US4904414A - Electrically conductive adhesive for a broad range of temperatures - Google Patents

Electrically conductive adhesive for a broad range of temperatures Download PDF

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Publication number
US4904414A
US4904414A US07/098,184 US9818487A US4904414A US 4904414 A US4904414 A US 4904414A US 9818487 A US9818487 A US 9818487A US 4904414 A US4904414 A US 4904414A
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US
United States
Prior art keywords
adhesive
composition
silver
approximately
organo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07/098,184
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English (en)
Inventor
Hanns-Heinz Peltz
Dietrich Wolfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Wacker Chemie AG
Original Assignee
Siemens AG
Wacker Chemie AG
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Assigned to SIEMENS AKTIENGESELLSCHAFT, BERLIN AND MUNICH, GERMANY A CORP. OF reassignment SIEMENS AKTIENGESELLSCHAFT, BERLIN AND MUNICH, GERMANY A CORP. OF ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: WOLFER, DIETRICH, PELTZ, HANNS-HEINZ
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances

Definitions

  • the present invention is directed to electrically conductive adhesives for the planar joining of corresponding planar parts to one another.
  • Adhesives are used in the manufacture of electric surface wave filters, large-area IC semiconductor circuits, and corresponding electronic components in order to glue the components to a substrate.
  • the substrate is to be a component part of the housing of the finished component, it is necessary to glue the substrate of, for example, the wave filter or, respectively, of the IC circuit or the like on, for example, a metallic substrate.
  • substrates With respect to the substrates, it is known, for example, to utilize as a substrate for wave filters, laminae of single-crystal lithium niobate or tantalate having a length of up to several cm long and being about 0.5 mm thick.
  • substrate laminae of silicon or of other semiconductor material as well are used for IC circuits.
  • These substrate materials share some similar properties that influence their use. Specifically, these materials are relatively sensitive to mechanical stresses and tend to break or rip when subjected to such mechanical stresses. Particularly in the case of surface wave filters, there is a further problem that the substrates are vulnerable to even mere mechanical deformations. A mere mechanical deformation, particularly bending, of the substrate leads to extremely great modifications in the electrical values of the component.
  • the adhesive layer is sufficiently thick so that it absorbs all mechanical stresses to the greatest extent possible. Such mechanical stresses are due to, on the one hand, the different temperature coefficients of expansion of the material of the substrate and, on the other hand, on the material of the foundation.
  • the adhesive layer absorbs these mechanical stresses because of the elasticity of, or, respectively, the viscosity of, the adhesive.
  • Epoxy silver glue provides satisfactory results as an adhesive for such components in temperature ranges between approximately 0° C. to about 125° C.
  • a temperature range that is typically required extends from approximately -40° C. to about 180° C.
  • the present invention provides an electrically conductive adhesive for the planar joining of correspondingly planar parts to one another. These planar parts have mutually different temperature coefficients of expansion of their material.
  • the adhesive of the present invention is useable over a broad temperature range that includes the typical temperatures the components will encounter.
  • the product manufactured in accordance with the method of the present invention may be used as an electrically conductive adhesive through a broad temperature range of approximately -60° C. to about 180° C.
  • particle-shaped silver is stirred into a composition that is cross-linkable with an organo polysiloxane with silicon-bonded hydrogen (e) to form an elastomer.
  • e silicon-bonded hydrogen
  • the composition comprises: (a) a di-organo polysiloxane with vinyl dimethyl siloxane units as end-position units, wherein the two Si-C-bonded organic radicals in the di-organo siloxane units are hydrocarbon radicals which are free from aliphatic multiple bonds, (b) an inorganic oxide, employable as filler, having a BET surface of at least 50m 2 /g, (c) an organic solvent, and (d) a catalyst that promotes the agglomeration of Si-bonded hydrogen to vinyl groups. After the particle-shaped silver is stirred into the composition, the mixture is thickened until a pasty working consistency has been achieved. The resultant mixture is then mixed with organo polysiloxane (e) before use as an adhesive.
  • organo polysiloxane e
  • the organo polysiloxane (e) has the formula:
  • R is hydrogen or the methyl, ethyl and/or phenyl radical, however, only one hydrogen atom is bonded to a respective silicon atom, at least 0.2 Si-bonded hydrogen atoms are present on the average per silicon atom and at least three Si-bonded hydrogen atoms are present per molecule; and p is a whole number having a value so that the viscosity of these organo polysiloxanes (e) is approximately 4 to about 150mPa.s at 25° C.
  • FIG. 1 illustrates a cross-sectional perspective view of a surface wave filter secured to a substrate by the adhesive of the present invention.
  • FIG. 2 illustrates a flow chart depicting the process steps of the method of making the adhesive of the present invention.
  • the present invention provides an electrically conductive adhesive.
  • silicone adhesives are known, numerous attempts to employ these adhesives as electrically conductive adhesives as for such applications as discussed above, have previously led to the conclusion that silicone adhesives cannot be so used. In particular, heretofore, these adhesives have failed to provide the necessary high electrical conductivity required for such applications.
  • the inventors of the present invention have developed a composition that meets the considerations set forth previously and, at the same time, functions as an adhesive. To this end, the inventors have invented a composition that utilizes commercially available particular-shaped silver that is stirred into the composition, described hereinafter, resulting in a compound that has a good final distribution of the silver and can be used as an electrically conductive adhesive.
