WO2003012884A1 - Systeme d'affichage - Google Patents

Systeme d'affichage Download PDF

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Publication number
WO2003012884A1
WO2003012884A1 PCT/KR2002/001453 KR0201453W WO03012884A1 WO 2003012884 A1 WO2003012884 A1 WO 2003012884A1 KR 0201453 W KR0201453 W KR 0201453W WO 03012884 A1 WO03012884 A1 WO 03012884A1
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WIPO (PCT)
Prior art keywords
layer
light emitting
emitting diode
display system
electrode unit
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Ceased
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PCT/KR2002/001453
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English (en)
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Nam-Young Kim
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Individual
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Individual
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Definitions

  • the present invention relates to a display system, and more particularly, to a display system using a light emitting diode (LED).
  • LED light emitting diode
  • Display systems for forming an image use a CRT (cathode ray tube), PDP (plasma display panel), LCD, VFD, EL, or light emitting device.
  • CTR cathode ray tube
  • PDP plasma display panel
  • LCD liquid crystal display
  • VFD liquid crystal display
  • EL light emitting device
  • a PDP for a large flat display system has a structure in which an image is formed by exciting a fluorescent material using parent rays (ultraviolet rays), which are generated due to plasma discharge formed by electrodes disposed in a discharge space, so a structure for securing the discharge space is complicated, and an opening rate in the discharge space decreases due to the electrodes.
  • parent rays ultraviolet rays
  • a flat and thin display system can be made, but it is difficult to make a large display system. In particular, a large display system using an LCD cannot be made due to the structure of the LCD.
  • the display system includes a substrate 1 , a plurality of monolithic light emitting devices 3 having red, green, and blue LEDs on the substrate 1 , and a first electrode pattern 4 formed on the substrate 1.
  • Each of the LEDs is separated from other LEDs by a separating part 2.
  • a predetermined voltage is applied between a first electrode and a second electrode 5 of each LED, the LEDs arranged in a matrix selectively emit light, thereby forming an image.
  • the plurality of monolithic light emitting devices 3 having red, blue, and green LEDs thereon are arranged on the substrate 1 at predetermined intervals, so it is difficult to manufacture the display system.
  • the LEDs must be planted individually, and the lead line of each second electrode 5 must be wire bonded. Thus, manufacturing is complicated, and it is not easy to make the display system large.
  • a light emitting display system using an LED is disclosed in Japanese Patent Publication No. hei 8-16114.
  • a plurality of chip-type LEDs are mounted on one side of a substrate having a plurality of a conductive layers, and driving circuits for the chip-type LEDs are mounted on the opposite side of the substrate. Since the chip-type LEDs rriust be attached to the substrate, a large number of processes are required.
  • a chip-type LED is disclosed in Japanese Patent Publication No. hei 11-186590. To manufacture the chip-type LED, an LED is installed on a printed substrate, and the LED is coated with epoxy resin.
  • Korean Patent Publication Nos. 1994-0004397, 1999-0041454, and 209925 are patents relating to a light emitting display system using an LED.
  • a display system including a substrate; a first electrode unit formed on the substrate in a predetermined pattern; a light emitting diode layer including a plurality of light emitting diode parts, which are epitaxially grown or deposited on the surface of the first electrode unit in a predetermined pattern so that one side of each light emitting diode part is electrically connected to the first electrode unit; a second electrode unit, which is formed on the surface of the substrate in a predetermined pattern to be electrically connected to the opposite side of each light emitting diode part.
  • the display system also includes a transparent insulation layer having via-holes corresponding to the light emitting diode parts, wherein the second electrode unit is formed on the transparent insulation layer in a predetermined pattern and is electrically connected to the upper surfaces of the light emitting diode parts through the via-holes.
  • the light emitting diode layer comprises a P-type layer, which is epitaxially grown or deposited to be electrically connected to the first electrode unit, and an N-type layer, which is deposited on the surface of the P-type layer to be electrically connected to the second electrode unit.
  • the first electrode unit may include thin film transistors for selectively driving the LED parts.
  • the display system also includes barriers formed in a predetermined pattern in order to optically separate at least three light emitting diode parts forming a pixel from other light emitting diode parts forming adjacent pixels.
