US8226792B2 - Flooring product with integrated circuitry and method for its manufacture - Google Patents

Flooring product with integrated circuitry and method for its manufacture Download PDF

Info

Publication number
US8226792B2
US8226792B2 US12/670,873 US67087308A US8226792B2 US 8226792 B2 US8226792 B2 US 8226792B2 US 67087308 A US67087308 A US 67087308A US 8226792 B2 US8226792 B2 US 8226792B2
Authority
US
United States
Prior art keywords
circuitry
pieces
piece
flooring product
flooring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US12/670,873
Other languages
English (en)
Other versions
US20100206473A1 (en
Inventor
Antonius Hendricus Maria Holtslag
Evert Jan Van Loenen
Georg Sauerlaender
Harald Josef Gunther Radermacher
Matheus Franciscus Antonius Van Hugten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signify Holding BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N V reassignment KONINKLIJKE PHILIPS ELECTRONICS N V ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RADERMACHER, HARALD JOSEF GUNTHER, SAUERLAENDER, GEORG, HOLTSLAG, ANTONIUS HENDRICUS MARIA, VAN HUGTEN, MATHEUS FRANCISCUS ANTONIUS, VAN LOENEN, EVERT JAN
Publication of US20100206473A1 publication Critical patent/US20100206473A1/en
Application granted granted Critical
Publication of US8226792B2 publication Critical patent/US8226792B2/en
Assigned to KONINKLIJKE PHILIPS N.V. reassignment KONINKLIJKE PHILIPS N.V. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Assigned to PHILIPS LIGHTING HOLDING B.V. reassignment PHILIPS LIGHTING HOLDING B.V. ASSIGNMENT OF ASSIGNOR'S INTEREST Assignors: KONINKLIJKE PHILIPS N.V.
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
    • B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B29C66/435—Making large sheets by joining smaller ones or strips together
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D99/00—Subject matter not provided for in other groups of this subclass
    • B29D99/0057—Producing floor coverings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/0027—Cutting off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/10—Building elements, e.g. bricks, blocks, tiles, panels, posts, beams
    • B29L2031/108—Roofs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3005—Body finishings
    • B29L2031/3017—Floor coverings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/732—Floor coverings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only

