WO2001053868A3 - Herstellungsverfahren für eine optische sendebaugruppe - Google Patents

Herstellungsverfahren für eine optische sendebaugruppe Download PDF

Info

Publication number
WO2001053868A3
WO2001053868A3 PCT/DE2001/000229 DE0100229W WO0153868A3 WO 2001053868 A3 WO2001053868 A3 WO 2001053868A3 DE 0100229 W DE0100229 W DE 0100229W WO 0153868 A3 WO0153868 A3 WO 0153868A3
Authority
WO
WIPO (PCT)
Prior art keywords
transmission assembly
optical transmission
production method
rod
reflective coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/000229
Other languages
English (en)
French (fr)
Other versions
WO2001053868A2 (de
Inventor
Ralf Dietrich
Mathias Kaempf
Wolfgang Gramann
Martin Weigert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to EP01909501A priority Critical patent/EP1252541A2/de
Publication of WO2001053868A2 publication Critical patent/WO2001053868A2/de
Publication of WO2001053868A3 publication Critical patent/WO2001053868A3/de
Anticipated expiration legal-status Critical
Priority to US10/200,420 priority patent/US6693312B2/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

Eine lichtoptische Sende-Baugruppe wird geformt, indem auf einem transparenten Submountwafer (1) ein Glaswafer (2) befe-stigt und anschließend durch gezielte Sägeschnitte eine V-förmige Ausnehmung (20) zwischen optischen Prismenelementen (2a, 2b) erzeugt wird. In die V-förmige Ausnehmung (20) wird ein stabförmiges Element (12) mit einer Reflexionsbeschich-tung (9) eingebracht, so daß von einem Halbleiterlaser (6) emittierte Laserstrahlung (S) an dem reflexionsbeschichteten stabförmigen Element (12) um 90° umgelenkt wird und durch den Submountwafer (1) hindurchtritt.
PCT/DE2001/000229 2000-01-20 2001-01-15 Herstellungsverfahren für eine optische sendebaugruppe Ceased WO2001053868A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01909501A EP1252541A2 (de) 2000-01-20 2001-01-15 Herstellungsverfahren für eine optische sendebaugruppe
US10/200,420 US6693312B2 (en) 2000-01-20 2002-07-22 Method for fabricating an optical transmitting subassembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10002329A DE10002329A1 (de) 2000-01-20 2000-01-20 Herstellungsverfahren für eine optische Sende-Baugruppe
DE10002329.0 2000-01-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/200,420 Continuation US6693312B2 (en) 2000-01-20 2002-07-22 Method for fabricating an optical transmitting subassembly

Publications (2)

Publication Number Publication Date
WO2001053868A2 WO2001053868A2 (de) 2001-07-26
WO2001053868A3 true WO2001053868A3 (de) 2002-03-21

Family

ID=7628154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/000229 Ceased WO2001053868A2 (de) 2000-01-20 2001-01-15 Herstellungsverfahren für eine optische sendebaugruppe

Country Status (4)

Country Link
US (1) US6693312B2 (de)
EP (1) EP1252541A2 (de)
DE (1) DE10002329A1 (de)
WO (1) WO2001053868A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693312B2 (en) 2000-01-20 2004-02-17 Infineon Technologies Ag Method for fabricating an optical transmitting subassembly

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1568158B1 (de) * 2002-12-04 2006-08-23 Infineon Technologies AG Bidirektionales sende- und empfangsmodul
US7011455B2 (en) * 2003-06-19 2006-03-14 Emcore Corporation Opto-electronic TO-package and method for laser
US7136552B2 (en) * 2003-06-19 2006-11-14 Emcore Corporation TO-packaged optic-fiber receiving interface and method
US9151664B2 (en) 2012-08-03 2015-10-06 Hoya Corporation Usa Submount for optoelectronic, optical, or photonic components
WO2018072610A1 (zh) * 2016-10-17 2018-04-26 西安炬光科技股份有限公司 一种半导体激光器模块及用于无创医疗的方法
US10283018B1 (en) * 2018-05-11 2019-05-07 Jack B. Martin Sign manufacturing system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121014A (ja) * 1984-11-16 1986-06-09 Nec Corp 光・電気混成集積回路
DE3819811A1 (de) * 1988-06-10 1989-12-14 Bosch Gmbh Robert T-koppler fuer lichtwellenleiter
JPH0513749A (ja) * 1991-06-28 1993-01-22 Nippon Telegr & Teleph Corp <Ntt> 光接続回路
US5650123A (en) * 1994-02-25 1997-07-22 Fci-Fiberchem, Inc. Chip level waveguide sensor
EP0822430A2 (de) * 1996-07-31 1998-02-04 Nippon Telegraph And Telephone Corporation Optischer Ablenker in einem Lichtwellenleiter, Verfahren zu dessen Hestellung,und Sägeblatt zur Verwendung bei diesem Verfahren

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4211899C2 (de) * 1992-04-09 1998-07-16 Daimler Benz Aerospace Ag Mikrosystem-Laseranordnung und Mikrosystem-Laser
DE59305898D1 (de) * 1993-12-22 1997-04-24 Siemens Ag Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE19810624A1 (de) * 1998-03-12 1999-09-16 Bosch Gmbh Robert Elektrooptisches Modul
DE10002329A1 (de) * 2000-01-20 2001-08-02 Infineon Technologies Ag Herstellungsverfahren für eine optische Sende-Baugruppe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121014A (ja) * 1984-11-16 1986-06-09 Nec Corp 光・電気混成集積回路
DE3819811A1 (de) * 1988-06-10 1989-12-14 Bosch Gmbh Robert T-koppler fuer lichtwellenleiter
JPH0513749A (ja) * 1991-06-28 1993-01-22 Nippon Telegr & Teleph Corp <Ntt> 光接続回路
US5650123A (en) * 1994-02-25 1997-07-22 Fci-Fiberchem, Inc. Chip level waveguide sensor
EP0822430A2 (de) * 1996-07-31 1998-02-04 Nippon Telegraph And Telephone Corporation Optischer Ablenker in einem Lichtwellenleiter, Verfahren zu dessen Hestellung,und Sägeblatt zur Verwendung bei diesem Verfahren

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 308 (P - 508) 21 October 1986 (1986-10-21) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 276 (E - 1372) 27 May 1993 (1993-05-27) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693312B2 (en) 2000-01-20 2004-02-17 Infineon Technologies Ag Method for fabricating an optical transmitting subassembly

Also Published As

Publication number Publication date
EP1252541A2 (de) 2002-10-30
WO2001053868A2 (de) 2001-07-26
US20030057443A1 (en) 2003-03-27
US6693312B2 (en) 2004-02-17
DE10002329A1 (de) 2001-08-02

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