WO1997024231A1 - Complex sheet and method of manufacturing the same - Google Patents
Complex sheet and method of manufacturing the same Download PDFInfo
- Publication number
- WO1997024231A1 WO1997024231A1 PCT/JP1996/003847 JP9603847W WO9724231A1 WO 1997024231 A1 WO1997024231 A1 WO 1997024231A1 JP 9603847 W JP9603847 W JP 9603847W WO 9724231 A1 WO9724231 A1 WO 9724231A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composite sheet
- inorganic filler
- aramide
- resin
- paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
Definitions
- the present invention relates to a composite sheet having excellent thermal conductivity, heat resistance, electrical properties, chemical resistance, mechanical properties, and the like, and a method for producing the same. More specifically, the present invention relates to a composite sheet useful as an electric insulating material in the fields of rotating machines and transformers. Further, the present invention relates to an electric device provided with such a composite sheet.
- BACKGROUND ART Conventionally, in the field of electrical insulation requiring heat resistance, a molded article made of a heat-resistant polymer has been used.
- molded articles using aromatic polyamides hereinafter referred to as “alamides”) are excellent industrial materials having heat resistance, chemical resistance, and flame retardancy derived from the molecular structure of the alamide.
- thin paper trade name: NO-MEX (registered trademark)
- NO-MEX registered trademark
- an organopolysiloxane (silicone resin) composition is mainly used as a heat-dissipating sheet for heat-generating electronic components such as power transistors and thyristors.
- Articles and molded products have been devised. These materials improve the thermal conductivity that cannot be achieved with silicone resin alone by adding fillers.
- Japanese Patent Application Laid-Open No. 52-146654 discloses an organopolysiloxane composition comprising an organopolysiloxane, an organohydridoenepolysiloxane and a silica-based filler, zinc carbonate powder, and a platinum catalyst. Has been described.
- JP-A-56-23949 discloses that a filler, an organic peroxide catalyst, and silicone oil are mixed with polydiorganosiloxane and then vulcanized to form a heat conductive material. An excellent rubber-like molded product for heat dissipation is described.
- silicone resin compositions and molded articles having electrical insulation and heat conductivity are known.
- these silicone resin compositions and molded articles (1) to (3) not only do not overcome the tearability characteristic of silicone resins, but also contain a large amount of filler, so that their mechanical strength is rather high. There is a disadvantage that impairs.
- JP-A-58-214446 discloses that a mixture of an addition-polymerizable liquid silicone rubber and a filler that enhances thermal conductivity is mixed into a reinforcing woven or nonwoven fabric. It is characterized by coating, sheet molding, and then cross-linking. A method for manufacturing a thermally conductive insulating sheet is described.
- the woven or nonwoven fabric may be made of any of inorganic fibers such as glass fiber, quartz fiber, alumina fiber, boron nitride fiber and the like, or organic fibers such as polyester and fluorine resin. I have.
- Japanese Patent Application Laid-Open No. 58-19034 describes that a fluid silicone rubber composition containing alumina powder is coated on a mesh-like insulator and then cured. It describes a method for producing a conductive heat radiating rubber sheet.
- the reticulated insulator is a woven fabric, a knitted fabric, a nonwoven fabric, or a laminate of these materials.
- Examples include glass fibers having a heat resistance corresponding to the heat resistance of the silicone resin, asbestos, silicon carbide fibers, etc. Have been.
- a silicone resin with good flowability and low viscosity is used to promote integration with the reinforcing material.
- a method of improving tear strength by reinforcing with a woven or nonwoven fabric made of fiber is known.
- the tape When used for insulating tape on conductors of rotating machines and transformers, the tape must have a certain amount of elongation to be well-wound with conductors and to achieve a wrinkle-free winding state.
- voids that is, closed cells
- thermally conductive silicone resin sheet reinforced with a woven or nonwoven fabric which is created by a conventionally proposed manufacturing method.
- the inorganic fibers and the organic fibers having high heat resistance are desirable.
- the coefficient of linear expansion is small (eg, E glass fiber 5 XI 0 -6 degrees)
- the dielectric constant is large, (eg, Lath dielectric constant 6.7-(1 MHz))
- silicone resin sheet reinforced with woven or nonwoven fabric of inorganic fiber has flexibility. Small is the problem.