  • the display system also includes a graded layer formed between the first electrode unit and the light emitting diode layer in order to grow single crystals having the same lattice constant as a material of the light emitting diode layer.
  • a display system including a substrate; a first electrode unit formed on the surface of the substrate; a light emitting diode layer including a plurality of light emitting diode parts, which is composed of a P-type layer epitaxially grown or deposited on the surface of the first electrode unit in a predetermined pattern and an N-type layer deposited on the P-type layer so that each light emitting diode part is electrically connected to the first electrode unit; a barrier formed around the light ' emitting diode part and separated from each light emitting diode part by a predetermined distance in order to reflect light emitted from the light emitting diode part to the front of the display system; a transparent insulation layer formed on the surface of the substrate having the light emitting diode layer and the barrier; and a second electrode unit formed on the surface of the transparent insulation layer to be electrically connepted to each light emitting diode part.
  • a display system including a substrate; a first electrode unit formed on the substrate in a predetermined pattern; an insulation layer formed on the surface of the first electrode unit; a light emitting diode layer comprising a light emitting part, which is formed by stacking a conductive layer, a P-type layer, and an N-type layer on the insulation layer and cutting the stack in a depth direction to expose the insulation layer, and a plurality of light emitting diode parts, each of which is electrically connected to the first electrode unit; and a second electrode unit, which electrically connects the surfaces of the light emitting diode parts and drives the light emitting diode parts.
  • the display system also includes a barrier formed in an area between adjacent light emitting diode parts.
  • a display system including a substrate; a first electrode unit formed on the substrate in a predetermined pattern; a light emitting diode layer comprising a plurality of light emitting diode parts, which are epitaxially grown or deposited on the surface of the first electrode unit in a predetermined pattern so that one side of each light emitting diode part is electrically connected to the first electrode unit; a barrier separating at least one light emitting diode part from the other light emitting diode parts; a white fluorescent layer formed to correspond to each light emitting diode part, the white fluorescent layer being excited by parent rays emitted from the light emitting diode part; a color filter layer formed on the surface of the white fluorescent layer; and a second electrode unit electrically connected to another side of each light emitting diode part.
  • a display system including a substrate; a first electrode unit formed on the substrate in a predetermined pattern; an insulation layer formed on the surface of the first electrode unit; a conductive layer formed on the surface of the insulation layer to be electrically connected to the first electrode unit; a light emitting diode layer comprising a plurality of light emitting diode parts, each of which is formed by depositing a P-type layer and an N-type layer on the conductive layer and the insulation layer and forming a groove having the shape of a closed loop to surround the P- and N-type layers in an area corresponding to the conductive layer; and a second electrode unit, which electrically connects the surfaces of the light emitting diode parts and drives the light emitting diode parts.
  • a method of manufacturing a display system including preparing a substrate; forming a first electrode unit by performing deposition or printing on the surface of the substrate in a predetermined pattern; forming a light emitting diode layer having a plurality of light emitting diode parts by depositing a P-type layer and an N-type layer in a predetermined pattern, the light emitting diode parts being electrically connected to the first electrode unit; forming an insulation layer to cover the exposed top surface of the substrate and the first electrode unit; forming a transparent insulation layer so that the light emitting diode layer is covered with the transparent insulation layer; and forming a second electrode unit to be insulated from the first electrode unit by the insulation layer and to be electrically connected to the N-type layer of each light emitting diode part.
  • FIG. 1 is a perspective view of a conventional display system.
  • FIG. 2 is a partially cut-away perspective view of a part of a display system according to an embodiment of the present invention.
  • FIG. 3 is a plan view of an example of a first electrode unit.
  • FIG. 4 is a sectional view of the display system shown in FIG. 2.
  • FIG. 5 is a sectional yiew of a display system according to another embodiment of the present invention.
  • FIG. 6 is a plan view of a display system according to the present invention.
  • FIGS. 7 and 8A are sectional views of display systems according to other embodiments of the present invention.
  • FIG. 8B is a partial perspective view of a second electrode according to another embodiment of the present invention.
  • FIG. 9 is a plan view of a display system according to still another embodiment of the present invention.
