WO1991002102A1 - Film base sur du dioxide de silicium et sa production - Google Patents
Film base sur du dioxide de silicium et sa production Download PDFInfo
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- WO1991002102A1 WO1991002102A1 PCT/JP1990/000982 JP9000982W WO9102102A1 WO 1991002102 A1 WO1991002102 A1 WO 1991002102A1 JP 9000982 W JP9000982 W JP 9000982W WO 9102102 A1 WO9102102 A1 WO 9102102A1
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- Prior art keywords
- film
- glass
- refractive index
- transparent
- refractive
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
- C03C17/3417—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials all coatings being oxide coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/213—SiO2
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/23—Mixtures
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133337—Layers preventing ion diffusion, e.g. by ion absorption
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133502—Antiglare, refractive index matching layers
Definitions
- the present invention relates to a target material and a target material used for forming a transparent oxide thin film containing silicon dioxide as a main component by a snow ring method.
- the present invention relates to a film containing silicon dioxide as a main component and a multilayer film using such a film.
- a transparent thin film having a low refractive index silicon dioxide, fusanimagnesium, and the like are known. These can be formed by a vacuum evaporation method, a coating method, or the like. However, it is difficult to form a film on a large-area substrate by these film-forming methods, and it is necessary to form a large-area film such as a building glass or an automotive glass. could not respond.
- the DC sputtering method is most suitable for large-area film formation, but there is no suitable target material that provides a transparent thin film with a low refractive index. It has not been possible to obtain a desired thin film by using a DC sputtering method capable of forming a film.
- a conductive Si target is subjected to reactive sputtering in an atmosphere containing oxygen to form a silicon dioxide thin film.
- the surface of the Si target is oxidized during the spatula, causing its conductivity to decrease. It could not be sustained stably.
- the formed silicon dioxide thin film had weaknesses and weaknesses in the alkaline property.
- a low-refractive-index thin film is used as an antireflection film formed on the substrate surface.
- a single-layer anti-reflection film formed with an optical film thickness of / 4 '(design wavelength; the same applies hereinafter) and a substance with two low and high refractive indexes are sequentially applied from the air side. // 4 1) / 2) An optical film with a thickness of 2) or a material with a refractive index of 3 types: low, high, and medium, in order from the air side in this order.
- the low-refractive index materials MgF 2 and SiO 2 used in these multilayer anti-reflection films are insulating materials, they cannot be used for large-scale, large-area coatings. It is difficult to form a film by the DC (direct current) sputtering method which is advantageous in production. Usually, a vapor deposition method is used for film formation of these low refractive index materials. For this reason, small products such as camera lenses and turrets are questionable. There is no problem, but there is a problem that it is necessary to control the film thickness to be uniform over a large area.
- M g F 2 and S i 0 2 a scan Roh, 'Tsu is a another means of forming a film Tsu by the data Li in g method
- Mg and S i of te gate Tsu Bok whether we reaction sex spa Tsu although other that intends Rere and in Tsu by you deposited Li in g method is considered the maintenance on the equipment because it is not Do, et al if Kere not use the fluorine is the case corrosive gas of MgF 2 it you have problems
- Si is a DC spa jitter for Ru semiconductor der flame teeth rather, also, the deposition Since the speed is generally slow, the production time is long, which is disadvantageous in terms of cost.
- the glass plate As a transparent material, the glass plate is chemically stable, has excellent surface hardness, withstands high temperatures up to about 500 ° C to 700 ° C, and has excellent electrical insulation and optical properties. Therefore, they are used not only as window glass materials for construction, vehicles, and aircraft but also for optical parts, electric parts, and electronic parts.
- conductive glass plates having a conductive film formed on the glass plate surface are used for display devices such as liquid crystal devices, electoric aperture chromic devices, and electroluminescent devices. It is used for glass solar cell substrates and the like. These conductive As the glass substrate of the conductive glass plate, there is a tendency to use a so-called glass glass plate which is the most widely used and inexpensive.
- the silica glass plate contains about 10 to 2 wt% of alkaline components such as sodium and lime in terms of composition.
- alkaline components such as sodium and lime
- the conductive film of the conductive glass plate may become cloudy or have reduced transparency, or the resistance of the conductive film may be increased, or the chemical and physical durability may be reduced. That is, in a liquid crystal display element, an oxidation-reduction reaction occurs on the surface of the display electrode due to the energy diffused from the glass.
- Indium oxide film (IT0 film) which is a transparent electrode material
- I0 film Indium oxide film
- the light coming out of the glass surface by diffusion penetrates the conductive film and enters the phosphor material, and changes in luminous efficiency and luminescent color. Let it go.
- a typical solution to this drawback is to form a thin film on the surface of the ordinary glass that prevents the diffusion of some alkali.
- a membrane is commonly used.
- the reason for using a silicon oxide film (eg, SiO 2 film) to prevent alkaline diffusion is that the film is amorphous, and another thin film, such as a conductive film, is placed on top of this.
- the same film as formed on the glass can be formed substantially, and the refractive index of the silicon oxide film is slightly lower than that of the glass.
- the transparency of the glass is not impaired because it is transparent to a wider range of light than a normal glass sheet.
- the conductive film formed on the rear surface is formed by a DC sputtering method that can form a uniform film over a large area at high speed.
- the silicon oxide film is formed by the DC sputtering method using the Si target, the silicon oxide film is formed in the sputtering.
- the surface of the gate is oxidized, the electrical conductivity is reduced, and the sputtering cannot be stably maintained. Therefore, the film cannot be formed by the DC sputtering method.
