistor-conductor pattern

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3913222A (en) * 1974-05-13 1975-10-21 Spectrol Electronics Corp Method of manufacturing a trimmer potentiometer
FR2611402A1 (fr) * 1987-02-27 1988-09-02 Fluke Mfg Co John Resistance composite et son procede de fabrication
US4907341A (en) * 1987-02-27 1990-03-13 John Fluke Mfg. Co., Inc. Compound resistor manufacturing method
US6347175B1 (en) 1999-07-14 2002-02-12 Corning Incorporated Solderable thin film
US20050258513A1 (en) * 2004-05-24 2005-11-24 International Business Machines Corporation Thin-film resistor and method of manufacturing the same
US7145218B2 (en) * 2004-05-24 2006-12-05 International Business Machines Corporation Thin-film resistor and method of manufacturing the same

Also Published As

Publication number Publication date
DE1908394B2 (de) 1971-10-21
DE1908394A1 (de) 1969-09-11
GB1221612A (en) 1971-02-03

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Date Code Title Description
AS Assignment

Owner name: NIPPON TELEGRAPH & TELEPHONE CORPORATION

Free format text: CHANGE OF NAME;ASSIGNOR:NIPPON TELEGRAPH AND TELEPHONE PUBLIC CORPORATION;REEL/FRAME:004454/0001

Effective date: 19850718