WO2003009362A1 - Polishing element, cmp polishing device and productionj method for semiconductor device - Google Patents

Polishing element, cmp polishing device and productionj method for semiconductor device Download PDF

Info

Publication number
WO2003009362A1
WO2003009362A1 PCT/JP2002/006780 JP0206780W WO03009362A1 WO 2003009362 A1 WO2003009362 A1 WO 2003009362A1 JP 0206780 W JP0206780 W JP 0206780W WO 03009362 A1 WO03009362 A1 WO 03009362A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
wafer
productionj
elastic member
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/006780
Other languages
English (en)
French (fr)
Inventor
Susumu Hoshino
Yutaka Uda
Isao Sugaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Priority to JP2003514607A priority Critical patent/JPWO2003009362A1/ja
Priority to US10/467,627 priority patent/US20040242132A1/en
Priority to EP02743826A priority patent/EP1408538A4/en
Priority to KR1020037007085A priority patent/KR100564125B1/ko
Publication of WO2003009362A1 publication Critical patent/WO2003009362A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/20—Mountings for the wheels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
PCT/JP2002/006780 2001-07-19 2002-07-04 Polishing element, cmp polishing device and productionj method for semiconductor device Ceased WO2003009362A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003514607A JPWO2003009362A1 (ja) 2001-07-19 2002-07-04 研磨体、ｃｍｐ研磨装置及び半導体デバイスの製造方法
US10/467,627 US20040242132A1 (en) 2001-07-19 2002-07-04 Polishing element, cmp polishing device and productionj method for semiconductor device
EP02743826A EP1408538A4 (en) 2001-07-19 2002-07-04 POLISHING ELEMENT, CMP POLISHING DEVICE AND MANUFACTURING METHOD FOR A SEMICONDUCTOR COMPONENT
KR1020037007085A KR100564125B1 (ko) 2001-07-19 2002-07-04 연마체, 화학 기계적 연마 장치 및 반도체 디바이스의제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001219431 2001-07-19
JP2001-219431 2001-07-19

Publications (1)

Publication Number Publication Date
WO2003009362A1 true WO2003009362A1 (en) 2003-01-30

Family

ID=19053436

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/006780 Ceased WO2003009362A1 (en) 2001-07-19 2002-07-04 Polishing element, cmp polishing device and productionj method for semiconductor device

Country Status (7)

Country Link
US (1) US20040242132A1 (ja)
EP (1) EP1408538A4 (ja)
JP (1) JPWO2003009362A1 (ja)
KR (1) KR100564125B1 (ja)
CN (1) CN1224082C (ja)
TW (1) TW537945B (ja)
WO (1) WO2003009362A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007021604A (ja) * 2005-07-13 2007-02-01 Nitta Haas Inc 研磨布固定用の両面粘着テープおよびこれを備えた研磨布
JP2008307610A (ja) * 2007-06-12 2008-12-25 Nikon Corp 研磨パッドのサイズ設定方法
JP2011507720A (ja) * 2007-12-31 2011-03-10 イノパッド，インコーポレイテッド 化学的機械的平坦化パッド
KR20150080696A (ko) * 2014-01-02 2015-07-10 주식회사 엘지실트론 웨이퍼 연마 장치
WO2020115867A1 (ja) * 2018-12-06 2020-06-11 三菱電機株式会社 Ｏｓｒ貼り付け装置及びｏｓｒ貼り付け方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004023009A (ja) 2002-06-20 2004-01-22 Nikon Corp 研磨体、研磨装置、半導体デバイス及び半導体デバイス製造方法
JP4876215B2 (ja) * 2005-01-21 2012-02-15 独立行政法人産業技術総合研究所 Ｃｍｐ研磨方法、ｃｍｐ研磨装置、及び半導体デバイスの製造方法
US7348276B2 (en) * 2005-03-30 2008-03-25 Fujitsu, Limited Fabrication process of semiconductor device and polishing method
EP1981685B1 (en) * 2006-01-30 2012-05-30 MEMC Electronic Materials, Inc. Double side wafer grinder and methods for assessing workpiece nanotopology
DE202006004193U1 (de) * 2006-03-14 2006-06-08 Richter, Harald Adapterplatte für einen Vakuumsauger
KR100901982B1 (ko) * 2007-07-12 2009-06-08 주식회사 실트론 접착강도 시험장치
DE102010040512B4 (de) 2010-09-09 2016-03-10 Infineon Technologies Ag Chip mit einer Hochfrequenzschalteranordnung und Schaltungsanordnung, Verfahren zur Herstellung einer Hochfrequenzschaltungsanordnung
CN105500186A (zh) * 2016-01-21 2016-04-20 苏州新美光纳米科技有限公司 晶片抛光用抛光垫及抛光垫的自吸附方法
JP6765267B2 (ja) * 2016-09-28 2020-10-07 株式会社ディスコ 研磨ユニット
JP6986930B2 (ja) * 2017-11-07 2021-12-22 株式会社荏原製作所 基板研磨装置および研磨方法
CN109648463B (zh) * 2018-12-14 2021-04-23 厦门大学 一种半导体晶片光电化学机械抛光加工方法
CN113414717A (zh) * 2021-08-05 2021-09-21 燕山大学 一种复合杯形抛光轮及其抛光方法
CN115704677B (zh) * 2021-08-13 2025-11-14 长鑫存储技术有限公司 一种计量标准器及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0950974A (ja) * 1995-08-07 1997-02-18 Sony Corp 研磨布及び半導体装置の製造方法
EP0845328A2 (en) * 1996-11-29 1998-06-03 Sumitomo Metal Industries, Ltd. Polishing pad and apparatus for polishing a semiconductor wafer
JPH11156701A (ja) * 1997-11-28 1999-06-15 Nec Corp 研磨パッド