- inorganic fibers are generally disadvantageous in weight reduction because they have a higher specific gravity than organic compounds.
- organic fibers those having heat resistance equal to or higher than that of silicone resin are limited to, for example, polyamide fibers, polyetheretherketone fibers, and polytetrafluoroethylene fibers.
- a woven fabric made of organic fibers is used as a reinforcing material, (d) the anisotropy in the vertical and horizontal directions is large and (e) the structure is constrained.
- F It is not easy to slit into a tape, (g) Generally, woven fabrics are expensive, etc. Can be pointed out as a point.
- an object of the present invention is to provide a composite sheet having both electrical insulation and thermal conductivity, and having excellent heat resistance and flexibility, and a method for producing the same. Make it an issue.
- Another object of the present invention is to provide an electric device having improved heat radiation characteristics by providing such a composite sheet.
- the present inventors have conducted intensive studies in order to solve the above-mentioned problems, and as a result, using a resin having rubber elasticity as a matrix, a molded article made of a fibrous organic compound and an inorganic filler have been used. By reinforcing this and making the internal porosity 10% or less and the specific gravity 1 or more and 2 or less, it was found that the composite sheet had good performance and could solve the above-mentioned problems.
- the present invention has been reached.
- the composite sheet provided according to the first embodiment of the present application is reinforced by a molded body made of a fibrous organic compound, an inorganic filler, and the molded body and the inorganic filler.
- a matrix resin composed of a resin having rubber elasticity, having an internal porosity of 10% or less, a specific gravity of 1 or more and 2 or less, and a heat conductivity of 0 in the thickness direction. It is characterized by being at least 4 W / mK.
- the molded article made of the fibrous organic compound may be an aramid paper made of aramid fiber and aramid fiber,
- the filler may have a thermal conductivity at 20 degrees Celsius of 1 W ZmK or more.
- a said Arami de paper having a basis weight force at 1 0 GZm 2 or more 2 00 GZm 2 below, the pre-Symbol Arami de paper of at least 5 weight 0/0 May be included.
- the aramide constituting the aramide paper is polymetaphenylene isophthalamide.
- Inorganic fillers preferably have a thermal conductivity of at least 5 W / mK at 20 degrees Celsius o
- the inorganic filler is at least selected from aluminum oxide, boron nitride, silicon nitride, magnesium oxide, and beryllium oxide. Preferably, it is one type of inorganic filler.
- the matrix resin is preferably a silicone rubber.
- the method for producing a composite sheet according to the second aspect of the present invention is a method for producing a composite sheet according to any one of the above 1) to 7), wherein A material is made to coexist with one of a molded body made of aramide fibrid and aramide fiber or a matrix resin having rubber elasticity, and the molded body and the matrix resin are brought into contact to form a composite. .
- a method for producing a composite sheet according to the third aspect of the present invention is a method for producing a composite sheet for producing a composite sheet according to any one of the above 1) to 7), wherein The composite is formed by impregnating or applying a rubber elastic resin containing an inorganic filler to a molded body made of a lamido fiber and an aramide fiber.
- the molded article made of a fibrous organic compound is preferably an aramid paper and an aramid paper made of aramid fibers.
- the aramid means a linear polymer compound in which 60% or more of amide bonds are directly bonded to an aromatic ring.
- aramides include polymethaphenylene sophthalamide, copolymers thereof, polyparaphenylene terephthalamide and copolymers thereof, and poly (paraphenylene) -copoly (3,4-diphenylene) terephthalamide.
- poly (metaphenyleneisophthalamide) is preferably used because it has good moldability and heat-fusibility.
- Poly (metaphenylene isophthalamide) can be industrially produced by a conventionally known interfacial polymerization method or solution polymerization method using isophthalic acid chloride and metaphenylenediamine.
- the aramide fiber is a film-shaped aramide particle having a papermaking property, and is also referred to as an aramide pulp (Japanese Patent Publication No. 35-11851, Japanese Patent Publication No. 37-757). No. 2, etc.).
- the aramid fire plied can be used as a raw material for papermaking by subjecting it to mashing and beating treatment in the same manner as ordinary wood pulp. In this case, it is preferable to adjust the freeness (freeness) of the aramid fiber to maintain good properties of the aramid paper.
- the standard freeness of Canada is 50 m1 or more and less than 500 ml. Is selected from the range.
