WO1995018464A1 - Protective coating combination for lead frames - Google Patents

Protective coating combination for lead frames Download PDF

Info

Publication number
WO1995018464A1
WO1995018464A1 PCT/US1994/008603 US9408603W WO9518464A1 WO 1995018464 A1 WO1995018464 A1 WO 1995018464A1 US 9408603 W US9408603 W US 9408603W WO 9518464 A1 WO9518464 A1 WO 9518464A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
protective coating
coated
lead frames
coating combination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1994/008603
Other languages
French (fr)
Inventor
Ranjan J. Mathew
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Priority to EP94922764A priority Critical patent/EP0737360A1/en
Priority to KR1019960703410A priority patent/KR100318818B1/en
Publication of WO1995018464A1 publication Critical patent/WO1995018464A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

A lead frame for a semiconductor device includes a base layer (10) which is coated by a protective coating. The protective coating includes a layer of nickel (12), over which is coated a layer of copper (14). The layer of copper (14) is coated by a layer of silver (16) over which is coated a layer of palladium (18). Protective coatings constructed in this way are bondable, solderable, oxidation resistant, corrosion resistant, free of lead (Pb), resistant to high temperatures, cost effective, and cosmetically acceptable.
PCT/US1994/008603 1993-12-27 1994-08-01 Protective coating combination for lead frames Ceased WO1995018464A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP94922764A EP0737360A1 (en) 1993-12-27 1994-08-01 Protective coating combination for lead frames
KR1019960703410A KR100318818B1 (en) 1993-12-27 1994-08-01 Protective film bonding to leadframe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/174,890 US5436082A (en) 1993-12-27 1993-12-27 Protective coating combination for lead frames
US08/174,890 1993-12-27

Publications (1)

Publication Number Publication Date
WO1995018464A1 true WO1995018464A1 (en) 1995-07-06

Family

ID=22637958

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1994/008603 Ceased WO1995018464A1 (en) 1993-12-27 1994-08-01 Protective coating combination for lead frames

Country Status (4)

Country Link
US (1) US5436082A (en)
EP (1) EP0737360A1 (en)
KR (1) KR100318818B1 (en)
WO (1) WO1995018464A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996034412A1 (en) * 1995-04-27 1996-10-31 National Semiconductor Corporation Protective coating combination for lead frames
GB2305188A (en) * 1995-09-16 1997-04-02 Sung Soo Moon Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
SG81217A1 (en) * 1997-06-19 2001-06-19 Sitron Prec Co Ltd Leadframe for integrated circuit package and method of manufacturing the same
US10122049B2 (en) 2014-02-06 2018-11-06 Gelion Technologies Pty Ltd Gelated ionic liquid film-coated surfaces and uses thereof
US11011476B2 (en) 2018-03-12 2021-05-18 Stmicroelectronics International N.V. Lead frame surface finishing
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714962A (en) * 1993-04-28 1995-01-17 Mitsubishi Shindoh Co Ltd Lead frame material and lead frame
US5454929A (en) * 1994-06-16 1995-10-03 National Semiconductor Corporation Process for preparing solderable integrated circuit lead frames by plating with tin and palladium
JP3259894B2 (en) * 1996-04-30 2002-02-25 ソニー株式会社 Lead frame, method for manufacturing the same, and semiconductor device using the same
US5916696A (en) * 1996-06-06 1999-06-29 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
US5792565A (en) * 1996-10-18 1998-08-11 Avon Products, Inc. Multiple layered article having a bright copper layer
KR100231828B1 (en) * 1997-02-20 1999-12-01 유무성 Multi-layer plated lead frame
US6521358B1 (en) * 1997-03-04 2003-02-18 Matsushita Electric Industrial Co., Ltd. Lead frame for semiconductor device and method of producing same
TW448204B (en) * 1997-04-09 2001-08-01 Jeng Wu Shuen A method for catalytic depolymerization of polyethylene terephthalate
KR100234164B1 (en) * 1997-04-10 1999-12-15 유무성 Lead frame
US6180999B1 (en) * 1997-08-29 2001-01-30 Texas Instruments Incorporated Lead-free and cyanide-free plating finish for semiconductor lead frames
DE59900741D1 (en) * 1998-06-10 2002-02-28 Heraeus Gmbh W C METHOD FOR PRODUCING A LEAD-FREE SUBSTRATE
US6232651B1 (en) 1999-05-21 2001-05-15 Samsung Aerospace Industries, Ltd. Lead frame for semiconductor device
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
US7122884B2 (en) * 2002-04-16 2006-10-17 Fairchild Semiconductor Corporation Robust leaded molded packages and methods for forming the same
JP4820616B2 (en) * 2005-10-20 2011-11-24 パナソニック株式会社 Lead frame
US7462926B2 (en) * 2005-12-01 2008-12-09 Asm Assembly Automation Ltd. Leadframe comprising tin plating or an intermetallic layer formed therefrom
US20070216026A1 (en) * 2006-03-20 2007-09-20 Adams Zhu Aluminum bump bonding for fine aluminum wire
CN101425468B (en) * 2007-10-29 2012-07-04 飞思卡尔半导体（中国）有限公司 Coated lead wire frame
KR100972982B1 (en) 2008-10-08 2010-08-03 삼성엘이디 주식회사 Leadframe for LED Package
KR20160003078A (en) 2013-05-03 2016-01-08 허니웰 인터내셔날 인코포레이티드 Lead frame construct for lead-free solder connections
US9129951B2 (en) 2013-10-17 2015-09-08 Freescale Semiconductor, Inc. Coated lead frame bond finger