Definitions

  • the present invention relates to a flooring product with integrated circuitry and a method of manufacturing such a flooring product.
  • WO2005/083800 discloses an electronic safety and marking device, in the form of a laminated flexible product. The product can be applied directly from a roll onto an existing surface.
  • the laminated flexible product when using the device according to WO2005/083800 to arrange circuitry such as light emitting devices on a floor, the laminated flexible product must be applied in an additional step, after the flooring has been laid. This leads to a time consuming process. Also, it may be problematic to achieve sufficient adhesion between the flooring and the laminated flexible product, especially on floors subject to extensive wear.
  • a method for manufacturing a flooring product with integrated circuitry comprising the steps of providing a plurality of pieces, stacking said pieces on top of each other, displaced in relation to each other to form an offset stack, compressing said offset stack to form said flooring product, and arranging flexible circuitry on an upper surface of at least one piece, so that, when said pieces are stacked, a first portion of flexible circuitry on the at least one piece is exposed, this first portion including circuitry for interacting with the environment.
  • a flooring product is achieved where only a portion of the circuitry is exposed, and another portion is embedded in the flooring. This allows for exposing those parts of the circuitry that are adapted to interact with the surrounding environment, such as optical components, pressure sensitive components, acoustic components, etc.
  • the circuitry In order to allow the further processing of the flooring product, the circuitry is flexible. This means that the circuitry will not be damaged by any rolling or deformation taking place after its application. Note that this requirement is not very significant, and the flexibility may be rather limited, as long as the circuitry is not damaged.
  • a flooring product manufactured according to the invention can be applied using more or less conventional techniques, and results in a flooring with integrated interacting capabilities, such as optics, acoustics, vibration.
  • the pieces are provided by forming a composition into a flat strip, and effecting a plurality of parallel cuts extending across said strip.
  • the pieces are preferably displaced in relation to each other in a direction parallel to said cuts, to form an offset stack.
  • the step of arranging flexible circuitry can be performed before the cuts are effected.
  • the first portion can be arranged along a longitudinal edge of the strip. This means that for a separated piece, the first portion extends along an edge that has not been cut, and ensures that the portion will be exposed, when the separated pieces are displaced.
  • a second portion of flexible circuitry on each piece may be covered by an overlying piece in said stack, and this second portion may include control circuitry. This means that other parts of the circuitry, which typically does not need to be exposed, such as control circuitry, may be embedded and hidden in the flooring.
  • a second portion of a first piece can be displaced in relation to a second portion of a second piece in the longitudinal direction of said strip.
  • the respective second portions will be displaced in two different directions, ensuring fewer overlaps between control circuitry of such second portions.
  • light emitting elements are integrated in a linoleum flooring product.
  • a flooring product comprising a substrate of a material suitable for use as flooring, and flexible circuitry integrated into said substrate, the circuitry including exposed portions having circuitry for interacting with the environment.
  • the circuitry can be arranged in a plurality of layers, each layer at least partly overlapping, and in electrical contact with, another layer.
  • FIG. 1 show a process for manufacturing a linoleum flooring according to an embodiment of the present invention.
  • FIG. 2 shows a flow chart of the process in FIG. 1 .
  • FIG. 3 a - c show three examples of how electrical contact is ensured between circuitry on different pieces in FIG. 1 .
  • FIGS. 1-2 show a process for manufacturing a linoleum flooring according to an embodiment of the present invention.
  • a granulate composition 1 comprising linseed oil (linoxyn) and e.g. wood flour is prepared.
  • the composition also comprises color pigment, and granulates of different color are used to create a marble pattern.
  • the granulate mix 1 is deposited on a conveyor 2 and rolled flat by rollers 3 to form a first strip 4 .
  • the longitudinal edges of the strip 4 are preferably cut to form a wave pattern.
  • the strip 4 is then in step S 2 separated into consecutive pieces 6 along parallel cuts 5 across the strip 4 .
  • the cuts may be effected by cutting, punching, or by any other suitable process.
  • the circuitry 7 includes circuitry for interacting with the environment, and preferably also control circuitry. It may also include power supply components, such as batteries and/or solar cells.
  • the interacting circuitry may include optical components, such as light emitting elements and light sensing elements, but may also include pressure sensors, electro-acoustic transducers for generating or detecting sound, etc. Also, if the circuitry includes solar cells, these are obviously part of the interacting circuitry.
  • additional flexible electrical circuitry 8 is mounted on the opposite side of the strip 4 .
  • Such circuitry may be connected with the circuitry on the upper side, e.g. by protrusions 9 a adapted to be pressed through the strip and received by cooperating protrusions and/or grooves 9 b on the other side, as indicated in FIG. 3 a.
  • step S 4 the separated pieces 6 are arranged on top of each other, displaced in a direction essentially parallel to the direction of the cuts 5 , to form an offset stack 10 .
  • the pieces 6 are thus displaced in a direction perpendicular to the rolling direction.
  • the exposed circuit portion 7 a includes at least a part of the interacting circuitry, thus allowing interaction with the environment.
  • the covered circuit portion 7 b preferably comprises a majority of any control circuitry.
  • step S 5 the offset stack 10 , with the embedded circuitry 7 a , 7 b , is then compressed, e.g. rolled by rollers 11 , to desired thickness. In case of wave formed edges, these contribute to seamless integration of the pieces.
  • step S 6 a backing 12 , e.g. canvas or burlap, is attached to the backside of the pressed flooring. If required, the backing may be prepared with a thin layer of waste granulate composition 1 acting as a primer, to ensure satisfactory adhesion. The flooring is then hung up to dry and cure in step S 7 .
  • the flooring may be provided with a protective layer 13 to protect the exposed circuitry.
  • a protective layer 13 may then be laminated on the flooring before or after the backing 12 , and in fact, even after the curing step.
  • the position of the circuitry 7 b that is to be covered by an overlying piece may be displaced relative to the circuitry 7 b of adjacent pieces 6 in the longitudinal direction of the strip.
  • the circuitry 7 b is shifted between three positions; left, right and middle. This provides for an improved spatial distribution of circuitry across the displaced stack 10 , thus allowing a tighter compression of the stack during the consecutive rolling step.
  • circuitry 7 , 8 arranged on both sides of the pieces 6 may be brought into electrical contact by means of protruding terminals 9 a extending into the linoleum 1 and pushed into contact with receiving terminals 9 b . Electrical contact between an underlying piece 6 ′ and an overlying piece 6 ′′ can then easily be ensured by ensuring contact between circuitry facing each other.
  • circuitry 7 is only arranged on the upper side, electrical contact between pieces can be ensured in a similar fashion, by protruding terminals 9 a of the circuitry 7 of an overlying piece 6 ′′ extending into the linoleum 1 and pushed into contact with receiving portions 9 b in the circuitry 7 of an underlying piece 6 ′.
  • contact pins 14 may be inserted into the displaced stack from underneath. Such pins may provide electrical contact between the circuitry 7 on several pieces 6 ′, 6 ′′, as indicated in FIG. 3 c.
  • step S 5 the electrical contact between different circuits can be secured and stabilized.
  • any contacts protruding through the paste will be more firmly pressed into contact with underlying or overlying circuitry.
  • the contacting portions of the circuitry such as the contact pins in FIG. 3 c , may also be deformable, so as to allow for further compression during the rolling step S 5 .
  • the circuitry 7 may comprise side-emitting LEDs or flexible OLEDs, mounted in holes in a thin plastic carrier-foil, e.g. with a total thickness of 0.2 mm.
  • the LEDs thus emit light into the thin foil.
  • the foil preferable contains on the bottom side a mirror of metal or titanium oxide powder, in order to increase the light output.
  • outcoupling structures such as V-grooves or dots are located on the upper side fo the foil. If a light emission patter is desired, such as text, the outcoupling structures are arranged to coincide with the desired pattern. If homogeneous illumination is desired, the outcoupling structures are distributed homogeneously.
  • another foil may be laminated to protect the components.
  • the LEDs can be connected to a power supply via a switch.
  • the power supply can be an internal power supply such as a solar cell or a battery, preferably in the shape of a thin flexible foil.
  • the battery can be connected with a loop, such that with an external positioned counter-loop a transformer is realised which allows to externally recharged the battery with an AC-voltage (without making mechanical contact).
  • the external loop can be positioned by human beings or with robots driving along all light generating devices.
  • the power supply is external, such as the mains.
  • a metal layer is used as reflector under the carrier foil, the same layer can be used for the electrical connection of the + and ⁇ of the LEDs.
  • the + connections are electrical disconnected from the large ⁇ electrode, by isolating air gaps.
  • the switch can be a stack of two thin foils with on the inner faces a metal layer, which make electrical contact as soon a person steps on it. Then a circuit is activated which ensures that the LEDs emit light during a limited amount of time and then the LED's are turned of.
  • the switch could be composed of a network of smaller switches.
  • the total switch area can be an area of e.g. 0.5 m ⁇ 0.5 m.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Floor Finish (AREA)
  • Manufacturing Of Printed Wiring (AREA)
US12/670,873 2007-08-03 2008-07-28 Flooring product with integrated circuitry and method for its manufacture Expired - Fee Related US8226792B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP07113751.7 2007-08-03
EP07113751 2007-08-03
EP07113751 2007-08-03
PCT/IB2008/053018 WO2009019625A2 (en) 2007-08-03 2008-07-28 Flooring product with integrated circuitry and method for its manufacture

