WO2002029385A3 - Procede et appareil de surveillance de traitement de substrat encastre par des techniques d'inspection de traitement multiples - Google Patents

Procede et appareil de surveillance de traitement de substrat encastre par des techniques d'inspection de traitement multiples Download PDF

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Publication number
WO2002029385A3
WO2002029385A3 PCT/US2001/042482 US0142482W WO0229385A3 WO 2002029385 A3 WO2002029385 A3 WO 2002029385A3 US 0142482 W US0142482 W US 0142482W WO 0229385 A3 WO0229385 A3 WO 0229385A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical
substrate
consolidation
monitoring
embedded substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/042482
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English (en)
Other versions
WO2002029385A2 (fr
Inventor
Reginald Hunter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2002029385A2 publication Critical patent/WO2002029385A2/fr
Publication of WO2002029385A3 publication Critical patent/WO2002029385A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

De manière générale, l'invention concerne un appareil et un procédé d'inspection de substrat dans un système de traitement. Plus précisément, l'invention concerne un procédé et un appareil de surveillance de substrat encastré faisant appel à des techniques multiples d'inspection de traitement dans des équipements de traitement de semiconducteurs. Dans un premier aspect, un système d'inspection optique comportant une source lumineuse et un dispositif de réception optique, tel qu'une caméra CCD, sert à illuminer et inspecter un substrat quant à diverses signatures optiques. Une pluralité de systèmes d'inspection optique sont placés à des endroits stratégiques selon une architecture d'outils groupés pour recueillir des informations optiques au cours des étapes de traitement. L'ensemble de la pluralité de systèmes d'inspection optique fonctionne comme un système de surveillance pour déterminer les conditions de traitements du substrat et l'acheminement.
PCT/US2001/042482 2000-10-06 2001-10-05 Procede et appareil de surveillance de traitement de substrat encastre par des techniques d'inspection de traitement multiples Ceased WO2002029385A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/684,263 US6721045B1 (en) 1999-09-07 2000-10-06 Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques
US09/684,263 2000-10-06

Publications (2)

Publication Number Publication Date
WO2002029385A2 WO2002029385A2 (fr) 2002-04-11
WO2002029385A3 true WO2002029385A3 (fr) 2002-12-27

Family

ID=24747348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/042482 Ceased WO2002029385A2 (fr) 2000-10-06 2001-10-05 Procede et appareil de surveillance de traitement de substrat encastre par des techniques d'inspection de traitement multiples

Country Status (3)

Country Link
US (1) US6721045B1 (fr)
TW (1) TW511214B (fr)
WO (1) WO2002029385A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7456977B2 (en) 2002-02-06 2008-11-25 Cyberoptics Semiconductor, Inc. Wireless substrate-like sensor