- Alamid fiber is a fiber made from alamide.
- Examples of such fibers include Teikoku's “Konex (registered trademark)” and “Technola (registered trademark) I”, Unitika's “Apière (registered trademark)”, and DuPont's Examples include “Nomex (registered trademark)”, “Kepler (registered trademark)”, and “Twaron (registered trademark)” of Axo Corporation, but are not limited thereto.
- the preferred fineness of the fiber is selected from the range of 0.5 denier to less than 20 denier, and the length is selected from the range of 1 mm to less than 50 mm. If the length is less than lmm, the mechanical properties of the composite will be reduced.
- those having a thickness of 50 mm or more are not preferable because they tend to cause “entanglement” and “bundling” in the production of nonwoven fabrics by the wet method, and are liable to cause defects.
- fibers having a fineness of less than 0.5 denier are not preferred since they tend to cause agglomeration in production by a wet method.
- fibers having a denier of 20 denier or more have too large a fiber diameter (for example, a perfect circular shape having a diameter of 45 micron or more), so that the aspect ratio decreases and the mechanical reinforcing effect decreases.
- inconveniences such as poor nonwoven fabric uniformity occur.
- the aramide paper refers to a sheet-like molded article produced by a dry method or a wet method from the above-mentioned aramide fiber and Z or aramide fiber.
- An arbitrary value in the range of 5/95 to 100/0 (% by weight) is selected as the composition ratio of the aramide fiber of the aramide paper.
- heat-resistant fibers include organic fibers such as polyvinylene sulfide fiber, polyetheretherketone fiber, polyester fiber, arylate fiber, liquid crystal polyester fiber, polyethylene naphthalate fiber, and glass fiber. , Rock wool, asbestos, boron fibers, and inorganic fibers such as alumina fibers. Do not mean.
- the basis weight (mass per 1 m 2 ; unit g_m 2 ) of the aramid paper is preferably in the range of 10 to 200 gZm 2 .
- Paper with a basis weight of less than 10 gZm 2 generally lacks uniformity in thickness and basis weight, and it is difficult to obtain a composite sheet with stable performance.
- paper having a basis weight exceeding 200 g / m 2 has a problem that it is difficult to obtain a desired mature conductivity after compounding with a resin described later.
- the reason why the aramide paper is preferably used as the base material is as follows: (1) excellent properties such as heat resistance and flame retardancy; and (2) disadvantages of the conventional glass cloth-silicone rubber composite. It is effective in improving the lack of flexibility, (3) it does not impair the dielectric breakdown characteristics of the composite sheet because it contains an aramid fibrid with high covering properties, and (4) it has a liquid retention property. Because of its large size, existing technologies such as resin impregnation and coating can be applied, which is advantageous for the production of composite sheets. (5) The specific gravity of alamide is as small as about 1.4, which is a lightweight composite sheet. (6) It can be expected that the aramid material has the same coefficient of thermal expansion as silicone resin, so it is expected that there is little risk of defect generation due to heat shock.
- the inorganic filler is a particulate, fibrous, plate-like or amorphous particle of an inorganic compound.
- the thermal conductivity of the inorganic filler is preferably 1 W / m K (temperature: 20 degrees Celsius) or more.
- examples of such inorganic fillers include calcium silicate, heavy calcium silicate, magnesium silicate, aluminum oxide, silicon carbide, silicon nitride, calcium titanate, magnesium oxide, boron nitride.
- Titanium oxide, silicon oxide, aluminum nitride, Inorganic compounds such as aluminum borate, boron oxide, beryllium oxide, calcium carbonate, glass, mica, and talc can be exemplified, but, of course, are not limited thereto.
- inorganic compounds such as aluminum oxide, boron nitride, silicon nitride, magnesium oxide, and beryllium oxide having relatively high thermal conductivity are preferably selected. It is more preferable that the thermal conductivity is 5 WZ m K or more. When these inorganic compounds are crystalline substances, the thermal conductivity generally shows anisotropic properties.
- the thermal conductivity of the bulk of the powder-sintered molded product is defined as the thermal conductivity of the inorganic compound.
- a molded product obtained by sintering powder has a dielectric breakdown voltage of 10 kV mm or more and a volume resistivity of 10 13 ohm cm or more. You can give things. Therefore, from the gist of the present invention, even a metal having a high thermal conductivity cannot be used as a heat conductor.
