WO1999045403A1 - Appareil de test de ci - Google Patents

Appareil de test de ci Download PDF

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Publication number
WO1999045403A1
WO1999045403A1 PCT/JP1999/000968 JP9900968W WO9945403A1 WO 1999045403 A1 WO1999045403 A1 WO 1999045403A1 JP 9900968 W JP9900968 W JP 9900968W WO 9945403 A1 WO9945403 A1 WO 9945403A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
low
bath
test
temperature bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1999/000968
Other languages
English (en)
Japanese (ja)
Inventor
Tsuyoshi Yamashita
Akihiko Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to DE19980524T priority Critical patent/DE19980524T1/de
Publication of WO1999045403A1 publication Critical patent/WO1999045403A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Definitions

  • the present invention relates to an IC test apparatus for performing a test by applying a low-temperature thermal stress to an IC under test, and in particular, proposes a structure for preventing frost or ice from being generated on the outer wall of a low-temperature constant temperature bath due to dew condensation. is there.
  • Fig. 1 shows an example of an IC test device equipped with a low-temperature constant temperature bath.
  • 20L indicates a low-temperature constant temperature bath.
  • the IC transfer device 21 is built in the low temperature oven 20L.
  • the IC transport device 21 has the lid 22 of the low-temperature constant temperature bath 20L opened, and although not shown in detail in FIG. 1, a tray on which a large number of ICs are mounted is inserted.
  • the mounted IC under test is sucked by a vacuum suction head one or several pieces at a time, moved by the drive belt 24, and placed on a low-temperature plate (not shown) placed on the floor in the low-temperature oven 20L.
  • B) Apply a low-temperature heat stress in the range of 0 to -30 ° C to the IC under test on this low-temperature plate.
  • the IC under test subjected to the heat stress is again sucked into the vacuum suction head of the handler 21, and the sucked IC is transported to the opening 23 formed in the low-temperature constant temperature bath 20 L, and is tested through the opening 23.
  • the IC is brought into contact with the IC socket 31 placed on the upper surface of the head 30, and the IC under test is electrically connected to the main frame 40 through the IC socket 31 and the cable 32. Perform the test.
  • the handler 21 is provided with a metal rotary shaft 25 for driving a drive belt 24 as a transport means for moving the vacuum suction head in the X-Y directions.
  • the rotating shaft 25 is inserted, for example, between the opposite heat insulating walls 20W (only one side is shown) of the low temperature constant temperature bath 20 and the end thereof is formed into the wall 20W as shown in FIG.
  • the metal bearing housing 25H fitted and mounted in the formed hole 20A and the metal bearing 25B accommodated in the bearing housing 25H are exposed to the outside. Since the rotating shaft 25 in the low temperature oven 20 is cooled, the exposed portion of the rotating shaft 25, the bearing 25B, the bearing housing 25H containing it, and the insulating wall 20W around them are shown in Fig. 2.
  • the inconvenience of frost or ice 2D due to condensation may occur. Occurs. In other words, if the ice 2D adheres, the ice melts and drops as water drops at the end of the test, causing the floor or the like to become dirty, or it enters the tank 20L via the rotating shaft 25, and is fed to the test head. 30 Drops on the upper surface, causing inconvenience such as accidents such as water entering the electrical circuit. For this reason, conventionally, there is a disadvantage that when all the tests are completed, the ice 2D is forcibly removed by hand, and a measure must be taken to prevent the drops from falling as water droplets. Fig.
  • FIG. 3 shows another example of an IC tester equipped with a 20L low-temperature oven.
  • this type of IC testing apparatus for example, about 64 ICs are mounted on each test tray 11, and the test tray 11 is circulated through the inside of the constant temperature chamber 100 and the external passage, and the port on the external circulation path is provided.
  • the IC under test is loaded on the test tray 11 by the loader section 100A, and the test tray 11 loaded with the IC under test is introduced into the low-temperature oven 20.
  • Cryostat applied to the IC under test such as low temperature thermal stress at 20 teeth, sent into the cryostat 20 teeth 2 containing the test portion.
  • IC under test in the test cryostat 20L within 2 for Te be sampled while being mounted on the test tray is performed, after the test completion is sent to a high temperature thermostatic chamber 20H, the thermal stress at high temperature thermostatic chamber 20H
  • the IC under test is returned to room temperature, discharged again to the external passageway, and the tested IC is reloaded into a general-purpose tray (not shown in the figure) by a fan loader unit 100B while reclassifying it into good and defective products, and one test is performed. Tray 11 Testing of the IC mounted on 1 is completed.
  • cryostat 20 and Mr. cryostat 20 teeth 2 is maintained, for example, one 3 0 ° C as low temperature. Therefore there is a case where the ice is attached due to condensation on the outer wall surface of the cryostat 20 Shito 20 teeth 2. Ice may also adhere to the outlet 32H of the cable K32, and this ice may melt after the test and cause inconvenience.
  • An object of the present invention is to propose an IC test apparatus equipped with a low-temperature constant-temperature bath, which has a structure capable of preventing the occurrence of dew condensation outside the low-temperature constant-temperature bath during a low-temperature test. Is what you do.
  • a portion where dew condensation occurs can be covered with a sealing cover outside the low temperature constant temperature bath maintained at a low temperature, and the air open to the atmosphere is directly exposed to the portion where dew condensation occurs.
  • the IC tester equipped with a low-temperature constant-temperature bath and a high-temperature constant-temperature bath supplies the heat of the high-temperature constant-temperature bath to the outer wall surface of the low-temperature constant-temperature bath or the cable draw-out portion.
