WO1994018516A1 - Echangeur de chaleur a collecteur - Google Patents

Echangeur de chaleur a collecteur Download PDF

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Publication number
WO1994018516A1
WO1994018516A1 PCT/AU1994/000039 AU9400039W WO9418516A1 WO 1994018516 A1 WO1994018516 A1 WO 1994018516A1 AU 9400039 W AU9400039 W AU 9400039W WO 9418516 A1 WO9418516 A1 WO 9418516A1
Authority
WO
WIPO (PCT)
Prior art keywords
manifold
fluid
thermocouples
channel
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AU1994/000039
Other languages
English (en)
Inventor
Graeme Scott Attey
Simon John Edwards
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Poseidon Scientific Instruments Pty Ltd
Hydrocool Pty Ltd
Original Assignee
Poseidon Scientific Instruments Pty Ltd
Hydrocool Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Poseidon Scientific Instruments Pty Ltd, Hydrocool Pty Ltd filed Critical Poseidon Scientific Instruments Pty Ltd
Priority to AU59664/94A priority Critical patent/AU5966494A/en
Publication of WO1994018516A1 publication Critical patent/WO1994018516A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/24—Arrangements for promoting turbulent flow of heat-exchange media, e.g. by plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

Definitions

  • thermoelectric system comprising a thermoelectric heat pump having first and second opposed outer faces and a manifold defining a volume attached to at least one outer face of the thermoelectric heat pump.
  • the or each manifold has a fluid inlet and a fluid outlet so that fluid flows through to the or each manifold.
  • the inlet and the outlet are connected to heat exchange means and fluid pump means is provided for circulating fluid between the or each manifold and the heat exchange means.
  • a manifold defining a volume and having an open face arranged to be juxtaposed with an article, a fluid inlet and a fluid outlet so that, in use, fluid flows through the manifold, the volume defined by the manifold including means for increasing the velocity and/or the degree of turbulence of fluid flowing through the manifold.
  • a thermoelectric cell characterised by a layer of thermocouples, a respective plastics material connector support mounted on each side of the layers, the connector support having a plurality of electrical conductor blocks mounted therein in spaced manner so as to connect up electrically P and N thermocouples.
  • thermoelectric cell characterised by a layer of thermocouples and electrical conductor blocks disposed between adjacent pairs of P and N thermocouples.
  • a fan pump characterised by comprising a fan with a rotary blade assembly and a pump with a rotary impeller assembly, first magnet means mounted on the fan assembly, second magnet means mounted on the impeller assembly, the first and second magnet means being disposed adjacent one another, so that when the fan assembly is caused to rotate the impeller assembly is also induced to rotate by magnetic interaction between the first and second magnet means.
  • Figure 1 is an underneath view of a first embodiment of a manifold in accordance with the present invention
  • Figure 2 is a side view of the manifold of Figure 1
  • Figure 3 is a schematic elevation to an enlarged scale through a channel of the manifold along the line 3-3 of Figure 1 showing a fence
  • Figure 4 is a schematic elevation to an enlarged scale through a channel of the manifold of Figure 1 along the line 4-4 showing a gate
  • Figure 5 is an underneath view of a second embodiment of a manifold in accordance with the present invention
  • Figure 6 is an underneath view of a spiral element which can be inserted in a channel of a manifold of the present invention to increase turbulence
  • Figure 7 is an underneath view of an alternating spiral element which can be inserted in a channel of a manifold of the present invention to increase turbulence
  • Figure 8 is a
  • a manifold 10 comprising a volume defining housing 12.
  • the housing 12 comprises a rectangular peripheral side wall 14 and a rear wall 16. Further, the housing 12 has an open front face 18. Further, the housing 12 includes a fluid inlet tube 20 and a fluid outlet tube 22 both mounted to the side wall 14.
  • the manifold includes a plurality of parallel partitions 24 which extend generally at about right angles to the fluid inlet 20 and the fluid outlet 22 and are of substantially the same length as one another. Further, the partitions 24 extend generally in depth from an inner face of the rear wall 16 to the open face 18. In terms of length each partition 24 extends from a point aligned with the inlet 20 to a point aligned with the outlet 22.
  • the partitions 24 do not extend as far as the side wall 14 so that at the ends thereof adjacent the inlet tube 20 there is a lateral inlet channel 26 and at the ends thereof adjacent the outlet 22 there is a lateral outlet channel 28.
  • the channels 30 include turbulence enhancing features such as small protruberances fitting into the path of the fluid in the channels 30.
  • the protruberances can be in the form of gates 32 (see Figure 4) which preferably extend alternately from opposite sides of the channels 30 partially across the channels 30.
  • the protruberances can take form of fences 34 depending from the inner face of the wall 16 into the channels 30 for a part of the depth thereof.
  • This arrangement creates a turbulent fluid flow through each of the channels 30 with relatively low fluid impedance compared to a zig-zag series channel arrangement as described in International Patent Application No. PCT/AU92/00008.
  • the pump power required to pump fluid from the inlet 20 to the outlet 22 is reduced compared to the prior art.
  • the number of channels 30 would be in the range from 8 to 30.
  • An alternative embodiment of manifold in accordance with the present invention is illustrated figure 5.
  • a manifold 40 having a rectangular peripheral side wall 42 and a rear wall 44.
  • the manifold 40 also has an open face 46.
  • the manifold 40 includes a longitudinal partition 48 which effectively divides the manifold 40 into two parallel channels 50 and 52.
  • the manifold 40 includes an inlet 54 for the channel 50 and an inlet 56 for the channel 52. Further, the manifold 40 includes an outlet 58 for the channel 50 and outlet 60 for the channel 52.
  • Each channel 50 and 52 includes a plurality of partitions 62 extending in depth from an inner face of the rear wall 44 to the open face 46. As can be seen in figure 5 the partitions 62 extend alternately from the side wall 42 and the partition 48 but always stop short of the opposing wall or.