  • the silver is preferably stirred into the composition at room temperature.
  • the inventors of the present invention have discovered that particleshaped silver that has been stirred into, for example, a 10% composition defined in detail below in a sufficient quantity and with a uniform distribution, provides adequate values of conductivity comparable to those of epoxy silver glue. Such a result, however, can only be achieved via further method steps of the invention set forth below.
  • composition having constituents (a)-(d) is produced as a dispersion.
  • the composition is useable to create the adhesive of the present invention and is cross-linkable with (e) an organo polysiloxane with silicon-bonded hydrogen to form an elastomer.
  • the composition comprises:
  • an inorganic oxide employable as a filler, having a BET surface of at least 50m 2 /g;
  • the di-organo polysiloxanes (a) chosen are those which preferably contain approximately 200 to about 800 silicon atoms per molecule, whereby other hydrocarbon radicals than vinyl groups in these di-organo polysiloxanes are preferably methyl radicals.
  • the di-organo polysiloxane (a) is preferably present in approximately 10 to about 30 weight percent of the composition comprising constituents (a), (b), (c), and (d).
  • Particle-shaped silver is then stirred into the composition.
  • the composition is thickened and organo polysiloxanes (e) are added.
  • organo polysiloxanes (e) are preferably those having the formula:
  • R is hydrogen or the methyl, ethyl and/or phenyl radical having only one hydrogen atom bonded to a silicon atom, an average of at least 0.2 Si-bonded hydrogen atoms are present per silicon atom and at least 3 Si-bonded hydrogen atoms are present per molecule; and p is a whole number having a sufficient value so that the viscosity of these organo polysiloxanes (e) is approximately 4 to about 150 mPa.s at 25° C.
  • the organo polysiloxane (e) preferably comprises approximately 1 to about 3 weight percent, of the resultant composition that comprises constituents (a), (b), (c), (d), (e) and the silver particles
  • the inorganic oxide (b) is pyrogenically produced silicon dioxide having a BET surface of approximately 100 to about 200m 2 /g
  • the inorganic oxide (b) is used in quantities of from approximately 10 to about 40 weight percent relative to the weight of the di-organo polysiloxane (a).
  • the solvent (c) is chosen from hydrocarbons such as, for example, toluol, xylol-isomer mixtures, gasoline, including n-pentane, which are liquids at room temperature and 1020hPa (abs.) and have a boiling point less than or equal to 200° C. at 1020hPa (abs.).
  • n-pentane is utilized as the solvent (c).
  • the catalyst (d) is chosen from the group consisting of platinum, a platinum compound, or a platinum complex.
  • a platinum-vinyl siloxane complex free of inorganically bonded halogen is utilized as the catalyst (d).
  • an agent for preventing the agglomeration of silicon-bonded hydrogen to vinyl groups at room temperature is utilized.
  • An example of such an agent is a maleic acid monoethylester.
  • lamina-shaped silver is used as the particle-shaped silver.
  • An example of a lamina-shaped silver that has been found to function satisfactorily is F14 available from the Demetron Company. It may also be desirable to utilize spherical silver. Extremely good results were also achieved with dendritic silver such as is also used for photographic film emulsions.
  • the dispersion is thickened preferably by heating the dispersion and, potentially, by applying under-pressure as well, i.e., by withdrawing the solvent contained in this compound.
  • a special characteristic of the present invention is that practically all of the solvent content can be withdrawn or, respectively is withdrawn from the compound.
  • the resultant product is a silicone having a high percentage of silver uniformly distributed therein. This product has a pasty viscosity that makes it useful as an adhesive.
  • a sufficiently high percentage of silver is stirred into the compound so that the resultant pasty end product, i.e. the adhesive, has a sufficiently high electrical conductivity that is comparable to that of epoxy silver adhesives. It has been found that a volume resistance of less than 4 ⁇ 10 -3 ohms/cm can be achieved with a silver content of 75 weight percent.
  • organo polysiloxane (e) Before the organo polysiloxane (e) is added to the dispersion, (a)-(d), but after the silver is added, the composition can be tested to see if there is adequate conductivity. After the organo polysiloxane (e) is added, crosslinking will take place making the addition of additional silver difficult. It should also be noted that organo polysiloxane (e) is added in small amounts so that it does not influence the conductivity of the composition that was achieved.
  • FIG. 1 illustrates a cross-sectional view of a surface wave filter known in the art.
  • the wave filter includes a substrate 1 on whose surface 2 transducer and/or reflector structures 3 are arranged in accordance with the requirements for the surface wave filter.
  • the substrate 1 is secured to a foundation 4 that is part of the housing by an adhesive layer 5 composed of adhesive of the present invention.
  • the material properties of the adhesive of the present invention, used for the adhesive layer 5, guarantees that thermal expansion of the foundation 4 do not lead to stresses and/or bendings of the substrate 1 and, thus, of the entire surface wave filter.
  • the adhesive has good elasticity properties particularly at temperatures down to almost -40° C.
  • the problems typically encountered with such evaporations are also eliminated in the present invention.
  • the surface wave filter is hermetically sealed from the environment in the housing 4 and accordingly, exhalations necessarily remain within the housing.
  • FIG. 2 illustrates a flow chart for the manufacture of the adhesive of the present invention.
  • Particle-shaped silver 12 is added to a silicone dispersion at step 10.
  • the particleshaped silver is added to the compound by being stirred therein.
  • the compound is thickened.
  • the result is a pasty adhesive at 16.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
US07/098,184 1986-09-25 1987-09-18 Electrically conductive adhesive for a broad range of temperatures Expired - Fee Related US4904414A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3632628 1986-09-25
DE3632628 1986-09-25