- the size of the inorganic filler used varies and it is difficult to define this uniquely.However, when the shape is granular, the diameter is in the range of about 0.1 micron to lmm, In this case, a length of 10 micron or more and 10 mm or less is usually used.
- the matrix resin having rubber elasticity is a resin having at least one crosslink point per one polymer chain constituting the resin.
- the cross-linking point is a position where a polymer chain is chemically or physically connected to another polymer chain.
- the chemical bond is used, and in the latter case, the crystal region or agglomerated portion is used as the crosslinking point.
- the polymer chain between the crosslinking points it is essential that the polymer chain between the crosslinking points be in a temperature environment equal to or higher than the glass transition point of the polymer chain. Therefore, in general, a resin exhibiting rubber elasticity at room temperature has a glass transition point of a polymer chain between crosslinks which is lower than room temperature.
- rubber elasticity means that after large deformation, deformation is almost Rheologically, it means that the viscoelastic behavior located in the middle temperature range between the glassy state and the flowing state develops at room temperature or lower.
- resins having such rubber elasticity include styrene-butadiene rubber, high styrene rubber, butadiene rubber, isoprene rubber, nitrile butadiene rubber, chloroprene rubber, butyl rubber, silicone rubber, room temperature vulcanized silicone rubber, and hydrogenated nitrogen rubber.
- Rubber polyether-based special rubber, fluorine rubber, tetrafluoroethylene propylene rubber, acrylic rubber, chlorosulfonated polyethylene rubber, epichlorohydrin rubber, propylene oxide rubber, ethylene acryl rubber, norbornene rubber, styrene-based thermoplastic elastomer Tomer, olefin-based thermoplastic elastomer, urethane-based thermoplastic elastomer, polyester-based thermoplastic elastomer, polyamide-based thermoplastic elastomer, polybutadiene-based thermoplastic Las Tomah one, vinyl chloride type thermoplastic gills scan Tomah, polymer compounds such as fluorine-based thermoplastic Elastica Tomah one is Ru can be exemplified.
- silicone rubbers and fluoro rubbers are preferred in terms of excellent heat resistance, chemical resistance and flame retardancy, and silicone rubber is particularly preferred.
- silicone rubber those obtained by crosslinking polydimethylsiloxanes with a crosslinking agent such as a peroxide, and those obtained by crosslinking addition polymerization type liquid silicone with a platinum catalyst can be used.
- the internal porosity of the composite sheet is preferably 10% or less.
- the internal void Is defined as closed cells (voids) that result from insufficient penetration of the matrix resin.
- the presence of internal voids is not preferred because of the possibility of corona generation under high voltage applied conditions and the hindrance of heat conduction.
- the specific gravity of the composite sheet of the present invention is preferably 1 or more and 2 or less. Those with a specific gravity less than 1 suggest that there are many voids inside. On the other hand, a sheet with a specific gravity of more than 2 causes problems such as impairing lightness and increasing the dielectric constant.
- the composite sheet of the present invention is composed of the above-mentioned aramid paper, an inorganic filler and a matrix resin having rubber elasticity.
- the method of mixing the inorganic filler and the matrix resin is not particularly limited, but can be roughly classified into the following two types depending on the properties of the resin used. That is, if the resin is a liquid and low-viscosity resin, it is convenient to add an inorganic filler and then stir and mix the mixture in a vessel equipped with stirring blades. On the other hand, for highly viscous or solid materials, the plasticity is improved by heating or diluting the solvent, and an inorganic filler is added to the mixture and mixed with a kneading extruder or a dairy machine. Can be recommended. Needless to say, the mixing method is not limited to these.
- the amount of the inorganic filler added to the resin is in the range of 5 to 200 parts by weight, more preferably 10 to 150 parts by weight, based on 100 parts by weight of the resin.
- the upper limit of this range is determined by the viscosity and fluidity of the filler mixture, while the lower limit is limited by the heat transfer properties of the composite sheet.
- the amount of rubber-elastic resin that is combined with the aramide paper depends on the porosity of the aramide paper and the degree of penetration of the resin into the paper, but in the case of complete penetration, 0.25 with respect to the weight of the paper. More than double is required. Further, when the permeation is incomplete, it is desirable to fall within the range of the internal porosity and the specific gravity described above.