  • FIG. 10 is a sectional view of the display system shown in FIG. 9.
  • FIGS. 1 1 , 14, and 15 are partially cut-away perspective views of parts of display systems according to other embodiments of the present invention.
  • FIGS. 12, 13, 17, and 18 are sectional views of display systems according to other embodiments of the present invention.
  • FIG. 16 is a sectional view of the display system shown in FIG. 15.
  • FIGS. 19 through 25 are sectional views of the stages in a method of manufacturing a display system according to the present invention.
  • a display system according to the present invention is manufactured by forming light emitting diodes (LEDs) on a substrate using epitaxial growth or deposition.
  • An embodiment of a display system according to the present invention is shown in FIGS 2 through 4.
  • a display system includes a first electrode unit 30 formed on a substrate 21 in a predetermined pattern.
  • the first electrode unit 30 may be composed of X electrode lines 31 , which are formed to be parallel to an X direction in a striped pattern, as shown in FIG. 2.
  • the first electrode unit 30 may be composed of data lines 32, which are formed in an X direction on the upper surface of the substrate 21 ; scan lines 33, which are insulated from the data lines 32; and thin-film transistors 34, which are driven by the scan lines 33 and the data lines 32.
  • the substrate may be formed of glass, plastic, silicon based material, sapphire, or silundum and may be formed of a flexible material.
  • An insulation layer 41 is formed on the upper surface of the substrate 21 having the first electrode unit 30.
  • a via-hole 41 a is formed in areas of the insulation layer 41 in which the pixels can be formed.
  • a conductive layer 42 is formed in the via-hole 41 a to be connected to an X electrode line 31 . Only via-holes exposing the X electrode lines 31 over which an LED layer is deposited can be formed in the insulation layer 41.
  • a reflective layer 43 is formed on the insulation layer 41 to surround the conductive layer 42.
  • the reflective layer 43 is formed of silver epoxy. The reflective layer 43 may be formed on the entire surface of the substrate 21.
  • the LED layer 50 forming a pixel for forming an image is deposited on the surface of the conductive layer 42 connected to the X electrode line 31 of the first electrode unit 30.
  • the LED layer 50 includes of a P-type layer 51, which is epitaxially grown or deposited on the surface of the conductive layer 42; and an N-type layer 52, which is deposited on the surface of the P-type laypr 51.
  • the P-type layer 51 and the N-type layer 52 may be repeatedly stacked and formed of different kinds of material depending on the type of LED layer 50 desired to be formed, as shown in FIG. 5.
  • a graded layer 42a may also be formed on the surface of the conductive layer 42 in order , to smoothly grow the P-type layer 51 during the deposition of the LED layer 50.
  • the graded layer 42a is formed of a material, which has the same lattice constant as a nitride semiconductor material and allows the growth of single crystals.
  • the graded layer 42a may be formed of sapphire powder, silundum powder, or silicon based powder by. spreading the powder on the surface of the conductive layer 42 and then performing heat treatment using plasma or laser.
  • LED layers 50 formed on conductive layers 42 are arranged such that red, green, and blue LED layers 50 emitting light in red, green, and blue, respectively, form a single pixel.
  • the red, green, and blue LED layers 50 may be arranged in a line or in a delta shape. It is preferable that the pitch between the LED layers 50 is between 0.05 and 5 mm.
  • the red LED layer is formed of an AIGalnp based material.
  • the green and blue LED layers are formed of ZnCdMgSeS based material.
  • Each of the LED layers 50 formed on the substrate 21 is covered with a transparent resin layer 54.
  • a second electrode unit 60 is formed on the surface of the insulation layer 41 in order to supply a predetermined current to the N-type layer 52 of a corresponding LED layer 50.
  • the transparent resin layer 54 may be manifested as a color filter layer 55. In this case, red, green, and blue color filter layers are formed on the surfaces of corresponding red, green, and blue LED layers 50 in order to increase the color purity of light emitted from the red, green, and blue LED layers 50.
  • the transparent resin layer 54 may be formed on the surface of the substrate 21 with a uniform thickness so that the LED layers 50 can be covered with the transparent resin layer 54.
