WO2000019791A1 - Dispositif de protection d'un circuit electrique contre les phenomenes de microdecharges d'interface - Google Patents
Dispositif de protection d'un circuit electrique contre les phenomenes de microdecharges d'interface Download PDFInfo
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- WO2000019791A1 WO2000019791A1 PCT/FR1999/002300 FR9902300W WO0019791A1 WO 2000019791 A1 WO2000019791 A1 WO 2000019791A1 FR 9902300 W FR9902300 W FR 9902300W WO 0019791 A1 WO0019791 A1 WO 0019791A1
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- electromagnetic
- audio
- reading
- absorbent
- veil
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0043—Casings being flexible containers, e.g. pouch, pocket, bag
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Definitions
- the interface micro-discharges appear to be the phenomenon mainly responsible for the degradation of the transmission and the detection of electronic signals. This is particularly the case with regard to the degradation of musicality observed in audio and / or video frequency signal processing devices, such as High Fidelity channels, HiFi, even in the case where these devices satisfy to conventional noise reduction standards and criteria.
- micro-discharges occur whenever electric charges, linked to insulators, in particular when these charges are present at the interface of this insulator, are subjected to variable electric fields.
- the phenomenon of micro-discharges is further favored by the existence of mechanical vibrations of which the electronic or electrical circuits can be the seat.
- these electrical charges are most often located on the surface of the aforementioned electrical insulators, either at the conductor / insulator interface itself, as in the case of electric or electronic cables, or at the junction between two insulators, like this systematically appears to be the case at the level of the insulator / air interfaces.
- the electric field which excites these micro-discharges, can be either of internal origin or of external origin such as for example the electric field generated by the sector at industrial frequencies.
- an electric charge, or a set of electric charges linked to electric insulators is subjected to a variable electric field, the new state of equilibrium of the electrostatic system thus formed can only be obtained through the phenomenon of micro-discharges , which can be analyzed as a local dielectric breakdown phenomenon, on the scale of the roughness of the insulating and / or conductive materials which house them.
- micro-discharges although of very low amplitude, of the order of a millivolt, however have very short rise or fall times, close to, or even less than a nanosecond.
- Corresponding measurements could indeed allow the identification of frequencies associated with the transient phenomena and waves generated by the MDI between 1 and 100 GHz or more.
- the aforementioned electromagnetic phenomena propagate in the form of electromagnetic waves, hereinafter referred to as MDI waves, in particular in the form of surface electromagnetic waves. along the aforementioned conductor / insulator, insulator / insulator and insulator / air interfaces.
- the MDI phenomena are synchronous with the latter and result in the generation of an electromagnetic wave correlated with, if not modulated by, these electric fields or these vibrations.
- MDIs could be highlighted by means of suitable antennas, in this case doublets or dipoles of 4 to 10 cm.
- the MDIs could in particular be highlighted:
- the signals generated by the MDIs are correlated with the input signal, in low frequency baseband, the amplitude and the frequency of recurrence of the signals generated by MDI varying according to the low frequency input signal;
- the object of the present invention is to remedy the drawbacks of the solutions proposed previously by the implementation of new or complementary solutions with regard to them.
- Another object of the present invention is, consequently, the implementation of a device for protecting an electric circuit against the phenomena of interface micro-charges having the object of suppressing the creation and the propagation of the MDI wave associated with these phenomena.
- Another object of the present invention is, also, the implementation of a device for protecting an electrical circuit against the phenomena of interface micro-discharges capable of application to the majority. t of the constituent elements of audio- and / or video-frequency devices, that these elements in fact constitute active or passive elements, capable of generating MDI phenomena and the MDI wave which is generated by the latter.
- the device for protecting an electrical circuit against the phenomena of interface micro-discharges, object of the present invention, these phenomena being generators of radio interference in audio frequencies, is remarkable in that it comprises at least one protective element formed by a electromagnetic absorbent veil, the electrical resistivity of which is between 0.004 x 10 "3 ⁇ xm and 5 x 10 " 3 ⁇ xm, this absorbent veil making it possible to attenuate the phenomena of interface micro-discharges.
- - Figure 1 shows a sectional view of a device for protecting an electrical circuit against the phenomena of interface micro-discharges, according to the subject of the present invention
- - Figures 2a to 2c relate to different embodiments of the device for protecting an electrical circuit against the phenomena of interface micro-discharges, in the case of a protective veil formed, either by a non-woven fabric, or by a veil woven protector or by a protective film placed on a support;
- FIGS. 3a and 3b to 3f relate to a particular embodiment of a device according to the object of the present invention, more particularly intended for systems for reading media from recordings of audio signals or data such as microgroove reading table and device for reading an optical compact audio and / or video disc;
- - Figures 4a and 4b relate to a specific embodiment of a device according to the object of the present invention more particularly intended for electroacoustic transducer systems such as loudspeakers implemented in a High Fidelity chain ;
- - Figures 5a and 5b relate to a particular embodiment of a device according to the object of the present invention more particularly intended for the protection of a drive motor for reading table microsillon, d '' a compact disc or the capstan of a magnetic tape, in a High Fidelity recording / playback device for audio and / or video signals;
- FIG. 6a to 6c show a device for protecting an electrical circuit against interface micro-charges, in accordance with the object of the present invention, applied to plug-in boxes or housings audio and / or video recording / playback devices;
- FIGS. 7a to 7c show a sectional view of a protection of a circuit device that electrically against the interface microdischarges phenomena according to the object of the present invention, more particu larly ⁇ applied to circuits electrical of any type, when the latter are produced in the form of a printed circuit, respectively of specific printed circuits in which, thanks to the integration into the latter of a device in accordance with the object of the present invention, the phenomena interface micro-downloads are substantially eliminated;
- FIGS. 8a to 8c represent a sectional view of a device for protecting an electrical circuit against the phenomena of interface micro-discharges, in accordance with the object of the present invention, applied to connection cables used in the High Fidelity audio and / or video installations;
- FIG. 9a represents a device for protecting an electrical circuit against the phenomena of interface micro-discharges produced in the form of a passive component making it possible to filter and attenuate the electromagnetic wave associated with these phenomena;
- - Figure 9b shows an impedance diagram, as a function of frequency, of a component as shown in Figure 9a, when the latter is wound to form a sleeve;
- FIG. 9g represents an embodiment in rolled-up form of a component having characteristics of a filter with capacitance resistances of the electromagnetic wave associated with the phenomena of interface micro-discharges;
- FIG. 9h shows an electrical equivalent diagram of the component shown in Figure 9g;
- FIG. 10a to 10f show, in section, an optical recording / reading medium for digital audio- and / or video frequency data, provided with a device for protecting an electrical circuit against the phenomena of micro-discharges of conforming interface to the subject of the present invention, this type of optical recording / reading medium for digital audio- and / or video frequency data being particularly remarkable in that the phenomena of interface micro-discharges and the parasites associated with the latter are substantially deleted at source, when these are read by a conventional reading device;
- FIG. 11 shows, in an illustrative manner, different successive stages of implementation of a method of manufacturing a support for optical recording / reading of digital audio- and / or video frequencies data, in accordance with object of the present invention
- the device protection of an electrical circuit in accordance with the object of the present invention, relates to any circuit or any object involving the creation of electric potentials and / or currents, either specifically for the purpose of electrical supply or the transmission of electrical signals carrying information to other electrical circuits, either by the creation of electrical charges, electrical currents and parasitic electrical potentials during the use of the latter, these electrical circuits and objects, seat of electrical phenomena, then being capable of generating phenomena of interface micro-discharges generating radio interference in audi frequency.