  • each channel 50 and 52 contains more than 8 partitions 62 and in fact has eleven partitions 62 in the illustrated embodiment.
  • FIG 6 there is shown an underneath view of a spiral element 63 which can be inserted in a channel 30 or 64 to increase turbulence of fluid flowing through a manifold in accordance with the present invention.
  • Figure 7 there is shown an underneath view of an alternating spiral element which can be inserted in a channel 30 or 64 to increase the turbulence of fluid flowing through a manifold in accordance with the present invention.
  • the manifolds of the present invention may be attached to thermoelectric modules and be used as a heat transfer means in the manner described in International Patent Application No. PCT/AU92/0008.
  • the manifolds of the present invention can be attached to electronic components in conjunction with a pump and a heat exchanger as described in International Patent No.
  • PCT/AU92/00008 so as to dissipate heat generated during operation of the electronic component.
  • the type of electronic component to which the present invention may be applied include radio frequency power amplifiers, transistors and transmitters, and printed circuit boards. If it were desired to cool the electronic component below ambient temperature then the manifold would be used in conjunction with a thermoelectric cell. However, if it is merely desired to cool the electronic component to a temperature not below ambient temperature then the manifold can be used without the thermoelectric cell as shown in Figure 8.
  • a manifold in accordance with the present invention such as a manifold 10 is attached at a point where heat is produced so that the manifold can remove heat from the component.
  • thermoelectric assembly 70 in accordance with the present invention comprising a layer of P thermocouples 72 and N thermocouples 74.
  • thermocouples Mounted on each side of the layer of thermocouples is a respective moulded plastic material connector support 76 having a plurality of electrical conductor blocks 78 mounted in spaced manner in an array in the plastic material (as shown in Figure 10) so as to connect up electrically the P and N thermocouples.
  • the connector blocks 78 may be made of copper or silver and extend right through the plastic material.
  • the blocks 78 are held in place by engagement with the plastic material located around their sides.
  • the blocks 78 are moulded in situ when the plastic material is moulded and the plastic material seals around the edges of the blocks 78 so as to make a fluid tight connection between the plastic material and the blocks 78.
  • the moulding technique ensures that the blocks 78 are located in the precise location required for soldering to the thermocouple 72 and 74.
  • the blocks 78 are relatively large compared with conventional connectors.
  • the connector blocks 78 project rearwardly of the plastic material support 76.
  • the rearward projection of the blocks 78 provides large surface areas in contact with fluid flowing through the manifolds for efficient heat transfer.
  • the front faces of the connector blocks 78 are flush with the face of the support 76 adjacent the layer of the thermocouples 72 and 74 for good electrical connection.
  • the plastic material is cheaper than conventional ceramics, is easier to work with and is more efficient because there is a reduction in convection losses from the hot to the cold side of the assembly.
  • the plastics material manifold can be welded correctly to the support 76 which ensures a fluid tight bond and negates the need for bolts and the like to apply pressure between the manifold and the support 76.
  • the supports 76 also include small caps which extend down and around top sections of the P and N thermocouples 72 and 74 to increase the thermal isolation of the hottest and coldest parts of the thermocouples, and thereby reduce convection losses.
  • thermoelectric module which is an improvement of that shown in Figures 8 and 9 of International Patent Application No. PCT/AU92/00008.
  • thermocouples 90 and N thermocouples 92 there is a layer of thermocouples comprising P thermocouples 90 and N thermocouples 92.
  • electrically conductive blocks 93 which may be made of copper disposed between adjacent P and N thermocouples and extending rearwardly thereof into manifolds 94 of the general type described herein and in International Patent Application NO. PCT/AU92/00008.
  • the blocks 93 extend right across the manifolds 94 as shown in Figure 11, whilst still permitting fluid flow so as to provide large heat transfer surfaces with the manifolds 94
  • the arrangement shown in Figure 11 is easier to construct and is structurally stronger than the arrangement shown in Figures 8 and 9 of International Patent Application NO.
  • FIG. 12 there is shown a fan pump 100 in which a fan 102 is used to operate a pump 104 by means of a magnetic coupling. This is particularly useful in the context of the present invention which requires both pumps and fans for circulation of fluid and for cooling.
  • the fan 102 includes a shaft 106 and a hub 108 rotatably mounted thereon. Fan blades 110 extend radially outward from the hub 108. Attached to the rear of the hub 108 is a number of magnets 112.
  • the pump 104 includes a rotatable impeller 114 mounted within a housing 116 having an inlet 118 and an outlet 120.
  • the housing 116 is closed adjacent the fan 102 so there is no physical connection between the fan 102 and the pump 104 except at mounting points around the perimeter of the fan housing 124.
  • a number of magnets 122 are mounted to the impeller 114 in opposition to the magnets 112 on the fan 102.
  • the impeller 114 is caused to rotate. This causes fluid to be moved from the inlet 118 to the outlet 120 in the pump housing 116.
  • a solar panel could be used that produces enough power to power a refrigerator directly during sunlight hours only.
  • the power output of the solar panel would be matched to the power consumption of the refrigerator.
  • the solar panel would typically only be arranged to power the refrigerator during daylight hours so that there would be no need to provide a battery and the solar panel could be smaller than one designed to power the refrigerator 24 hours a day.
  • the provision of the solar panel could be achieved economically with a significant reduction in main power consumption. Modifications and variations such as would be apparent to a skilled addressee are deemed within the scope of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