- a functional glass by applying a coating 31 on the surface of a glass 30 as shown in FIG. Is well known.
- examples include an interference filter, an antireflection film, a heat ray reflection glass, a transparent 'conductive glass, an electromagnetic shielding glass, and an electrothermal windshield glass.
- transparent conductive glass, heat mirror ⁇ , electromagnetic shielding glass, electrothermal windshield glass, etc. are formed by using a transparent oxide conductor as the main constituent layer 31.
- stomach down di cormorant-time scan's oxide iT 0
- tin oxide of full Tsu iodine-doped S n0 2: F
- zinc oxide of aluminum two-cormorant-time de one-flops ⁇ 0: ⁇ 1
- the ultraviolet cut glass include a glass in which a zinc oxide (ZnQ) film is coated on the glass surface as an ultraviolet absorbing layer.
- each of these transparent oxide materials has a refractive index of 1.8 to 2.2, which is larger than that of glass, so that reflection at a wavelength satisfying the interference condition is required. The rate will increase. This is observed as the maximum (ripple) in the spectral reflection (transmission) spectrum. For this reason, large area When these thin films are coated on a glass of different types, the wavelength of the reflection maximum shifts due to the in-plane film thickness variation (mura), and the color of the reflected color becomes uneven. It will be perceived by the eyes.
- the film thickness distribution on the glass surface depends on the film formation method.For example, when considering a glass of 1 mx 1 m, it is extremely difficult to keep it within ⁇ 5% by evaporation or CVD. At present, advanced technology is required. According to our research, assuming this level of film thickness distribution, when the above-mentioned transparent oxide film is formed on a glass substrate of 0.15 m or more, the color in-plane color distribution is reduced. Reaches the problematic level. On the other hand, as the film thickness is increased, the saturation of the reflected color is reduced. Therefore, when the thickness is 0.6 m or more, the vividness is reduced, but the color is blurred. A film thickness of 3 ⁇ m or more, preferably 5 ⁇ m or more, is required to exceed the discernible level.
- the large ripples in the spectral spectrum would remain and be a vivid color. It will be perceived by the eyes. If this is formed in a large area glass, the angle between the glass surface and the line of sight, that is, the maximum reflection wavelength shifts depending on the viewing angle, and the color changes, so that the color is perceived as a color blur. And Therefore, it is desirable to reduce the ripple of the spectral spectrum itself.
- the film thickness is less than 0.15 m, the variation of the film thickness distribution is ⁇ 75 A, so that the in-plane color blur is hardly perceived. However, color unevenness due to viewing angle is still a problem.
- the glass becomes luminous (color film) due to in-plane film thickness distribution and change in viewing angle. B)), and may significantly impair the merchantability.
- the specific means for providing this layer is not particularly specified, but is exemplified by vacuum deposition or atmospheric pressure CVD of the mixture, and is intended for coating large area glass. Considering that atmospheric pressure CVD is advantageous, only the atmospheric pressure CVD is described in the examples.
- - Patent 1 The 201,046, as a practical means for forming the underlayer of this, that has been shown a technique for forming a SiC x 0 y.
- This method envisions the float process as a process for manufacturing sheet glass, in which a mixed gas of silane, unsaturated hydrocarbon compounds, and carbon dioxide is applied to the glass surface in a tin tank kiln.
- This is basically a method of forming an intermediate refractive index transparent film by normal pressure CVD.
- Atmospheric CVD deposition is very cost-effective, especially when large volumes of glass are processed continuously in the manufacturing process (so-called on-line).
- This method is disadvantageous in that it is not suitable for multi-product small-quantity production or multilayer film formation. For this reason, heat ray reflection for current construction and automobiles Glass is often manufactured using the sparkling ring method.
- Advantages of the sputtering method include excellent uniformity and controllability of the film thickness, easy production of many kinds of small-quantity products, and easy formation of a multilayer film.
- Another advantage is that the combination with other vacuum film forming means such as evaporation and plasma CVD is easy in terms of equipment design.
- the disadvantages of the sputtering method are that the film formation speed is slow and the cost is high. For this reason, studies are currently being actively conducted to increase the sputtering speed of sputtering. Among them, the biggest disadvantage of this method is that the deposition rate when forming a metal oxide film by reactive sputtering from a metal gate is remarkably slow. It has been said that it is difficult to form a stable and durable intermediate refractive index transparent material at high speed by sputtering. Disclosure of the invention
- a first object of the present invention is to solve the above-mentioned problem and to provide a low-refractive-index oxide containing silicon dioxide as a main component by a reactive DC sputtering method capable of forming a large area film.
- a method for forming a thin film, a target material used in that case, and a film containing silicon dioxide as a main component, which is formed by a reactive direct current sputtering method It is to provide things to do. Furthermore, it is intended to eliminate the low Al resistance that the silicon dioxide thin film had.
- the present invention is directed to the surface oxidation of sputters of Si target.
- the object of the present invention is to provide a sputtering target for solving the problem of low conductivity and low resistance to silicon oxide silicon thin film.
- the main component is Si
- the object of the present invention is to provide a sputtering target characterized by containing at least one kind in a proportion of 4 to 35 atoms in total.
- the total content of Zr, Ti, Ta, Hf, Mo, W, Nb, Sn, In, La, Cr, etc. is 4 atomic% to 35 atomic% with respect to the total amount of Si.