- the circuit shown in a section view in FIG. 1 relates to a printed circuit provided with elements such as resistor R, capacitance C, transistor T and self-inductance L installed on a PCB printed circuit board.
- object of the present invention comprises at least one protective element 1, formed by an electromagnetic absorbent veil whose electrical resistivity is between 0.004 10 "3 ⁇ xm and 5 10 "3 ⁇ x m. This absorbent veil 1 person puts to mitigate the phenomena of MDI, by absorption of the MDI wave.
- the absorbent veil completely surrounding and enveloping the electrical circuit considered, in order to ensure complete protection.
- the electromagnetic absorbent veil placed in the vicinity of the metallized face of the PCB printed circuit, face opposite to the face containing the components, is preferably constituted by an electromagnetic absorbent veil itself 1 0 which is superimposed a layer of electrically insulating material li, in order to avoid any short circuit between the metallizations of the metallized face of the PCB printed circuit.
- the electromagnetic absorbent veil can consist of a texture formed from organic fibers covered with an electrically conductive coating.
- the texture corresponds to a non-woven element, called non-woven, formed on the basis of metallic or organic fibers, in particular carbon or conductive polymer, covered if necessary with conductive metal. tor.
- the aforementioned surface resistance parameter can then be chosen as a function of the percentage of conductive fibers used.
- the above-mentioned electromagnetic absorbent veil 1 can be constituted by a fabric formed from woven electrically conductive fibers. It is recalled that a fabric designates a flexible, resistant surface constituted by a regular assembly of interlaced textile threads, either woven or meshed. In this case, these fabrics are mainly used in the semiconductor industry, in order to limit the static charges in the manufacturing processes. These fabrics can also be used to protect enclosures confined to electromagnetic radiation during transmission and / or reception.
- a particularly suitable textile, commercially available, is the textile marketed under the name ISOWAVE by the company SCHLEGEL BVA, Roc esterlaan 4, 8470 GISTEL Belgium, in France and in Europe.
- the aforementioned fabric has an impedance of 0.05 ohm per square and very high electromagnetic wave absorption coefficients, of the order of 100 dB for a frequency band of radio signals between 1 GHz and 10 GHz .
- an absorption coefficient of 65 dB depending on the experimental conditions, that is to say a higher absorption coefficient from 30 to 40 dB to that of the absorbent masses commonly used.
- Such a fabric appears particularly well suited to constitute an electromagnetic absorbent veil consisting of titutive of a protection device in accordance with the object of the present invention, insofar as, firstly, such a fabric is available in a metallic copper version and a metallic silver version whose resistance per square is more on the other hand, such a fabric appears particularly thin, light and very handy, this fabric having a mass not exceeding 40 g / m 2 .
- the aforementioned fabric can be shaped, and ultimately molded, by thermoforming, for the coating of organs or components, as shown in FIG. 1, in order to ensure sufficient cohesion between the protected circuit and the protection device of such a circuit, in accordance with the object of the present invention.
- the electromagnetic absorbent web 1 can be formed by an electromagnetic absorbent film, this electromagnetic absorbent film naturally having an electrical surface resistance whose value corresponds to the range of values previously mentioned in the description. In such a case, however, the electromagnetic absorbent film is deposited on a substrate S, this substrate corresponding for example to the insulating layer of an electrical or electronic conductor whose insulator / conductor interface is the seat of MDI phenomena.
- such an electromagnetic absorbent veil may consist of a veil of semiconductor material, a plastic film charged with electrically conductive particles, the corresponding film 1 being deposited on the substrate S, thus that will be described in more detail later in the description.
- a more detailed description of a device for protecting an electrical circuit against MDI phenomena, in accordance with the subject of the present invention, more particularly intended for protecting electrical circuits for reading a signal recording medium or video frequency data in a device for reading an audio and / or video recording, from a rotary signal or audio and / or video data recording medium, will now be given in connection with FIGS. 3a and 3b .
- FIG. 3a relates to the protection of a microgroove disc, denoted DMS, which, during common use, is placed on the rotary plate PR of a reading table TL in order to ensure the reading of this micro disc - DMS groove by a TLE reading head carried by a BL reading arm.
- DMS microgroove disc
- microgroove discs are in particular produced from a material such as vinyl, a material recognized as being particularly electrostatic, which therefore attracts dust and other particles present in the air.
- Such a phenomenon results in crackles caused by MDI phenomena generating audible parasites, or by the friction of the diamond of the TLE read head on the dust accumulated on the microgroove disc.
- micro-discharges propagate by surface waves on the surface of the microgroove disc and are picked up by the read head and then reinjected via the read signal into the amplification circuits, which, by detection, causes parasites. cited above.
- object of the present invention consists in placing, on the rotary plate PR, between the microgroove disc DMS and the rotary plate PR, a protective element consisting of an electromagnetic absorbent sheet 1, which can advantageously have the shape of the rotary plate PR and the dimensions of the latter.
- the protective element 1 was constituted by a cover plate produced by one to four layers of non-woven copper metal, sold by the company SCHLEGEL, of thickness 0.1 mm and intended absorption of the above-mentioned high frequency electromagnetic waves.
- an additional precaution may consist in surrounding the TLE read head with an envelope constituted by the protective element formed by the abovementioned absorbent veil, only the support rod of the read point being thus free, as shown in section in Figure 3a.
- Figure 3b there is shown the application of a protection device, according to the ob- jet of the present invention, to a compact disc, denoted CD, with optical reading.
- the TLE reading head is constituted by a laser allowing the reading on the reading face CDi of the compact disc CD, the reading face CDi being constituted by a layer of etched polycarbonate, covered with a metallization ME , and the face opposite to the reading face CD 2 comprising for example a screen printing and a layer of varnish V deposited on the metallization ME.
