WO2001076329A1 - Apparatus for plasma processing - Google Patents

Apparatus for plasma processing Download PDF

Info

Publication number
WO2001076329A1
WO2001076329A1 PCT/JP2001/000311 JP0100311W WO0176329A1 WO 2001076329 A1 WO2001076329 A1 WO 2001076329A1 JP 0100311 W JP0100311 W JP 0100311W WO 0176329 A1 WO0176329 A1 WO 0176329A1
Authority
WO
WIPO (PCT)
Prior art keywords
waveguide
microwave
box
quartz
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2001/000311
Other languages
English (en)
French (fr)
Inventor
Yasuyoshi Yasaka
Nobuo Ishii
Kibatsu Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Nihon Koshuha Co Ltd
Original Assignee
Tokyo Electron Ltd
Nihon Koshuha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Nihon Koshuha Co Ltd filed Critical Tokyo Electron Ltd
Priority to EP01901433A priority Critical patent/EP1276356B1/en
Priority to US09/979,719 priority patent/US6910440B2/en
Publication of WO2001076329A1 publication Critical patent/WO2001076329A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/3222—Antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32247—Resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32247—Resonators
    • H01J37/32256—Tuning means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
PCT/JP2001/000311 2000-03-30 2001-01-18 Apparatus for plasma processing Ceased WO2001076329A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP01901433A EP1276356B1 (en) 2000-03-30 2001-01-18 Apparatus for plasma processing
US09/979,719 US6910440B2 (en) 2000-03-30 2001-01-18 Apparatus for plasma processing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000093660 2000-03-30
JP2000-93660 2000-03-30

Publications (1)

Publication Number Publication Date
WO2001076329A1 true WO2001076329A1 (en) 2001-10-11

Family

ID=18608815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/000311 Ceased WO2001076329A1 (en) 2000-03-30 2001-01-18 Apparatus for plasma processing

Country Status (5)

Country Link
US (2) US6910440B2 (ja)
EP (1) EP1276356B1 (ja)
KR (1) KR100789796B1 (ja)
TW (1) TW497367B (ja)
WO (1) WO2001076329A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002058124A1 (en) * 2001-01-18 2002-07-25 Tokyo Electron Limited Plasma device and plasma generating method
WO2003030236A1 (en) * 2001-09-27 2003-04-10 Tokyo Electron Limited Electromagnetic field supply device and plasma processing device
JP2003110312A (ja) * 2001-09-28 2003-04-11 Tokyo Electron Ltd 整合器およびプラズマ処理装置
WO2004077540A1 (ja) * 2003-02-25 2004-09-10 Sharp Kabushiki Kaisha プラズマプロセス装置
JP2006179477A (ja) * 2000-03-30 2006-07-06 Tokyo Electron Ltd プラズマ処理装置
JP2007109670A (ja) * 2006-12-22 2007-04-26 Tokyo Electron Ltd プラズマ処理装置
JP2007188722A (ja) * 2006-01-12 2007-07-26 Tokyo Electron Ltd プラズマ処理装置
US8365096B2 (en) 2007-12-31 2013-01-29 Motorola Mobility Llc Method and apparatus for transparently mapping personalized alert preferences onto thin client devices with differing capabilities
JPWO2023248347A1 (ja) * 2022-06-21 2023-12-28

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6847003B2 (en) * 2000-10-13 2005-01-25 Tokyo Electron Limited Plasma processing apparatus
JP4209612B2 (ja) * 2001-12-19 2009-01-14 東京エレクトロン株式会社 プラズマ処理装置
TW200532060A (en) * 2004-03-19 2005-10-01 Adv Lcd Tech Dev Ct Co Ltd Plasma treatment apparatus and plasma treatment
DE102004030344B4 (de) * 2004-06-18 2012-12-06 Carl Zeiss Vorrichtung zum Beschichten optischer Gläser mittels plasmaunterstützter chemischer Dampfabscheidung (CVD)
JP5082229B2 (ja) * 2005-11-29 2012-11-28 東京エレクトロン株式会社 プラズマ処理装置
JP2008059991A (ja) * 2006-09-01 2008-03-13 Canon Inc プラズマ処理装置及びプラズマ処理方法
TWD123707S1 (zh) * 2006-12-15 2008-07-11 東京威力科創股份有限公司 電漿處理裝置用微波導入天線
USD563951S1 (en) * 2006-12-15 2008-03-11 Tokyo Electron Limited Microwave introducing antenna for a plasma processing apparatus
USD563949S1 (en) * 2006-12-15 2008-03-11 Tokyo Electron Limited Microwave introducing antenna for a plasma processing apparatus
US8753475B2 (en) 2008-02-08 2014-06-17 Tokyo Electron Limited Plasma processing apparatus
JP2010050046A (ja) * 2008-08-25 2010-03-04 Hitachi High-Technologies Corp プラズマ処理装置
US20100059508A1 (en) * 2008-09-05 2010-03-11 Atmel Corporation Semiconductor processing
TW201026162A (en) * 2008-12-25 2010-07-01 Ind Tech Res Inst A long linear-type microwave plasma source using variably-reduced-height rectangular waveguide as the plasma reactor
WO2010110256A1 (ja) * 2009-03-27 2010-09-30 東京エレクトロン株式会社 チューナおよびマイクロ波プラズマ源
JP5440604B2 (ja) 2009-08-21 2014-03-12 東京エレクトロン株式会社 プラズマ処理装置および基板処理方法
JP5710209B2 (ja) 2010-01-18 2015-04-30 東京エレクトロン株式会社 電磁波給電機構およびマイクロ波導入機構
JP2015022940A (ja) * 2013-07-19 2015-02-02 東京エレクトロン株式会社 プラズマ処理装置、異常発振判断方法及び高周波発生器
US10039157B2 (en) * 2014-06-02 2018-07-31 Applied Materials, Inc. Workpiece processing chamber having a rotary microwave plasma source
US9613783B2 (en) * 2014-07-24 2017-04-04 Applied Materials, Inc. Method and apparatus for controlling a magnetic field in a plasma chamber
EP3189376A1 (en) 2015-09-03 2017-07-12 3M Innovative Properties Company Beam expander with a curved reflective polarizer
US10340124B2 (en) * 2015-10-29 2019-07-02 Applied Materials, Inc. Generalized cylindrical cavity system for microwave rotation and impedance shifting by irises in a power-supplying waveguide
JP7194937B2 (ja) * 2018-12-06 2022-12-23 東京エレクトロン株式会社 プラズマ処理装置、及び、プラズマ処理方法
WO2021220329A1 (ja) * 2020-04-27 2021-11-04 株式会社日立ハイテク プラズマ処理装置
KR20210150883A (ko) * 2020-06-04 2021-12-13 삼성전자주식회사 기판 처리 장치
US12084759B2 (en) 2022-01-07 2024-09-10 Wave Power Technology Inc. Artificial diamond plasma production device
TW202514705A (zh) 2023-05-30 2025-04-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 用於將能量提供至具有多個功率信號輸入之電漿腔室的系統以及半導體處理系統
US20250259819A1 (en) * 2024-02-08 2025-08-14 Tokyo Electron Limited Apparatus for plasma processing

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07135095A (ja) * 1993-11-08 1995-05-23 Hitachi Ltd マイクロ波プラズマ処理装置
JPH0878190A (ja) * 1994-09-01 1996-03-22 Kokusai Electric Co Ltd マイクロ波放電装置及び放電方法
JPH08111297A (ja) * 1994-08-16 1996-04-30 Tokyo Electron Ltd プラズマ処理装置
JPH09289099A (ja) * 1996-02-20 1997-11-04 Hitachi Ltd プラズマ処理方法および装置
JPH1092597A (ja) * 1996-09-17 1998-04-10 Hitachi Ltd プラズマ処理方法及び装置
JPH10177994A (ja) * 1996-12-18 1998-06-30 Hitachi Ltd プラズマ処理装置および処理方法
JP2000012290A (ja) * 1998-06-19 2000-01-14 Hitachi Ltd プラズマ処理装置
JP2000058294A (ja) * 1998-08-07 2000-02-25 Furontekku:Kk プラズマ処理装置
JP2000299198A (ja) * 1999-02-10 2000-10-24 Tokyo Electron Ltd プラズマ処理装置
JP2000353695A (ja) * 2000-01-01 2000-12-19 Hitachi Ltd プラズマ処理方法及び装置

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US4593259A (en) * 1983-07-27 1986-06-03 Varian Associates, Inc. Waveguide load having reflecting structure for diverting microwaves into absorbing fluid
JP2993675B2 (ja) * 1989-02-08 1999-12-20 株式会社日立製作所 プラズマ処理方法及びその装置
US5134965A (en) * 1989-06-16 1992-08-04 Hitachi, Ltd. Processing apparatus and method for plasma processing
GB2235590B (en) * 1989-08-21 1994-05-25 Radial Antenna Lab Ltd Planar antenna
JP3044049B2 (ja) 1990-03-14 2000-05-22 株式会社日立製作所 プラズマ処理方法及び装置
JPH03272136A (ja) 1990-03-22 1991-12-03 Hitachi Ltd ドライエッチング装置
US5173641A (en) * 1990-09-14 1992-12-22 Tokyo Electron Limited Plasma generating apparatus
KR0156011B1 (ko) * 1991-08-12 1998-12-01 이노우에 아키라 플라즈마 처리장치 및 방법
EP0725164A3 (en) * 1992-01-30 1996-10-09 Hitachi Ltd Method and apparatus for generating plasma and semiconductor processing methods
JPH065386A (ja) 1992-06-19 1994-01-14 Kobe Steel Ltd 電子サイクロトロン共鳴装置
JP3287041B2 (ja) * 1992-12-28 2002-05-27 株式会社ダイヘン プラズマ処理装置の制御方法
JPH06333848A (ja) 1993-05-27 1994-12-02 Hitachi Ltd プラズマ生成装置
JPH07263186A (ja) 1994-03-17 1995-10-13 Hitachi Ltd プラズマ処理装置
US5698036A (en) * 1995-05-26 1997-12-16 Tokyo Electron Limited Plasma processing apparatus
US5580387A (en) * 1995-06-28 1996-12-03 Electronics Research & Service Organization Corrugated waveguide for a microwave plasma applicator
DE69719108D1 (de) * 1996-05-02 2003-03-27 Tokyo Electron Ltd Plasmabehandlungsgerät
US5874706A (en) * 1996-09-26 1999-02-23 Tokyo Electron Limited Microwave plasma processing apparatus using a hybrid microwave having two different modes of oscillation or branched microwaves forming a concentric electric field
EP1189493A3 (en) * 1997-05-22 2004-06-23 Canon Kabushiki Kaisha Plasma processing apparatus provided with microwave applicator having annular waveguide and processing method
JP3813741B2 (ja) 1998-06-04 2006-08-23 尚久 後藤 プラズマ処理装置
JP3549739B2 (ja) 1998-08-27 2004-08-04 忠弘 大見 プラズマ処理装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07135095A (ja) * 1993-11-08 1995-05-23 Hitachi Ltd マイクロ波プラズマ処理装置
JPH08111297A (ja) * 1994-08-16 1996-04-30 Tokyo Electron Ltd プラズマ処理装置
JPH0878190A (ja) * 1994-09-01 1996-03-22 Kokusai Electric Co Ltd マイクロ波放電装置及び放電方法
JPH09289099A (ja) * 1996-02-20 1997-11-04 Hitachi Ltd プラズマ処理方法および装置
JPH1092597A (ja) * 1996-09-17 1998-04-10 Hitachi Ltd プラズマ処理方法及び装置
JPH10177994A (ja) * 1996-12-18 1998-06-30 Hitachi Ltd プラズマ処理装置および処理方法
JP2000012290A (ja) * 1998-06-19 2000-01-14 Hitachi Ltd プラズマ処理装置
JP2000058294A (ja) * 1998-08-07 2000-02-25 Furontekku:Kk プラズマ処理装置
JP2000299198A (ja) * 1999-02-10 2000-10-24 Tokyo Electron Ltd プラズマ処理装置
JP2000353695A (ja) * 2000-01-01 2000-12-19 Hitachi Ltd プラズマ処理方法及び装置

Non-Patent Citations (1)

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Title
See also references of EP1276356A4 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179477A (ja) * 2000-03-30 2006-07-06 Tokyo Electron Ltd プラズマ処理装置
US6911617B2 (en) 2001-01-18 2005-06-28 Tokyo Electron Limited Plasma device and plasma generating method
WO2002058124A1 (en) * 2001-01-18 2002-07-25 Tokyo Electron Limited Plasma device and plasma generating method
WO2003030236A1 (en) * 2001-09-27 2003-04-10 Tokyo Electron Limited Electromagnetic field supply device and plasma processing device
JP2003110312A (ja) * 2001-09-28 2003-04-11 Tokyo Electron Ltd 整合器およびプラズマ処理装置
WO2004077540A1 (ja) * 2003-02-25 2004-09-10 Sharp Kabushiki Kaisha プラズマプロセス装置
JP2007188722A (ja) * 2006-01-12 2007-07-26 Tokyo Electron Ltd プラズマ処理装置
JP2007109670A (ja) * 2006-12-22 2007-04-26 Tokyo Electron Ltd プラズマ処理装置
US8365096B2 (en) 2007-12-31 2013-01-29 Motorola Mobility Llc Method and apparatus for transparently mapping personalized alert preferences onto thin client devices with differing capabilities
JPWO2023248347A1 (ja) * 2022-06-21 2023-12-28
WO2023248347A1 (ja) * 2022-06-21 2023-12-28 株式会社日立ハイテク プラズマ処理装置および加熱装置
KR20240001109A (ko) * 2022-06-21 2024-01-03 주식회사 히타치하이테크 플라스마 처리 장치 및 가열 장치
JP7516674B2 (ja) 2022-06-21 2024-07-16 株式会社日立ハイテク プラズマ処理装置および加熱装置
KR102864349B1 (ko) 2022-06-21 2025-09-24 주식회사 히타치하이테크 플라스마 처리 장치 및 가열 장치

Also Published As

Publication number Publication date
KR100789796B1 (ko) 2007-12-31
EP1276356A1 (en) 2003-01-15
EP1276356B1 (en) 2007-08-15
US6910440B2 (en) 2005-06-28
US20020148564A1 (en) 2002-10-17
US20050211382A1 (en) 2005-09-29
TW497367B (en) 2002-08-01
EP1276356A4 (en) 2006-01-04
KR20020088413A (ko) 2002-11-27

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