  • the color filter layer 55 may be used to form a color image.
  • a white fluorescent layer (not shown) may be formed on the surface of each LED layer 50 so that the white fluorescent layer can emit light due to ultraviolet rays generated from the LED layer, and the color filter layer 55 may be formed on the white fluorescent layer in order to form a color image.
  • the second electrode unit 60 includes a Y electrode line 61 , which is formed on the insulation layer 41 in a direction orthogonal to the X-electrode line 31, and a connection electrode 62, which connects the Y electrode line 61 to the N-type layer 52 of the LED layer 50.
  • the Y and X electrode lines may be formed of aluminum and an aluminum alloy; a conductive polymer containing aluminum, gold, silver, copper, nickel, or chrome; or a transparent conductive layer of ITO.
  • the connection electrode 62 includes a gold wire 62a, which penetrates through the transparent resin layer 54 and is connected to the N-type layer 52, and an auxiliary electrode 62b, which connects the gold wire 62a protruding from the transparent resin layer 54 to the Y electrode line 61.
  • the Y electrode line 61 and the auxiliary electrode 62b may be simultaneously formed using a deposition process.
  • the auxiliary electrode 62b and the gold wire 62a may be formed using deposition. In this case, a conical recess may be formed at an area for the gold wire 62a electrically connected to the N-type layer 52 in the transparent resin layer 54, and then the gold wire 62a may be deposited.
  • FIG. 8A shows another embodiment of a second electrode unit.
  • the second electrode unit includes a connection electrode 66, which penetrates the color filter layer 55 or the transparent resin layer 54 and is electrically connected to an N-type layer, and a transparent conductive layer 67, which is formed on the insulation layer 41 and the color filter layer 55 or the transparent resin layer 54 to be electrically connected to the connection electrode 66.
  • the connection electrode 66 may be formed of a gold wire and, as shown in FIG. 8B, may be formed by forming a conical recess 66a in the transparent conductive layer, 54 or the color filter layer 55 and filling the recess with a transparent conductive material or conductive metal such as gold or silver.
  • Barriers 70 partitioning areas for pixels are formed on the substrate 21 having the first and second electrode units 30 and 60 or the insulation layer 41 in order to prevent cross-talk, thereby increasing the contrast of an image. Shades of colors can be changed according to the height of the barriers 70, so it is preferable to properly adjust the height of the barriers 70 according to installation requirements of a display system.
  • the barriers 70 may be formed in a lattice or polygonal pattern such that at least one pixel can be defined.
  • the barriers 70 are separated from one another at their corners, as shown in FIG. 2, so they can be prevented from being noticed as non-light emitting areas. It is preferable to form the barriers 70 of semitransparent or opaque resin taking into account definition and contrast.
  • a reflective film 71 may be formed on the side of each barrier 70 facing LED layers 50.
  • a protective layer 80 is formed of transparent resin on the surface of the substrate 21 having the barriers 70 in order to protect the second electrode units 60 and the LED layers 50.
  • the protective layer 80 may include a light scatterer (not shown), which can scatter light emitted from the LED layers 50.
  • the light scatterer may be formed of glass powder or crystal powder.
  • At least one light scattering layer 83 for scattering light emitted from the LED layers 50 and a conductive film 81 for blocking static electricity and electromagnetic waves may be formed on the surface of the protective layer 80.
  • the conductive film 81 may be formed by depositing a transparent conductive layer entirely or in a radial or latticed pattern on the surface of the protective layer 80.
  • an external light reflection preventing layer 82 may be formed on the surface of the light scattering layer 83 in order to diffusedly reflect external light.
  • An auxiliary barrier (not shown) having a predetermined height may be formed correspondingly over each barrier 70. An area partitioned by the auxiliary barriers may be filled with a transparent resin layer.
  • FIGS. 9 and 10 show a display system according to still another embodiment of the present invention.
  • the same reference numerals denote the same members.
  • the LED layers 50 are formed by epitaxially growing or depositing the P-type layers 51 and the N-type layers 52 in bulk on the surfaces of the conductive layers 42 exposed over the insulation layer 41 and electrically connected to the first electrode unit 30.