- object of the present invention it consists, for a CD compact disc installed on its drive support, of placing an electromagnetic absorbent web disc 1 on the CD compact disc, that is to say on the layer of varnish thereof, as shown in section in Figure 3b.
- the absorbent sail disc 1 can then advantageously have the same dimensions as those of the compact disc CD.
- the aforementioned phenomenon can be highlighted in the following way.
- switching to pause mode for a few tens of seconds, followed by a new passage to playback mode allows a much more defined and clearer signal to be highlighted , an impression of gain in the low frequencies and an appreciation of better level sound planes being clearly perceptible.
- the reading laser beam scanning the same reading range the excitation of these same areas by the laser beam leads to exhaustion of the MDI phenomenon, which of course reduces the parasitic phenomena associated with the latter.
- the reading face CDi is formed by a thin aluminized layer constituting the metallization ME, with a thickness of 0.6 to 0.8 nm (nanometer), deposited on the etched polycarbonate with a thickness of 0.8 mm, metallization on which a layer of epoxy varnish with a thickness of 7 to 8 ⁇ m is formed.
- the metallization ME of extremely thin thickness - a lighted electric bulb is visible by transparency through the latter - does not constitute a reflective screen for electromagnetic waves. For this reason, the major part of the electromagnetic waves associated with the MDI phenomena induced by photoelectric effect is in fact transmitted by the unread surface CD 2 of the support CD.
- - absorbent fleece disc made from a copper non-woven or silver-nickel non-woven, referenced CO.60830 and N MP 61027 respectively, manufactured by the company SCHLEGEL BVA. This disc can be used, either for compact discs with optical reading, or for microgrooves.
- these absorbent veil discs can be kept permanently on each optical disc, or, if necessary, used on a case-by-case basis.
- absorbent webs produced in the form of electromagnetic absorbent films can be used on any digital disc with optical reading, DSD disc or DVD.
- the aforementioned digital disks can then be coated with an intrinsic semiconductor product in the last stages of their treatment by simple spraying, deposition and then centrifugation for example.
- a particularly advantageous product appears to be the semiconductor product produced and marketed under the brand name BAYTRON by the company BAYER CHEMIE in Germany.
- This product has the advantage of being transparent, very stable and insensitive to ultraviolet radiation, while the surface resistance can be adjusted over large ranges of values.
- the optimal resistivity of the films thus produced is close to 0.68 ohm / m, which corresponds to a resistance of 0.68 ⁇ 10 6 ohm per square for a thickness of 1 ⁇ m.
- the protection device object of the present invention, can advantageously comprise, in addition to the aforementioned electromagnetic absorbent veil disc, bearing the reference 1, as in FIG. 3b, a device electrically conductive, referenced 20 , in electrical contact via conductive elements 2 ⁇ with the absorbent web disc 1, the electrically conductive device assembly 2 . and conductive elements being connected to a damping resistor RT to earth for example, in order to ensure the evacuation of static electrical charges stored in the vicinity of the electromagnetic absorbent web 1.
- the assembly constituted by the electrically conductive device 2 0 and the conductive elements 2 ⁇ directly in contact with the disc in electromagnetic absorbent web 1 can be articulated around an axis 2 3 in order to allow the adapted positioning of the assembly, which can then be aligned on one of the spokes of the CD compact disc.
- FIG. 3d Other embodiments of the absorbent veil disc, in accordance with the object of the present invention, as represented in FIG. 3d, can consist in providing a first electromagnetic absorbent veil disc, bearing the reference l ', constituted by a fabric or texture as mentioned previously in the description, on which is superimposed an absorbent veil disc, bearing the reference 1.
- a first electromagnetic absorbent veil disc bearing the reference l '
- an absorbent veil disc bearing the reference 1.
- the superposition of a first and a second absorbent fleece disc has also been shown to be satisfactory.
- FIG. 3e A particularly advantageous embodiment of a multilayer absorbent web disc, in accordance with the object of the present invention, is described in relation to FIG. 3e.
- the absorbent web 1 is in fact formed by a plurality of electromagnetic absorbent webs la, lb, le, ld, superimposed so as to form a multi-layer composite absorbent web.
- each successive electromagnetic absorbent veil, la to ld has an electrical resistivity pa, pb, pc, pd increasing from the electromagnetic absorbent contact veil la, intended to come into physical contact with the support d 'recording.
- the external electromagnetic absorbent veil ld, opposite the electromagnetic absorbent veil la in the sandwich structure thus produced is constituted by a material that is substantially electrically insulating, the resistivity pd of which is greater than 10 8 ⁇ x m.
- the electromagnetic absorbent veil 1a consisted of a non-woven ISOWAVE copper marketed by the company SCHLEGEL BVA under the reference IWCO.60830.
- the electromagnetic absorbent sheet le consisted of a dissipative PVC material with a pc resistivity of between 2 10 ⁇ 3 and 3 10 "3 ⁇ xm for a thickness of 0.3 to 0.5 mm.
- the material used was the product marketed by SEKISUI CHEMICALS under the reference G406 AS-ELSON / DC
- the electromagnetic absorbent veil ld consisted of a polypropylene plastic sheet with a thickness of 0.1 mm and a resistivity pd> 10 8 ⁇ x m.
- multi-layer electromagnetic absorbent sheets With regard to the use of multi-layer electromagnetic absorbent sheets, it is indicated that the sheets of the aforementioned materials have been superimposed and then assembled using an aerosol adhesive, by pressing, then cut to the dimensions of a recording medium, such as '' a CD disc, outside diameter 12 cm, inside diameter 16 mm. Following experiments, it appeared advantageous not to put the protective device and the CD disc in direct contact, but to interpose an insulating sheet of polycarbonate or polypropylene type, a material commonly used with overhead projectors, of thick between 50 and 150 ⁇ m. Furthermore, as shown in FIG. 3f, the combination of absorbent sheets of different resistivities as described above can be replaced by a stack of 3 to 5 sheets of SCHLEGEL BVA non-woven absorbent copper, ref. I CO.60830 or SCHLEGEL BVA absorbent non-woven silver, ref. NWMP.61027.
- the variety of absorbent materials thus used makes it possible to widen the absorption band for the waves emitted.
- the interposition of an insulating layer le between the CD disc and the first conductive layer ld of the device, object of the invention leads to creating an interval where the emitted wave can be propagated by undergoing multiple reflections and absorptions. , which considerably attenuates it.
- the layers le and lf are thus insulating, 0.1 mm thick.