- the content be 4 atomic% to 15 atomic%, because the refractive index of the formed thin film is very low at 1.6 or less. Due to the surface oxidation of the target having a content of Zr or the like smaller than 4 atomic%, it is difficult to perform a stable sputtering, and the deposited thin film (eg, Si-Zr- 0 series) has poor alkali resistance.
- the content of Zr or the like is more than 35 atomic%, the refractive index of the formed thin film becomes high, so that it is not preferable when a low refractive index film is to be formed.
- the uniform film can be a membrane. Since the target of the present invention is conductive and has a small amount of surface oxidation of the gate during the snow, the film can be formed using the DC sputtering method. A uniform film can be formed at high speed over a large area. Needless to say, the target of the present invention is a similar film using a high frequency (RF) sputtering device or the like. Can be formed.
- RF high frequency
- the low refractive index film of the present invention is formed by a vapor deposition method such as vacuum vapor deposition or ion plating, using a substance containing a total of 4 or more atoms in a ratio of 4 to 35 atoms as a tablet. It can also be coated.
- the target or the tablet of the present invention can be prepared, for example, by the following method.
- the particle size of the powder is suitably 0.05 ⁇ to 40 Mm.
- iron, aluminum, magnesium, magnesium, calcium, indium, manganese, and hydrogen in the above-mentioned targets were 3 wt% or less in total. Even if included Since carbon disappears as CO 2 during film formation, it may contain 20 wt% or less of carbon. Further, the same effect can be obtained by mixing the target of the present invention with copper, vanadium, cobalt, rhodium, iridium, or the like of an impurity level.
- Table 1 shows some examples of the case where a film was formed by a reactive RF scanner's ring using other targets as a reference. In the films formed using various targets, the composition ratios of constituent materials such as Zr to Si in the targets were almost maintained even in the films.
- the alkali resistance of the film was determined by immersing it in 0.11 ⁇ NaOH at room temperature for 240 hours.As a result, the film was dissolved when the rate of change in film thickness before immersion was within 10%. Then, the result is called X.
- a 1000 A film was formed using a soda glass plate by the float method as a substrate, and used as a sample for evaluation.
- the film thickness was determined by measuring the step formed by the mask at the time of film formation by the Taristep method.
- the film was immersed in a 0.1NH 2 SO 4 aqueous solution at room temperature for 240 hours, and as a result, the rate of change in the film thickness before immersion was within 10%.
- the rate of change in the film thickness after immersion in distilled water at 100 ° C under 1 atm for 2 hours should be within 10%. I decided to do it.
- the refractive index of the oxide film formed by using the target of the present invention was 1.47 to; L ⁇ 74, and the targets as shown in Comparative Examples 1 to 4 were as follows.
- oxide had use film Hibehi always rather small, the present invention 3, 4, 6, Si Remind as in 8 that also the more than 90 atomic% state, and are a refractive index of 1.5 or less, Si 0 2 It had almost the same refractive index as the film.
- the film using the target of the present invention also had excellent alkaline resistance.
- the hardness was compared with a relative value when the above film was measured with a dynamic ultra-micro hardness tester (load 1 g, indenter tip angle 115, DH115) manufactured by Shimadzu Corporation at a film thickness of 1000 A. While the SiO 2 film of Example 5 was 499, the lOZr—90S i Ox film of Example 3 was 614, which was very hard. Further, In its One to internal stress, S i Ox film against to Oh one in two 10 1 ° dyn / cra, 10 Z r- 90Si0x film of Example 3 Comparative Example 5 10 9 dyn It was found that the internal stress was very low at / cm 2 or less.
- Zr, Ti, Hf, Mo, W, Nb, Sn, Ta, In, a, Cr and the like in the target are mostly silicon compounds.
- Sn is present as a Si-Sn alloy and has a lower activity to oxygen than Si, so it is not easily oxidized: it suppresses a decrease in conductivity due to surface oxidation of the target. It is thought to work as if A second object of the present invention is to solve the above-mentioned disadvantages of the prior art by using the above-mentioned film containing silicon dioxide as a main component, and to use the film for construction and automation. This is to provide such a large-area anti-reflection film at low cost.
- the present invention has been made to solve the above-mentioned problems, and a multilayer antireflection film having a low-refractive-index film formed on at least the outermost layer on the air side.
- Another object of the present invention is to provide an antireflection film characterized in that the film is mainly composed of a complex oxide containing at least one of Si and Si.
- the point of interest in the present invention is that a composite oxide containing at least one of Zr, Ti, Hf, Mo, W, Nb, Sn, Ta, In, La, and Cr and Si, for example, In ZrSi Y 0, the refractive index changes continuously as the composition ratio of Si changes.
- the ZrSi Y O z system, and Tsu by the and this atomic ratio Y for Zr of Si is 0 to 9.0 or in ⁇
- refractive index decreases continuously in 2-1 or found 1.5 or Table 2 shows the refractive index of the film made of this composite oxide. Films were formed by reactive sputtering using the targets of the compositions shown in the table.
- the film of the Zr 1 0 Si 90 O z and Zr 5 Si 95 0 2 composition is a refractive index of 1.5, and this resulting a very low value will have a 1.47 .
- This value of anything beyond the value that would have 1.46 of S i 0 2 as the material of the low refractive index ⁇ for multilayer antireflection film, Ru Oh is also sufficient available for.
- these films Unlike Si0 2 film, because it has excellent ⁇ A Luke Li resistance, Ru can be expected improvement in durability. Furthermore, this Zri. Si 9 .