Publications (2)

Publication Number Publication Date
US20100206473A1 US20100206473A1 (en) 2010-08-19
US8226792B2 true US8226792B2 (en) 2012-07-24

Family

ID=40341838

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/670,873 Expired - Fee Related US8226792B2 (en) 2007-08-03 2008-07-28 Flooring product with integrated circuitry and method for its manufacture

Country Status (7)

Country Link
US (1) US8226792B2 (de)
EP (1) EP2176471B1 (de)
JP (1) JP5225379B2 (de)
CN (1) CN101772405B (de)
AT (1) ATE492700T1 (de)
DE (1) DE602008004165D1 (de)
WO (1) WO2009019625A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107618133B (zh) * 2016-07-14 2019-09-20 书香门地（上海）美学家居股份有限公司 一种透明镶钻地板的成型设备及其制作方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000000822A (ja) 1998-06-17 2000-01-07 Toshiba Corp 廃棄物処理方法と廃棄物処理装置
WO2000075417A1 (en) 1999-06-04 2000-12-14 Interface, Inc. Floor covering with sensor
WO2003042596A1 (en) 2001-11-14 2003-05-22 Sooferian Danny H Solar stepping stone
EP1469141A1 (de) 2003-04-17 2004-10-20 Koninklijke Mosa B.V. Fliese mit Beleuchtungelement
WO2005024323A1 (de) 2003-08-29 2005-03-17 BSH Bosch und Siemens Hausgeräte GmbH Kältegerät mit oled-innenbeleuchtung
WO2005071597A1 (en) 2004-01-22 2005-08-04 University Of Florida Research Foundation, Inc. Location determination and navigation using arrays of passive rfid tags
WO2005083800A1 (en) 2004-02-24 2005-09-09 Mark Banister Photovoltaic/solar safety and marker tape
JP2006127993A (ja) 2004-10-29 2006-05-18 Toshiba Lighting & Technology Corp 照明装置
JP2006154566A (ja) 2004-11-30 2006-06-15 Audam Corp 太陽光発電を利用した夜光性看板
US20080121263A1 (en) * 2006-11-21 2008-05-29 Evonik Degussa Gmbh Thermoelectric elements, method for manufacturing same, and use of same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000000822A (ja) 1998-06-17 2000-01-07 Toshiba Corp 廃棄物処理方法と廃棄物処理装置
WO2000075417A1 (en) 1999-06-04 2000-12-14 Interface, Inc. Floor covering with sensor
WO2003042596A1 (en) 2001-11-14 2003-05-22 Sooferian Danny H Solar stepping stone
EP1469141A1 (de) 2003-04-17 2004-10-20 Koninklijke Mosa B.V. Fliese mit Beleuchtungelement
WO2005024323A1 (de) 2003-08-29 2005-03-17 BSH Bosch und Siemens Hausgeräte GmbH Kältegerät mit oled-innenbeleuchtung
WO2005071597A1 (en) 2004-01-22 2005-08-04 University Of Florida Research Foundation, Inc. Location determination and navigation using arrays of passive rfid tags
WO2005083800A1 (en) 2004-02-24 2005-09-09 Mark Banister Photovoltaic/solar safety and marker tape
JP2006127993A (ja) 2004-10-29 2006-05-18 Toshiba Lighting & Technology Corp 照明装置
JP2006154566A (ja) 2004-11-30 2006-06-15 Audam Corp 太陽光発電を利用した夜光性看板
US20080121263A1 (en) * 2006-11-21 2008-05-29 Evonik Degussa Gmbh Thermoelectric elements, method for manufacturing same, and use of same