Un collecteur comprend des éléments (30) pour fluide disposés de manière à accroître la vitesse et/ou la turbulence de l'écoulement du fluide dans celui-ci, tels que des éléments spiralés ou protubérances (32, 34).
PCT/AU1994/000039 1993-02-02 1994-02-01 Echangeur de chaleur a collecteur Ceased WO1994018516A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU59664/94A AU5966494A (en) 1993-02-02 1994-02-01 Manifold heat exchanger

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
AUPL7040 1993-02-02
AUPL704093 1993-02-02
AUPL902293 1993-05-27
AUPL9022 1993-05-27
AUPM0485 1993-08-10
AUPM048593 1993-08-10
AUPM0940 1993-09-01
AUPM094093 1993-09-01

Publications (1)

Publication Number Publication Date
WO1994018516A1 true WO1994018516A1 (fr) 1994-08-18

Family

ID=27424341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AU1994/000039 Ceased WO1994018516A1 (fr) 1993-02-02 1994-02-01 Echangeur de chaleur a collecteur

Country Status (1)

Country Link
WO (1) WO1994018516A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999018399A1 (fr) 1997-10-06 1999-04-15 Matsushita Refrigeration Company Collecteur comportant un module thermoelectrique et un dispositif de refroidissement utilisant ce module
US5956965A (en) * 1996-10-16 1999-09-28 Thermovonics Co., Ltd. Watercooler
WO2002013282A1 (fr) * 2000-08-09 2002-02-14 Peltech S.R.L. Pompe a chaleur thermoelectrique
WO2002018852A1 (fr) * 2000-08-31 2002-03-07 Imi Vision Limited Commande thermoelectrique de la temperature d'un fluide
CN103822407A (zh) * 2014-03-03 2014-05-28 浙江金宸三普换热器有限公司 一种双排扁管的平行流换热器及其制造方法
WO2015130827A3 (fr) * 2013-04-23 2015-12-23 Hi-Z Technology, Inc. Générateur thermoélectrique à haute densité de puissance compact