- reactive spa Tsu - deposition rate of the evening of these that by the-ring method film is also, Si0 for 2 fast Ri Teka compared to the membrane, tuna force s Ri also to shorten the production data click Bok This is also considered to be advantageous in terms of cost.
- the above-mentioned low refractive index ⁇ containing silicon dioxide of the present invention as a main component is not present on a transparent substrate.
- a low refractive index film of various antireflection multilayer films such as a four-layer antireflection film with an optical film thickness of ( ⁇ / 4/4/4/2 ⁇ / 4/4 ⁇ / 2). Further, the antireflection multilayer film can be formed continuously by a physical vapor deposition method without breaking vacuum.
- the optical layer is formed as the first layer on the surface of the substrate, counting from the air side. / 4 of the refractive index 1.49 ZrSi Y O z film is formed.
- This film having a refractive index of 1.49 is the same as that of the aforementioned Zr ,. Si 9 . This can be achieved by slightly adjusting the composition of O z .
- the second layer has an optical thickness.
- a ZrSi x O z film having a refractive index of 2.05 and a refractive index of / 2 is formed.
- This film with a refractive index of 2.05 can be realized by setting the atomic ratio X of Si to Zr to about 0.25 according to Table 2.
- an antireflection film having three or more layers can also be formed by adjusting the refractive index of each constituent film.
- Poi down bets are materials of low refractive index film
- a film having a refractive index of 1.5 can be realized.
- the refractive index can be further reduced, but when the Si content is too high, the DC sputtering is performed as described above. In this case, the film cannot be formed by the above-described method, and the alkali resistance of the film is reduced.
- the lower limit of Y as the material of the low refractive index film is not strictly defined because it is influenced by the type of the material of the high refractive index film to be combined. If the refractive index of the low-refractive-index material is too high, the high-refractive-index materials to be combined will be limited, and the antireflection performance will also be reduced. It is thought that 1.7 or less is appropriate. Therefore, it is desirable that the range of the value of Y be 2 or more and 19 or less.
- the substrate on which the antireflection film of the present invention is formed glass, plastic, film, or the like can be used, and the refractive index is 1.45 to: L, 60 Somewhat transparent is desirable.
- the high-refractive-index material is also low-refractive-index material is also Ri by the and the child to use the same Z r S i y 0 z, Ru obtained Ri come cause it to be and between different material layers Peeling can be prevented, and as a result, an effect of improving adhesion can be expected.
- any method such as a normal vapor deposition method, a sputtering method, and a CVD method may be used.
- the sparkling method is desirable. This is because the feature of the present invention is that a low refractive index film can be formed by a DC sputtering ring as described above.
- an alloy target of Zr and Si is used as a target. as a jitter gas using a mixed gas of Ar and 0 2.
- a high-refractive-index film can also be prepared by reactive sputtering from a Zr and Si alloy target, but other materials can be used. There is no problem when using a metal target as long as the metal target of each material is used.
- a conductive material such as sintered IT0 can be used as a target.
- the film whose main component is a composite oxide containing Si and Zr has been described.
- a third object of the present invention is to use the above-mentioned film containing silicon dioxide as a main component to prevent aluminum ions from diffusing from the glass of an alkali-containing glass.
- Al Force Linor film The purpose is to provide an electrically conductive glass.
- the present invention has been made based on the above-mentioned problem, and has been made by finding a novel aluminum linole film which can be formed by the DC sputtering method.
- An electrically conductive glass in which an alkali barrier film for suppressing alkali diffusion from the glass and a conductive film are sequentially laminated on the surface of the glass,
- the first film is a film whose main component is an oxide containing at least one of Zr, Hf, Nb, Sn, La, Ti, Ta, Mo, W, Cr, and In.
- the present invention also provides a method for producing a conductive glass, which comprises forming an alkali metal film containing an oxide containing Si as a main component and then forming a conductive film. It is. _
- the composition of the aluminum alloy film according to the present invention is such that it contains Si at a ratio of at least 5 atoms of Si to 95 atoms of the total metal such as Zr and Hf. I like it. This is because if the Si content is less than this ratio, the film becomes crystalline, and the alkali barrier performance is significantly reduced.
- Si is contained at a ratio of 96 atoms or less of Si to 4 atoms of the total amount of metals such as Zr. If the Si content is more than this ratio, the surface cannot be stably formed by the DC sputtering method due to the surface oxidation of the target.
- the refractive index of the film of the present invention can be freely adjusted by its composition.
- Zr is used as the metal
- the refractive index change due to the composition of the Al-linol film Are shown in Table 3.
- a transparent electrode plate such as a display element having a transparent electrode such as an ITO film (tin-containing indium oxide film) as a conductive film is formed.
- the refractive index of the film of the present invention is set to be the same as that of the transparent electrode according to the present invention, the alumi- num-liner film is formed.
- the transparent electrode pattern Since there is no difference in the refractive index between the portion where the transparent electrode pattern is formed on the top and the portion where only the transparent film is formed without forming the transparent electrode, the transparent electrode pattern is not formed. This makes it possible to prevent the so-called “bone-view” phenomenon of the so-called transparent electrode pattern.
- the refractive index of the IT0 film is set to about 1.9, as shown in Table 1.
- Zr: Si about 70:30.
- the refractive index can be different from that of the IT0 film.
- the refractive index can be reduced by increasing the proportion of Si.
- the composition of the alcohol film of the present invention can be appropriately selected according to the refractive index of the conductive film formed on each of the films.