  • a first protective layer 91 is formed of a transparent resin layer on the surface of the substrate 21 so that the LED layers 50 and the insulation layer 41 can be covered with the first protective layer 91.
  • Gold wires 67a electrically connected to the N-type layers 52 protrude above the first protective layer 91.
  • the second electrode units 60 including a transparent conductive layer 67 are formed on the surface of the first protective layer 91 in a direction orthogonal to the X electrode lines 31 of the first electrode unit 30.
  • the transparent conductive layer 67 is electrically connected to the N-type layer 52 of each LED layer 50.
  • a second protective layer 92 is formed by coating the surface of the first protective layer 91 having the second electrode units 60 formed thereon with a transparent resi ⁇ " .
  • the light scattering layer 83 and the conductive film ; 81 may be formed on the surface of the second protective layer 92.
  • the conductive film 81 may be formed of an external light reflection layer, whose surface is processed to prevent the scattering effect of scratches and reflections, or a transparent conductive film in order to block static electricity and electromagnetic waves.
  • the red, greep, and blue LED layers 50 may be formed in order to form a color image.
  • a flat color filter layer (not shown) may be provided in a second electrode unit 60 disposed on each LED layer 50.
  • a white fluorescent layer emitting white light may be formed between the LED layer 50 and the flat color filter layer.
  • the thus-formed display system may be used as a single module, so a large screen can be realized by connecting a plurality of display systems.
  • Reference numeral 70 denotes a barrier.
  • the X and Y electrode lines or scan lines and data lines of the first and second electrode units are connected to one another by a driving circuit for driving the display system and a flexible printed circuit (FPC).
  • the display system having a predetermined size is 'modularized, so a large screen can be realized by connecting a plurality of modularized display systems.
  • a predetermined voltage is applied to the X electrode lines 31 and the Y electrode lines 61 or the data lines, and when a voltage is selectively applied to the scan lines, a predetermined voltage is applied to the P-type layer 51 and N-type layer 52 of each LED layer 50, so current flows in a forward direction.
  • the red, green, and blue LED layers 50 selectively emit light, forming a color image. Since a color filter layer 55 is formed on each LED layer 50, the color purity of the LED layer 50 can be increased, and furthermore white balance characteristics can be increased. In addition, at least one of the red, green, and blue LED layers 50 constituting each pixel is separated from other red, green, and blue LED layers 50 of other pixels by a barrier 70, so cross-talk between the pixels can be prevented.
  • FIGS. 11 and 12 show a display system using an ultra-thin LED according to an embodiment of the present invention.
  • a display system 100 includes a substrate 101.
  • a first electrode unit 102 is formed on the surface of the substrate 101 in a predetermined pattern.
  • a LED layer 103 having LED parts 103a is formed on the substrate 101 having the first electrode unit 102.
  • the LED parts 103a are formed by depositing P-type layers on the first electrode unit 102 at predetermined intervals to be electrically connected to the first electrode unit 102 and epitaxially growing or depositing N-type layers on the respective P-type layers.
  • a barrier 105 is formed to be separated from each LED part 103a by a predetermined distance and to surround each LED part 103a in order to reflect light emitted from the LED parts 103a to the front of the display system.
  • the first electrode unit 102 For the first electrode unit 102, X-electrode lines 102a having the same width as the LED parts 103a are formed on the substrate 101 in a striped pattern parallel to the LED parts 103a. But the first electrode unit 102 is not restricted to the above-described structure and may include thin film transistors for driving the LED parts 103a as described above.
  • the barrier 105 is formed on the entire surface of the substrate 101 to a predetermined thickness and has openings 105a in areas corresponding to the respective LED parts. The sidewall of each opening 105a slants at a predetermined angle.
  • a reflective layer 105b is formed on the inner sidewall and bottom of each opening 105a in order to reflect light emitted from the LED parts 103a to the front of the display system.
  • the LED parts 103a pf the LED layer 103 are connected to one another by a second electrode unit 104.
  • the second electrode unit 104 may include Y electrode lines, which are formed on a transparent insulation layer 106 to be electrically connected to the N-type layers.
  • the transparent insulation layer 106 is formed on the substrate 101 having the LED parts 103a and the barrier 105.
