WO1987004568A1 - Interconnexion de plaques de circuit electrique - Google Patents

Interconnexion de plaques de circuit electrique Download PDF

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Publication number
WO1987004568A1
WO1987004568A1 PCT/US1987/000104 US8700104W WO8704568A1 WO 1987004568 A1 WO1987004568 A1 WO 1987004568A1 US 8700104 W US8700104 W US 8700104W WO 8704568 A1 WO8704568 A1 WO 8704568A1
Authority
WO
WIPO (PCT)
Prior art keywords
support member
interconnect
area array
connector device
array connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1987/000104
Other languages
English (en)
Inventor
Mark S. Zifcak
Bruce G. Kosa
Scott S. Simpson
Herman B. Gordon
Richard C. Berry
Jeffrey B. Otto
Richard T. Traskos
Claudette M. Hoffman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/887,260 external-priority patent/US4793814A/en
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of WO1987004568A1 publication Critical patent/WO1987004568A1/fr
Priority to KR870700832A priority Critical patent/KR880701027A/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures

Definitions

  • This invention relates to devices for interconnecting contact pads of opposed circuit' board surfaces.
  • the objectives of the present invention include providing a connector arrangement having improvement in one or more of the following features: reduction of total resistance between interconnected pairs of contact pads, consistency of contact stresses during repeated connector compression/decompression cycles, minimal deformation of the connector element, simplicity of design, predictability of the effect of temperature and time on performance, and contact pad wiping during compression.
  • Summary of the Invention The invention relates to an area array connector device for providing electrical interconnection from a large plurality of first contact pads on a first printed circuit board surface to a
  • the connector device comprises an " electrically nonconductive support member disposed between the opposed circuit board surfaces, the support member having defined
  • interconnect members extending through elastomeric material in the regions of the support member.
  • the connector device is characterized in that the metallic interconnect members extend through the elastomeric
  • the interconnect members sized and arranged each to provide total resistance from a first 5 contact pad to a second contact pad of the order of less than about 25 illi-ohms.
  • the interconnect members are arranged in a manner so their exposed end surfaces can deflect under contact pressure from a first position and be restored upon release of the contact pressure toward 0; the first position at least in part by the restorative effect of the elastomeric material, whereby the area array connector device is adapted to provide continuous electrical interconnection between opposed circuit board surfaces at varying spacing.
  • the support member comprises resilient elastomeric material, has support surfaces respectively opposed to the surfaces of the first and second circuit boards and is adapted to be compressed by urging of the circuit boards together.
  • Each metallic interconnect member comprises a bodily-rotatable, electrically conductive interconnect element extending through the thickness of the resilient support member and having a pair of pad engagement Q surfaces disposed to engage the respective contact pads of the circuit boards, a line projected through the engagement surfaces, at the time of their initial engagement upon the first and second contact pads, being disposed at an initial, acute angle to the direction of 5 thickness of the support member.
  • the connector further comprises means for retaining the circuit boards in a clamped-together relationship with the su po t ember in a compressed, reduced thickness state and with the interconnect member bodily rotated, whereby the line 0 projected through the engagement surfaces lies at an acute angle to the direction of thickness of the support member greater than the initial angle, the body of the support member being locally deformed by the interconnect element and resiliently biasing the S interconnect element towards its original position, into engagement with the pads.
  • the circuit boards carry a multiplicity of matching contact pads in a predetermined pattern corresponding to the arrangement of circuits on the boards
  • the support member 0 includes a corresponding multiplicity of the interconnect elements, the elements each being bodily rotated in response to the clamped-together relationship of the circuit boards, locally deforming the compressed support member and being resiliently biased against the 5 respective contact pads by the support member.
  • the support member is of sheet form having inserted therein a multiplicity of interconnect elements in a pattern corresponding to the pattern of the pads.
  • the support member includes a distribution of voids that serve locally to accomodate the bodily rotation of the
  • the support member is a layer of foam having an aggregate void volume in the range of about 25 to 95%, preferably in the range of about 60 to 75%.
  • the elastomer is selected from the group consisting of silicone, urethane, natural rubber, rr j copolymers of butadiene-styrene, butadiene-acrylonitrile, butadiene-isobutylene, chloroprene polymers, polysulfide polymers, plasticized vinyl chloride and acetate polymers and copolymers.
  • the support member has a compression force deflection (CFD)
  • the interconnect element comprises a body extending
  • the interconnect element is generally of S-shape, and lines of projection of the end 5 portions lie in a common plane normal to the direction of thickness of the support member.