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261146A (ja) * 2001-03-02 2002-09-13 Hitachi Ltd 半導体集積回路装置の製造方法および半導体製造装置
KR100452317B1 (ko) * 2001-07-11 2004-10-12 삼성전자주식회사 포토리소그래피 공정시스템 및 그 방법
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
US7085622B2 (en) * 2002-04-19 2006-08-01 Applied Material, Inc. Vision system
US7233841B2 (en) * 2002-04-19 2007-06-19 Applied Materials, Inc. Vision system
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US7106434B1 (en) 2003-07-28 2006-09-12 Kla-Tencor Technologies, Inc. Inspection tool
US8313277B2 (en) 2003-11-10 2012-11-20 Brooks Automation, Inc. Semiconductor manufacturing process modules
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US7171334B2 (en) * 2004-06-01 2007-01-30 Brion Technologies, Inc. Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process
KR100577582B1 (ko) * 2004-06-09 2006-05-08 삼성전자주식회사 반도체 포토 스피너 설비 및 이를 이용한 웨이퍼 티칭불량방지방법
US20070196011A1 (en) * 2004-11-22 2007-08-23 Cox Damon K Integrated vacuum metrology for cluster tool
US20060156979A1 (en) * 2004-11-22 2006-07-20 Applied Materials, Inc. Substrate processing apparatus using a batch processing chamber
US7601272B2 (en) * 2005-01-08 2009-10-13 Applied Materials, Inc. Method and apparatus for integrating metrology with etch processing
US20060154388A1 (en) * 2005-01-08 2006-07-13 Richard Lewington Integrated metrology chamber for transparent substrates
US20070042510A1 (en) * 2005-08-19 2007-02-22 Wafermasters, Incorporated In situ process monitoring and control
KR100926117B1 (ko) * 2005-12-30 2009-11-11 엘지디스플레이 주식회사 가상 리뷰를 이용한 검사 시스템 및 그 방법
US7486878B2 (en) * 2006-09-29 2009-02-03 Lam Research Corporation Offset correction methods and arrangement for positioning and inspecting substrates
US20080219810A1 (en) * 2007-03-05 2008-09-11 Van Der Meulen Peter Semiconductor manufacturing process modules
DE102007036814A1 (de) * 2007-08-03 2009-02-12 Vistec Semiconductor Systems Gmbh Koordinaten-Messmaschine zum Vermessen von Strukturen auf einem Substrat
US7773226B2 (en) * 2008-06-05 2010-08-10 3M Innovative Properties Company Web inspection calibration system and related methods
TW201015391A (en) * 2008-10-09 2010-04-16 Elan Microelectronics Corp Optical mouse
US20120266810A1 (en) * 2011-04-20 2012-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Planarization system for high wafer topography
US9128064B2 (en) 2012-05-29 2015-09-08 Kla-Tencor Corporation Super resolution inspection system
US9970818B2 (en) * 2013-11-01 2018-05-15 Tokyo Electron Limited Spatially resolved optical emission spectroscopy (OES) in plasma processing
US10190868B2 (en) * 2015-04-30 2019-01-29 Kla-Tencor Corporation Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing
US10192762B2 (en) * 2016-01-26 2019-01-29 Applied Materials, Inc. Systems and methods for detecting the existence of one or more environmental conditions within a substrate processing system
WO2017205391A1 (fr) * 2016-05-23 2017-11-30 Applied Materials, Inc. Détection de particules pour traitement de substrat
CA3117253A1 (fr) * 2018-10-23 2020-04-30 Asml Netherlands B.V. Appareil d'inspection
WO2021076320A1 (fr) 2019-10-15 2021-04-22 Tokyo Electron Limited Systèmes et procédés de surveillance d'un ou plusieurs caractéristiques d'un substrat
CN114616657A (zh) 2019-11-04 2022-06-10 东京毅力科创株式会社 用于校准多个晶圆检查系统(wis)模块的系统和方法
KR102786705B1 (ko) 2019-11-04 2025-03-25 도쿄엘렉트론가부시키가이샤 분배 시스템을 모니터링하고, 제어하고, 동기화하는 방법 및 시스템
US20210129166A1 (en) 2019-11-04 2021-05-06 Tokyo Electron Limited Systems and Methods for Spin Process Video Analysis During Substrate Processing
US11276157B2 (en) 2019-11-14 2022-03-15 Tokyo Electron Limited Systems and methods for automated video analysis detection techniques for substrate process
US11624607B2 (en) 2020-01-06 2023-04-11 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
KR102874193B1 (ko) 2020-03-10 2025-10-20 도쿄엘렉트론가부시키가이샤 트랙 시스템 내로의 통합을 위한 장파 적외선 열 센서
US11738363B2 (en) 2021-06-07 2023-08-29 Tokyo Electron Limited Bath systems and methods thereof
US12488452B2 (en) 2021-06-16 2025-12-02 Tokyo Electron Limited Wafer bath imaging
US12148647B2 (en) * 2022-01-25 2024-11-19 Applied Materials, Inc. Integrated substrate measurement system
TWI871809B (zh) 2023-10-24 2025-02-01 南亞科技股份有限公司 石英座監測系統及石英座監測方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US5909276A (en) * 1997-03-31 1999-06-01 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
US5940175A (en) * 1996-11-01 1999-08-17 Msp Corporation Method and apparatus for surface inspection in a chamber
EP1030173A1 (fr) * 1999-02-18 2000-08-23 Spectra-Physics VisionTech Oy Dispositif et méthode d'inspection de la qualité d'une surface