  • the second electrode unit 104 is not restricted to the above-described structure.
  • the second electrode unit 104 may be formed by wire bonding.
  • a color filter layer 107 may also be provided in order to form a color image using light emitted from the LED parts 103a.
  • a white fluorescent layer 108 which is excited by the ultraviolet rays emitted from the LED parts 103a and thus emits white light, may be formed within the openings 105a.
  • the light scattering layer 83 and the external light reflection preventing layer 82 may be formed on the surface of the transparent insulation layer 106 or the color filter layer 107.
  • a graded layer 109 may be formed on the surface of the first electrode unit 102 so that the P-type layers or the N-type layers can easily grow.
  • the graded layer 109 may be formed by spreading powder of at least one of the materials, i.e., gold, silver, copper, Al, Ni, Si, C, Ga, N, In, P, As, Cd, Mg, S, Zn, sapphire, crystal, quartz, silundum, silicon family, ZnCdMgSeS, GaP, GaAs, GaAsP, InGaAIP, GaN, p-GaN, and InGaN, which have the same lattice constant as a material of the P-type layers or N-type layers, on the first electrode unit 102, then performing heat treatment using plasma or laser at a predetermined pressure, and then cooling at a predetermined pressure and temperature.
  • the materials i.e., gold, silver, copper, Al, Ni, Si, C, Ga, N, In, P, As, C
  • FIG. 13 shows a display system using an ultra-thin LED according to another embodiment of the present invention.
  • the display system includes a substrate 111 , a first electrode unit 112 formed in a predetermined pattern on the surface of the substrate 111 , an insulation layer 113 formed on the surface of the first electrode unit 112, and an LED layer 115 formed on the surface of the insulation layer 113.
  • the LED layer 115 includes a plurality of LED parts 115a including a P-type layer 115c and an N-type layer 115d and a light emitting part 115b, which are formed by sequentially stacking a conductive layer 114, the P-type layer 1 15c, and the N-type layer 115d or the conductive layer 114, the N-type layer 115d, and the P-type layer 1 15c and cutting the stack in a depth direction to
  • the first electrode unit 112 may be composed of X electrode lines 112a, which are parallel to one another in a striped pattern, or may also include thin film transistors for driving the individual LED parts 115a.
  • Via-holes 113a are formed in portions, at which the LED parts 115a are to be formed, in the insulation layer 113 on the substrate 111 having the first electrode unit 112.
  • the via-holes 113a are filled with a conductive material, thereby forming the conductive layer 114, so the LED parts 115a are electrically connected to the first electrode unit 112.
  • the LED layer 115 is formed by sequentially growing epitaxially or depositing the conductive layer 114, the P-type layer 115c, and the N-type layer 115d on the entire surface of the substrate 111 having the insulation layer 113 and forming grooves 116 to expose the insulation layer 113 in the depth direction of the stack of the conductive layer 114, the P-type layer 115c, and the N-type layer 115d, thereby separating the stack into a plurality of parts corresponding to the LED parts 115a.
  • the independent conductive layers 114 are electrically connected to the first electrode unit 112 through the corresponding via-holes 113a.
  • two grooves 116 may be formed between adjacent LED parts 115a, apd a reflective film 116a may be formed on the side of each groove 116 facing the LED parts 115a in order to reflect light to the front of the display system.
  • a groove 116' having the shape of a closed loop may be formed to surround each LED part 115a so that the LED part 115a connected to the first electrode unit 112 forms an island.
  • a reflective film 116b is formed on the inside of the groove 116' such that light emitted from the LED part 115a is reflected to the front of the display system.
  • the conductive layer 114 or the first electrode unit 112 is divided so that the bottoms of the LED parts 115a are independently and electrically connected to the conductive layer 114 or the first electrode unit 112.
  • a graded layer 1 15e may be formed between each LED part 1 15a and the conductive layer 1 14 or the first electrode unit 1 12 in order to easily grow the P-type layer 1 15c or the N-type layer 1 15d.
  • a barrier 1 17 is formed in an area among the LED parts 1 15a.