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
US4529667A (en) * 1983-04-06 1985-07-16 The Furukawa Electric Company, Ltd. Silver-coated electric composite materials
EP0250146A1 (en) * 1986-06-16 1987-12-23 Texas Instruments Incorporated Palladium plated lead frame for integrated circuit
EP0335608A2 (en) * 1988-03-28 1989-10-04 Texas Instruments Incorporated Lead frame with reduced corrosion
JPH04312937A (en) * 1991-03-26 1992-11-04 Mitsubishi Electric Corp Method of manufacturing semiconductor device
JPH0590465A (en) * 1991-09-27 1993-04-09 Mitsui High Tec Inc Semiconductor device
EP0538019A2 (en) * 1991-10-17 1993-04-21 Shinko Electric Industries Co. Ltd. Lead frame for a semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030587B1 (en) * 1969-07-02 1975-10-02
JPS607161A (en) * 1984-03-12 1985-01-14 Masami Kobayashi Method for imparting soldering property and bonding property to lead frame of nickel iron alloy for ic
JPS60228695A (en) * 1984-04-26 1985-11-13 Furukawa Electric Co Ltd:The Manufacture of heat-resistant ag-plated cu-base substrate
JPS6418246A (en) * 1987-07-14 1989-01-23 Shinko Electric Ind Co Lead frame for semiconductor device
JPH01257356A (en) * 1988-04-07 1989-10-13 Kobe Steel Ltd Lead frame for semiconductor
EP0384586A3 (en) * 1989-02-22 1991-03-06 Texas Instruments Incorporated High reliability plastic package for integrated circuits

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
US4529667A (en) * 1983-04-06 1985-07-16 The Furukawa Electric Company, Ltd. Silver-coated electric composite materials
EP0250146A1 (en) * 1986-06-16 1987-12-23 Texas Instruments Incorporated Palladium plated lead frame for integrated circuit
EP0335608A2 (en) * 1988-03-28 1989-10-04 Texas Instruments Incorporated Lead frame with reduced corrosion
JPH04312937A (en) * 1991-03-26 1992-11-04 Mitsubishi Electric Corp Method of manufacturing semiconductor device
JPH0590465A (en) * 1991-09-27 1993-04-09 Mitsui High Tec Inc Semiconductor device
EP0538019A2 (en) * 1991-10-17 1993-04-21 Shinko Electric Industries Co. Ltd. Lead frame for a semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 145 (E - 1337) 24 March 1993 (1993-03-24) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 431 (E - 1411) 10 August 1993 (1993-08-10) *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996034412A1 (en) * 1995-04-27 1996-10-31 National Semiconductor Corporation Protective coating combination for lead frames
GB2305188A (en) * 1995-09-16 1997-04-02 Sung Soo Moon Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
GB2305188B (en) * 1995-09-16 1997-11-12 Sung Soo Moon Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
SG81217A1 (en) * 1997-06-19 2001-06-19 Sitron Prec Co Ltd Leadframe for integrated circuit package and method of manufacturing the same
US10122049B2 (en) 2014-02-06 2018-11-06 Gelion Technologies Pty Ltd Gelated ionic liquid film-coated surfaces and uses thereof
US11011476B2 (en) 2018-03-12 2021-05-18 Stmicroelectronics International N.V. Lead frame surface finishing
US11756899B2 (en) 2018-03-12 2023-09-12 Stmicroelectronics S.R.L. Lead frame surface finishing
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same
US12362195B2 (en) 2018-12-31 2025-07-15 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Also Published As

Publication number Publication date
US5436082A (en) 1995-07-25
EP0737360A1 (en) 1996-10-16
KR970700379A (en) 1997-01-08
KR100318818B1 (en) 2002-05-13

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