WO2002074521A1 - Procede et appareil permettant d'eliminer une orientation moleculaire d'un moulage en resine - Google Patents

Procede et appareil permettant d'eliminer une orientation moleculaire d'un moulage en resine Download PDF

Info

Publication number
WO2002074521A1
WO2002074521A1 PCT/JP2002/002435 JP0202435W WO02074521A1 WO 2002074521 A1 WO2002074521 A1 WO 2002074521A1 JP 0202435 W JP0202435 W JP 0202435W WO 02074521 A1 WO02074521 A1 WO 02074521A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded product
infrared
transmission window
irradiation
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/002435
Other languages
English (en)
Japanese (ja)
Inventor
Yasuo Kurosaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Campus Create Co Ltd
Original Assignee
Campus Create Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Campus Create Co Ltd filed Critical Campus Create Co Ltd
Publication of WO2002074521A1 publication Critical patent/WO2002074521A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/0072—After-treatment of articles without altering their shape; Apparatus therefor for changing orientation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment

Definitions

  • the present invention relates to a method and an apparatus for removing the molecular orientation of a resin molded product, and more particularly, to the molecular orientation of a resin molded product used as a precision component such as an electronic device, an optical component, and a micromachine component that requires high dimensional accuracy.
  • the present invention relates to improvement of heat treatment for removal. Background art
  • Very high dimensional accuracy is generally required for resin molded products used for electronic devices such as the base housing that comes into direct contact with the CPU of the computer, and devices for photoelectric transmission. These resin molded products are usually manufactured by injection molding of a high melting point thermoplastic resin.
  • the molded product is sealed in a mold and heated by a heater incorporated in the mold before heat treatment.
  • the warpage that is manifested by plasticization to some extent by heating is corrected.
  • the molded product is sealed in a correction mold, heated by a heater, clamped and held, cooled, and then removed from the mold.
  • an object of the present invention is to remove the residual molecular orientation in a resin molded product in a short time, to improve the surface flatness of the product with high processing efficiency, and to remove internal residual distortion. Is to do. Disclosure of the invention
  • At least one infrared transmission window is formed in a part of the molded product die, and the resin molded product is inserted into the die as if the surface faces the transmission window.
  • the gist is that the posture is fixed, and at least one infrared irradiation source is arranged so as to be directed to the transmission window, and the surface of the molded article is irradiated with infrared light from the irradiation source through the transmission window. I do.
  • Fig. 3 shows the temperature distribution inside the molded article due to heating.
  • the case of the present invention is shown by a solid line in the figure, and the left side in the figure is an infrared transmission window, and the right side is a molded product.
  • the dotted line in FIG. 3 shows the case of conventional heater heating.
  • the left side of the figure is a metal plate provided with a heater, and the right side is a molded product.
  • the temperature distribution in the molded article drops from the surface, and no rise in the temperature near the surface is observed as in the present invention.
  • FIG. 1 is a model diagram showing the configuration of the apparatus of the present invention for irradiating infrared rays to one side of a molded article
  • Fig. 2 is a model diagram showing the configuration of the apparatus of the present invention for irradiating infrared rays to both sides of a molded article
  • Fig. 3 is a model diagram showing the temperature gradient in the molded article during heating
  • Fig. 4 is an explanatory diagram showing the concept of infrared irradiation heating according to the present invention
  • FIG. 6 is a transmission spectrum diagram of a molding material
  • FIG. 6 is a side view showing a more specific configuration of the apparatus of FIG. 1, and FIG.
  • FIG. 7 is a more specific configuration of the apparatus of FIG. Fig. 8 is a graph showing the results of warpage measurement before and after reflow of a molded product that has not been subjected to infrared radiation heating, and Fig. 9 is the temperature over time of the molded product during single-sided irradiation.
  • FIG. 10 is a graph showing the change.
  • FIG. 10 is a plan view showing the lateral fixed points in the case of FIG. Fig. 1 is a graph showing the amount of product warpage when heated to 250 ° C by single-sided infrared irradiation, and Fig. 1 2 is the molded product warpage when heated to 300 ° C by one-sided infrared irradiation.
  • Fig. 10 is a plan view showing the lateral fixed points in the case of FIG. Fig. 1 is a graph showing the amount of product warpage when heated to 250 ° C by single-sided infrared irradiation
  • Fig. 1 2 is the
  • FIG. 13 is a graph showing the amount of warpage of the molded product when heated to 330 ° C by single-sided infrared irradiation.
  • FIG. 15 is a graph showing temperature change
  • FIG. 15 is a graph showing the amount of warpage when heated to 250 ° C. by double-sided infrared irradiation
  • FIG. 16 is a graph showing 300 ° C. to 300 ° C. by double-sided infrared irradiation.
  • Fig. 17 is a graph showing the amount of warpage when heated to 330 ° C by double-sided infrared irradiation.
  • FIG. 4 shows the concept of the present invention.
  • Infrared radiation heating is performed from an external infrared source on a molded product enclosed in a mold having an infrared transmission window.
  • FIG. 1 shows an example of single-sided infrared irradiation.
  • the resin molded product P is inserted into the mold 1 to fix the posture, and the infrared transmitting window 3 is in close contact with the target surface (for example, the electronic device mounting surface of the molded product).
  • Irradiation is performed from an infrared irradiation source (not shown) as shown by an arrow. Infrared irradiation is performed until the center of the target surface reaches a certain temperature.
  • Fig. 6 shows a more specific configuration.
  • FIG. 2 shows an embodiment of double-sided infrared irradiation.
  • the resin molded product P is inserted into the mold 1, the posture is fixed, and the infrared transmitting window 3 is in close contact with both surfaces of the object (for example, the electronic device mounting surface of the molded product). Then, infrared light is irradiated from an infrared irradiation source (not shown) as shown by the arrow.
  • an infrared irradiation source not shown
  • Fig. 7 shows a more specific configuration.
  • the experiment was basically performed in the order of “warpage measurement ⁇ irradiation heating ⁇ warpage measurement ⁇ reflow ⁇ warpage measurement”.
  • 20 molded products were randomly selected and the average value was taken as the initial value of the molded product.
  • Reflow was performed at about 220 ° C.
  • the molded product was fixed on a measuring table, and two diagonal lines (X, Y) were placed at 9 points at 5 mm intervals on the thick part on the surface. And the amount of warpage (Z) was measured.
  • the molded article was placed in a mold, and infrared radiation heating was performed until the maximum surface temperature of the molded article reached a predetermined value.
  • the maximum surface temperature of the molded article 250 ° C, 300 ° C and 330 ° C were selected, and the loads by bolting were 1.5 kgf, llkgf, and 40 kgf. In the case of single-sided irradiation, a load of 80 kgf was also applied.
  • Figure 8 shows the results of the warpage measurement before and after reflow for the molded product that was not subjected to infrared radiation heating.
  • the horizontal axis indicates the position (mm) of the diagonal line, and the vertical axis indicates the warpage Z ( ⁇ m) of the molded product.
  • the warpage has increased more than three times by the reflow process. It is considered that the internal residual stress generated during injection molding was released by the heat applied during these reflow treatments.
  • Figure 9 shows the temperature rise of the molded product over time when infrared radiation was applied at a maximum output from a position 9 cm away from the molded product. The measurement points are shown in FIG.
  • Fig. 11 shows the warped state when the temperature of the center of the molded product's CPU mounting surface reaches 250 ° C
  • Fig. 12 shows the warped state when the temperature reaches 300 ° C.
  • the state of warpage when the temperature reaches 0 ° C is shown in Figure 13 respectively.
  • Figure 15 shows an example of the state of warpage when the center temperature of the electronic device mounting surface is 250 ° C in the case of double-sided infrared irradiation
  • Figure 16 shows an example of the state at 300 ° C.
  • An example of the state at 330 ° C. is shown in FIG. 17, respectively.
  • the amount of warpage after irradiation was almost the same under any of the irradiation conditions. This is presumably because the deformation temperature of the molded product was lower than 250 ° C.
  • the return of the warp during reflow after irradiation increases. It can be seen that when the surface temperature was raised to 300 ° C.
  • plastic materials are opaque to infrared rays and absorb the projection energy well, so that heating is performed efficiently. Since the mold itself does not generate heat, the temperature gradient between the molding and the mold is always in the direction of cooling. Therefore, the time required for reversing the temperature gradient in the conventional heater heating is not required, and the processing time can be greatly reduced.