Also Published As

Publication number Publication date
WO2009019625A2 (en) 2009-02-12
JP2010535954A (ja) 2010-11-25
DE602008004165D1 (de) 2011-02-03
WO2009019625A3 (en) 2009-05-28
US20100206473A1 (en) 2010-08-19
CN101772405A (zh) 2010-07-07
EP2176471A2 (de) 2010-04-21
ATE492700T1 (de) 2011-01-15
EP2176471B1 (de) 2010-12-22
CN101772405B (zh) 2014-08-20
JP5225379B2 (ja) 2013-07-03

Similar Documents

Publication Publication Date Title
EP2374856A3 (de) System und Verfahren zur Anbringung eines Fussbodenbelags
EP1667228A3 (de) Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
WO2002005413A3 (en) Mems actuator with lower power consumption and lower cost simplified fabrication
WO2007002738A8 (en) Bilayer anode
ATE366179T1 (de) Bodenbelagelement
WO2009013890A1 (ja) 電池用電極板、電池用極板群、リチウム二次電池、及び電池用電極板の製造方法
AU2002356956A1 (en) Biomedical electrochemical sensor array and method of fabrication
TR200001782A2 (tr) Termoplast ara tabakalı tabaka yapıştırma malzemesi.
WO2009050881A1 (ja) 超音波探触子
US4159559A (en) Method of making plastic EL lamp
WO2006019691A3 (en) Dry erase substrate
SE0301291D0 (sv) Golvskiva med en inbakad, elektriskt påverkbar folie
DE602007007470D1 (de) Mehrschichtmodul mit gehäuse
US8226792B2 (en) Flooring product with integrated circuitry and method for its manufacture
EP1138300A3 (de) Nachgiebige Verbundschicht
WO2006033021A3 (en) Sealed medical electrode package
GB2426825A (en) Sensor assembly
TW200509160A (en) A method for manufacturing a multi-layered ceramic electronic component
JP5194764B2 (ja) 可動接点体およびその製造方法
DE60212166D1 (de) Bilddeckende laminatfolie und blatt für wandprojektion
TW200606968A (en) Method for manufacturing multilayer electronic component
JP6810993B2 (ja) 埋め込み機能構造を有する金属複合材料の製造方法および対応する金属複合材料
WO2005103179A3 (en) Fabric coated foam
MY136100A (en) Transfer member
JP2021014711A (ja) センサ付き床材

Legal Events

Date Code Title Description
AS Assignment

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N V, NETHERLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HOLTSLAG, ANTONIUS HENDRICUS MARIA;VAN LOENEN, EVERT JAN;SAUERLAENDER, GEORG;AND OTHERS;SIGNING DATES FROM 20080828 TO 20090528;REEL/FRAME:023855/0313

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: KONINKLIJKE PHILIPS N.V., NETHERLANDS

Free format text: CHANGE OF NAME;ASSIGNOR:KONINKLIJKE PHILIPS ELECTRONICS N.V.;REEL/FRAME:039428/0606

Effective date: 20130515

AS Assignment

Owner name: PHILIPS LIGHTING HOLDING B.V., NETHERLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KONINKLIJKE PHILIPS N.V.;REEL/FRAME:040060/0009

Effective date: 20160607

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20200724