- the thickness of the alkaline barrier film of the present invention be 50 A or more so that sufficient linear force can be exerted. Among them, the range of 100A to 5000A is most practical.
- Examples of the glass applicable to the conductive glass of the present invention include, but are not limited to, the most commonly used glass containing 10 to 20 wt% of Na and ⁇ . And various other glass containing glass.
- conducting glass of the present Hatsu ⁇ is a conductive film formed on the above-mentioned alkali Roh 'Li Aichi film, ITO film, F and Sn0 2 film Sb and the like are de one flop, A1 Etc. were doped Any conductive film, such as a transparent conductive oxide film such as a ZnO film, or a conductive metal film such as Ag or Au, which is likely to be degraded by alkali ions, may be used. There is no particular limitation.
- the conductive glass alkaline barrier film of the present invention can be formed by the direct sputtering method, a uniform film over a large area can be stably formed at high speed. And provide it. This is because when a conductive film formed on an alkaline metal film is formed by a physical vapor deposition method using a vacuum such as a DC sputtering method or the like without breaking the vacuum. This is a great advantage, especially in terms of productivity, because the continuous film and the conductive film can be formed continuously in an in-line vacuum process system.
- a fourth object of the present invention is to provide a case where a high-refractive-index transparent film having a thickness of 0.15 ⁇ or more is formed on a glass substrate using the above-mentioned film containing silicon dioxide as a main component.
- the purpose is to provide an achromatic glass that prevents the problematic glow (color blur).
- a high-refractive-index transparent thin film having a refractive index ⁇ of 1.8 or more and a thickness d of 0.15 ⁇ m or more is formed on a glass substrate, and between the high-refractive-index transparent thin film and the glass substrate.
- Reference numeral 10 denotes a glass substrate
- 11 denotes a high-refractive-index transparent thin film having ⁇ ⁇ 1.8 and d ⁇ 0 ⁇ 15 m or more
- 12 denotes a transparent underlayer film.
- the high-refractive-index transparent thin film 11 of the present invention is not limited to such a force S as indium tin oxide, fluorine-doped tin oxide, zinc oxide and the like.
- the main constituent material is a composite oxide containing at least one of Zr, Ti, Ta, Hf, o, W, Nb, Sn, In, La, and Cr, and Si. It is desirable that the film be as follows. This is because such a film is formed by a direct sputtering method using an alloy target of a metal such as Zr and Si and an Si-containing atmosphere in an oxygen-containing atmosphere. This is because it can form a film at a high speed and has excellent physical and chemical durability.
- a composite oxide containing Zr and Si is preferable because of its excellent acid resistance and alkali resistance.
- the composite oxide of Si and a metal such as Zr also has the advantage that the refractive index can be adjusted to a desired value by changing the mixing ratio.
- the achromatic glass described above is laminated with another glass substrate via a plastic intermediate film, and is composed of glass / transparent lower film, high refractive index transparent thin film / intermediate film Z glass.
- the same effect can be obtained with any combination glass.
- the cause of the color blur is the interference of light at the upper and lower interfaces of the high-refractive transparent thin film. For this reason, a maximum and a minimum (ripple) are generated in the spectroscopic spectrum, and a deviation of the maximum and a minimum due to a variation in the thickness of the high refractive index thin film is sensed as color blur. .
- the transparent underlayer film of the present invention functions to prevent reflection at the interface between the glass and the high-refractive-index transparent thin film. As a result, equivalently, this interface has disappeared, and light interference in reflection and transmission is eliminated. In other words, the ripple in the spectral spectrum disappears, and the spectrum does not change even if the film thickness changes.
- the anti-reflection effect due to the interference of light can be achieved only at a specific wavelength (main wavelength), and some ripples remain at other wavelengths.
- a transparent upper layer film for preventing reflection is also provided on the upper layer of the high refractive index transparent thin film as shown in Fig. 2. Is also preferred.
- FIG. 2 is a cross-sectional view of another example of the achromatic glass of the present invention, in which 20 is a glass substrate, 21 is a high-refractive-index transparent thin film (the same thin film as 11 in FIG. 1), 22 is a transparent base film (the same thin film as 12 in FIG. 1), and 23 is a transparent upper film.
- 20 is a glass substrate
- 21 is a high-refractive-index transparent thin film (the same thin film as 11 in FIG. 1)
- 22 is a transparent base film (the same thin film as 12 in FIG. 1)
- 23 is a transparent upper film.
- n ⁇ 1.55 is preferable if the composition is 80 atoms or more of Si with respect to 20 atoms of Zr.
- the amount of Si is less than 96 atoms with respect to 4 atoms of Zr, it is possible to prevent the decrease in conductivity due to the oxidation of the alloy target surface during the reactive sputtering, so that the direct current Reactive sputtering by the cutter can be stably performed.
- I 2 4 n 2 d 2
- the residual ribble can be sufficiently suppressed over a wide wavelength range in the visible region.
- the top 2 is 0.05 m away. This is because the upper film can suppress the ripple at the wavelength near I, and the lower film can suppress the ripple at the wavelength near 2 . is there .
- two wavelengths are set in the wavelength range, and these are set to upper and lower layers so as to correspond to L i and ⁇ 2 .
- FIG. 4 is a cross-sectional view of an example of the non-light matching glass of the present invention.
- 40 is a glass substrate
- 41 is a high-refractive-index transparent thin film (same as in FIGS. 1 and 2)
- 42 is a transparent underlayer film (same as in FIGS. 1 and 2)
- 43 Is a transparent upper layer film
- -44 is a plastic interlayer film.