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé et un appareil permettant d'éliminer une orientation moléculaire résiduelle d'un moulage en résine provoquée par un court temps de chauffage permettant d'améliorer la planéité d'une surface d'un produit avec une efficacité de traitement élevée. Au moins une fenêtre d'émission d'infrarouges est fabriquée au niveau d'une partie d'une matrice de moulage et un moulage en résine est inséré dans la fenêtre d'émission de sorte que la surface du moulage de résine fasse face à la fenêtre d'émission, puis l'attitude de ladite fenêtre est fixée. Au moins une source de rayonnement infrarouge est disposée de sorte à orienter la fenêtre d'émission, et la surface du moulage subit le rayonnement infrarouge provenant de la source de rayonnement et passant à travers la fenêtre d'émission.
PCT/JP2002/002435 2001-03-16 2002-03-14 Procede et appareil permettant d'eliminer une orientation moleculaire d'un moulage en resine Ceased WO2002074521A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-76181 2001-03-16
JP2001076181A JP4549562B2 (ja) 2001-03-16 2001-03-16 樹脂成形品の分子配向除去方法と装置

Publications (1)

Publication Number Publication Date
WO2002074521A1 true WO2002074521A1 (fr) 2002-09-26

Family

ID=18933159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/002435 Ceased WO2002074521A1 (fr) 2001-03-16 2002-03-14 Procede et appareil permettant d'eliminer une orientation moleculaire d'un moulage en resine