- one or other of the layers la or lb can be replaced by a non-woven silver SCHLEGEL BVA isowave ref. NWMP.61027 or by a graphite veil.
- FIGS. 4a and 4b Another example of implementation of the device for protecting an electrical circuit against MDIs, in accordance with the object of the present invention, more particularly adapted to the protection of a transducer electromagnetic such as a loudspeaker used in a sound reproduction device of an audio recording and / or video frequencies, will now be described in connection with FIGS. 4a and 4b.
- a loudspeaker is formed by a cylinder head, denoted SH, provided with an air gap E in which a mobile electric coil Co can move, this mobile electric coil being associated with a membrane M, the assembly thus formed constituting an audiofrequency transducer such as a loudspeaker.
- the protection device object of the present invention, makes it possible to protect the moving winding Co against the phenomenon of MDI.
- the aforementioned device is constituted by a protective coating formed by an electromagnetic absorbent veil, bearing the reference l a , as described above, and further thermoformed on the walls of the air gap E of the cylinder head SH, as well as 'an absorbent veil, bearing the reference l b applied, and if necessary thermoformed, on the wall of the membrane M in particular in the vicinity of the moving winding Co.
- the support for the mobile electrical Co winding can also be formed by means of the electromagnetic absorbent veil bearing in this case, in FIG. 4b, the reference 1.
- the membrane M itself can also be produced from such a material, in order to allow the drainage of the static charges which appear on the surface of this membrane M and which, consequently, modify its sound by RAHBECK effect.
- the membrane M can also be covered with a veil of semiconductor product such as the BAYTRON product previously mentioned in the description.
- FIGS. 5a and 5b Another application of the devices for protection against MDI phenomena, in accordance with the object of the present invention, for the protection of vibrating organs such as motors or transformers used in an apparatus for reading an audio recording and / or video frequencies, will now be given in connection with FIGS. 5a and 5b.
- FIG. 5a there is shown, in section, a motor for driving a reading medium such as a compact disc for example, this motor conventionally comprising, in a carcass Ca, a stator winding Stat, a rotor winding Ro and connection and supply wires for the AStat stator and the Aro rotor.
- a tree transmission ensures the training of a capstan, itself adapted to the drive of the recording medium.
- the protection device comprises a protective element 1, which can then be thermoformed around the motor, so as to encapsulate the latter by the aforementioned protective element.
- the protective veil thus formed can be connected to the ground by a damping impedance RT. This can be made up of a resistance of 1.5 M ⁇ and an earth choke of 2.5 mH for example.
- the power cables of these motors can be screened under conditions which will be described later in the description.
- the parasitic radiation phenomenon is the same, and the transformer carcass shown in FIG. 5b can, in the same way, be provided with a protective element 1 constituting an encapsulation of the assembly, as shown in Figure 5b.
- This encapsulation can then be carried out by thermoforming in a similar manner.
- a metallic fabric ME can be superimposed on the encapsulating veil. lation 1, this metallic textile then being connected to earth by the above-mentioned damping impedance.
- the same measure can be taken for the protection of the transformers.
- Another application of the devices for protection against MDI phenomena relates to the protection of boxes of electronic devices, in particular of devices used in the composition of a HiFi system.
- Such an application relates, on the one hand, to the metal boxes, as shown in FIG. 6a, on the other hand, to the electrically insulating boxes, as shown in FIG. 6b, or also to the cable entries in the boxes or boxes of any type, as shown in Figure 6c.
- these boxes or boxes can contain a device for reading an audio and / or video frequency recording from a signal or data recording medium.
- the device for protecting these electronic circuits against MDI phenomena comprises at least one protective coating, denoted 1, formed by an electromagnetic absorbent veil, as described previously in the description.
- an electromagnetic absorbent veil As shown in partial cutaway perspective in FIG. 6a, the electromagnetic absorbent sheet 1 is placed on the internal face of the box.
- the box being electrically conductive, in the embodiment of FIG. 6a, this the latter is also electrically connected to earth via an RT damping impedance.
- the electromagnetic absorbent veil 1 thus makes it possible to prevent the interface micro-discharges generated by the parts of the electrical circuits contained inside the boxes from being thus collected by others, the propagation of the electromagnetic wave associated with these phenomena being thus substantially suppressed.
- the materials capable of being used to produce the above-mentioned internal coatings 1 or external coatings 1 it is indicated that all of the materials previously mentioned in the description can be used.
- the production of a semiconductor film using the BAYTRON product from the company BAYER CHEMIE has made it possible to obtain particularly significant results.
- the semiconductor film thus produced on the internal face of the electrical insulating box was produced by spraying of the BAYTRON product considered, using a film of thickness not exceeding 10 to 20 ⁇ m.
- a particularly advantageous application of the protection device, object of the present invention relates, as shown in FIG. 6c, to the grommets constituting the cable entries in the insulating and / or conducting boxes.
- the electromagnetic wave associated with MDI phenomena propagates as a surface wave at the insulator / air interface of the conductors.
- the implementation of such a grommet can be carried out in the following manner: when the box is provided with a box body COF and a cover COU covering this box body, the gap between the closed cover and the box body constitutes a grommet for cables such as flat cables comprising for example at least the flat cable CP, as shown in section in FIG.
- the electromagnetic wave associated with the phenomena of interface micro-discharges is thus absorbed on arrival in a housing by the coating 1, which makes it possible to reduce the corresponding level of radiation.
- the grommet described in connection with FIG. 6c appears particularly advantageous when the cable CP is a cable sold under the brand FLATLINE, consisting of copper ribbons coated with polytetrafluoroethylene coating.
- the printed circuit board PCB has a first face, on which the components are mounted, and a second face, opposite the first face, comprising the printed circuits, and therefore the metallizations, to which these components are connected.
- the device for protection against the phenomena of interface micro-discharges, object of the present invention comprises a protective element formed by an electromagnetic absorbent veil as described previously in the description. , this protective element bearing the reference 1.
- the protective element can be formed by a simple electromagnetic absorbent veil, as described previously with FIG. 1, in the lower part, on the metallization side, the electromagnetic absorbent veil 1 can be advantageously made up, not only of the veil itself absorbing electromagnetic bearing the reference 1_, but also a layer of insulating material 1 2 affixed on the metallization side.
- the layer of insulating material 1 2 may in fact be constituted by a semiconductor material of sufficiently low resistivity not to cause the short circuit of the metallizations, but of sufficiently high conductivity to ensure proper flow of electrical charges and thus reduce the phenomenon of interface micro-discharges and propagation of the electromagnetic wave associated with them.
- the protective element in the lower part of the PCB printed circuit shown in Figure 7a is formed by the protective veil itself 1 0 and the insulating or semiconductor layer 1 2 above.