Publications (1)

Publication Number Publication Date
US4904414A true US4904414A (en) 1990-02-27

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US07/098,184 Expired - Fee Related US4904414A (en) 1986-09-25 1987-09-18 Electrically conductive adhesive for a broad range of temperatures

Country Status (4)

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US (1) US4904414A (de)
EP (1) EP0264635B1 (de)
JP (1) JPS63117086A (de)
DE (1) DE3772321D1 (de)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015413A (en) * 1989-02-28 1991-05-14 Toshiba Silicone Co., Ltd. Electrically conductive polyorganosiloxane primer composition
WO1998028787A1 (en) * 1996-12-20 1998-07-02 Telefonaktiebolaget Lm Ericsson (Publ) Method and device for connecting electrical components to circuit boards
WO1998028959A1 (en) * 1996-12-20 1998-07-02 Ericsson Radio Systems Ab Method and device for connecting electrical components to printed circuit boards
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
US5932145A (en) * 1996-10-31 1999-08-03 Dow Corning Toray Silicone Co., Ltd. Addition reaction-curing electrically conductive silicone composition and method for the preparation thereof
WO2000044849A1 (de) * 1999-01-28 2000-08-03 Siemens Aktiengesellschaft Verfahren zum verkleben grossflächiger werkstücke mit gegenläufigem ausdehnungskoeffizienten und damit hergestellter verbund
WO2001069669A1 (de) * 2000-03-16 2001-09-20 Infineon Technologies Ag Verfahren und vorrichtung zur herstellung einer halbleiterchip-umhüllung
US6488869B2 (en) 1997-04-08 2002-12-03 Matsushita Electric Industrial Co., Ltd. Conductive paste, its manufacturing method, and printed wiring board using the same
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives
US20110062137A1 (en) * 2007-07-18 2011-03-17 Chia-Hsiung Wu Vehicular fluid heater
CN106811170A (zh) * 2017-01-07 2017-06-09 苏州瑞力博新材科技有限公司 一种高分子基原位纳米银导电粘接材料及制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2000787A1 (en) * 1988-11-04 1990-05-04 Richard L. Cole Electrically conductive silicone compositions
JP3134333B2 (ja) * 1991-03-27 2001-02-13 ジェイエスアール株式会社 導電性エラストマー用組成物
GB2338713A (en) * 1998-06-25 1999-12-29 Gentech Int Ltd Electrically conductive polymeric compositions
DE102005044433A1 (de) * 2005-09-16 2007-03-22 Universität Bremen Katalytisch aktive Zusammensetzung, Membran-Elektroden-Einheit mit der Zusammensetzung und Katalysator mit/aus der Zusammensetzung
JP5611460B2 (ja) * 2010-07-08 2014-10-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 弾性電極を有するオプトエレクトロニクス装置およびその製造方法
WO2016017644A1 (ja) * 2014-07-31 2016-02-04 タツタ電線株式会社 導電性組成物およびそれを備えた導電性シート

Citations (3)

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DE2307776A1 (de) * 1973-02-16 1974-08-22 Wacker Chemie Gmbh Klebstoffe
US4130707A (en) * 1973-02-16 1978-12-19 Wacker-Chemie Gmbh Adhesive compositions
US4250075A (en) * 1979-02-05 1981-02-10 Dow Corning Corporation Electrically conductive polydiorganosiloxanes