  • the bottom of the barrier 1 17 contacts the surface of the insulation layer 1 13, and the height of the barrier 1 17 can be controlled taking into account cross-talk between pixels and/or light reflectance.
  • the sidewalls of the barrier 1 17 facing the LED parts 115a are formed to slant, and reflective films 1 17a are formed on the sidewalls, so that light emitted from the LED parts 1 15a is reflected to the front of the display system.
  • a second electrode unit 1 18 is formed on the LED parts 1 15a in order to connect the LED parts 1 15a to one another.
  • the first electrode unit 1 12 and the second electrode unit 1 18 may be formed so that together they form a matrix.
  • the first electrode unit 1 12 may also include thin film transistors for selectively driving the LED parts 1 15a.
  • a transparent insulation layer 1 19 is formed on the substrate 1 1 1 having the LED parts 1 15a, the barrier 1 17, and the second electrode unit 118.
  • a color filter layer 119a, the light scattering layer 83, the external light reflection preventing layer 82, and the conductive film for preventing static electricity may be formed on the surface of the substrate 1 1 1 having the transparent insulation layer 1 19, as described above.
  • FIGS. 17 and 18 show a display system using an ultra-thin LED according to still another embodiment of the present invention.
  • the same reference numerals denote the same members!
  • a display system 120 includes a white fluorescent layer 121 , which is excited by parent rays, i.e., ultraviolet rays, emitted from the LED parts 1 15a to thus emit white light, in areas defined by the barrier 105 or 117 separating the LED parts 115a.
  • a color filter layer 122 is formed on the surface of the white fluorescent layer 121.
  • the color filter layer 122 is formed such that red, green, and blue can be realized at the portion of the color filter layer 122 corresponding to the white fluorescent layer 121 for each LED part 115a in order to form a color image.
  • the structures of the first electrode unit 102 or 112 and the second electrode unit 104 or 118 are the same as those of the above described embodiments.
  • the first electrode unit 102 or 112 may also include thin film transistors 34.
  • the LED parts 115a selected by the first and second electrode units 102 or 112 and 104 or 118 are driven to emit parent rays, i.e., ultraviolet rays, and the white fluorescent layers 121 are excited by the ultraviolet rays to emit w,hite light.
  • the white light emitted from the white fluorescent layer 121 is filtered by the corresponding color filter layer 122 to have red, green, and blue colors for forming a color image.
  • FIGS. 19 through 25 show a method of forming a display system according to an embodiment of the present invention.
  • an X electrode line 31 or drain electrode, scan electrode, and thin film transistor, which is driven by the drain and scan electrodes, of a first electrode unit 30 are formed on the substrate 21 using photolithography, silk printing, or deposition.
  • conductive layers 42 are formed to fill the via-holes 41 a connected to the X electrode line 31 or the drain electrode of the thin film transistor and to be deposited on predetermined areas of the surface of the insulation layer 41 , as shown in FIG. 21.
  • a reflective layer 43 is formed on the surface of the insulation layer 41 around the conductive layer 42, as shown in FIG. 22.
  • the reflective layer 43 is formed by depositing a silver epoxy.
  • a graded layer 42a is formed on the surface of the conductive layer 42 in order to easily grow a thin film when forming a LED layer.
  • P-type layers 51 are epitaxially grown or deposited on the surface of the conductive layer 42.
  • the P-type layers 51 may be formed in three stages to separately form LED layers 50 with different colors, i.e., red, green, and blue.
  • the P-type layer 51 of each of the blue and green LED layers 50 is formed by sequentially depositing a ZnSSe layer, a ZnMgSSe layer, a ZnSSe layer, a ZnSe layer, and a ZnTe layer or at least one of these layers on the surface of a' corresponding conductive layer 42.
  • An N-type layer 52 is formed on each P-type layer 51 by depositing an N-type ZnSe layer, an N-type ZnSSe layer, and an N-type ZnCdSe light emitting layer or at least one of these layers.
  • the wavelength of light emitted from the ZnCdSe layer can be changed by changing the percentage of Cd so that the ZnCdSe layer can emit blue or green light.
  • the P-type layer 51 of each of the red LED layers 50 is formed by sequentially depositing an AlyGa1-ylnp layer, an AlxGa1-xlnp layer, a Galnp layer, and a GaAs layer or at least one of these layers on a corresponding conductive layer 42.