- a film similar to the transparent lower film 12 can be used.
- the reflection of the transparent upper layer film 43 (refractive index na, optical film thickness n 3 da) and the transparent lower layer film 42 (refractive index n 4 , optical film thickness n 4 d 4) are suppressed.
- the wavelength range in which residual treble is sufficiently suppressed can be extended.
- FIG. 1 schematically shows a cross section of one embodiment of the present invention.
- 10 is a glass substrate
- 11 is a transparent thin film having a high refractive index
- 12 ' is a transparent lower layer film.
- reference numeral 20 denotes a glass substrate
- 21 denotes a high-refractive-index transparent thin film
- 22 denotes a transparent lower film
- 23 denotes a transparent upper film.
- FIG. 3 schematically shows a cross section of a conventional example.
- 30 is a glass substrate
- 31 is a high refractive index transparent thin film
- the film is shown.
- FIG. 4 is a sectional view of an example of the non-light-aligned glass of the present invention.
- 40 is a glass substrate
- 41 is a high-refractive-index transparent thin film
- 42 and 43 are a transparent lower film and a transparent upper film
- 44 is a plastic intermediate film.
- FIG. 5 and FIG. 6 are diagrams showing spectral reflection spectra of samples in Examples and Comparative Examples of the present invention.
- FIG. 7 shows the spectral reflection spectrum in the visible region of the sample on which the antireflection film of the present invention was formed.
- 1 indicates the spectral reflection curve of the sample prepared according to Example 1
- 2 indicates the spectral reflection curve of the sample prepared according to Example 2.
- Example 3 and the product of Comparative Example 1 were each brought into contact with pure water and kept at 90 ° C. for 24 hours, and then the amount of Na + eluted into the pure water was measured to determine the amount of Na + lyophile. When the properties were examined, it was 0.60 ⁇ g / cm 2 for the product of Example 3 and 0.61 / g / cm 2 for the product of Comparative Example 1. Further, the product of Example 3 and the product of Comparative Example 1 were each washed with 5% NaOH, and then contacted with pure water at room temperature for 24 hours to determine the amount of Na + eluted in the pure water (during the above washing). The amount of Na + adsorbed) was measured to determine the alkaline adsorption. The results were 0.13 ⁇ g / cm 2 for the product of Example 3 and 0.14 ⁇ g / cm 2 for the product of Comparative Example 1. . From this, it was found that the product of Example 3 had almost the same characteristics as the comparative example.
- Zr. . ISIO. S 0 2 film was about 200 A formed.
- FIG. 5 shows the spectral reflection spectra of Samples 1, 2, and 5.
- 51, 52, and 53 correspond to samples 1, 2, and 5, respectively.
- the transparent underlayer film according to the present invention was formed (51)
- the ripple was clearly reduced as compared with the case where the transparent underlayer film was not formed (53), indicating that the film had an effect of preventing glow. It is taken. It can also be seen that the effect is even more pronounced when a transparent upper layer film is applied (52).
- Figure 6 shows the spectral reflection spectra of samples 3, 4, and 6. 61, 62, and 63 in the figure correspond to samples 3, 4, and 6, respectively.
- High refractive index transparent thin film as in Fig. 5 It can be seen that when the transparent lower layer film and the transparent upper layer film according to the present invention are formed above and below, the effect of preventing ripple is the greatest.
- a transparent thin film having a low refractive index and an excellent anti-alkaline property can be stably provided over a large area at a high speed.
- the optical design of the thin film can be facilitated by the combination with the transparent oxide thin film having a high refractive index.
- the low refractive index film of the present invention has chemical stability, it can be used as an overcoat for various articles. For example, it is most suitable for the outermost layer of heat-reflective glass for buildings and vehicles, the protective plate for the reading part of bar code readers, anti-reflective coatings, and glasses lenses.
- a film containing silicon dioxide as a main component can be formed by the DC sputtering method. Vapor deposition (Vacuum deposition, ion plating, sputtering, etc. can be combined. Therefore, at least a film containing silicon dioxide as a main component should be used.
- each layer of the multilayer film can be continuously formed by a physical vapor deposition method without breaking vacuum, and the production efficiency is significantly improved. .
- the present invention it is possible to provide a large-area antireflection film which has been difficult to prepare conventionally.
- the high refractive index film and the low refractive index film Of both and even Tsu by the fact while creating use the Z r S i y O z film, also cormorants effect have If you prevent the Ha-click away of layers ⁇ You can be expected.
- Z r S i y O z film is Tsu in film amorphous by the addition of the S i, for the smoothness of the table surface is improved, is also observed improvement of scratch resistance.
- Zr S i ⁇ 0 z film is a wood charge of the low refractive index film used in the present invention, our Ri excellent resistance Aruka Li surname compared to S i 0 2 film, hardness high rather dense Therefore, it is also effective in improving the chemical resistance of the antireflection multilayer film.
- a multilayer antireflection film can be formed by an inline D. sputtering apparatus.
- the characteristic of this in-line DC sputtering method is that it is relatively easy to control the film thickness uniformity over a large area, and as a result, Therefore, a large-area antireflection film can be realized.
- Such large-area anti-reflection coatings can be used for shops such as shop windows, doll cases, and the front glass of paintings.
- the ability to produce large-area products means that small products can be produced in large quantities at once, which leads to a reduction in production costs. .
- Specific applications of such a device include a front panel of a display, a power burglar for solar cells, and a lens for glasses.