  • the support member further comprises a sheet-form layer of generally non-distendable material disposed generally parallel to the opposed board surfaces.
  • the interconnect element comprises at least two electrically conductive metal filaments enclosed in elastomeric material, the filaments extending in generally parallel relationship between the first and second exposed end 5 surfaces.
  • the surface of the support member defining the aperture is of configuration differing from the configuration of the corresponding surface of the interconnect element to provide localized areas of pressure between the interconnect element and the support, more preferably the aperture has an irregular diameter.
  • the metal filaments enclosed in the elastomeric material are in electricity-conductive contact.
  • the support member is of elastomeric material, e.g., a foam, and the interconnect members are oriented in a manner whereby application of the contact pressure causes their angular deflection.
  • the interconnect members are copper containing, and the exposed end surfaces are gold-plated.
  • the apertures are formed by removal of material, preferably by punching or drilling.
  • a connector arrangement for providing electrical interconnection between a first contact pad on a surface of a first circuit board and a corresponding second contact pad on an opposed surface of a second opposed circuit board comprises an electrically nonconductive support member of resilient elastomeric material, a bodily-rotatable, electrically conductive interconnect element, and means for retaining the circuit boards in a clamped-together relationship.
  • the support member has support surfaces respectively opposed to the surfaces of the first and second circuit boards and is disposed therebetween, and is adapted to be compressed by urging of the circuit boards together.
  • the interconnect element extends through the thickness of the resilient support member and has a pair of pad engagement surfaces disposed to engage the respective contact pads of the circuit boards, a line projected through the engagement surfaces, at the time of their initial engagement upon the first and second contact pads, being disposed at an initial, acute angle to the direction of thickness of the support member.
  • the circuit boards are retained in a clamped-together relationship with the support member in a compressed, reduced thickness state and with the interconnect member bodily rotated, whereby the line projected through the engagement surfaces lies at an
  • the interconnect device of the invention has now made possible accurate and precise interconnection of circuit boards having large numbers of contact pads of very high density and small diameter, and the device j _5_ may be employed to provide interconnection between all nature of planar and nonplanar surfaces, including, but not limited to: ceramic-to-printed circuit board, printed circuit board-to-printed circuit board, or ceramic-to-ceramic.
  • connection system e.g., total resistance of below about 25 milliohms and as low as 5 to 10 milliohms.
  • the device thus provides for very low contact resistance and low total resistivity of the connection system, e.g., total resistance of below about 25 milliohms and as low as 5 to 10 milliohms.
  • Fig. 1 is an exploded view in perspective of a circuit including a preferred embodiment of the connector arrangement of the invention
  • Fig. la is an enlarged perspective view of a preferred embodiment of the interconnect element in the connector arrangement of Fig. 1;
  • Figs. 2, 3 and 4 are somewhat diagrammatic side 5 section views of the circuit of Fig. 1, respectively showing the circuit in exploded, assembled and compression states;
  • Figs. 5 and 5a are enlarged side section views of the circuit of Fig. 1 showing a 3-interconnect T/J element segment in assembled and compression states;
  • Figs. 6 and 6a are side section views of an alternate embodiment showing a one-interconnect element segment in the assemoled and compression states, while Figs. 7 and 7a are similar views of another alternate 2 embodiment of the interconnect element;
  • Figs. 8 and 9 are side section views, and Figs. 10 and 10a are side and rear section views of still other alternate embodiments of the interconnect element, while Fig. 10b is rear section view of another alternate Q embodiment of the interconnect element having a front view as seen in Fig. 10;
  • Fig. 11 is a side section view of an alternate embodiment of the connector arrangement of Fig. 1 for low impedance connection, and Fig. 11a is a perspective 2 view of the interconnect element of the device of Fig. 11; and
  • Fig. 12 is a side section view of still another embodiment of the invention.
  • the electrical circuit 10 20 consists of connector arrangement 12 disposed between first and second electrical circuit boards '14, 16.
  • Clamping frame 18 is provided for fixed assembly of the circuit over alignment posts 20.
  • Area array connector arrangement 12 consists of 35 a sheet-form support member 13 of planar expanse, having uncompressed thickness.
  • A e.g., between about 0.025 inch (0.64 mm) and 0.500 inch (12.7 mm), and preferably about 0.125 inch (3.18 mm) , including resilient, electrically nonconductive elastomeric material in the
  • open cell foam having a density in the range of about 2 to 50 lbs/ft 3 (0.032 to 0.8 gm/cm 3 ) , preferably about 15 to 25 lbs/ft 3 (0.24 to 0.40
  • the support member has a characteristic compression force deflection (CFD) in the range of 2 to 50 lbs per square inch (0.14 to 3.45 atm) at 25 percent
  • the foam material of support- member 13 is preferably urethane, silicone or natural
  • ZfJ rubber although the specific material employed is less critical than the physical characteristics mentioned above, and other suitable materials may also be employed, e.g., copolymers of butadiene-styrene, butadiene-acrylonitrile, butadiene-isobutylene, ;