Country Status (3)

Country Link
JP (1) JP4549562B2 (fr)
CN (1) CN1498159A (fr)
WO (1) WO2002074521A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4234143B2 (ja) * 2006-02-15 2009-03-04 テクノポリマー株式会社 樹脂成形方法及び樹脂成形装置
JP4234130B2 (ja) * 2005-11-15 2009-03-04 テクノポリマー株式会社 樹脂成形方法及び樹脂成形装置
JP4234142B2 (ja) * 2006-02-15 2009-03-04 テクノポリマー株式会社 樹脂成形方法及び樹脂成形装置
KR100950873B1 (ko) 2005-11-15 2010-04-06 니혼 렉스 가부시키가이샤 수지 성형 방법 및 수지 성형 장치
JP4252586B2 (ja) * 2006-07-10 2009-04-08 テクノポリマー株式会社 樹脂成形装置
JP2008188953A (ja) * 2007-02-07 2008-08-21 Univ Of Electro-Communications プラスチック製スタンパの製造方法、プラスチック製スタンパ、及び、プラスチック製基板の製造方法
JP6129592B2 (ja) * 2013-03-11 2017-05-17 本田技研工業株式会社 繊維含有樹脂体の加熱方法、及び、加熱装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144939A (en) * 1980-04-15 1981-11-11 Matsushita Electric Works Ltd Apparatus for confirming filling-up of metal mold
JPS5770608A (en) * 1980-10-22 1982-05-01 Ricoh Co Ltd Compression molding method of plastic
US4594204A (en) * 1983-10-05 1986-06-10 Bayer Aktiengesellschaft Process for annealing thermoplastically-shaped plastics parts
JPS63193937A (ja) * 1987-02-05 1988-08-11 Kyowa Gas Chem Ind Co Ltd 樹脂成形品のアニ−リング方法
JPH08216194A (ja) * 1995-02-10 1996-08-27 Yasuo Kurosaki 高分子射出成形装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144939A (en) * 1980-04-15 1981-11-11 Matsushita Electric Works Ltd Apparatus for confirming filling-up of metal mold
JPS5770608A (en) * 1980-10-22 1982-05-01 Ricoh Co Ltd Compression molding method of plastic
US4594204A (en) * 1983-10-05 1986-06-10 Bayer Aktiengesellschaft Process for annealing thermoplastically-shaped plastics parts
US4594204B1 (en) * 1983-10-05 1998-03-03 Bayer Ag Process for annealing thermoplastically-shaped plastics parts
JPS63193937A (ja) * 1987-02-05 1988-08-11 Kyowa Gas Chem Ind Co Ltd 樹脂成形品のアニ−リング方法
JPH08216194A (ja) * 1995-02-10 1996-08-27 Yasuo Kurosaki 高分子射出成形装置

Also Published As

Publication number Publication date
CN1498159A (zh) 2004-05-19
JP4549562B2 (ja) 2010-09-22
JP2002273764A (ja) 2002-09-25

Similar Documents

Publication Publication Date Title
CN104582940B (zh) 退火方法、退火夹具和退火装置
JPS57608A (en) Method of manufacturing contact lens and contact lens manufactured thereby
WO2002074521A1 (fr) Procede et appareil permettant d'eliminer une orientation moleculaire d'un moulage en resine
KR920009914B1 (ko) 플라스틱 패키지내의 반도체칩 내장방법
JPH026107A (ja) 繊維強化プラスチックのマイクロ波による加熱、硬化方法
US11065805B2 (en) Warpage reduction device and warpage reduction method
JPS6127212A (ja) 合成樹脂成形用型
US6440501B2 (en) Apparatus and method for curing silicone rubber
CN103309006B (zh) 镜头片的制作方法
JP3879143B2 (ja) レンズ素材の製造方法と成形レンズの製造方法およびレンズ素材の製造装置
JP5231314B2 (ja) 接合光学素子及びその製造方法
JP2011513166A (ja) 加熱成形によるガラス製品の製造装置及び製造方法
JP3560098B2 (ja) 光硬化性樹脂を用いた樹脂シートの製造方法
JP2005131798A (ja) 樹脂成形体の製造方法
JP3103393B2 (ja) 射出成形金型の加熱装置及び射出成形金型の加熱昇温方法
GB2088273A (en) Method of making biaspherical optical elements
Sato et al. Straightening of warped products assisted by near-infrared radiation
CN101798486A (zh) 一种胶接方法
JPS5923537B2 (ja) ポリエステルフイルムの深紋り加工法
JPS62143001A (ja) 透明樹脂板の製造方法
JP2025162661A (ja) センサ装置の製造方法
JP2003311822A (ja) 樹脂成形体の製造方法及びその製造装置
KR101284843B1 (ko) 피치랙 가이드 고주파열처리 장치
JP2005158873A (ja) 半導体装置の製造方法
JP3359631B2 (ja) 複合型光学素子の製造方法および製造装置

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 028066987

Country of ref document: CN

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase