WO2003014000A3 - Edge gripping pre-aligner - Google Patents

Edge gripping pre-aligner Download PDF

Info

Publication number
WO2003014000A3
WO2003014000A3 PCT/US2002/025290 US0225290W WO03014000A3 WO 2003014000 A3 WO2003014000 A3 WO 2003014000A3 US 0225290 W US0225290 W US 0225290W WO 03014000 A3 WO03014000 A3 WO 03014000A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
aligner
edge gripping
robot arm
gripping mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/025290
Other languages
French (fr)
Other versions
WO2003014000A2 (en
Inventor
Terry Murray
Preston Whitcomb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Integrated Dynamics Engineering GmbH
Integrated Dynamics Engineering Inc
Original Assignee
Integrated Dynamics Engineering GmbH
Integrated Dynamics Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Dynamics Engineering GmbH, Integrated Dynamics Engineering Inc filed Critical Integrated Dynamics Engineering GmbH
Priority to JP2003518961A priority Critical patent/JP2004537868A/en
Priority to EP02768466A priority patent/EP1417150A2/en
Priority to IL16016402A priority patent/IL160164A0/en
Publication of WO2003014000A2 publication Critical patent/WO2003014000A2/en
Publication of WO2003014000A3 publication Critical patent/WO2003014000A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

An apparatus for holding and orienting a wafer (4) includes a movable robot arm (6), and an end effector (8) attached to an end of the robot arm (6), the end effector (8) including a gripping mechanism (12a-f) which during operation holds and rotates the wafer (4) about an axis that is perpendicular to the plane of the wafer (4), wherein the gripping mechanism (12a-f) comprises a first contacting member, and a second contacting member, and a drive member (12e, f) arranged to grip opposing edges of the wafer (4), and wherein the drive member (12a, f) comprises a first pair of rollers.
PCT/US2002/025290 2001-08-09 2002-08-09 Edge gripping pre-aligner Ceased WO2003014000A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003518961A JP2004537868A (en) 2001-08-09 2002-08-09 Edge gripping pre-aligner
EP02768466A EP1417150A2 (en) 2001-08-09 2002-08-09 Edge gripping pre-aligner
IL16016402A IL160164A0 (en) 2001-08-09 2002-08-09 Edge gripping pre-aligner

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31129001P 2001-08-09 2001-08-09
US60/311,290 2001-08-09

Publications (2)

Publication Number Publication Date
WO2003014000A2 WO2003014000A2 (en) 2003-02-20
WO2003014000A3 true WO2003014000A3 (en) 2003-10-16

Family

ID=23206242

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/025290 Ceased WO2003014000A2 (en) 2001-08-09 2002-08-09 Edge gripping pre-aligner

Country Status (5)

Country Link
US (1) US20030072645A1 (en)
EP (1) EP1417150A2 (en)
JP (1) JP2004537868A (en)
IL (1) IL160164A0 (en)
WO (1) WO2003014000A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070057164A1 (en) * 2003-07-02 2007-03-15 David Vaughnn Scheimpflug normalizer
WO2005055312A1 (en) * 2003-12-04 2005-06-16 Hirata Corporation Substrate positioning system
US20080203641A1 (en) * 2005-01-19 2008-08-28 Tosoh Smd Etna, Llc End Effector For Handling Sputter Targets
US20080241384A1 (en) * 2007-04-02 2008-10-02 Asm Genitech Korea Ltd. Lateral flow deposition apparatus and method of depositing film by using the apparatus
AU2011204992B2 (en) * 2007-04-26 2012-09-06 Adept Technology, Inc. Uniform Lighting and Gripper Positioning System for Robotic Picking Operations
AU2008246203B2 (en) 2007-04-26 2012-08-16 Omron Robotics And Safety Technologies, Inc. Vacuum gripping apparatus
US20090217953A1 (en) * 2008-02-28 2009-09-03 Hui Chen Drive roller for a cleaning system
CN103863851A (en) * 2012-12-14 2014-06-18 鸿富锦精密工业（深圳）有限公司 Automatic loading and unloading device
WO2015135782A1 (en) * 2014-03-12 2015-09-17 Asml Netherlands B.V. Sensor system, substrate handling system and lithographic apparatus
US10553472B2 (en) * 2018-06-22 2020-02-04 Jabil Inc. Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner
JP2020174902A (en) * 2019-04-18 2020-10-29 クオリカプス株式会社 Secant line information acquisition device and tablet printing device
CN113644019B (en) * 2021-08-09 2024-03-19 恩纳基智能科技无锡有限公司 A composite loading device for a semiconductor patch machine

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608519A (en) * 1995-03-20 1997-03-04 Gourley; Paul L. Laser apparatus and method for microscopic and spectroscopic analysis and processing of biological cells
US5715050A (en) * 1995-01-25 1998-02-03 New Creation Co., Ltd. Optical inspection apparatus including a telecentric optical system, an aperture stop and a screen
US6012192A (en) * 1997-04-21 2000-01-11 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6453214B1 (en) * 1998-12-02 2002-09-17 Newport Corporation Method of using a specimen sensing end effector to align a robot arm with a specimen stored on or in a container
US6468022B1 (en) * 2000-07-05 2002-10-22 Integrated Dynamics Engineering, Inc. Edge-gripping pre-aligner

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6435807B1 (en) * 2000-12-14 2002-08-20 Genmark Automation Integrated edge gripper

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5715050A (en) * 1995-01-25 1998-02-03 New Creation Co., Ltd. Optical inspection apparatus including a telecentric optical system, an aperture stop and a screen
US5608519A (en) * 1995-03-20 1997-03-04 Gourley; Paul L. Laser apparatus and method for microscopic and spectroscopic analysis and processing of biological cells
US6012192A (en) * 1997-04-21 2000-01-11 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6453214B1 (en) * 1998-12-02 2002-09-17 Newport Corporation Method of using a specimen sensing end effector to align a robot arm with a specimen stored on or in a container
US6468022B1 (en) * 2000-07-05 2002-10-22 Integrated Dynamics Engineering, Inc. Edge-gripping pre-aligner

Also Published As

Publication number Publication date
WO2003014000A2 (en) 2003-02-20
EP1417150A2 (en) 2004-05-12
IL160164A0 (en) 2004-07-25
JP2004537868A (en) 2004-12-16
US20030072645A1 (en) 2003-04-17

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