  • the average void diameter is of the order of about 125 microns.
  • Area array connector 12 also consists of a multiplicity of interconnect elements 22, disposed in the support member 13, and positioned selectively in the plane of the connector array, with element body 24 extending through the support member to expose contact "
  • S-shape interconnect element 22 consists of body 24 and tabs 27, 29 of electricity-conducting material, e.g., copper or other metal or metal-coated resin (provided the volume of metal is sufficient for the desired level of conductance, typically less than 1 ohm for power
  • body 24 When disposed in the support member in the assembled, uncompressed state, body 24 preferably lies at acute angle B, to the direction of thickness of the support member (the normal line between surfaces 30,
  • angle, B being in the range of about 0 to 70°, preferably about 20° to 40° and optimally about 30°.
  • Angle, M taken between a line projected through the engagement surfaces at the time of their initial engagement upon the contact pads and the direction of Q thickness, is somewhat greater where the tabs extend generally parallel to the overlying contact pad surfaces.
  • Element 22 has width, W, selected to be in the range of 10 to 90% of contact pad spacing, thickness, T, selected to be in the range of about 10 to
  • interconnect element width preferably between about 0.250 inch (6.35 mm) down to 0.003 to 0.005 inch (0.076 to 0.127 mm), or 0.001 inch (0.025 mm), and length, L, selected to extend at angle B generally through the support member between surfaces 30, 32 in 30 uncompressed state.
  • W is about 0.040 inch (1.02 mm)
  • T is about 0.010 inch (0.25 mm)
  • L is about 0.160 inch (4.06 mm), including the curved segments of radius, R, e.g., about 0.012 inch (0.305 mm).
  • the contact pad.engagement 35 surfaces 26, 28, exposed on the tabs, are of area C by W, e.g., about 0.030 inch (0.76 mm) by 0.040 inch (1.02 mm) .
  • circuit boards 14, 16 having board surfaces 15, 17 respectively opposed to connector array surfaces 30, 32.
  • contact pads 34, 36 Disposed on the board surfaces are contact pads 34, 36, in the embodiment shown having thickness of about 0.001 inch (0.025 mm), with a diameter of 0.050 inch (1.27 mm) on 0.100 inch (2.54 mm) centers.
  • each contact pad 34 of board 14 lies in electricity-conductive contact with the opposed contact pad engagement surface 26 of a interconnect element 22, which extends through the support member 13 to electricity-conductive contact between contact pad engagement surface 28 and contact pad 36 of the .opposed circuit board 16.
  • the circuit 10 is shown in assembled state, with area array connector 12 disposed between circuit boards 14, 16.
  • Interconnect elements 22 extend through the support member 13, with contact pad ; engagement surfaces 26, 28 of tabs 27, 29 disposed in contact with contact pads 34, 36.
  • the centers of the opposed contact pads to be electrically interconnected are offset from each other by a distance, D, e.g., about 0.120 inch (3.05 mm), and the undersurfaces of tabs 27, 29 lie generally on the respective planar surfaces 30, 32 of the support member 13.
  • the gap between board surfaces 15, 17 is decreased to distance, G, equal to about 100% down to about 60% of W, the uncompressed thickness of the support member 13, e.g., in the embodiment shown, G is about 0.100 inch (2.54 mm).
  • the combination of the structure of the interconnect elements 22, the relationship of the elements to the material of the surrounding support member matrix, and the angle of the line projected through the contact pad engagement surfaces of the interconnect element at the time of their initial engagement upon the contact pad surfaces 0 causes the interconnect elements to move bodily within the support member by rotation, e.g. about axes, X, on the support member center-line to a greater acute angle, M*, without significant flexing of the interconnect element.
  • -t ⁇ support member 13 allows the member to give resiliently by movement of elastomeric material into the foam voids, without significant adverse affect on the position of surrounding adjacent interconnect elements.
  • the contact pad engagement 0 surfaces also move along the opposed surfaces of the contact pads, indicated by arrows, S, over a distance, E, in a wiping action that removes oxides, dust particles and the like from the contacting surfaces for improved electricity-conducting contact.
  • the interconnect elements rotate without significant flexing or deformation.
  • pressure, P is removed, the resilience to
  • the connector arrangement shown in Figs. 6 and 6a, is a single, 3 isolated interconnect element 22", having a body 24' lying generally perpendicular to the opposed board surfaces, with tabs 26' , 28' extending outwardly, in opposite directions, parallel to the surfaces.
  • Line, F connecting points on the engagement surfaces of the interconnect element lies -at an initial acute angle, M, to the direction of thickness of the support member.
  • the positions of interconnect elements in the support member are predetermined, and apertures formed at precise locations, e.g., by numerically controlled drilling.
  • the elements may also be cast in place, or 22 the support member may be cast in a manner to provide apertures at the desired positions.
  • Oval or even slit-form apertures may be provided, in order to more closely conform to the rectangular shape of the element, by forming the apertures, e.g., by drilling, while the
