US3607682A - Electroplating baths and methods for electroplating gold alloys and a product thereof - Google Patents
Electroplating baths and methods for electroplating gold alloys and a product thereof Download PDFInfo
- Publication number
- US3607682A US3607682A US842704A US3607682DA US3607682A US 3607682 A US3607682 A US 3607682A US 842704 A US842704 A US 842704A US 3607682D A US3607682D A US 3607682DA US 3607682 A US3607682 A US 3607682A
- Authority
- US
- United States
- Prior art keywords
- gold
- electroplating
- baths
- cyanide
- potassium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000009713 electroplating Methods 0.000 title claims abstract description 23
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 11
- 239000003353 gold alloy Substances 0.000 title claims abstract description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 27
- 229910052737 gold Inorganic materials 0.000 claims description 27
- 239000010931 gold Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 15
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- OZVDYRYDJPFDBZ-UHFFFAOYSA-N [In](C#N)(C#N)C#N.[K] Chemical compound [In](C#N)(C#N)C#N.[K] OZVDYRYDJPFDBZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 abstract description 6
- 239000008151 electrolyte solution Substances 0.000 abstract description 5
- 229940021013 electrolyte solution Drugs 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 4
- 229910052783 alkali metal Inorganic materials 0.000 abstract description 4
- -1 alkali metal silver cyanide Chemical class 0.000 abstract description 4
- 239000000243 solution Substances 0.000 abstract description 4
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 abstract description 2
- 229940098221 silver cyanide Drugs 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 6
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 229910000027 potassium carbonate Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- NEMPKXBJHKFWNF-UHFFFAOYSA-N [C-]#N.[K+].C(O)(O)=O Chemical compound [C-]#N.[K+].C(O)(O)=O NEMPKXBJHKFWNF-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Definitions
- the thickness of the gold coating is limited to a maximum of about 0.0003 to 0.0005 inches if satisfactory slip ring properties (i.e., the lack of brittleness and flaking caused by the buildup of internal stresses) are to be maintained. Since it is exceedingly difficult, if not impossible, to subject coatings of such thicknesses to machining operations, it is required, in the manufacture of slip rings, to employ coatings having thicknesses to about 0.003 to 0.040.
- a patent to Spreter et al. (2,724,687) discloses the addition, to an alkaline aurocyanide bath, of a metal to be alloyed with the gold in he form of its ethylenediaminotetraacetic acid salt.
- This bath contains no free alkali cyanide and unlike the process of the present invention the ethylenediaminotetraacetic acid is added in the form of a metal salt.
- Spreter et al. teach that the advantage of this addition is that the bath does not age, as is the case with previously disclosed baths.
- electroplating baths which allow the deposition of thicknesses of gold of up to about 0.04 inches.
- the present invention allows the production of suitably heavy gold deposits while at the same time greatly simplifying the plating process in that no machining of preliminary basis coatings is required.
- the baths of the present invention are alkaline cyanide electroplating baths designed for the electrodeposition of an alloy comprising gold and silver.
- Electrolyte solutions comprising the electroplating baths of this invention comprise the following components in the proportions set forth below, all proportions being set forth in grams per liter:
- Further embodiments of the present invention are electroplating baths designed to produce alloys of gold, silver, and indium.
- the components of these baths and their proportions (in grams per liter) are set forth below:
- indium to the baths of this invention as set forth above results in deposits possessing higher hardness and built-in" lubricating properties to the surface of coating. These properties are particularly advantageous, for example in the production of the slip rings mentioned above.
- the plating bath of this invention may be operated at a current density of from 2 to 22 amperes per square foot of cathode surface, although it is preferable to operate at a current density of 10:5 amperes per square foot.
- the process of this invention operates at an efficiency of approximately percent-l00 percent.
- the range of operating temperature for the baths of the present invention is about F. to about 130 F., preferably about 1 15 F. to about F.
- the pH of the bath is automatically maintained at about 12.2 by the potassium carbonate present.
- the baths of this invention are formed by dissolving the appropriate amounts of potassium aurocyanide, free potassium cyanide, and potassium carbonate in water.
- the silver is added during the course of the electroplating process as a mixture of potassium silver cyanide and EDTA.