- the conductive glass with an Al-Li-barrier film of the present invention can be applied to a display element such as a liquid crystal element, an electrochromic element, an electroluminescent element or the like.
- a display element such as a liquid crystal element, an electrochromic element, an electroluminescent element or the like.
- an anti-diffusion film for conductive glass It is optimal and has heat resistance, as can be seen from Table 3, and is stable and deteriorates even in the manufacturing process of such display elements, solar cells, etc., and various subsequent environmental conditions. There is nothing.
- conductive films are formed on glass plates for automobiles, aircraft, railway vehicles and other various types of traffic vehicles, construction, various devices, optical components, electrical components, and electronic components. It can be usefully applied to a base coat for forming a heat ray anti-reflection coating, a reflection coating, a coloring coating, and other coatings having various functions.
- the Al film of the present invention can be made to have a desired refractive index by changing the ratio of S ⁇ to a metal such as Zr, the force S can be increased. Widely available for
- the alkaline monolayer film of the present invention has a low alkaline adsorption property, it can be sufficiently used even if there is a step of washing with an alkaline-containing liquid in the production of a liquid crystal cell or the like. You can do it.
- the thickness of the high refractive index thin This has the effect of preventing color mura (glow). In particular, it has a remarkable effect when applied to a large-area glass substrate.
- the transparent lower layer film and the transparent upper layer film of the present invention use a film mainly composed of a complex oxide containing Si and a metal such as Zr or Ti
- the reactivity is reduced by the DC sputtering method.
- the film can be formed by the sputter ring method, and therefore all thin films including the high-refractive-index transparent thin film are continuously deposited in-line, that is, physically deposited without breaking vacuum. The method makes it possible to form an achromatic glass, thereby significantly improving the manufacturing efficiency.
- the present invention By using the present invention to form a high-refractive-index transparent film on a large-area glass with no color unevenness, it can be used for heat mirrors for construction, electromagnetic shielding glass, and electric heating for motor vehicles.
- a windshield glass, a transparent conductive substrate for display, a transparent conductive substrate for solar cells, an ultraviolet cut glass, etc. can be applied to a large area application without deteriorating the appearance.
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
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- Physical Vapour Deposition (AREA)
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP90911700A EP0436741B1 (en) | 1989-08-01 | 1990-08-01 | DC sputtering method and target for producing films based on silicon dioxide |
| DE69027590T DE69027590T2 (de) | 1989-08-01 | 1990-08-01 | Verfahren zur Herstellung von Schichten auf basis von Siliziumdioxyd mittels DC Sputtern und Target dafür |
| US08/323,579 US5605609A (en) | 1988-03-03 | 1994-10-17 | Method for forming low refractive index film comprising silicon dioxide |
| US08/429,845 US5772862A (en) | 1988-03-03 | 1995-04-27 | Film comprising silicon dioxide as the main component and method for its productiion |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1/197993 | 1989-08-01 | ||
| JP19799389 | 1989-08-01 | ||
| JP1/224484 | 1989-09-01 | ||
| JP1224484A JPH03173638A (ja) | 1989-03-07 | 1989-09-01 | 反射防止膜及びその製造方法 |
| JP2/161413 | 1990-06-21 | ||
| JP2161413A JPH0780692B2 (ja) | 1989-08-01 | 1990-06-21 | 電導性ガラス及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1991002102A1 true WO1991002102A1 (fr) | 1991-02-21 |
Family
ID=27321852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1990/000982 Ceased WO1991002102A1 (fr) | 1988-03-03 | 1990-08-01 | Film base sur du dioxide de silicium et sa production |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0436741B1 (ja) |
| DE (1) | DE69027590T2 (ja) |
| WO (1) | WO1991002102A1 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6607947B1 (en) * | 1990-05-29 | 2003-08-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with fluorinated layer for blocking alkali ions |
| US9581875B2 (en) | 2005-02-23 | 2017-02-28 | Sage Electrochromics, Inc. | Electrochromic devices and methods |
| JP2024045057A (ja) * | 2022-09-20 | 2024-04-02 | アップル インコーポレイテッド | 湾曲表面のためのコーティング |
| CN121299818A (zh) * | 2025-11-17 | 2026-01-09 | 浙江日久新材料科技有限公司 | 减反膜及其制备方法 |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR920020223A (ko) * | 1991-04-04 | 1992-11-20 | 세야 히로미찌 | 무진주광택 투명체 |
| FR2683230B1 (fr) * | 1991-11-04 | 1995-03-31 | Siderurgie Fse Inst Rech | Procede de revetement d'un produit metallurgique, produit ainsi obtenu et dispositif pour sa fabrication. |