  • the support member may be an open cell foam or may be of other construction providing the desired voids, or, as shown in Figs. 6 and 6a, the support member may include a sheet-form layer 40 of generally nondistendible material, e.g.. Mylar ⁇ or woven fiberglass mat, in the embodiment shown, disposed along the center line between the surfaces of the support member to further minimize bulging of the material of the support member in the plane of the member under compressional force, thereby to reduce displacement of adjacent interconnect elements from the desired positions.
  • a sheet-form layer 40 of generally nondistendible material e.g.. Mylar ⁇ or woven fiberglass mat
  • the Mylar " @ film may also be 0 disposed upon support member surfaces 30, 32, the modulus of the material of the film allowing application of higher compressional force without adversely affecting performance of the connector arrangement, and also permitting adjustment of the coefficient of thermal 5 expansion of the connector arrangement.
  • the interconnect element may be a sheet form member (122, Figs. 7 and 7a) or a round or a rectangular pin (222, Fig. 8; 322, Fig. 9, respectively) without tabs, the body of the interconnect element lying Q at an acute angle to the direction of thickness of the support member, with contact pad engagement surfaces disposed at each end.
  • the interconnect element 122 bodily j rotates to a greater acute angle with the engagement surfaces wiping the contact pad surfaces for improved conductivity.
  • the interconnect elements may be provided with support-member-engaging rings (42, Fig. 8) or 0 protrusions (44, Fig. 9) to retain the pin placement within the support member, and the elements may be placed by insertion through the support member.
  • the interconnect element may be bent three 5 di ensionally to cause the lines of projection of the tabs to be in different planes normal to the direction of thickness of the support member, whereby the member is caused to twist as it rotates bodily upon application of compressional force to the opposed boards, thereby providing oblique or rotational wiping of the engagement
  • the support member- also may include a conductive grounded layer 52, e.g., of foam, disposed between two layers of nonconductive elastomeric material 54, 56, also
  • the body 58 of the interconnect element is coated first wi-t- »--_aHLayer of dielectrical material and then coatedjwi h a -n t -l- outer layer 64.
  • the protruding tabs (66, Fig-.-_lla)- ensure connection between the conductive foam layer 52 and the
  • interconnect device 10' (Fig. 12) consists of an electrically nonconductive support member 24' that is a foam elastomer matrix of thickness,- t, e.g., about 0.015
  • each aperture 26* Disposed in each aperture 26* is an interconnect element 28', consisting of a column 30' of solid elastomeric material, e.g., silicone rubber of about 30 durometer, or foam of similar softness, through which a metallic interconnect member 32', e.g., a wire of conductive, very flexible, fine wire elements 34 1 , e.g., copper, typically each about 0.001 to 0.002 inch (0.025 to 0.050 0 mm) diameter (only a few are shown) , the vast majority of which extend over the full length of the column from the end surface 36* to the end surface 38' of the element. (The wires may be caused to protrude from the ends of the element by removal of the elastomeric
  • the wire protrusions serving to-enhance electrical -contact with the pads since the wire.is ⁇ bent when pressed against the pads.
  • individual filaments of wire may form a substantially encapsulating, supporting column of elastomeric material about each wire filament, separating it from adjacent filaments, if any.
  • some twisting or braiding of the wire may be provided,
  • the wire filaments are typically in electrically conductive contact and only one or a few of the
  • 10 diameter must be close to or smaller than column diameter, e.g., with a range of between about +0.010 to -0.030 inch (+0.25 to -0.75 mm), and preferably +.007 to -.019 inch (+0.18 to -0.48 mm).
  • the height of the column may vary from the thickness of the support, e.g.,
  • non-conductive support member defining formed apertures for receiving the interconnect element may be substantially rigid, e.g., glass reinforced phenolic, e.g., as sold by Rogers Corporation, Rogers, Connecticut under trade designation RX640.
  • the apertures may be formed with protrusions extending radially inwardly from the surface defining each aperture in a manner to apply pressure to the interconnect element to hold the assembly straight and centered in the aperture, as well as to enhance its
  • the surface may extend radially inwardly at several points about the circumference, the aperture may be of diameter less than that of the interconnect element, e.g., the aperture may narrow axially with the surrounding surface necking inwardly to a minimum diameter at the center plane.
  • Such designs control the connector wire contact and exert pressure toward the pads, and by having selected pressure lines, spots or rings within the molding of the support member, subtle and controlled pressure can be provided by areas of the side surfaces of the apertures that are relieved for displacement of the elastomer, thus allowing the system to be well located in the center of the apertures.
  • the interconnect elements may thus be positioned in the molded apertures in a way as to provide lateral relief for the material of the element so that: (1) the element is held in position; and (2) the elastomeric material is allowed to resiliently flow in selected zones to provide stability and the ability to position the entire system.
  • the elastomer When pressure is applied to the assembly, the elastomer will be under axial compression and therefore have to move in the horizontal direction.
  • the form of the molding is created in such a way to allow for controlled lateral movement, thus providing for the precise contact pressure in the system.