- This layer can for example be produced by spraying a layer or film of BAYTRON product manufactured by the company BAYER CHEMIE.
- FIG. 7a a specific printed circuit board, allowing the implementation of audio frequency components in an apparatus for reproduction and amplification of audio and / or video signals, comprising, integrated in this board, a device for protection according to the object of the present invention will now be described in connection with FIG. 7b.
- the printed circuit board advantageously comprises an elementary printed circuit board, denoted PCB, comprising a first face free of printed circuits, the upper face in FIG. 7b, and a second face , opposite this first face and corn- carrying the printed circuits considered, the underside of this printed circuit board PCB shown in FIG. 7b.
- PCB an elementary printed circuit board
- the printed circuit board comprises an electromagnetic absorbent veil, bearing the reference 1, as described previously in the description, this veil being placed on the first face, upper face, of the basic printed circuit board PCB.
- the first face of the elementary wafer made of insulating material referenced IB, of this sandwich structure is intended to receive the audio frequency components, while the second face of the elementary printed circuit board PCB comprising the printed circuits, is intended to receive the connection of the audio frequency components to these printed circuits.
- the electromagnetic absorbent sheet 1 consisting of a metallic textile or, if necessary, a non-woven fabric, forming the above-mentioned sandwich structure, is then laminated between the two PCB and IB wafers.
- the PCB and IB boards can be made of polyethylene.
- trafluoroethylene a material that offers good resistance to interface micro-discharges.
- the sandwich structure thus obtained can then be stabilized by pressing or scaling, optionally followed by baking, in order to ensure sintering of the polytetrafluoroethylene.
- the assembly can then be accompanied by a coating of a semiconductor film from the BAYTRON product previously mentioned in the description.
- the semiconductor film can be affixed to either of the aforementioned faces of the sandwich structure, the upper face or the lower face.
- FIG. 7c This latter embodiment is shown in FIG. 7c in which the film attached to the upper face of the aforementioned sandwich structure bears the reference l ′ and therefore corresponds to a semiconductor film attached under the conditions mentioned above.
- the upper face of the elementary printed circuit board PCB can be separated from the electromagnetic absorbent sheet itself separating the first elementary printed circuit board PCB from the board in insulating material IB via a layer or film of semiconductor material, also bearing the reference l 'because corresponding to a material of the same kind as the layer l' previously mentioned and represented on the upper face of the sandwich structure in Figure 7c.
- the second layer of semiconductor material 1 ′ is then affixed to the upper face of the elementary printed circuit board PCB and thus separates this upper face from the semi-absorbent web. driver 1 above.
- the assembly thus produced can be subjected to the aforementioned scaling and sintering operations.
- FIGS. 8a to 8c Another particularly remarkable application of a device for protecting against micro-discharges from the interface of an electrical circuit, in accordance with the object of the present invention, will now be described in connection with FIGS. 8a to 8c relative to connection cables of apparatus for reading an audio and / or video frequency recording from a medium for recording signals or audio and / or video frequencies, apparatus for amplifying these signals or audio data and / or video frequencies, and audio reproduction of these signals and audio and / or video frequencies.
- the cables likely to benefit from the installation of a protection device can be cables substantially of any kind such as coaxial cables, as well as shown in Figures 8a and 8b, or flat cables such as FLATLINE cables as shown in Figure 8c.
- the cable comprises, on the peripheral face of the latter, a coating bearing the reference 1, formed by an electromagnetic absorbent veil as described previously in the description.
- a coaxial cable was wrapped from an electromagnetic absorbent veil constituted by a woven or non-woven material as described above in the description, this veil being shaped and cut out in the form of strips of given given length. The wrapping is carried out by covering the parts of tape to ensure total recovery of the whole. The junction points of the overlapping strip parts can then be subjected to a spot welding process or the like, in order to maintain the cohesion of the assembly.
- the recovery of the entire coaxial cable is carried out from a longitudinal winding of the material, folding along the edges of a generator of the external part of the coaxial cable considered, and welding of the two raised edges thus formed.
- edges of the covering are simply overlapped and fixed by welding, for example.
- the bare conductors used for wiring or inductance in HiFi installation circuits can be covered with metallic textile by wrapping or wrapping, or any other suitable method, as described in connection with the figures. 8a to 8c.
- the filtering of the parasitic currents thus generated is difficult because the conventional methods by inductance or ferrite are substantially inoperative from approximately 1 GHz. Indeed, the stray capacitances of the coils where the skin effect in the ferrites reduce any inductance effect from a critical frequency corresponding most often to the low threshold of MDI phenomena, that is to say of around 1 GHz.
- the device for protection against the MDI phenomena of an electrical circuit in accordance with the object of the present invention, can also consist, from the electromagnetic absorbent veil previously mentioned in the description, to constitute a protection circuit proper, associated with the electrical circuit to be protected.
- the aforementioned electromagnetic absorbent sheet, bearing the reference 1 can then advantageously be provided with an electrical input connection, denoted Ci, and an electrical outlet connection, denoted Cost .
- the electromagnetic absorbent sheet 1, the input connection and the output connection form a transmission line with very low attenuation below the cut-off frequency thereof and a transmission line with very high attenuation at from and beyond this cutoff frequency.
- the absorption of the electromagnetic wave associated with the MDI phenomena being a function of the overall length of the transmission line thus formed, it is advantageous, in a preferred embodiment, to wind the electromagnetic absorbent veil 1 on itself in order to reduce the ohmic resistance and to increase the length of the path for electromagnetic wave ⁇ gnically and absorption thereof while reducing the overall size of the component thus produced.
- the aforementioned component then has the following properties:
- FIG. 9b the transfer function of such a component is shown when the electromagnetic absorbent veil was a silver woven fabric, sold by the company SCHLEGEL BVA.
- This transfer function represented in logarithmic impedance / frequency coordinates, clearly highlights the characteristics of the aforementioned component for which, for a frequency band between 0 kHz and 15 MHz, the abscissa axis being graduated in frequencies, the impedance of this component varies substantially linearly in a range of values between 0.024 ohm and 00
- the growth of the impedance of the aforementioned component is substantially exponential as a function of the frequency.
- such a component is constituted by a ribbon wound on itself to form a substantially cylindrical element such as a sleeve MA, the electrical input connection Ci and the Cost output electrical connection being formed at the opposite end of the aforementioned cylindrical member or sleeve.
- the winding can be made from a woven fabric or nonwoven tape sold by the so ⁇ ciety SCHLEGEL mentioned above, corresponding to a texture formed from son of silver 5 ⁇ m in diameter coated with conductive polymer.