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2308969A1 (de) * 1973-02-23 1974-09-05 Baisch Hermann Anlage zur rekuperation von waermeenergie aus heissen gasen oder fluessigkeiten
JPS521652A (en) * 1975-06-24 1977-01-07 Tsukishima Kikai Co Ltd Double faced flow mixing type heater
GB1594740A (en) * 1976-12-04 1981-08-05 Hoechst Ag Plate heat exchangers and plates therefor
JPS6219696A (ja) * 1985-07-18 1987-01-28 Toshiba Corp 多管式熱交換器
SU1740954A1 (ru) * 1989-05-05 1992-06-15 Производственное Объединение "Белгородский Завод Энергетического Машиностроения" Теплообменна труба
WO1992013243A1 (fr) * 1991-01-15 1992-08-06 Hyco Pty Ltd Ameliorations relatives a la refrigeration thermoelectrique

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2308969A1 (de) * 1973-02-23 1974-09-05 Baisch Hermann Anlage zur rekuperation von waermeenergie aus heissen gasen oder fluessigkeiten
JPS521652A (en) * 1975-06-24 1977-01-07 Tsukishima Kikai Co Ltd Double faced flow mixing type heater
GB1594740A (en) * 1976-12-04 1981-08-05 Hoechst Ag Plate heat exchangers and plates therefor
JPS6219696A (ja) * 1985-07-18 1987-01-28 Toshiba Corp 多管式熱交換器
SU1740954A1 (ru) * 1989-05-05 1992-06-15 Производственное Объединение "Белгородский Завод Энергетического Машиностроения" Теплообменна труба
WO1992013243A1 (fr) * 1991-01-15 1992-08-06 Hyco Pty Ltd Ameliorations relatives a la refrigeration thermoelectrique

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Industrial Heat Exchangers - A Basic Guide", G. WALKER, published 1982, (HEMISPHERE PUBLISHING CORPORATION, NEW YORK), see in particular pages 15 to 17, 31 and 67. *
DERWENT ABSTRACT, Accession No. 93-180975/22, Class Q78; & SU,A,1 740 954 (BELGOROD POWER EQUIP WKS), 15 June 1992. *
PATENT ABSTRACTS OF JAPAN, M-601, page 95; & JP,A,62 019 696 (TOSHIBA CORP), 28 January 1987. *
PATENT ABSTRACTS OF JAPAN, M-77, page 85; & JP,A,52 001 652 (TSUKISHIMA KIKAI KK), 07-01-1977. *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5956965A (en) * 1996-10-16 1999-09-28 Thermovonics Co., Ltd. Watercooler
WO1999018399A1 (fr) 1997-10-06 1999-04-15 Matsushita Refrigeration Company Collecteur comportant un module thermoelectrique et un dispositif de refroidissement utilisant ce module
EP0945692A4 (fr) * 1997-10-06 2004-12-15 Matsushita Refrigeration Collecteur comportant un module thermoelectrique et un dispositif de refroidissement utilisant ce module
WO2002013282A1 (fr) * 2000-08-09 2002-02-14 Peltech S.R.L. Pompe a chaleur thermoelectrique
WO2002018852A1 (fr) * 2000-08-31 2002-03-07 Imi Vision Limited Commande thermoelectrique de la temperature d'un fluide
GB2384624A (en) * 2000-08-31 2003-07-30 Imi Vision Ltd Thermoelectric control of fluid temperature
WO2015130827A3 (fr) * 2013-04-23 2015-12-23 Hi-Z Technology, Inc. Générateur thermoélectrique à haute densité de puissance compact
CN103822407A (zh) * 2014-03-03 2014-05-28 浙江金宸三普换热器有限公司 一种双排扁管的平行流换热器及其制造方法
CN103822407B (zh) * 2014-03-03 2017-05-31 浙江金宸三普换热器有限公司 一种双排扁管的平行流换热器及其制造方法

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