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Un connecteur matriciel (12) permettant d'effectuer une interconnexion électrique entre des contacts se trouvant sur une première surface d'une plaque à circuit imprimé (15) et des contacts correspondants sur une seconde surface opposée (17) consiste en un organe de support électriquement non conducteur (13) disposé entre des surfaces de plaque opposées, l'organe de support ayant des ouvertures traversantes dans des régions de l'organe de support et correspondant généralement à l'alignement des paires correspondantes et opposées de contact (34, 36), et des organes d'interconnexion métallique électriquement conducteur (22) s'étendant dans du matériau élastomère dans lesdites régions. Les organes métalliques d'interconnexion s'étendent au travers de la masse élastomère et présentent des surfaces extrêmes (26, 28) exposées pour assurer un contact électriquement conducteur du type métal-sur-métal avec les contacts, la résistance totale entre les contacts étant inférieure à environ 25 milliohms. Les surfaces extrêmes des organes flechissent sous une pression et reprennent leur position initiale lorsque cette pression disparaît, au moins en partie, grâce à l'effet de remise à l'état initial de l'élastomère. De préférence, le corps de l'organe d'interconnexion est rotatif.
PCT/US1987/000104 1986-01-15 1987-01-15 Interconnexion de plaques de circuit electrique Ceased WO1987004568A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR870700832A KR880701027A (ko) 1986-01-15 1987-09-15 전기 배선판 상호 접속기