| CA2120875C (en) * | 1993-04-28 | 1999-07-06 | The Boc Group, Inc. | Durable low-emissivity solar control thin film coating |
| US6352755B1 (en) | 1994-10-04 | 2002-03-05 | Ppg Industries Ohio, Inc. | Alkali metal diffusion barrier layer |
| US5830252A (en) * | 1994-10-04 | 1998-11-03 | Ppg Industries, Inc. | Alkali metal diffusion barrier layer |
| US6165598A (en) * | 1998-08-14 | 2000-12-26 | Libbey-Owens-Ford Co. | Color suppressed anti-reflective glass |
| US6410173B1 (en) | 1998-11-30 | 2002-06-25 | Denglas Technologies, Llc | Antireflection coatings and other multilayer optical coatings for heat-treatable inorganic substrates and methods for making same |
| JP3227449B2 (ja) * | 1999-05-28 | 2001-11-12 | 日本板硝子株式会社 | 光電変換装置用基板とその製造方法、およびこれを用いた光電変換装置 |
| EP1164112A1 (en) * | 2000-06-16 | 2001-12-19 | Denglas Technologies, LLC | Multilayer antireflection coatings for heat-treatable inorganic substrates and methods for making same |
| TWI276613B (en) | 2002-04-05 | 2007-03-21 | Murakami Corp | Composite material |
| US20050094279A1 (en) * | 2003-10-30 | 2005-05-05 | Tonar William L. | Electrochromic device having a self-cleaning hydrophilic coating with an acid resistant under layer |
| JP2005284216A (ja) | 2004-03-31 | 2005-10-13 | Shin Etsu Chem Co Ltd | 成膜用ターゲット及び位相シフトマスクブランクの製造方法 |
| DE102004051846B4 (de) * | 2004-08-23 | 2009-11-05 | Heraeus Quarzglas Gmbh & Co. Kg | Bauteil mit einer Reflektorschicht sowie Verfahren für seine Herstellung |
| FR2881757B1 (fr) | 2005-02-08 | 2007-03-30 | Saint Gobain | Procede d'elaboration par projection thermique d'une cible a base de silicium et de zirconium |
| US7964788B2 (en) | 2006-11-02 | 2011-06-21 | Guardian Industries Corp. | Front electrode for use in photovoltaic device and method of making same |
| US8076571B2 (en) | 2006-11-02 | 2011-12-13 | Guardian Industries Corp. | Front electrode for use in photovoltaic device and method of making same |
| US20080302414A1 (en) * | 2006-11-02 | 2008-12-11 | Den Boer Willem | Front electrode for use in photovoltaic device and method of making same |
| US8203073B2 (en) * | 2006-11-02 | 2012-06-19 | Guardian Industries Corp. | Front electrode for use in photovoltaic device and method of making same |
| US8012317B2 (en) | 2006-11-02 | 2011-09-06 | Guardian Industries Corp. | Front electrode including transparent conductive coating on patterned glass substrate for use in photovoltaic device and method of making same |
| US8334452B2 (en) | 2007-01-08 | 2012-12-18 | Guardian Industries Corp. | Zinc oxide based front electrode doped with yttrium for use in photovoltaic device or the like |
| US8022291B2 (en) | 2008-10-15 | 2011-09-20 | Guardian Industries Corp. | Method of making front electrode of photovoltaic device having etched surface and corresponding photovoltaic device |
| US9263359B2 (en) | 2013-02-27 | 2016-02-16 | Lotus Applied Technology, Llc | Mixed metal-silicon-oxide barriers |
| CN111206217A (zh) * | 2020-03-25 | 2020-05-29 | 郑州大学 | 一种核电用Zr-Si-O非晶防护涂层的制备方法 |
| DE102023119796A1 (de) * | 2023-07-26 | 2025-01-30 | Schott Ag | Beschichteter Artikel |
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| JPS61144029A (ja) * | 1984-12-17 | 1986-07-01 | Nippon Telegr & Teleph Corp <Ntt> | 燐を含有する酸化シリコン膜の製造方法及び製造装置 |
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| KR940008020B1 (ko) * | 1988-12-21 | 1994-08-31 | 가부시끼가이샤 도시바 | 스퍼터링장치용 타겟 |
-
1990
- 1990-08-01 DE DE69027590T patent/DE69027590T2/de not_active Expired - Fee Related
- 1990-08-01 EP EP90911700A patent/EP0436741B1/en not_active Expired - Lifetime
- 1990-08-01 WO PCT/JP1990/000982 patent/WO1991002102A1/ja not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS55110127A (en) * | 1979-02-19 | 1980-08-25 | Teijin Lens Kk | Preparation of plastic antireflection film |
| JPS61144029A (ja) * | 1984-12-17 | 1986-07-01 | Nippon Telegr & Teleph Corp <Ntt> | 燐を含有する酸化シリコン膜の製造方法及び製造装置 |
| JPS61145823A (ja) * | 1984-12-20 | 1986-07-03 | Toshiba Corp | 分子線エピタキシ成長法 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6607947B1 (en) * | 1990-05-29 | 2003-08-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with fluorinated layer for blocking alkali ions |
| US7355202B2 (en) | 1990-05-29 | 2008-04-08 | Semiconductor Energy Co., Ltd. | Thin-film transistor |
| US9581875B2 (en) | 2005-02-23 | 2017-02-28 | Sage Electrochromics, Inc. | Electrochromic devices and methods |
| US10061174B2 (en) | 2005-02-23 | 2018-08-28 | Sage Electrochromics, Inc. | Electrochromic devices and methods |
| US11567383B2 (en) | 2005-02-23 | 2023-01-31 | Sage Electrochromics, Inc. | Electrochromic devices and methods |
| JP2024045057A (ja) * | 2022-09-20 | 2024-04-02 | アップル インコーポレイテッド | 湾曲表面のためのコーティング |
| CN121299818A (zh) * | 2025-11-17 | 2026-01-09 | 浙江日久新材料科技有限公司 | 减反膜及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69027590T2 (de) | 1996-12-05 |
| DE69027590D1 (de) | 1996-08-01 |
| EP0436741A4 (en) | 1992-01-22 |
| EP0436741A1 (en) | 1991-07-17 |
| EP0436741B1 (en) | 1996-06-26 |
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