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132044A (en) 1981-02-10 1982-08-16 Hitachi Metals Ltd Discriminating method of surface defect
US4499595A (en) 1981-10-01 1985-02-12 General Electric Co. System and method for pattern recognition
US4441124A (en) 1981-11-05 1984-04-03 Western Electric Company, Inc. Technique for inspecting semiconductor wafers for particulate contamination
DE3484982D1 (de) 1983-11-26 1991-10-02 Toshiba Kawasaki Kk Apparat zum nachweis von oberflaechenfehlern.
US4920385A (en) 1984-02-14 1990-04-24 Diffracto Ltd. Panel surface flaw inspection
IL79097A0 (en) 1985-06-17 1986-09-30 Visionetics Corp Automatic optical inspection of printed circuit boards
US4893932A (en) 1986-05-02 1990-01-16 Particle Measuring Systems, Inc. Surface analysis system and method
US4772126A (en) 1986-10-23 1988-09-20 Inspex Incorporated Particle detection method and apparatus
US4898471A (en) 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
US4989973A (en) 1988-10-03 1991-02-05 Nissan Motor Co., Ltd. Surface condition estimating apparatus
US4941980A (en) 1989-02-17 1990-07-17 Opal, Inc. System for measuring a topographical feature on a specimen
US4969748A (en) 1989-04-13 1990-11-13 Peak Systems, Inc. Apparatus and method for compensating for errors in temperature measurement of semiconductor wafers during rapid thermal processing
US5127726A (en) 1989-05-19 1992-07-07 Eastman Kodak Company Method and apparatus for low angle, high resolution surface inspection
NL8902471A (nl) 1989-10-05 1991-05-01 Philips Nv Tweetraps positioneerinrichting.
US5058178A (en) 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
US5233191A (en) 1990-04-02 1993-08-03 Hitachi, Ltd. Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process
US5274434A (en) 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
IL99823A0 (en) 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US5463459A (en) 1991-04-02 1995-10-31 Hitachi, Ltd. Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process
US5177559A (en) 1991-05-17 1993-01-05 International Business Machines Corporation Dark field imaging defect inspection system for repetitive pattern integrated circuits
US5563702A (en) 1991-08-22 1996-10-08 Kla Instruments Corporation Automated photomask inspection apparatus and method
US5486919A (en) 1992-04-27 1996-01-23 Canon Kabushiki Kaisha Inspection method and apparatus for inspecting a particle, if any, on a substrate having a pattern
EP0597637B1 (fr) 1992-11-12 2000-08-23 Applied Materials, Inc. Système et méthode de positionnement automatique d'un substrat dans une chambre de traitement
US5861952A (en) 1992-11-16 1999-01-19 Canon Kabushiki Kaisha Optical inspection method and apparatus including intensity modulation of a light beam and detection of light scattered at an inspection position
US5637881A (en) 1993-04-01 1997-06-10 High Yield Technology, Inc. Method to detect non-spherical particles using orthogonally polarized light
US5479252A (en) 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
US5808735A (en) 1993-06-17 1998-09-15 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
US5416594A (en) 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
DE69322775T2 (de) 1993-08-12 1999-07-22 International Business Machines Corp., Armonk, N.Y. Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls
US5663569A (en) 1993-10-14 1997-09-02 Nikon Corporation Defect inspection method and apparatus, and defect display method
