WO1994016854A1 - Procede de traitement de la surface d'un article et installation pour ce faire - Google Patents
Procede de traitement de la surface d'un article et installation pour ce faire Download PDFInfo
- Publication number
- WO1994016854A1 WO1994016854A1 PCT/RU1994/000005 RU9400005W WO9416854A1 WO 1994016854 A1 WO1994016854 A1 WO 1994016854A1 RU 9400005 W RU9400005 W RU 9400005W WO 9416854 A1 WO9416854 A1 WO 9416854A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation
- plasma
- products
- fact
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/10—Surface shaping of articles, e.g. embossing; Apparatus therefor by electric discharge treatment
- B29C59/106—Surface shaping of articles, e.g. embossing; Apparatus therefor by electric discharge treatment the electrodes being placed on the same side of the material to be treated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2791/00—Shaping characteristics in general
- B29C2791/001—Shaping in several steps
Definitions
- non-volatile compounds which are used for oxidation, nitridization and other processes of the formation of films on the surface of the market, as well as the use of the process of the economy.
- STIMULATED PROCESSES ARE DIFFERENT IN HIGH QUALITY AND QUALITY OF OPERATIONS OF THE PROCESSES. Pressurization
- Permanent or pulsed optical radiation with a long wavelength in the range of 10 - 0.2 ⁇ m stimulates the reaction in the active medium and in the transducer.
- the optical system is housed in a product and product.
- active media usually use molecular gases with oxygen, nitrogen, halogen and metal compounds, other products
- the thickness of the layer of the stimulated emission process per unit of radiation energy does not exceed 0.1 nm cm / J.
- the radiation energy density available for processing is limited by the processes of recrystallization, smelting, sublimation, and others. ⁇
- the rate of growth and deposition is very fast and the typical pulse frequency of 100 - 1000 Hz is around 1 nm / s.
- the area of the power is limited by the conditions of the energy supply with the irradiation C ⁇ 10 ⁇ / -
- the rate of pressure per unit of energy does not exceed 0.1 nm cm / J, but a maximum speed of -3 nm / s.
- the possibility of increasing the comfort of the service is due to the reduction of the area of the irradiation, when the condition of the device is convenient
- the growth rate of the extract can reach 20-100 nm / s, but the average productivity of such a method per unit of energy remains low.
- a stimulated gas treatment in an active gas medium has a low efficiency of use of radiation and low efficiency.
- Plasma is sprayed in a vacuum of C10 - 10 Pa) by ignition by low temperature - 3 - a charge in a gas mixture containing chemically active gas. Plasma increases the concentration of chemically active particles in an active medium, thereby increasing the efficiency of stimulated processes. Like, for example, effective-
- the vacuum chamber is supplied with gas of a predetermined system at low pressure and the electric voluminous plasma discharge is excited, which can be separated if it is separated by gas.
- the latest exposure is radiation, which is
- the device is easy to handle, and the above described method is also low pressure, which is impermissible for the inadequate gas absorption.
- the main task of the invention is the creation of a vehicle
- ba ⁇ b ⁇ ab ⁇ i ⁇ ve ⁇ n ⁇ s ⁇ i products ⁇ y would ⁇ zv ⁇ lil ⁇ vysi ⁇ e ⁇ e ⁇ ivn ⁇ s ⁇ v ⁇ zdeys ⁇ viya ⁇ iches ⁇ g ⁇ radiation ⁇ ve ⁇ n ⁇ s ⁇ products ⁇ i improving ⁇ aches ⁇ va Schis ⁇ y ⁇ ve ⁇ n ⁇ s ⁇ i and ⁇ len ⁇ , ⁇ su ⁇ s ⁇ vie ⁇ adiatsi ⁇ nny ⁇ na ⁇ usheny ⁇ ve ⁇ n ⁇ s ⁇ i and s ⁇ u ⁇ u ⁇ ) and ⁇ s ⁇ e ⁇ izv ⁇ di ⁇ eln ⁇ s ⁇ i ⁇ b ⁇ ab ⁇ -
- the task posed is solved by the fact that in the process of processing the products, the process creates chemical products.
- the invention offers a method of processing a machine.