- Methods for impregnating the resin with the resin include heating the resin or diluting the resin with improved plasticity by solvent dilution onto the paper, and dicing the resin into a resin solution or plasticized resin. And any other method can be adopted. In any case, pressure may be applied by a roll or a press for the purpose of promoting impregnation. If the resin is thermosetting, the resin-impregnated aramid paper can be heated and Z or hot-pressed under appropriate conditions. To coat the resin on the aramide paper, a machine with a known coating method can be applied.
- Such coating machines include Air Doctor Coater, Blade Coater, Rod Coater, Knife Coater, Squeeze Coater, Reno Kushiro Koru Coater, Transfa Coater Such as, but not limited to, a ru coater, a gravure coater, a kissing mouth, a caster, a spray coater, and a curtain coater.
- the aramide paper When compounding the aramide paper and the resin, the aramide paper can be subjected to a surface treatment in order to further strengthen the bond between the paper and the resin.
- This treatment is not limited to a force that can be exemplified by plasma treatment, corona discharge treatment, primer treatment and the like.
- the thickness of the sheet is adjusted to be in the range of 0.01 mm or more and less than 10 mm.
- the lower limit of the thickness is due to the limitation of the basis weight of the aramid paper.
- the thickness of the composite sheet is set to 10 mm or more, the contribution of the paper is relatively greatly reduced, and mechanical properties are impaired.
- a laminate obtained by laminating and laminating different aramide papers can be compounded by impregnating with a resin.
- a multi-layer composite sheet obtained by laminating a paper containing pararamid fibers and another aramide paper for the purpose of improving the rigidity of the sheet is also included in the scope of the present invention.
- multiple resins can be blended and used to improve the elastic and mechanical properties of the resin.
- a plurality of types of resins may be sequentially impregnated.
- the thermal conductivity in the thickness direction of the composite sheet is preferably 0.4 WZmK (temperature: 20 degrees Celsius) or more.
- the thermal conductivity of the aramid paper used as the base material is at most about 0.2 WZmK, and it is preferable that the thermal conductivity be higher than this. More preferably, those having 0.5 WZ m K or more are particularly preferable.
- the measurement was performed according to JIS C2111.
- air permeability The time required for 100 cc of air to pass through the sheet (air permeability) was measured using a Gurley air permeability meter. For a series of sheets, the shorter the time, the more porous the sheet.
- the prepared aramide fibrids and fibers were dispersed in water to form a slurry. After mixing this slurry so that the ratio of the aramide fiber and the aramide fiber is 20/80, the slurry is sent to a Fodlinier type 1 paper machine, dewatered, squeezed, and dried. And wound it up to get alarm paper. Table 1 shows the main characteristics of this paper.
- Addition-polymerized liquid silicone resin is added to the aramide paper manufactured in the above reference example.
- a sheet was prepared in the same manner as in Example (1) except that the impregnation with 50 parts of toluene diluted resin was omitted.
- the sheet obtained was supple and highly flexible.
- Table 2 summarizes the properties of the composite sheet prepared in Examples 1-2. Table 2
- Example 1 Aramid paper basis weight g / m 2 75 7 5
- a heat-resistant alumide composite sheet can be provided.
- Such composite sheets can be widely used as insulating materials for electrical equipment such as rotating machines and transformers. In particular, it can be used favorably as an electrical insulation material for small, highly integrated devices that require rapid heat dissipation.
