WO2000010771A1 - Planetary gear system parallel planer - Google Patents
Planetary gear system parallel planer Download PDFInfo
- Publication number
- WO2000010771A1 WO2000010771A1 PCT/JP1999/004170 JP9904170W WO0010771A1 WO 2000010771 A1 WO2000010771 A1 WO 2000010771A1 JP 9904170 W JP9904170 W JP 9904170W WO 0010771 A1 WO0010771 A1 WO 0010771A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- surface plate
- carrier
- plate
- rotation
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/26—Accessories, e.g. stops
Definitions
- the present invention relates to a planetary gear type parallel plane processing machine that performs plane processing such as lapping and polishing.
- FIG. 4 is a perspective view showing a main part of a conventional 4-way parallel plane processing board
- FIG. 5 is a cross-sectional view of the same main part.
- 1 is an annular lower surface plate that is rotationally driven by a first driving device (not shown)
- 2 is a carrier having a tooth surface on an outer peripheral surface
- 3 is a rotating device that is rotationally driven by a second driving device (not shown).
- Tooth gear 4 is a sun gear driven by a third driving device (not shown)
- 5 is a workpiece
- 6 is a column
- 7 is a suspension plate
- 8 is a universal joint
- 9 is an annular upper surface plate
- Reference numeral 0 denotes a drive shaft that is rotationally driven by a fourth drive device (not shown).
- Reference numeral 11 denotes a drive key that is mounted on the key groove 10 a of the drive shaft 10 and connects the upper surface plate 9 and the drive shaft 10. is there.
- a plurality of carriers 2 are arranged radially on the lower surface plate 1 along with the internal gear 3 and the sun gear 4, and a plurality of work holding holes of these carriers 2 are provided.
- a workpiece 5 as a work is mounted on the workpiece.
- the upper platen 9 suspended in a pendulum shape by the universal joint 8 via members such as the support column 6 and the suspension plate 7 is lowered by a pressure adjusting mechanism (not shown) such as an air cylinder.
- An appropriate load is applied to the workpiece 5 mounted on the carrier 2.
- the drive key 11 attached to the upper stool 9 and the drive shaft 10 are connected.
- Drive shaft 1 0 keyway 1 0 a is provided in the up-down direction, and the drive key 11 and the keyway 10a of the drive shaft 10 transmit rotational driving force, but can be moved in the up-down direction. For this reason, the upper surface plate 9 naturally descends downward by gravity following the workpiece 5 even after the connection.
- the support shaft attached to the universal joint 8 is configured to be rotatable by a bearing (not shown), and the upper surface plate 9 rotates as the drive shaft 10 rotates.
- the lower platen 1 and the upper platen 9 are rotated in opposite directions while supplying abrasive grains from an abrasive supply hole (not shown) provided in the upper platen 9.
- the carrier 2 on which the workpiece 5 sandwiched between the lower surface plate 1 and the upper surface plate 9 rotates while revolving, and revolves. are polished on both sides.
- the rotation of these lower platen 1, internal gear 3, sun gear 4 and upper platen 9 is controlled by first, second, third and fourth driving devices, respectively. Adjust and perform optimal polishing.
- the term “polishing” is a general term for abrasive grain processing such as lapping and polishing, including grinding.
- the parallel plane processing machine shown in Fig. 4 and Fig. 5 is composed of four motion elements including the rotation of the lower surface plate 1, the rotation of the upper surface plate 9, the rotation of the carrier 2, and the revolution of the carrier 2. 4 It is called a one-way parallel plane processing machine.
- the present invention first employs a mechanism that rotates the lower platen and does not rotate the upper platen in order to eliminate the influence of the moment of inertia generated by the rotational drive of the upper platen.
- An object of the present invention is to avoid a situation in which the dynamic friction resistance between the key groove 10a of the drive shaft 10 of the unit and the drive key 11 becomes large, and to facilitate the natural descent of the upper platen due to gravity.