- V / - the minimum width of the line of the drawing on the processing is the 20th volume of the output, m;
- V is the velocity of the motion of the radiation exposure zone at the processed surface, m / s;
- G is the frequency of the radiation pulses, Hz; a - Operation of the external front-end zone is irradiated with the 25-second operating environment to the rear of the next operating area, m.
- the radiation parameters chosen by this method ensure high image quality at the turn of the product and the possibility of non-processing of the whole 30.
- the setup is for the processing of products with a low-temperature plasma generator and a source of radiation with an optical system. - 7 -
- the product holder installed by them, according to the invention as a plasma generator, is used with a plasma generator that is less than the pressure
- the last owner’s accommodation is equipped with a housing sensor
- the source of radiation of the optical device is less expensive, the process is less expensive.
- Fig. 1 depicts a version of the installation for the investigation of the processing of radiation and plasma spray
- Fig. 2 displays a version with an option of 25 simultaneous influences on the processed radiation and plasma flow.
- Fig. 1 At the beginning, we will take a look at Fig. 1 and arrange for the installation of the process to be processed, from the process it becomes clear and the essence of the proposed method.
- generator 1 plasma 2 at atmospheric pressure is connected to the source of 3 power supply and to the system 4 of the supply of plasma-forming and reactive.
- the installation is equipped with an operating device 7, in case of - 8 - to the power supply 6, and unit 8 of the control unit with a speed switch for the power supply 5.
- the power supply 9 of the power supply is connected to the power supply 10
- source 9 of radiation in this variant was an excimer laser.
- Generator 1 has been installed so that an additional simple line 2 interrupts the movement of the propeller 6 from the final 5.
- the default setting is 11 and the system is shut down
- the generators 1 are equipped with facilities. Again, the transfer systems in this direction are not shown.
- the generators 1 may also be equipped with protective devices.
- the inert gas can be used with inert gases. These are:
- Laser radiation 9 is extinguished through the optical system 11 at the speed of the product 5 at a selected speed of the vehicle, 6
- Controlled source 10 for laser power supply 9 connected to unit 8 of control unit 7 and secured
- the efficiency of radiation is very varied and inconsistent with adsorbent processes used in the process of processing products. If, under specified conditions, reagents and materials are used for process desorption of products and the reaction itself
- FIG. 2 shows a more universal installation.
- Sydentic elements in FIG. 2 have the same meanings as in FIG. 1), the optical system is additionally equipped with a system mirror, one of which is mounted on a rotational axis 6 at a 45 ° angle of rotation
- the rear mirror 13 is mounted on the holder 6 with the possibility of changing the angle of inclination to falling on a negative optical beam. and directs it to turn the product on. 5. Larger use allows you to save a lot of radiation on the turn of the product without
- the optical system 11 is equipped with a photo system 14, the main system, for example, is connected to a public system. With this optical system, it is necessary to ensure that the picture is not damaged at all.
- the radiation generator must have a radiation frequency of more than 200 Hz. This condition is satisfactory.
- the frequency of radiation can reach 500 Hz.
- the minimum residence time of the processed product is that it is protected by a plasma transmitter.