  • the present invention proposes an IC test apparatus configured to prevent dew condensation on the outer wall of the low-temperature constant temperature bath or the cable outlet.
  • dew condensation does not occur on the outer wall of the low-temperature constant-temperature bath, so that there is no need to remove dew condensation by hand after the test is completed, so that an easy-to-handle IC test apparatus is provided. can do.
  • FIG. 1 is a side view for explaining an example of a preferred Ic test apparatus to which the present invention is applied.
  • FIG. 2 is a cross-sectional view for explaining a conventional technique.
  • FIG. 3 is a schematic perspective view for explaining another type of IC test apparatus suitable for applying the present invention.
  • FIG. 4 is a sectional view of a main part showing an embodiment of the present invention.
  • FIG. 5 is a sectional view showing a modification of FIG.
  • FIG. 6 is a sectional view showing another embodiment of the present invention.
  • FIG. 7 is a sectional view showing a modified example of FIG.
  • FIG. 8 is a sectional view showing still another embodiment of the present invention.
  • FIG. 4 shows an embodiment of the present invention.
  • a case is shown in which the present invention is applied to a portion where the rotating shaft 25, the bearing 25B, the bearing housing 25H, and the like are exposed from the inside of the low-temperature oven 20L.
  • a box-shaped hermetic cover 12 is covered on the dew condensation portion 2a where dew condensation occurs on the outer wall surface of the wall 20W of the low-temperature constant temperature bath 20L.
  • the cover 12 is made of a hard material such as metal or plastic, and is formed in a box shape having an opening on one side, and the opening surface is joined to the outer wall surface of the wall 20W around the dew condensation generating portion 2a of the low-temperature constant temperature bath 20L. And seal the condensation generating part 2a.
  • a suitable means such as a screw or an adhesive can be used to attach the cover 12.
  • the water vapor that can be supplied to the wall area of the rotating shaft 25, the bearing 25 B, the bearing housing 25, and the surrounding cover 12 is at most The total amount of water vapor is very small, and even if all the water vapor is condensed, the amount of condensation is significantly smaller than that of conventional equipment.
  • the temperature inside the cover 12 is much higher than the temperature inside the low-temperature oven 20L, the occurrence of dew condensation on the outer surface of the cover 12 is also reduced, and there is no need to treat dew. It will be easier.
  • Fig. 5 shows the case where the present invention is applied when the low temperature oven 20L and the high temperature oven 20H are adjacent to each other.
  • the boundary between the low temperature oven 20L and the high temperature oven 20H is the dew condensation part 2a. Therefore, if the sealing cover 12 is put on the dew condensation generating portion 2a.
  • FIG. 6 shows a case where the present invention is applied to an IC test apparatus of the type shown in FIG. Fig. 6 shows the vertical cross section of the test equipment.
  • the test tray 11 with the IC under test is inserted into the low-temperature oven 20 at the highest position, and It is moved and cooled during this time. Torei 1 1 lowermost position is moved in the horizontal direction, into the cryostat 20L 2.
  • the IC is tested, and then inserted into the lowest position of the high-temperature oven 20H.
  • the IC in the tray is heated to room temperature while being moved to the uppermost position, and then is taken out by horizontal movement.
  • FIG. 6 may be combined with the embodiment shown in FIG. That is, As shown by the line, a sealing cover 12 is provided so as to surround the dew condensation portion 2a on the upper surface of the low temperature oven 20L 2 adjacent to the high temperature oven 20H, and the temperature from the blower 105 is provided on the upper surface of the cover 12. It is configured to blow the wind.
  • FIG. 7 shows a modification of the embodiment shown in FIG.
  • a tube 106 is piped along the inner wall of the high-temperature bath 20H, compressed air is sent from the air conditioner 107 into the tube 106, and the warm air 108 discharged from the outlet of the tube 106 is cooled at a low temperature.
  • An example is shown in which the configuration is such that dew condensation is prevented by injecting water onto the peripheral surfaces of the constant temperature baths 20 and 20, particularly at a portion where dew condensation occurs.
  • This embodiment may be implemented in combination with the embodiment shown in FIG.
  • a sealed cover 12 surrounding the dew condensation portion 2a on the upper surface of the low temperature constant temperature bath 20L 2 adjacent to the high temperature constant temperature bath 20H is provided as shown by a broken line, and the hot air from the tube 106 is provided on the upper surface of the cover 1 2. Spray.
  • Figure 8 shows the case of applying the invention of the cable outlets 32H Nico drawn from cryostat 20L 2 shown in FIG.
  • the cable outlet 32H is sealed with a heat-insulating bush 109, and one side of the L-shaped heat transfer plate 11 1 is brought into contact with the closed surface of the bush 109, and the other surface perpendicular to it is kept at high temperature and temperature.
  • the structure was screwed to the wall of tank 20H.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention concerne un appareil de test de CI (circuits intégrés) pourvu d'un réservoir à basse température et à température constante, dans lequel un couvercle de fermeture hermétique est placé sur la partie du réservoir qui vient en contact avec la rosée lors de sa formation, ou un appareil de test de CI pourvu d'un réservoir à basse température et à température constante, et d'un réservoir à température élevée et à température constante, dans lequel on empêche la formation de rosée sur une surface périphérique du réservoir à basse température et à température constante en amenant la chaleur du réservoir à température élevée et à température constante à la surface périphérique du réservoir à basse température et à température constante.
PCT/JP1999/000968 1998-03-02 1999-03-01 Appareil de test de ci Ceased WO1999045403A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19980524T DE19980524T1 (de) 1998-03-02 1999-03-01 IC-Testgerät