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP96943326A EP0882574A4 (en) | 1995-12-28 | 1996-12-27 | COMPOSITE MATERIAL AND METHOD FOR THE PRODUCTION THEREOF |
| US09/091,901 US6143819A (en) | 1995-12-28 | 1996-12-27 | Composite sheet and method of manufacturing the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7343961A JP2732822B2 (ja) | 1995-12-28 | 1995-12-28 | 複合体シートおよびその製造方法 |
| JP7/343961 | 1995-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1997024231A1 true WO1997024231A1 (en) | 1997-07-10 |
Family
ID=18365582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1996/003847 Ceased WO1997024231A1 (en) | 1995-12-28 | 1996-12-27 | Complex sheet and method of manufacturing the same |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6143819A (ja) |
| EP (1) | EP0882574A4 (ja) |
| JP (1) | JP2732822B2 (ja) |
| CN (1) | CN1209093A (ja) |
| WO (1) | WO1997024231A1 (ja) |
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| CN104260508B (zh) * | 2014-09-10 | 2016-11-23 | 华南理工大学 | 一种具有自洁功能的复合材料及其制备方法和用途 |
| JP6585469B2 (ja) * | 2015-11-02 | 2019-10-02 | 株式会社巴川製紙所 | 熱伝導シート |
| WO2018032269A1 (en) * | 2016-08-15 | 2018-02-22 | Abb Schweiz Ag | Electrically insulating composite material and electrical product |
| DE102016115183A1 (de) * | 2016-08-16 | 2018-02-22 | Heraeus Sensor Technology Gmbh | Poröses Material, Pulver zur Herstellung eines porösen Materials, Verfahren zur Herstellung eines porösen Materials und Bauteil |
| CN106225515A (zh) * | 2016-09-13 | 2016-12-14 | 成都创慧科达科技有限公司 | 一种串联式烟气热量回收系统 |
| JP7058704B1 (ja) * | 2020-11-25 | 2022-04-22 | 三菱電機株式会社 | 絶縁シート及びその製造方法、並びに回転電機 |
| EP4167255A1 (en) | 2021-10-14 | 2023-04-19 | Premo, S.A. | Thermal conductive bobbin for a magnetic power unit |
| EP4325526A1 (en) * | 2022-08-19 | 2024-02-21 | Ahlstrom Oyj | Electrical insulation paper |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390000A (en) * | 1977-01-18 | 1978-08-08 | Unitika Ltd | Electric insulating film |
| JPS58218711A (ja) * | 1982-06-14 | 1983-12-20 | 日立電線株式会社 | 熱伝導性電気絶縁シ−ト |
| JPS6244914A (ja) * | 1985-08-23 | 1987-02-26 | 山陽国策パルプ株式会社 | 耐熱性電気絶縁シ−ト |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5553802A (en) * | 1978-10-17 | 1980-04-19 | Japan Mica Ind | Resin impregnated lumped mica basic material sheet and method of manufacturing same |
| JPH0412415A (ja) * | 1990-05-01 | 1992-01-17 | Metsuku Lab:Kk | 送電線路用がいし |
| WO1993024314A1 (en) * | 1992-06-01 | 1993-12-09 | Motorola, Inc. | Thermally conductive printed circuit board |
| US5681612A (en) * | 1993-06-17 | 1997-10-28 | Minnesota Mining And Manufacturing Company | Coated abrasives and methods of preparation |
| RU2043446C1 (ru) * | 1993-08-19 | 1995-09-10 | Научно-производственное акционерное общество закрытого типа "Синтекс" | Электроизоляционная бумага и электроизоляционный материал на ее основе |
| JP3029556B2 (ja) * | 1995-06-22 | 2000-04-04 | 信越化学工業株式会社 | 熱伝導性複合シリコーンゴムシート |
-
1995
- 1995-12-28 JP JP7343961A patent/JP2732822B2/ja not_active Expired - Fee Related
-
1996
- 1996-12-27 EP EP96943326A patent/EP0882574A4/en not_active Withdrawn
- 1996-12-27 US US09/091,901 patent/US6143819A/en not_active Expired - Fee Related
- 1996-12-27 WO PCT/JP1996/003847 patent/WO1997024231A1/ja not_active Ceased
- 1996-12-27 CN CN96180059A patent/CN1209093A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390000A (en) * | 1977-01-18 | 1978-08-08 | Unitika Ltd | Electric insulating film |
| JPS58218711A (ja) * | 1982-06-14 | 1983-12-20 | 日立電線株式会社 | 熱伝導性電気絶縁シ−ト |
| JPS6244914A (ja) * | 1985-08-23 | 1987-02-26 | 山陽国策パルプ株式会社 | 耐熱性電気絶縁シ−ト |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP0882574A4 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6737299B1 (en) * | 1999-06-08 | 2004-05-18 | Micron Technology, Inc. | Thermally conductive adhesive tape for semiconductor devices and method for using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US6143819A (en) | 2000-11-07 |
| CN1209093A (zh) | 1999-02-24 |
| JPH09183187A (ja) | 1997-07-15 |
| EP0882574A1 (en) | 1998-12-09 |
| JP2732822B2 (ja) | 1998-03-30 |
| EP0882574A4 (en) | 2000-01-19 |
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