- the upper platen is hung with a wire rope to improve the ability of the upper platen to follow the workpiece surface, so that the upper platen is always parallel to the lower platen.
- the purpose is to provide a gear type parallel plane processing machine. Disclosure of the invention
- a carrier having a tooth surface formed on an outer periphery and having a plurality of work holding holes formed in a rotation direction is arranged on a lower surface plate, Place this carrier in a horizontal plane
- the planetary gear train is formed by combining a plurality of the sun gears and the internal gears. Then, after inserting the work into the work holding hole of the carrier, lower the upper platen so that both sides of the carrier are sandwiched between the upper and lower platens, and rotate the sun gear and the internal gear. Let it. As a result, the carrier moves in a planetary manner, and at the same time, the lower platen and the upper platen are rotated relative to the carrier to rub or polish the work.
- Its structural features include one or more detent pins protruding from the upper surface of the upper platen near the outer periphery, and the rotation of the upper platen supported by the panel body and abutting against the side surfaces of the detent pins.
- a stopper for stopping a support member fixed to the upper stool, a first pulley group pivotally supported by a plurality of rotating shafts protruding from a side surface of the support member, and a suspension plate moving vertically.
- a second pulley group that is supported by a plurality of rotating shafts protruding from the side surfaces of the suspension plate, and a pulley that constitutes a first booley group to evenly support the vertical load of the upper stool.
- an endless wire rope that is stretched between the pulleys constituting the second pulley group.
- the planetary gear type parallel plane processing machine of the present invention is arranged such that, with the upper surface plate stopped, the relative speeds of the upper surface plate and the lower surface plate contacting the upper and lower surfaces of the carrier with respect to the carrier are substantially the same.
- a rotation control device for controlling the rotation speed of the sun gear, the internal gear and the lower platen.
- FIG. 1 is a perspective view showing a main part of an embodiment of the present invention.
- FIG. 2 is a sectional view of a main part of the embodiment of the present invention.
- FIG. 3 is an explanatory diagram illustrating speed control of the upper stool, the lower stool, and the carrier according to the embodiment of the present invention.
- FIG. 4 is a perspective view showing a conventional example.
- FIG. 5 is a cross-sectional view of a conventional example.
- FIG. 1 is a perspective view showing a main part of an embodiment of a planetary gear type parallel plane processing machine according to the present invention
- FIG. 2 is a sectional view of the same main part.
- 1 is a lower platen that is rotated by a first drive unit (not shown)
- 2 is a plurality of carriers radially arranged on the lower platen 1
- 3 is in contact with the tooth surface of the outer periphery of the carrier 2, and is not shown.
- An internal gear that is rotated by the second drive device, 4 is a sun gear that meshes with teeth on the outer periphery of the carrier 2 and that is rotated by a third drive device (not shown)
- 5 is a work drilled in the carrier 2.
- a plurality of workpieces, which are works to be wrapped or polished by being attached to the holding holes, 9 is an upper platen, 12 is a pulley 1 constituting a group of first pulleys, and 13 is a support member of the present invention.
- This is an example of an annular ring, 14 is a pulley that constitutes a group of second pulleys, 15 is a pentagonal suspension plate, and 16 is a bearing placed at the center of the suspension plate 15.
- a concentric ring 13 is fixed to the upper surface of the upper platen 9 near the inner periphery so as to be integral with the upper platen 9, and five pulleys are fixed on the outer peripheral surface of the ring 13. 1 and 2 are mounted at equal intervals on a horizontal rotating shaft. Above the ring 13, a pentagonal suspension plate 15 is rotatably supported by a rod tip 20 via a bearing 16. Each side of the outer peripheral surface of this hanging plate 15 A total of 10 pulleys 14 are mounted on the horizontal rotating shaft. Between the pulleys 1 and 2 of the ring 13 and the pulleys 14 of the suspension plate 15, a wire rope 17 connected in both ends and in an endless state is stretched. The ring 13 and the upper platen 9 are supported by the suspension plate 15 with an equal force by 7.