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US81923586A 1986-01-15 1986-01-15
US819,235 1986-01-15
US887,260 1986-07-21
US06/887,260 US4793814A (en) 1986-07-21 1986-07-21 Electrical circuit board interconnect

Publications (1)

Publication Number Publication Date
WO1987004568A1 true WO1987004568A1 (fr) 1987-07-30

Family

ID=27124343

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1987/000104 Ceased WO1987004568A1 (fr) 1986-01-15 1987-01-15 Interconnexion de plaques de circuit electrique

Country Status (3)

Country Link
EP (1) EP0255541A4 (fr)
KR (1) KR880701027A (fr)
WO (1) WO1987004568A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2684492A1 (fr) * 1991-11-29 1993-06-04 Bernier Raymond Dispositif d'interconnexion electrique.
EP0498530A3 (en) * 1991-01-09 1994-11-30 David A Johnson Electrical interconnect contact system
US5634801A (en) * 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
GB2406722A (en) * 2003-10-02 2005-04-06 Agilent Technologies Inc High frequency electrical module
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
USRE44407E1 (en) 2006-03-20 2013-08-06 Formfactor, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US9274143B2 (en) 2007-04-10 2016-03-01 Formfactor, Inc. Vertical probe array arranged to provide space transformation
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
CN111193115A (zh) * 2020-04-13 2020-05-22 苏州昀冢电子科技股份有限公司 压接电连接器

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US3904934A (en) * 1973-03-26 1975-09-09 Massachusetts Inst Technology Interconnection of planar electronic structures
US4003621A (en) * 1975-06-16 1977-01-18 Technical Wire Products, Inc. Electrical connector employing conductive rectilinear elements
US4593961A (en) * 1984-12-20 1986-06-10 Amp Incorporated Electrical compression connector

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US3904934A (en) * 1973-03-26 1975-09-09 Massachusetts Inst Technology Interconnection of planar electronic structures
US4003621A (en) * 1975-06-16 1977-01-18 Technical Wire Products, Inc. Electrical connector employing conductive rectilinear elements
US4593961A (en) * 1984-12-20 1986-06-10 Amp Incorporated Electrical compression connector

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0255541A4 *

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0498530A3 (en) * 1991-01-09 1994-11-30 David A Johnson Electrical interconnect contact system
US5634801A (en) * 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
EP0545790A1 (fr) * 1991-11-29 1993-06-09 Raymond Bernier Dispositif d'interconnexion électrique
US5338232A (en) * 1991-11-29 1994-08-16 Raymond Bernier Electrical interconnection device
FR2684492A1 (fr) * 1991-11-29 1993-06-04 Bernier Raymond Dispositif d'interconnexion electrique.
GB2406722A (en) * 2003-10-02 2005-04-06 Agilent Technologies Inc High frequency electrical module
US9316670B2 (en) 2004-05-21 2016-04-19 Formfactor, Inc. Multiple contact probes
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
USRE44407E1 (en) 2006-03-20 2013-08-06 Formfactor, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US9310428B2 (en) 2006-10-11 2016-04-12 Formfactor, Inc. Probe retention arrangement
US9274143B2 (en) 2007-04-10 2016-03-01 Formfactor, Inc. Vertical probe array arranged to provide space transformation
CN111193115A (zh) * 2020-04-13 2020-05-22 苏州昀冢电子科技股份有限公司 压接电连接器
CN111193115B (zh) * 2020-04-13 2020-06-30 苏州昀冢电子科技股份有限公司 压接电连接器

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EP0255541A4 (fr) 1988-04-26
KR880701027A (ko) 1988-04-13
EP0255541A1 (fr) 1988-02-10

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