WO2001077402A3 - Method and apparatus for magnetron sputtering - Google Patents

Method and apparatus for magnetron sputtering Download PDF

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Publication number
WO2001077402A3
WO2001077402A3 PCT/CA2001/000413 CA0100413W WO0177402A3 WO 2001077402 A3 WO2001077402 A3 WO 2001077402A3 CA 0100413 W CA0100413 W CA 0100413W WO 0177402 A3 WO0177402 A3 WO 0177402A3
Authority
WO
WIPO (PCT)
Prior art keywords
cathode
magnet
magnet package
length
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CA2001/000413
Other languages
French (fr)
Other versions
WO2001077402A2 (en
Inventor
Konstantin K Tzatzov
Alexander S Gorodetsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Surface Engineered Products Corp
Original Assignee
Surface Engineered Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surface Engineered Products Corp filed Critical Surface Engineered Products Corp
Priority to AU2001242192A priority Critical patent/AU2001242192A1/en
Priority to EP01914925A priority patent/EP1273028A2/en
Publication of WO2001077402A2 publication Critical patent/WO2001077402A2/en
Publication of WO2001077402A3 publication Critical patent/WO2001077402A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A cathode assembly for magnetron sputtering of a workpiece, and sputtering apparatus and methods of sputtering using same are provided. The cathode assembly includes a tubular cathode, which may be cylindrical in cross section along its length, or which may be curved or flexible, depending on the shape of workpiece that is to be sputtered, and which has a sputtering length of Ls. The cathode assembly also includes a magnet package, or a plurality of spaced magnet packages, each magnet package including either one magnet or a plurality of spaced magnets of alternating polarity, and having a magnet package length Lpkg which is less than Ls. The cathode assembly further includes one or more means for positioning, and preventing radial displacement of, the cathode along the axis of symmetry of the cathode. The magnet package is held within the cathode such that a driving force applied to the magnet package or to the cathode, or to both independently, imparts relative longitudinal movement between the magnet package and the cathode. The cathode assembly preferably includes cooling means. Furthermore, the magnet package(s) is preferably held within the cathode for shuttle movement. The cathode assembly allows for variations of one or more of the magnet package length, number, and spacing, and the relative displacement distance or shuttle distance, in order to tailor the erosion profile along the axis of symmetry of the cathode.
PCT/CA2001/000413 2000-04-07 2001-03-30 Method and apparatus for magnetron sputtering Ceased WO2001077402A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2001242192A AU2001242192A1 (en) 2000-04-07 2001-03-30 Method and apparatus for magnetron sputtering
EP01914925A EP1273028A2 (en) 2000-04-07 2001-03-30 Method and apparatus for magnetron sputtering

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/545,817 2000-04-07
US09/545,817 US6436252B1 (en) 2000-04-07 2000-04-07 Method and apparatus for magnetron sputtering

Publications (2)

Publication Number Publication Date
WO2001077402A2 WO2001077402A2 (en) 2001-10-18
WO2001077402A3 true WO2001077402A3 (en) 2002-03-28

Family

ID=24177669

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CA2001/000413 Ceased WO2001077402A2 (en) 2000-04-07 2001-03-30 Method and apparatus for magnetron sputtering

Country Status (4)

Country Link
US (1) US6436252B1 (en)
EP (1) EP1273028A2 (en)
AU (1) AU2001242192A1 (en)
WO (1) WO2001077402A2 (en)

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US20060049040A1 (en) * 2004-01-07 2006-03-09 Applied Materials, Inc. Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels
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WO2006007504A1 (en) * 2004-07-01 2006-01-19 Cardinal Cg Company Cylindrical target with oscillating magnet from magnetron sputtering
US20060207871A1 (en) 2005-03-16 2006-09-21 Gennady Yumshtyk Sputtering devices and methods
US8470141B1 (en) * 2005-04-29 2013-06-25 Angstrom Sciences, Inc. High power cathode
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
CN101297059A (en) * 2005-10-24 2008-10-29 索莱拉斯有限公司 Cathode incorporating fixed or rotating target in combination with a moving magnet assembly and applications thereof
JP4110175B2 (en) * 2006-03-22 2008-07-02 株式会社神戸製鋼所 Arc ion plating method
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US8940140B2 (en) * 2007-09-05 2015-01-27 Uchicago Argonne, Llc Thin film application device and method for coating small aperture vacuum vessels
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GB2461094B (en) * 2008-06-20 2012-08-22 Mantis Deposition Ltd Deposition of materials
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US20110155568A1 (en) * 2009-12-29 2011-06-30 Sputtering Components, Inc. Indexing magnet assembly for rotary sputtering cathode
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US20120312233A1 (en) * 2011-06-10 2012-12-13 Ge Yi Magnetically Enhanced Thin Film Coating Method and Apparatus
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US20140246311A1 (en) * 2013-03-01 2014-09-04 Poole Ventura, Inc. In-situ sputtering apparatus
US9368330B2 (en) 2014-05-02 2016-06-14 Bh5773 Ltd Sputtering targets and methods
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KR102037065B1 (en) 2015-08-21 2019-10-28 한국과학기술연구원 Apparatus for coating inner surface of metallic tube and method for the same
US9546837B1 (en) 2015-10-09 2017-01-17 Bh5773 Ltd Advanced gun barrel
US20190032197A1 (en) * 2016-02-17 2019-01-31 Innohance Co., Ltd. Cathode for plasma treatment apparatus
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JP7837011B2 (en) * 2021-05-20 2026-03-30 大学共同利用機関法人 高エネルギー加速器研究機構 Non-evaporative getter coating apparatus, method for manufacturing non-evaporative getter coated containers and piping, non-evaporative getter coated containers and piping
EP4195236B1 (en) 2021-12-09 2024-02-21 Platit AG Magnetron sputtering apparatus with a movable magnetic field and method of operating the magnetron sputtering apparatus
DE202022107147U1 (en) * 2022-12-21 2023-01-18 VON ARDENNE Asset GmbH & Co. KG Magnet system arrangement, processing device and vacuum arrangement
CN115976484B (en) * 2022-12-28 2024-11-29 江苏芯德半导体科技股份有限公司 Sputtering process stability assessment method
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Also Published As

Publication number Publication date
EP1273028A2 (en) 2003-01-08
US6436252B1 (en) 2002-08-20
AU2001242192A1 (en) 2001-10-23
WO2001077402A2 (en) 2001-10-18

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