- Size may vary widely. 0.01 - thirteen -
- the user may have a light source 15 installed on the holder 6;
- the agent can be made in the form of a sweetener, which will allow you to keep continuous
- ⁇ ami were ⁇ isany ⁇ ime ⁇ y ⁇ tsessa ⁇ avleniya and ⁇ sazhdeniya, ⁇ dna ⁇ ⁇ isannym s ⁇ s ⁇ b ⁇ m m ⁇ zhn ⁇ ⁇ a ⁇ zhe ⁇ susches ⁇ vlya ⁇ ⁇ m ⁇ le ⁇ snuyu ⁇ chis ⁇ u ⁇ ve ⁇ n ⁇ s ⁇ i ⁇ vse ⁇ vid ⁇ v zag ⁇ yazneny Sads ⁇ ba ⁇ a, and ⁇ ganiches ⁇ i ⁇ ⁇ li- me ⁇ ny ⁇ zag ⁇ yazneny, me ⁇ aniches ⁇ i ⁇ chas ⁇ its, and na ⁇ ushenny ⁇ ⁇ i- slenny ⁇ sl ⁇ ev ⁇ ve ⁇ n ⁇ s ⁇ i and d ⁇ ,), and replaced ch ⁇ ⁇ zv ⁇ lyae ⁇ - ni ⁇ it zhid ⁇ s ⁇ uyu
- ⁇ a ⁇ im ⁇ b ⁇ az ⁇ m ⁇ luchaemaya s ⁇ glasn ⁇ iz ⁇ b ⁇ e ⁇ eniyu ⁇ b ⁇ a- b ⁇ a ⁇ ve ⁇ n ⁇ s ⁇ i products ⁇ lichae ⁇ sya vys ⁇ y ⁇ izv ⁇ di- ⁇ eln ⁇ s ⁇ , unive ⁇ saln ⁇ s ⁇ yu, e ⁇ e ⁇ ivn ⁇ s ⁇ yu v ⁇ zdeys ⁇ viya radiation ⁇ iches ⁇ g ⁇ , ⁇ su ⁇ s ⁇ viem ⁇ adiatsi ⁇ nny ⁇ de ⁇ e ⁇ v, vys ⁇ y chis ⁇ y ⁇ tsess ⁇ v and ⁇ zv ⁇ lyae ⁇ susches ⁇ venn ⁇ ⁇ vy- si ⁇ ⁇ aches ⁇ v ⁇ ⁇ b ⁇ aba ⁇ yvaemy ⁇ products.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Radiation-Therapy Devices (AREA)
Abstract
L'invention concerne le domaine du traitement de surfaces à l'aide de plasmas et de rayonnement optique. Le procédé consiste à créer un milieu plasmatique actif chimiquement se présentant sous la forme d'au moins un courant de plasma (2) à la pression atmosphérique, et un rayonnement optique continu ou pulsé agissant simultanément ou successivement sur la surface de l'article (5) soumise à un traitement, avec n intersections de la surface traitée avec le courant de plasma et le faisceau de rayonnement, n étant » 1. Une installation de mise en ÷uvre de ce procédé comprend un générateur (1) produisant un courant de plasma (2) à basse température, à la pression atmosphérique, une source de rayonnement (9) présentant un système optique (11) au dessous duquel se trouve un support (6). Le système comporte au moins une unité d'entraînement (7) ainsi qu'une armoire de commande (8) dotée d'une unité de régulation destinée à régler les positions relatives du support, du générateur de plasma et du système optique, l'armoire de commande étant utilisée périodiquement pour introduire le support dans la zone de traitement au plasma et au rayonnement, et pour l'en retirer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU93003593/25 | 1993-01-19 | ||
| RU93003593/25A RU93003593A (ru) | 1993-01-19 | Способ обработки поверхности твердого тела и устройство для его осуществления |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1994016854A1 true WO1994016854A1 (fr) | 1994-08-04 |
Family
ID=20136113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/RU1994/000005 Ceased WO1994016854A1 (fr) | 1993-01-19 | 1994-01-18 | Procede de traitement de la surface d'un article et installation pour ce faire |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO1994016854A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0642421A4 (fr) * | 1992-05-19 | 1996-03-13 | Maxwell Lab Inc | Procede d'utilisation de l'energie optique pulsee. |
| CN103212755A (zh) * | 2013-05-14 | 2013-07-24 | 哈尔滨工业大学 | 水电极大气等离子体加工回转零件方法 |
| CN103265183A (zh) * | 2013-05-14 | 2013-08-28 | 哈尔滨工业大学 | 采用单个水射流作为电极的大气等离子体的加工方法 |
| CN105014383A (zh) * | 2014-04-23 | 2015-11-04 | 大族激光科技产业集团股份有限公司 | 一种激光喷砂加工系统及方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198824A (ja) * | 1984-03-23 | 1985-10-08 | Nec Corp | イオンビ−ムエツチング法 |