- two pins 18 are provided upright at positions near the outer periphery of the upper surface of the upper platen 9 and opposed to each other.
- a bracket 21 is mounted on a bracket 21 integrally attached to a panel body (not shown) so as to freely swing up and down.
- the stopper 19 is brought into contact with the side surface of the pin 18 by lowering the tip of the stopper 19 onto the upper surface plate 9.
- the upper surface plate 9 is suspended at a plurality of positions at equal intervals in the rotation direction by the wire ropes 17, so that the upper surface plate 9 is stabilized at a position parallel to the horizontal plane. Even when the work piece 5 is polished and the upper surface level of the work piece 5 is lowered, the upper platen 9 naturally descends due to gravity, and the lower surface of the upper platen 9 is well placed on the upper surface of the work piece 5.
- the upper stool 9 since the upper stool 9 is not rotated, it is not necessary to consider the centrifugal force and the like, and the upper stool 9 can be suspended in this manner.
- the operation is restricted so that the upper platen 9 is moved only in the vertical direction, and the upper platen 9 is moved upward and downward.
- the platen 9 may be configured to surely maintain the parallelism with the lower platen 1.
- a plurality of carriers 2 are arranged in equal divisions together with the internal gear 3 and the sun gear 4, and the work held in the carrier 2 is held.
- a plurality of workpieces 5 as works are mounted in the holes. Operate the air cylinder to place the upper platen 9 on the workpiece 5 By lowering and adjusting the vertical position of the suspension plate 15, the load condition of the upper platen 9 on the workpiece 5 is maintained in an optimal state for processing.
- the first, second, and third drive units (all not shown) are driven to move the three axes of the internal gear 3, the sun gear 4, and the lower stool 1 excluding the upper stool 9 to the same.
- the carrier 2 By rotating at a predetermined rotation speed, the carrier 2 performs a planetary motion, and the upper stool 9 and the lower stool 1 pressing the upper and lower surfaces of the workpiece 5 are relatively moved with respect to the workpiece 5.
- the upper and lower surfaces of the workpiece 5 are polished.
- both sides of the workpiece 5 are polished by carrying out planetary motion while being pressed between the lower surface plate 1 and the upper surface plate 9 with the carrier 2 on which the workpiece 5 is mounted. That is, in this embodiment, the workpiece 5 is machined by a combination of three motion elements including the rotation of the lower stool 1, the rotation of the carrier 2, and the revolution of the carrier 2. This is referred to as a plane processing machine.
- FIG. 3 is an explanatory diagram illustrating speed control of the lower stool 1, the upper stool 9 and the carrier 2. The explanation is simplified without considering the rotation of the carrier 2. For example, when the relative speed between the revolution speed of the carrier 2 and the rotation speed of the lower stool 1 and the relative speed of the revolution speed of the carrier 2 and the rotation speed of the upper slab 9 are equalized, the conventional 4-way method is used.
- Fig. 3 (a) If it is a parallel plane machine, for example, it will be as shown in Fig. 3 (a). That is, if the upper platen 9 is rotated counterclockwise at an angular velocity of 0.5 ⁇ and the carrier 2 is revolved clockwise at an angular velocity of 0.5 ⁇ , the workpiece 5 is set as a reference. Then, the upper surface of the workpiece 5 comes into contact with the upper platen 9 at an angular velocity, and similarly, the lower platen 1 is rotated clockwise at an angular velocity of 1.5 ⁇ , and the carrier 2 is also rotated at an angular velocity of 0.5 ⁇ . If the workpiece 5 is made to revolve clockwise, the lower surface of the workpiece 5 contacts the lower surface plate 1 at an angular velocity ⁇ with respect to the workpiece 5.
- FIG. 1 In order to realize the same processing as the 4-way parallel plane processing machine using the 3-way parallel plane processing machine of the present embodiment, for example, FIG.