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287663A (en) * 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
JP2891083B2 (ja) * 1993-12-14 1999-05-17 信越半導体株式会社 シート状研磨部材およびウエーハ研磨装置
US6099954A (en) * 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5921856A (en) * 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same
US5931724A (en) * 1997-07-11 1999-08-03 Applied Materials, Inc. Mechanical fastener to hold a polishing pad on a platen in a chemical mechanical polishing system
US5882251A (en) * 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
JP2001054859A (ja) * 1999-08-20 2001-02-27 Nikon Corp 研磨装置及び研磨部材
JP2001160545A (ja) * 1999-12-02 2001-06-12 Okamoto Machine Tool Works Ltd 半導体基板上の白金層の化学機械研磨方法
US6402591B1 (en) * 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6561889B1 (en) * 2000-12-27 2003-05-13 Lam Research Corporation Methods for making reinforced wafer polishing pads and apparatuses implementing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0950974A (ja) * 1995-08-07 1997-02-18 Sony Corp 研磨布及び半導体装置の製造方法
EP0845328A2 (en) * 1996-11-29 1998-06-03 Sumitomo Metal Industries, Ltd. Polishing pad and apparatus for polishing a semiconductor wafer
JPH11156701A (ja) * 1997-11-28 1999-06-15 Nec Corp 研磨パッド

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1408538A4 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007021604A (ja) * 2005-07-13 2007-02-01 Nitta Haas Inc 研磨布固定用の両面粘着テープおよびこれを備えた研磨布
JP2008307610A (ja) * 2007-06-12 2008-12-25 Nikon Corp 研磨パッドのサイズ設定方法
JP2011507720A (ja) * 2007-12-31 2011-03-10 イノパッド，インコーポレイテッド 化学的機械的平坦化パッド
KR20150080696A (ko) * 2014-01-02 2015-07-10 주식회사 엘지실트론 웨이퍼 연마 장치
KR101596561B1 (ko) 2014-01-02 2016-03-07 주식회사 엘지실트론 웨이퍼 연마 장치
WO2020115867A1 (ja) * 2018-12-06 2020-06-11 三菱電機株式会社 Ｏｓｒ貼り付け装置及びｏｓｒ貼り付け方法
JPWO2020115867A1 (ja) * 2018-12-06 2021-09-02 三菱電機株式会社 Ｏｓｒ貼り付け装置及びｏｓｒ貼り付け方法
JP7101812B2 (ja) 2018-12-06 2022-07-15 三菱電機株式会社 Ｏｓｒ貼り付け装置及びｏｓｒ貼り付け方法

Also Published As

Publication number Publication date
EP1408538A4 (en) 2008-07-09
TW537945B (en) 2003-06-21
CN1224082C (zh) 2005-10-19
KR20040010566A (ko) 2004-01-31
KR100564125B1 (ko) 2006-03-27
CN1494734A (zh) 2004-05-05
EP1408538A1 (en) 2004-04-14
JPWO2003009362A1 (ja) 2004-11-11
US20040242132A1 (en) 2004-12-02

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