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10049523A JPH11248787A (ja) 1998-03-02 1998-03-02 Ｉｃ試験装置
JP10/49523 1998-03-02

Publications (1)

Publication Number Publication Date
WO1999045403A1 true WO1999045403A1 (fr) 1999-09-10

Family

ID=12833509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/000968 Ceased WO1999045403A1 (fr) 1998-03-02 1999-03-01 Appareil de test de ci

Country Status (5)

Country Link
JP (1) JPH11248787A (fr)
KR (1) KR20010020333A (fr)
DE (1) DE19980524T1 (fr)
TW (1) TW428095B (fr)
WO (1) WO1999045403A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5348731B2 (ja) * 2007-12-26 2013-11-20 ホシザキ電機株式会社 冷凍機ユニット
KR102179036B1 (ko) * 2019-07-02 2020-11-16 세메스 주식회사 테스트 핸들러의 챔버 벽 구조

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0466882A (ja) * 1990-07-06 1992-03-03 Advantest Corp Ｉｃ試験用恒温槽装置
JPH0466588U (fr) * 1990-10-19 1992-06-11
JPH0528039U (ja) * 1991-09-13 1993-04-09 安藤電気株式会社 低温槽内のフアンの駆動機構

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0466882A (ja) * 1990-07-06 1992-03-03 Advantest Corp Ｉｃ試験用恒温槽装置
JPH0466588U (fr) * 1990-10-19 1992-06-11
JPH0528039U (ja) * 1991-09-13 1993-04-09 安藤電気株式会社 低温槽内のフアンの駆動機構

Also Published As

Publication number Publication date
DE19980524T1 (de) 2000-05-25
TW428095B (en) 2001-04-01
KR20010020333A (ko) 2001-03-15
JPH11248787A (ja) 1999-09-17

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