- the deposition normally takes place over a period of about 20 hours, although a period of about 0.5 to about 50 hours is contemplated.
- a slip ring is a mechanical device that is used to transmit electrical information from a stationary member to a rotating member or vice versa.
- the slip ring of this Example Prior to the deposition of metal, the slip ring of this Example consists of cured epoxy resin and in machined to effect latitudinal grooves.
- Various copper leads extend from the core of the device and are separately exposed at the bottom of each groove.
- the bottom of the groove is coated with a conductive paint, which is removed from the end of the copper lead with a dental burr.
- the slip ring is then subjected to a preplate cleaning cycle e.g. pickling) and electrodeposited by immersion in an electrolyte having the following composition (in grams/liter) Gold (as metal) 33.0 Free potassium cyanide 30.0 Potassium carbonate 300 Silver (as metal) 0.02 EDTA 5.0
- the gold and silver were added to the bath in the form of potassium metal salts.
- the conditions of treatment were as follows:
- Example II The procedure of Example I was followed except that the electrolyte solutions contained, in addition, indium in the amount of 0.02 grams/liter (added as potassium indium cyanide and EPTA was present in the amount of 10.0 grams/liter. A bright deposit was obtained in a thickness of 0.033 inches and possessed a hardness of 155 Knoop.
- Deposits produced in accordance with the present invention meet the specifications of MIL-G-45204 B with respect to thickness, hardness and purity. This fact is extremely important, since the reliability of such products as slip rings depends, in great measure, upon the purity of the gold deposit coupled with good wearing qualities.
- the baths of the present invention produce gold deposits which possess this particular combination of properties and hence are particularly suited to be employed in the production of slip rings.
- An aqueous alkaline cyanide gold-plating bath comprising from about 28.8 to g./l. of gold, added as potassium gold cyanide, about 0.0l3 to about 0.04 g./l. of silver, added as potassium silver cyanide, about 0.75 to about 30.0 g./l. of free potassium cyanide, about 14.9 to about 75 g/l of potassium carbonate, and about 2.0 to about 15.0 g./l. of ethylenediaminetetraacetic acid.
- a process of producing a gold alloy coating which comprises electroplating the alloy from an aqueous alkaline cyanide gold-plating baths as set forth in claim 1.
- a process of producing a gold alloy coating which comprises electroplating the alloy from an aqueous alkaline cyanide gold-plating bath as set forth in claim 4.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84270469A | 1969-07-17 | 1969-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3607682A true US3607682A (en) | 1971-09-21 |
Family
ID=25288049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US842704A Expired - Lifetime US3607682A (en) | 1969-07-17 | 1969-07-17 | Electroplating baths and methods for electroplating gold alloys and a product thereof |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3607682A (fr) |
| BE (1) | BE753613A (fr) |
| DE (1) | DE2033970A1 (fr) |
| FR (1) | FR2051823A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2829979A1 (de) * | 1977-07-08 | 1979-01-18 | Systemes Traitements Surfaces | Elektrolysebad zur abscheidung von gold-kupfer-cadmium-legierungen und seine anwendung in der galvanotechnik |
-
1969
- 1969-07-17 US US842704A patent/US3607682A/en not_active Expired - Lifetime
-
1970
- 1970-07-08 DE DE19702033970 patent/DE2033970A1/de active Pending
- 1970-07-15 FR FR7026921A patent/FR2051823A1/fr not_active Withdrawn
- 1970-07-17 BE BE753613D patent/BE753613A/fr unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2829979A1 (de) * | 1977-07-08 | 1979-01-18 | Systemes Traitements Surfaces | Elektrolysebad zur abscheidung von gold-kupfer-cadmium-legierungen und seine anwendung in der galvanotechnik |
| DE2829979C3 (de) * | 1977-07-08 | 1990-06-21 | Systemes Traitements Surfaces | Wässriges bad zur galvanischen abscheidung von gold-kupfer-cadmium-legierungen |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2051823A1 (fr) | 1971-04-09 |
| DE2033970A1 (de) | 1971-02-18 |
| BE753613A (fr) | 1970-12-31 |
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