- the length of the tape or ribbon used for winding can vary from one to ten meters depending on the final resistance to be obtained.
- the table below gives the value of the approximate resistances obtained as a function of the length of the ribbon used.
- the resistance value indicated corresponds to a resistance value measured at the line cutoff frequency as shown in FIG. 9b.
- the ends of the sleeve thus formed can be tied using a copper wire or an electrically conductive wire, in order to ensure the connections of the aforementioned input and output connections.
- the aforementioned ligatures or input / output connections can then advantageously be protected by means of encapsulation sheaths, denoted Gi and Go.
- Resistances of larger values can be obtained by using shorter lengths of electromagnetic absorbent web or, if necessary, by placing several elements in series.
- FIG. 9d Another embodiment of a component constituting a protection device in accordance with the object of the present invention, but more particularly adapted to the implementation of a component itself free of parasitic electromagnetic radiation or to the removal of the latter will now be described in connection with FIG. 9d.
- FIG. 9d there are substantially the same elements as in the case of FIG. 9c, these same elements having the same references.
- the input sheaths Gi and output Go can be replaced by a single sheath, denoted Gi in FIG. 9d.
- an electromagnetic absorbent veil 1 is provided, which surrounds the encapsulation sheath Gi, this electromagnetic absorbent veil 1 being provided with a connection so as to allow the connection of the latter to a reference electrical potential, such as that the earth potential for example, by means of an impedance depreciation, as mentioned previously in the description.
- a second encapsulation sheath G 2 can then be provided so as to ensure the cohesion of the assembly and the protection of the electromagnetic absorbent web 1, as shown in FIG. 9d.
- the input / output sheaths Gi, Go, the first and the second sheath d, G 2 can be produced by a heat-shrinkable sheath.
- these components can advantageously be installed at the critical locations of a HiFi installation, these critical locations being defined as the locations which appreciably allow the free propagation of the electromagnetic wave associated with MDI phenomena by propagation of surface waves type.
- the aforementioned powders can be compressed graphite powders and metallic powders in air or insulating media such as semiconductor polymers.
- FIG. 9c or 9d a silver-nickel textile marketed by the company SCHLEGEL BVA under the reference NWMP 61027, a device being connected in series on the phase and a device being connected in series on the neutral and connected to a spectrum analyzer device.
- NWMP 61027 a silver-nickel textile marketed by the company SCHLEGEL BVA under the reference NWMP 61027
- the above devices or components provide a 30 dB attenuation at 1.8 GHz.
- the attenuation is increased at high frequency where it reaches 50 dB at 1.8 GHz while the attenuation is moderate but regular up to 900 MHz.
- the three components are connected in series and connected on the phase, respectively on the neutral, from the male plug PM and connected to a female plug PF intended to constitute an output plug connected to the spectrum analyzer.
- a box or box made up of a semiconductor material, or if necessary by an insulating material but coated with a semiconductor external coating, as mentioned previously in the description and referenced CO, carried out the maintenance of the the assembly, the external part or the semiconductor case CO being connected by a damping resistor to earth.
- the junction points of the components CCu, CAg-Ni and CFe were themselves connected to the semiconductor package CO or semiconductor coating of the latter, via a resistance circuit R of a few ohms and a capacitance C with a value of 25 pF.
- the RT earth resistance had a value of 1 M ⁇ and was accompanied by a SCHAFFNER type filter, referenced RE1-16 / 4.
- resistors R With regard to the resistors R, it is indicated that the latter were produced by the filament of a vacuum bulb of low power, thus achieving a vacuum resistance free from phenomena of interface micro-discharges.
- semiconductor partitions, denoted Cl made it possible to separate the filtering branch relating to the phase of the filtering branch relating to neutral.
- this component may advantageously comprise, in addition to an external sheath G of insulating material such as a heat-shrinkable material, a first component or circuit Ci and a second component or circuit C 2 .
- the two circuits are connected in series but they are physically separated by means of a substantially cylindrical permanent magnet PM making it possible to generate a longitudinal magnetic excitation H, along the longitudinal axis of symmetry of the first and second component Ci, C 2 .
- the aforementioned magnetic field or excitation allows, on the currents, to exert a magnetron effect, the currents no longer propagating along substantially rectilinear lines, but, due to the magnetron effect thus produced, according to circular paths having as axis of symmetry the longitudinal axis of symmetry XX above.
- the circuits or components Ci, C 2 as shown in FIG. 9f can be identical or distinct, in accordance with the embodiment previously mentioned with FIG. 9e.
- a end sealing Se is provided at each end of the sleeve G.
- this device comprises a first cylindrical element, denoted Ei, formed by an electromagnetic absorbent veil ribbon wound on itself by means of one of the materials previously mentioned in the description and constituting a core central with an input connection and an output connection, denoted Cii respectively Coi.
- a succession of substantially tubular elements denoted E 2 , E 3 in FIG. 9g is also provided, these elements forming sleeves in successive overlap and alternately constituted by a tubular element of electrically insulating material I x , I 2 and a tubular element - Area formed by a winding of electromagnetic absorbent web ribbons E 2 , E 3 , as shown in the aforementioned Figure 9g.
- the tubular elements E 2 , E 3 are produced in a similar manner to the tubular element Ei. They are also provided with an input connection Ci 2 , respectively Ci 3 , and with an output connection Co 2 , respectively Co 3 .
- the assembly thus formed by the first substantially cylindrical element Ei and the succession of tubular elements E 2 , E 3 and their insulating elements Ii, I 2 has, in a cross section plane of this first cylindrical element Ei and of the succession tubular elements I ⁇ , E 2 I 2f E 3 , a succession of concentric circular zones made of electromagnetic absorbent veil tape and electrically insulating material respectively. All of these elements and the input connections Cii to Ci 3 and output Coi to Co 3 thus form a radioelectric filter with capacitance resistances making it possible to attenuate the electromagnetic wave associated with the phenomena of MDI.
- FIG. 9h An electrical diagram equivalent to the interface micro-discharge protection device according to the subject of the present invention, as shown in FIG. 9g, is represented in FIG. 9h. It is a symmetrical T filter made up of elementary T filters with capacity resistances. It is indicated that the capacities C shown in FIG. 9h correspond in fact in a particularly advantageous manner to capacities free from micro-discharges, which are immediately absorbed by the textile in the case where these interface micro-discharges occur.
- FIGS. 10a to 10e show a view in section along a radial plane of a support d CD-type recording with this device.
- the optical data recording medium comprises a metal disk, or a metallization denoted ME, this metallization being associated with a face for recording / reading this data, constituted by a polycarbonate layer, denoted CD.