  • An N-type layer 52 is formed on the P-type layer 51 by sequentially depositing a Galnp layer, an AlxGa1-xlnp layer, and an AlyGa1-ylnp layer and then depositing an AlyGa1-ylnp layer and a Galnp light emitting layer.
  • a color filter layer 55 is formed in order to increase the color purity of light emitted from each LED layer 50.
  • the color filter layer 55 is formed to have an opening partially exposing the N-type layer so that a gold wire of a second electrode unit can be bonded to the N-type layer.
  • a transparent resin layer may be formed. The transparent resin layer ' may be formed on the entire surface of the substrate 21 so that the insulation layer 41 and the LED layers 50 can be covered with the transparent resin layer.
  • each second electrode unit 60 is formed in two stages: a gold wire bonding stage in which one end of each gold wire 62a is bonded to a corresponding N-type layer 52 and the other end of the gold wire 62a is exposed above the surface of a corresponding color filter layer or transparent resin layer 55, and an electrode forming stage in which a Y electrode line 61 is formed in a direction orthogonal to the X electrode line 31 of the first electrode unit 30 in a predetermined pattern and a connection electrode 62b connecting the Y electrode line 61 to the • gold wire 62a is formed.
  • the Y electrode line 61 and the connection electrode 62b may be formed in separate stages.
  • the gold wire 62a may be formed using deposition.
  • the above-described stages are performed throughout the substrate 21.
  • a barrier 70 defining the light emitting area of at least one pixel is formed.
  • the barrier 70 may be formed by repeatedly printing a barrier material such as a frit or using electrodeposition.
  • a reflective layer may be formed on the inner sidewall of the barrier 70.
  • a conductive layer for blocking statistic electricity and electromagnetic waves and an external light reflection preventing layer for preventing the reflection of external light are formed on the surface of the protective layer 80.
  • the external light reflection preventing layer is formed using a non-reflective coating.
  • a pixel is formed using an LED layer, in which a P-type layer makes a junction with an N-type layer, so the display system has high brightness and very long life.
  • First and second electrode units and LED layers are deposited on a single substrate in bulk, thereby simplifying a manufacturing process. Consequently, productivity can be increased due to mass production.
  • the present invention can easily realize a subminiature display system having a pixel smaller than 0.1 mm x 0.1 mm, a computer monitor having high definition, and a system having a large screen.
  • the present invention can be applied to various display systems such as indoor or outdoor signboards, interior decoration, moving picture traffic signals, and traffic information boards.
  • cross-talk between pixels can be prevented due to a barrier, thereby increasing the contrast of an image.
  • the present invention realizes the satisfactory definition, color purity, and brightness of an image and the satisfactory durability and electrical characteristics of a display system, the present invention can be applied to indoor and outdoor high-definition display systems in all sizes.

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  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Dans cette invention, pour fabriquer en grandes quantités et à faible coût des systèmes d'affichage utilisant des diodes électroluminescentes (DEL), on a recours à la technique des films minces pour déposer ou imprimer sur un substrat en vrac plusieurs couches de DEL formant des pixels. Chaque système d'affichage comprend: un substrat; un première unité électrode formée sur ce substrat selon une configuration prédéterminée; une couche de DEL comportant une couche de type P, qui est formée sur le substrat de la première unité électrode selon une configuration prédéterminée à connecter électriquement à la première unité électrode, et une couche de type N déposée sur la couche de type P; une couche d'isolation transparente formée sur la surface du substrat à isoler de la première unité électrode par une couche d'isolation et devant être traversée par un trou d'interconnexion correspondant à la couche de DEL; ainsi qu'une seconde unité électrode connectée électriquement à la couche de type N de la couche de DEL.
PCT/KR2002/001453 2001-08-01 2002-07-31 Systeme d'affichage Ceased WO2003012884A1 (fr)

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KR2001-46490 2001-08-01
KR20010046490 2001-08-01
KR20020005248 2002-01-29
KR2002-5248 2002-01-29
KR20020010059 2002-02-25
KR2002-10059 2002-02-25

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