- the same effect as that of the conventional four-way parallel plane processing machine of the present embodiment is obtained with the lower surface of the three-way parallel plane processing machine of this embodiment. It can be obtained by adjusting the rotation speed of the board 1, the internal gear 3, and the sun gear 4.
- the rotation is caused by the rotation of the upper surface plate.
- a mechanism that rotates the lower platen 1 but does not rotate the upper platen 9 is adopted, and the keyway 1 of the drive shaft 10 of the connecting part shown in Figs. 4 and 5 is adopted. It is possible to avoid a situation in which the dynamic friction resistance between 0a and the drive key 11 becomes large, and to facilitate the natural descent of the upper platen due to gravity.
- the followability of the upper platen 9 to the surface of the workpiece 5 is improved, and the upper platen 9 is always parallel to the lower platen 1. It is possible to provide a three-way parallel plane processing machine.
- the planetary gear type surface processing machine according to the present invention is suitable for performing surface processing such as rubbing and polishing.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Milling, Drilling, And Turning Of Wood (AREA)
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55521199A JP3262808B2 (ja) | 1998-08-20 | 1999-08-03 | 遊星歯車方式平行平面加工盤 |
| EP99933239A EP1048409B1 (en) | 1998-08-20 | 1999-08-03 | Planetary gear system parallel planer |
| DE69933754T DE69933754T2 (de) | 1998-08-20 | 1999-08-03 | Planetengetriebesystem für doppelseitige läppmaschine |
| US09/403,554 US6206767B1 (en) | 1998-08-20 | 1999-08-03 | Planetary gear system parallel planer |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10/234553 | 1998-08-20 | ||
| JP23455398 | 1998-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2000010771A1 true WO2000010771A1 (en) | 2000-03-02 |
Family
ID=16972837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1999/004170 Ceased WO2000010771A1 (en) | 1998-08-20 | 1999-08-03 | Planetary gear system parallel planer |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6206767B1 (ja) |
| EP (1) | EP1048409B1 (ja) |
| JP (1) | JP3262808B2 (ja) |
| DE (1) | DE69933754T2 (ja) |
| TW (1) | TW410187B (ja) |
| WO (1) | WO2000010771A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010221348A (ja) * | 2009-03-24 | 2010-10-07 | Hamai Co Ltd | 両面研磨装置および加工方法 |
| CN118700022A (zh) * | 2024-07-22 | 2024-09-27 | 江苏保捷锻压有限公司 | 一种便于上料的齿轮表面去毛刺加工夹具 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000069597A1 (en) * | 1999-05-17 | 2000-11-23 | Kashiwara Machine Mfg. Co., Ltd. | Method and device for polishing double sides |
| US6702657B2 (en) * | 2002-01-09 | 2004-03-09 | Daniel A. Ficarro | Continuous polisher machine |
| CN100463778C (zh) * | 2004-09-10 | 2009-02-25 | 上海日进机床有限公司 | 平行平面研磨机 |
| US7767023B2 (en) * | 2007-03-26 | 2010-08-03 | Tokyo Electron Limited | Device for containing catastrophic failure of a turbomolecular pump |
| DE102009038942B4 (de) * | 2008-10-22 | 2022-06-23 | Peter Wolters Gmbh | Vorrichtung zur beidseitigen Bearbeitung von flachen Werkstücken sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung mehrerer Halbleiterscheiben |