- the polycarbonate layer CD 0 has an etched face, which is metallized by the metallic layer ME, the metallic layer interface ME-etched face of the polycarbonate layer CD 0 , constituting the reading face CDi of the aforementioned CD recording medium.
- the face of the metal disc or of the metallic layer ME in the form of a disc opposite to the recording face comprises a protective layer of varnish V and, where appropriate, an appropriate serigraphy.
- the latter also comprises an electromagnetic absorbent veil, bearing the reference 1, whose surface electrical resistance is between 0.004 ohm per square and 0.5 ohm per square.
- This electromagnetic absorbent veil makes it possible to attenuate the MDI phenomena and the parasites associated with these phenomena.
- the web 1 is shown superimposed on the layer of varnish V and permanently attached to the latter. It may therefore consist, as mentioned previously in the description, of a layer of semiconductor material such as the BAYTRON material sold by the company BAYER CHEMIE.
- the optical data recording / reading medium provided with a device in accordance with the object of the present invention, comprises an electromagnetic absorbent sheet 1 constituted by a film of transparent semiconductor material formed on the polycarbonate layer CD 0 on the free face of the latter, and therefore facing the recording / reading face denoted CDi.
- the electromagnetic absorbent veil may consist of a film of BAYTRON material also marketed by the company BAYER CHEMIE. The conditions for forming such a film will be described later in the description.
- the absorbent fleece 1 may consist of at least one metallized plastic film affixed to the face opposite to the recording / reading face, that is to say on the free face of the layer of varnish V.
- the layer 1 of metallized conductive plastic material may be a plastic material marketed by SEKISUI CHEMICALS under the reference ELSON G406AS or SOFT PVC of thickness 0.5 or 0.3 mm.
- the absorbent web 1 constituted by a metallized plastic film affixed to the opposite face of the recording / reading face, that is to say on the free face of the layer of varnish V, may further include, as shown in Figure lOd, a coating of electrically insulating material, bearing the reference 3.
- This insulating material, referenced 3 may be constituted by a very insulating synthetic sheet of thickness 0.1 to 0.3 mm and made of a material such as polypropylene.
- the layer of varnish V comprises a layer of semiconductor material 1, in a manner analogous to the embodiment of FIG. 10c, while in addition, the interface produced by metallization ME and the polycarbonate layer CD 0 , that is to say the etched part thereof, is produced by means of a layer of semi-material conductor thin enough to ensure reading of the reading face CDi shown for this reason in the same way as in the case of FIG. 10c.
- the layer allows it, on the one hand, to ensure the reading of the reading face CD X that is that is to say during the illumination by a laser beam, the transmission of this laser beam by the etched face of the polycarbonate layer towards the metallization ME, then the reflection by the latter and the return towards the reading device in l absence of notorious attenuation, whereas this layer of semiconductor material allows it, on the other hand, to appreciably suppress the phenomenon of interface micro-discharges between the polycarbonate insulator and the metallization and, consequently, the phenomena of micro-discharges during excitation by the read laser beam.
- a preferred embodiment of an optical reading data recording-reading medium, such as a CD, in which the absorbent web has a multilayer structure, will now be described in conjunction with FIG. 10O.
- the recording medium in accordance with the object and of the present invention, further comprises a plurality of superimposed electromagnetic absorbent sails, denoted la, lb, le.
- the aforementioned electromagnetic absorbent webs are interposed between the metallization ME and the layer of varnish V, which can constitute the layer le.
- the electromagnetic absorbent webs have an increasing electrical resistivity from the electromagnetic absorbent web of contact la, in physical contact with the surface CD 2 opposite the reading face CDi.
- the electromagnetic absorbent veil can then be constituted by the layer of V epoxy varnish whose electrical resistivity is greater than 10 8 ⁇ xm and serving as a final protective layer.
- the electromagnetic absorbent sheet 1a in physical contact with the metallization layer ME, was constituted by a layer of BAYTRON semiconductor polymer material referenced CCP105T, marketed by BAYER CHEMIE. This layer had a thickness of 7 ⁇ m after hardening and a surface resistance of 10 3 to 10 4 ⁇ per square.
- the electromagnetic absorbent veil 1b in physical contact with the electromagnetic absorbent veil 1a, consisted of a layer of the above-mentioned BAYTRON semiconductor polymer material, of appreciably thick thickness but having after hardening an over-resistance. facie from 10 8 to 10 9 ⁇ per square.
- the method of implementing the successive layers of the multilayer structure will be described later in the description.
- a preferred manufacturing process may consist, from a coded Ep test, of producing by molding, by injection of polycarbonate into an M mold, an engraved pancake GG made of polycarbonate, of depositing by metallic vapor deposition the metallization ME on the engraved face to constitute the CDi reading side, then deposit a layer of varnish on the metallization by centrifugation.
- a film of semiconductor material such as the BAYTRON material is then deposited on the layer of varnish V by centrifugation.
- the centrifugation operation more commonly called “spin coa ting" operation in Anglo-Saxon language in the corresponding technical field, consists in placing the engraved wafer GG provided with its metallization layer ME, provided with its layer of varnish V, on a TE rotary drive table.
- a nozzle A makes it possible to deposit, in the vicinity of the center of the engraved wafer GG, on the layer of varnish V, as shown in FIG. 11, a rod of semiconductor material BSC, while the drive table TE and the wafer engraved GG are moving rotation at low speed, less than or equal to four or five revolutions per minute for example.
- the nozzle A When the flange BSC is formed, the nozzle A is closed and the drive table TE and the engraved wafer GG are driven at high speed, greater than 1500 rpm in two seconds.
- the centrifugal force applied to the strand of BSC semiconductor material causes it to spread into a homogeneous layer over the entire surface of varnish V.
- Curing processes by crosslinking with UV radiation can be applied when the material MSC semiconductor used is a polymer such as BAYTRON.
- the layer of varnish V is replaced directly by the layer of semiconductor material.
- a film of semiconductor material such as BAYTRON material, is deposited on the free face, not etched, of the polycarbonate wafer GG.
- the deposition is carried out by centrifugation.
- a film of semiconductor material is deposited during an intermediate step prior to the metallization step.
- the deposit is also made by centrifugation.
- the deposition of the film of semiconductor material on the varnish layer V, or of the latter is followed by a step of depositing a layer of material insulator, layer 3 shown in Figure lOd. It is indicated in particular that for the implementation of the aforementioned variants, the same process can be implemented on the ME metallization layer or on any suitable intermediate surface.
- each layer of electromagnetic absorbent web can, as shown in FIG. 12a, be implemented by centrifugation, as described in relation to the Figure 11.