| JPS60198825A (ja) * | 1984-03-23 | 1985-10-08 | Nippon Telegr & Teleph Corp <Ntt> | 極微細パタン形成法 |
-
1994
- 1994-01-18 WO PCT/RU1994/000005 patent/WO1994016854A1/fr not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198824A (ja) * | 1984-03-23 | 1985-10-08 | Nec Corp | イオンビ−ムエツチング法 |
| JPS60198825A (ja) * | 1984-03-23 | 1985-10-08 | Nippon Telegr & Teleph Corp <Ntt> | 極微細パタン形成法 |
Non-Patent Citations (3)
| Title |
|---|
| JU.M. AGRIKOV et al., "Dinamicheskaya Plazmennaya Obrabotka Podlozhek GIS", Elektronnaya Tekhnika, Ser. 10, Mikroelektronnye Ustroistva, Vyp. 5(71), 1988, TSNII, "Elektronika", Moscow, pages 30-32. * |
| Plazmokhimia-87, 1987, Moscow, AN SSSR, Part 2, pages 4-13, 65-37. * |
| Zarubezhnaya Elektronnaya Tekhnika, Sbornik Obzorov No. 16(301), 1986, Moscow, Ministerstvo Elektronnoi Promyshlennosti SSSR, pages 13, 15, 17, 22. * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0642421A4 (fr) * | 1992-05-19 | 1996-03-13 | Maxwell Lab Inc | Procede d'utilisation de l'energie optique pulsee. |
| CN103212755A (zh) * | 2013-05-14 | 2013-07-24 | 哈尔滨工业大学 | 水电极大气等离子体加工回转零件方法 |
| CN103265183A (zh) * | 2013-05-14 | 2013-08-28 | 哈尔滨工业大学 | 采用单个水射流作为电极的大气等离子体的加工方法 |
| CN103212755B (zh) * | 2013-05-14 | 2015-06-17 | 哈尔滨工业大学 | 水电极大气等离子体加工回转零件方法 |
| CN105014383A (zh) * | 2014-04-23 | 2015-11-04 | 大族激光科技产业集团股份有限公司 | 一种激光喷砂加工系统及方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2820534B2 (ja) | 照射による表面汚染物質の除去方法及び装置 | |
| US5531857A (en) | Removal of surface contaminants by irradiation from a high energy source | |
| KR100189794B1 (ko) | 피처리물의 산화방법 | |
| JP2555045B2 (ja) | 薄膜形成方法及びその装置 | |
| US5814156A (en) | Photoreactive surface cleaning | |
| EP0350021B1 (fr) | Enlevage de contaminants de surface par irradiation à l'aide d'une source à haute énergie | |
| CA1281819C (fr) | Source d'atomes mono-energetiques a flux eleve | |
| KR910007110B1 (ko) | 표면처리장치 | |
| US6793736B2 (en) | Method of providing high flux of point of use activated reactive species for semiconductor processing | |
| JP2705023B2 (ja) | 被処理物の酸化方法 | |
| EP0633823B1 (fr) | Enlevement de contaminants de surface par irradiation | |
| US5562841A (en) | Methods and apparatus for treating a work surface | |
| JPH1075991A (ja) | 紫外線レーザビームによって物体を清掃または汚染除去するための方法および装置 | |
| JP2005158796A (ja) | 処理装置 | |
| US5204506A (en) | Plasma pinch surface treating apparatus and method of using same | |
| WO1994016854A1 (fr) | Procede de traitement de la surface d'un article et installation pour ce faire | |
| RU2196394C1 (ru) | Способ плазменной обработки материалов, способ генерации плазмы и устройство для плазменной обработки материалов | |
| EP3789157B1 (fr) | Procédé de traitement d'une surface de solide | |
| JP3432545B2 (ja) | 高速原子線を用いる加工装置 | |
| DE10010126C2 (de) | Verfahren und Vorrichtung zum Plasmabehandeln der Oberfläche von Substraten durch Ionenbeschuß | |
| Herziger | Basic elements of laser material processing | |
| JPH0425698B2 (fr) | ||
| EP0441905B1 (fr) | Procede et appareil de traitement de matieres | |
| JPH079183A (ja) | エキシマレーザ加工装置 | |
| RU2099811C1 (ru) | Способ удаления поверхностных примесей с поверхности подложки и устройство для его осуществления |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| 122 | Ep: pct application non-entry in european phase |