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
US4138369A (en) * 1976-10-02 1979-02-06 Japan Synthetic Rubber Co., Ltd. Pressure sensitive conductor and method of manufacturing the same
JPS5637267A (en) * 1979-08-31 1981-04-10 Matsushita Electric Works Ltd Inorganic fiber board
DE2940917A1 (de) * 1979-10-09 1981-04-23 Wacker-Chemie GmbH, 8000 München Klebstoffe
DE3001613C2 (de) * 1980-01-17 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Befestigung eines, eine monolithisch integrierte Halbleiterschaltung enthaltenden Halbleiterkörpers aus Silicium an einer Unterlage mit einem entsprechenden Verfahren hierzu
JPS59199756A (ja) * 1983-04-27 1984-11-12 Toshiba Silicone Co Ltd 導電性シリコ−ンゴム組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2307776A1 (de) * 1973-02-16 1974-08-22 Wacker Chemie Gmbh Klebstoffe
US4051454A (en) * 1973-02-16 1977-09-27 Wacker-Chemie Gmbh Adhesive compositions and flexible heating device fabricated therewith
US4130707A (en) * 1973-02-16 1978-12-19 Wacker-Chemie Gmbh Adhesive compositions
US4250075A (en) * 1979-02-05 1981-02-10 Dow Corning Corporation Electrically conductive polydiorganosiloxanes

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015413A (en) * 1989-02-28 1991-05-14 Toshiba Silicone Co., Ltd. Electrically conductive polyorganosiloxane primer composition
US6114019A (en) * 1996-06-28 2000-09-05 International Business Machines Corporation Circuit board assemblies having filled vias free from bleed-out
US6178093B1 (en) 1996-06-28 2001-01-23 International Business Machines Corporation Information handling system with circuit assembly having holes filled with filler material
US6138350A (en) * 1996-06-28 2000-10-31 International Business Machines Corporation Process for manufacturing a circuit board with filled holes
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
US6000129A (en) * 1996-06-28 1999-12-14 International Business Machines Corporation Process for manufacturing a circuit with filled holes
US6127025A (en) * 1996-06-28 2000-10-03 International Business Machines Corporation Circuit board with wiring sealing filled holes
US5932145A (en) * 1996-10-31 1999-08-03 Dow Corning Toray Silicone Co., Ltd. Addition reaction-curing electrically conductive silicone composition and method for the preparation thereof
US6101099A (en) * 1996-12-20 2000-08-08 Telefonaktiebolaget Lm Ericsson Method and device for connecting electrical components to printed circuit boards
WO1998028959A1 (en) * 1996-12-20 1998-07-02 Ericsson Radio Systems Ab Method and device for connecting electrical components to printed circuit boards
WO1998028787A1 (en) * 1996-12-20 1998-07-02 Telefonaktiebolaget Lm Ericsson (Publ) Method and device for connecting electrical components to circuit boards
US6271479B1 (en) 1996-12-20 2001-08-07 Telefonaktiebolaget Lm Ericsson (Publ) Method and apparatus for connecting an electric component to a printed circuit board
US6488869B2 (en) 1997-04-08 2002-12-03 Matsushita Electric Industrial Co., Ltd. Conductive paste, its manufacturing method, and printed wiring board using the same
WO2000044849A1 (de) * 1999-01-28 2000-08-03 Siemens Aktiengesellschaft Verfahren zum verkleben grossflächiger werkstücke mit gegenläufigem ausdehnungskoeffizienten und damit hergestellter verbund
US6716535B1 (en) 1999-01-28 2004-04-06 Siemens Aktiengesellschaft Method for gluing together large-surfaced workpieces with opposed expansion coefficients in a stable manner and composite structure produced in this way
WO2001069669A1 (de) * 2000-03-16 2001-09-20 Infineon Technologies Ag Verfahren und vorrichtung zur herstellung einer halbleiterchip-umhüllung
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives
US20110062137A1 (en) * 2007-07-18 2011-03-17 Chia-Hsiung Wu Vehicular fluid heater
CN106811170A (zh) * 2017-01-07 2017-06-09 苏州瑞力博新材科技有限公司 一种高分子基原位纳米银导电粘接材料及制备方法

Also Published As

Publication number Publication date
JPS63117086A (ja) 1988-05-21
EP0264635B1 (de) 1991-08-21
EP0264635A2 (de) 1988-04-27
EP0264635A3 (en) 1988-05-11
DE3772321D1 (de) 1991-09-26

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Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:PELTZ, HANNS-HEINZ;WOLFER, DIETRICH;REEL/FRAME:004788/0231;SIGNING DATES FROM 19870811 TO 19870907

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