- each layer 1a, 1b can then be subjected to a curing process by UV crosslinking for implementation. of the next superimposed layer, as shown in Figure 12b.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Elimination Of Static Electricity (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Noise Elimination (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000573141A JP2002526937A (ja) | 1998-09-29 | 1999-09-28 | 界面マイクロ放電現象に対する電気回路の保護装置 |
| EP99946248A EP1120026A1 (fr) | 1998-09-29 | 1999-09-28 | Dispositif de protection d'un circuit electrique contres les phenomenes de microdecharges d'interface |
| AU58685/99A AU5868599A (en) | 1998-09-29 | 1999-09-28 | Device for protecting an electric circuit against interface microdischarge phenomena |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR98/12143 | 1998-09-29 | ||
| FR9812143A FR2784000A1 (fr) | 1998-09-29 | 1998-09-29 | Dispositif de protection d'un circuit electrique contre les phenomenes de microdecharges d'interface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2000019791A1 true WO2000019791A1 (fr) | 2000-04-06 |
Family
ID=9530951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FR1999/002300 Ceased WO2000019791A1 (fr) | 1998-09-29 | 1999-09-28 | Dispositif de protection d'un circuit electrique contre les phenomenes de microdecharges d'interface |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1120026A1 (fr) |
| JP (1) | JP2002526937A (fr) |
| AU (1) | AU5868599A (fr) |
| FR (1) | FR2784000A1 (fr) |
| WO (1) | WO2000019791A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2172082C1 (ru) * | 2000-06-06 | 2001-08-10 | Дочернее государственное унитарное предприятие "Научно-производственный центр спутниковых координатно-временных технологий "КОТЛИН" Федерального государственного унитарного предприятия "Российский институт радионавигации и времени" | Радиоэлектронный блок с внутриплатной экранировкой |
| RU2175821C1 (ru) * | 2000-06-06 | 2001-11-10 | Дочернее государственное унитарное предприятие "Научно-производственный центр спутниковых координатно-временных технологий "КОТЛИН" Федерального государственного унитарного предприятия "Российский институт радионавигации и времени" | Радиоэлектронный блок |
| RU2351103C1 (ru) * | 2007-10-08 | 2009-03-27 | ОАО "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") | Радиоэлектронный блок с внутриплатной экранировкой |
| US10219381B2 (en) | 2017-03-22 | 2019-02-26 | Carling Technologies, Inc. | Circuit board mounted switch with electro static discharge shield |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2811510B1 (fr) * | 2000-07-06 | 2002-10-11 | Electricite De France | Dispositif de protection d'un circuit electronique contre les parasites engendres dans ce circuit par le phenomene de micro-decharges d'interface |
| FR2823634B1 (fr) * | 2001-04-13 | 2003-05-30 | Pierre Henri Raymond Johannet | Dispositif de protection des conducteurs electriques contre les microdecharges d'interface (mdi) |
| FR2827116A1 (fr) * | 2001-07-03 | 2003-01-10 | Pierre Johannet | Dispositif de protection des conducteurs et haut-parleurs contre les microdecharges d'interface (mdi) |
| FR2831385A1 (fr) * | 2001-10-23 | 2003-04-25 | Pierre Henri Raymond Johannet | Dispositif de protection des conducteurs et lecteurs de disques numeriques contre les microdecharges d'interface (mdi) |
| FR2834858A1 (fr) * | 2002-01-16 | 2003-07-18 | Pierre Henri Raymond Johannet | Dispositif de protection des haut-parleurs contre la distorsion ionique de couplage a l'air (dica) |
| JP5341608B2 (ja) * | 2008-09-11 | 2013-11-13 | ソフトバンクBb株式会社 | 小型基地局、中継機器、通信方法 |
| CN113438796B (zh) * | 2021-04-29 | 2022-03-01 | 武汉芯宝科技有限公司 | 可吸收瞬间高压脉冲能量的电路板及制作方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0043040A1 (fr) * | 1980-07-01 | 1982-01-06 | Bayer Ag | Matière composée pour le blindage contre rayonnement électro-magnétique |
| EP0602664A2 (fr) * | 1992-12-18 | 1994-06-22 | MY-T ONKEN Co. Ltd. | Eléments en feuilles configurés spécifiquement pour améliorer la compatibilité électromagnétique |
| FR2754630A1 (fr) * | 1996-10-10 | 1998-04-17 | Electricite De France | Procede de fabrication d'un conducteur, ou circuit electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant |
-
1998
- 1998-09-29 FR FR9812143A patent/FR2784000A1/fr not_active Withdrawn
-
1999
- 1999-09-28 JP JP2000573141A patent/JP2002526937A/ja active Pending
- 1999-09-28 EP EP99946248A patent/EP1120026A1/fr not_active Withdrawn
- 1999-09-28 AU AU58685/99A patent/AU5868599A/en not_active Abandoned
- 1999-09-28 WO PCT/FR1999/002300 patent/WO2000019791A1/fr not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0043040A1 (fr) * | 1980-07-01 | 1982-01-06 | Bayer Ag | Matière composée pour le blindage contre rayonnement électro-magnétique |
| EP0602664A2 (fr) * | 1992-12-18 | 1994-06-22 | MY-T ONKEN Co. Ltd. | Eléments en feuilles configurés spécifiquement pour améliorer la compatibilité électromagnétique |
| FR2754630A1 (fr) * | 1996-10-10 | 1998-04-17 | Electricite De France | Procede de fabrication d'un conducteur, ou circuit electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2172082C1 (ru) * | 2000-06-06 | 2001-08-10 | Дочернее государственное унитарное предприятие "Научно-производственный центр спутниковых координатно-временных технологий "КОТЛИН" Федерального государственного унитарного предприятия "Российский институт радионавигации и времени" | Радиоэлектронный блок с внутриплатной экранировкой |
| RU2175821C1 (ru) * | 2000-06-06 | 2001-11-10 | Дочернее государственное унитарное предприятие "Научно-производственный центр спутниковых координатно-временных технологий "КОТЛИН" Федерального государственного унитарного предприятия "Российский институт радионавигации и времени" | Радиоэлектронный блок |
| RU2351103C1 (ru) * | 2007-10-08 | 2009-03-27 | ОАО "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") | Радиоэлектронный блок с внутриплатной экранировкой |
| US10219381B2 (en) | 2017-03-22 | 2019-02-26 | Carling Technologies, Inc. | Circuit board mounted switch with electro static discharge shield |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2784000A1 (fr) | 2000-03-31 |
| JP2002526937A (ja) | 2002-08-20 |
| AU5868599A (en) | 2000-04-17 |
| EP1120026A1 (fr) | 2001-08-01 |
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