US5578832A (en) 1994-09-02 1996-11-26 Affymetrix, Inc. Method and apparatus for imaging a sample on a device
US5563798A (en) 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
US5465152A (en) 1994-06-03 1995-11-07 Robotic Vision Systems, Inc. Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar structures
US5883710A (en) 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US5864394A (en) 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5774222A (en) 1994-10-07 1998-06-30 Hitachi, Ltd. Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected
EP0718624A3 (fr) 1994-12-19 1997-07-30 At & T Corp Procédé et appareil pour l'illumination des matériaux translucides ou semitransparents
JPH08178857A (ja) 1994-12-21 1996-07-12 Nikon Corp 大型基板用異物検査装置
US5805278A (en) 1995-02-09 1998-09-08 Inspex, Inc. Particle detection method and apparatus
US5903342A (en) 1995-04-10 1999-05-11 Hitachi Electronics Engineering, Co., Ltd. Inspection method and device of wafer surface
US5659172A (en) 1995-06-21 1997-08-19 Opal Technologies Ltd. Reliable defect detection using multiple perspective scanning electron microscope images
JP3140664B2 (ja) 1995-06-30 2001-03-05 松下電器産業株式会社 異物検査方法及び装置
US5644393A (en) 1995-10-19 1997-07-01 Hitachi Electronics Engineering Co., Ltd. Extraneous substance inspection method and apparatus
US5818576A (en) 1995-11-28 1998-10-06 Hitachi Electronics Engineering Co., Ltd. Extraneous substance inspection apparatus for patterned wafer
US5694214A (en) 1996-01-08 1997-12-02 Hitachi Electronics Engineering Co., Ltd. Surface inspection method and apparatus
JPH09196859A (ja) 1996-01-23 1997-07-31 Nec Corp 表面欠陥検査装置
US5822213A (en) 1996-03-29 1998-10-13 Lam Research Corporation Method and apparatus for determining the center and orientation of a wafer-like object
US6012966A (en) 1996-05-10 2000-01-11 Canon Kabushiki Kaisha Precision polishing apparatus with detecting means
US5781693A (en) 1996-07-24 1998-07-14 Applied Materials, Inc. Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween
IL119213A (en) 1996-09-06 2000-08-31 Orbot Instr Ltd Universal chuck for holding plates of various sizes
US5801824A (en) 1996-11-25 1998-09-01 Photon Dynamics, Inc. Large area defect monitor tool for manufacture of clean surfaces
US5889593A (en) 1997-02-26 1999-03-30 Kla Instruments Corporation Optical system and method for angle-dependent reflection or transmission measurement
AU8472898A (en) 1997-06-30 1999-01-19 Semiconductor Technologies & Instruments, Inc. Method and apparatus for inspecting a workpiece
KR19990027324A (ko) 1997-09-29 1999-04-15 윤종용 웨이퍼 인식 시스템을 구비하는 멀티 챔버 시스템과 이를 이용한 웨이퍼 가공방법
US6208751B1 (en) * 1998-03-24 2001-03-27 Applied Materials, Inc. Cluster tool
US6020957A (en) 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
US6707544B1 (en) 1999-09-07 2004-03-16 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US5940175A (en) * 1996-11-01 1999-08-17 Msp Corporation Method and apparatus for surface inspection in a chamber
US5909276A (en) * 1997-03-31 1999-06-01 Microtherm, Llc Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
EP1030173A1 (fr) * 1999-02-18 2000-08-23 Spectra-Physics VisionTech Oy Dispositif et méthode d'inspection de la qualité d'une surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7456977B2 (en) 2002-02-06 2008-11-25 Cyberoptics Semiconductor, Inc. Wireless substrate-like sensor

Also Published As

Publication number Publication date
WO2002029385A2 (fr) 2002-04-11
US6721045B1 (en) 2004-04-13
TW511214B (en) 2002-11-21

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