| JP5505713B2 (ja) * | 2010-04-26 | 2014-05-28 | 株式会社Sumco | 研磨液分配装置及びこれを備えた研磨装置 |
| CN103624674A (zh) * | 2012-08-27 | 2014-03-12 | 深圳富泰宏精密工业有限公司 | 研磨机升降机构及应用该升降机构的研磨机 |
| JP6491024B2 (ja) * | 2015-04-20 | 2019-03-27 | 不二越機械工業株式会社 | 両面研磨装置および研磨方法 |
| CN108608318A (zh) * | 2018-04-28 | 2018-10-02 | 湖南宇晶机器股份有限公司 | 高精密研磨机双直驱传动系统 |
| CN119115777B (zh) * | 2024-11-12 | 2025-06-24 | 兴化市剑达铸造有限公司 | 一种铸件的表面处理自动化系统 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5440391A (en) * | 1977-09-06 | 1979-03-29 | Mo Buisushiee Tekhn Uchiritsus | Method of lapping group of work pieces and planetary lapping machine |
| JPH0425372A (ja) * | 1990-05-17 | 1992-01-29 | Seiko Electronic Components Ltd | 両面研磨装置 |
| JPH0596466A (ja) * | 1991-10-02 | 1993-04-20 | Speedfam Co Ltd | 両面研磨方法及び装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58171255A (ja) * | 1982-03-29 | 1983-10-07 | Toshiba Corp | 両面鏡面研摩装置 |
| US4674236A (en) * | 1985-05-13 | 1987-06-23 | Toshiba Machine Co., Ltd. | Polishing machine and method of attaching emery cloth to the polishing machine |
| JPS62176755A (ja) * | 1986-01-31 | 1987-08-03 | Yasunori Taira | 平面研磨装置 |
| JPH0373265A (ja) * | 1989-05-02 | 1991-03-28 | Sekisui Chem Co Ltd | 被研磨物保持用キャリヤ及びその製造方法 |
| US5174067A (en) * | 1990-10-19 | 1992-12-29 | Shin-Etsu Handotai Co., Ltd. | Automatic wafer lapping apparatus |
| US5422316A (en) * | 1994-03-18 | 1995-06-06 | Memc Electronic Materials, Inc. | Semiconductor wafer polisher and method |
| US6080042A (en) * | 1997-10-31 | 2000-06-27 | Virginia Semiconductor, Inc. | Flatness and throughput of single side polishing of wafers |
| US5980366A (en) * | 1997-12-08 | 1999-11-09 | Speedfam-Ipec Corporation | Methods and apparatus for polishing using an improved plate stabilizer |
| JPH11179649A (ja) * | 1997-12-16 | 1999-07-06 | Speedfam Co Ltd | ワークの取出方法及びワーク取出機構付き平面研磨装置 |
-
1999
- 1999-08-03 JP JP55521199A patent/JP3262808B2/ja not_active Expired - Lifetime
- 1999-08-03 WO PCT/JP1999/004170 patent/WO2000010771A1/ja not_active Ceased
- 1999-08-03 US US09/403,554 patent/US6206767B1/en not_active Expired - Lifetime
- 1999-08-03 EP EP99933239A patent/EP1048409B1/en not_active Expired - Lifetime
- 1999-08-03 DE DE69933754T patent/DE69933754T2/de not_active Expired - Lifetime
- 1999-08-05 TW TW088113360A patent/TW410187B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5440391A (en) * | 1977-09-06 | 1979-03-29 | Mo Buisushiee Tekhn Uchiritsus | Method of lapping group of work pieces and planetary lapping machine |
| JPH0425372A (ja) * | 1990-05-17 | 1992-01-29 | Seiko Electronic Components Ltd | 両面研磨装置 |
| JPH0596466A (ja) * | 1991-10-02 | 1993-04-20 | Speedfam Co Ltd | 両面研磨方法及び装置 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP1048409A4 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010221348A (ja) * | 2009-03-24 | 2010-10-07 | Hamai Co Ltd | 両面研磨装置および加工方法 |
| CN118700022A (zh) * | 2024-07-22 | 2024-09-27 | 江苏保捷锻压有限公司 | 一种便于上料的齿轮表面去毛刺加工夹具 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1048409B1 (en) | 2006-10-25 |
| TW410187B (en) | 2000-11-01 |
| DE69933754T2 (de) | 2007-02-08 |
| JP3262808B2 (ja) | 2002-03-04 |
| EP1048409A4 (en) | 2005-11-23 |
| EP1048409A1 (en) | 2000-11-02 |
| US6206767B1 (en) | 2001-03-27 |
| DE69933754D1 (de) | 2006-12-07 |
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