WO2003023857A3 - Led-leuchtpaneel und trägerplatte - Google Patents

Led-leuchtpaneel und trägerplatte Download PDF

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Publication number
WO2003023857A3
WO2003023857A3 PCT/CH2002/000339 CH0200339W WO03023857A3 WO 2003023857 A3 WO2003023857 A3 WO 2003023857A3 CH 0200339 W CH0200339 W CH 0200339W WO 03023857 A3 WO03023857 A3 WO 03023857A3
Authority
WO
WIPO (PCT)
Prior art keywords
sub
luminous
units
electrically
minimal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH2002/000339
Other languages
English (en)
French (fr)
Other versions
WO2003023857A2 (de
Inventor
Gerhard Staufert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucea AG
Original Assignee
Lucea AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucea AG filed Critical Lucea AG
Priority to DE50209685T priority Critical patent/DE50209685D1/de
Priority to JP2003527799A priority patent/JP2005502214A/ja
Priority to US10/489,116 priority patent/US7055987B2/en
Priority to EP02740176A priority patent/EP1451872B1/de
Publication of WO2003023857A2 publication Critical patent/WO2003023857A2/de
Anticipated expiration legal-status Critical
Publication of WO2003023857A3 publication Critical patent/WO2003023857A3/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Burglar Alarm Systems (AREA)

Abstract

Das erfindungsgemässe konfektionierbare lichtemittierende Paneel beinhaltet parallel geschaltete kleinste Untereinheiten mit je mindestens zwei seriell geschalteter durch Elektrizität betreibbare Leuchtkörper, beispielsweise Leuchtdioden (24). Das Leuchtpaneel ist nachträglich in für sich funktionsfähige Teilstücke mit mindestens der Grösse einer kleinsten Untereinheit zertrennbar. Es weist eine elektrisch leitenden Unterlage (21) und eine von dieser elektrisch isolierte Deckschicht (29) auf, wobei die Unterlage (21) und die Deckschicht (29) als Anschlussflächen zum elektrisch parallelen Kontaktieren der Untereinheiten fungieren. Von den elektrischen Anschlussflächen elektrisch isolierte Leiterbahnen (23) dienen zur elektrischen Verbindung der verschiedenen Leuchtkörper (24) der Untereinheiten.
PCT/CH2002/000339 2001-09-13 2002-06-24 Led-leuchtpaneel und trägerplatte Ceased WO2003023857A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE50209685T DE50209685D1 (de) 2001-09-13 2002-06-24 Leuchtdioden-leuchtpaneel und leiterplatte
JP2003527799A JP2005502214A (ja) 2001-09-13 2002-06-24 発光パネルおよび搬送プレート
US10/489,116 US7055987B2 (en) 2001-09-13 2002-06-24 LED-luminous panel and carrier plate
EP02740176A EP1451872B1 (de) 2001-09-13 2002-06-24 Leuchtdioden-leuchtpaneel und leiterplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1700/01 2001-09-13
CH17002001 2001-09-13

Publications (2)

Publication Number Publication Date
WO2003023857A2 WO2003023857A2 (de) 2003-03-20
WO2003023857A3 true WO2003023857A3 (de) 2004-06-03

Family

ID=4565955

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH2002/000339 Ceased WO2003023857A2 (de) 2001-09-13 2002-06-24 Led-leuchtpaneel und trägerplatte

Country Status (7)

Country Link
US (1) US7055987B2 (de)
EP (1) EP1451872B1 (de)
JP (1) JP2005502214A (de)
CN (1) CN100477210C (de)
AT (1) ATE356532T1 (de)
DE (1) DE50209685D1 (de)
WO (1) WO2003023857A2 (de)

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2417172C (en) * 2000-07-07 2010-10-12 Cosmo Plant Co., Ltd. Plant cultivating method, cultivating device, and its lighting device
US7279718B2 (en) 2002-01-28 2007-10-09 Philips Lumileds Lighting Company, Llc LED including photonic crystal structure
JP4620458B2 (ja) * 2002-06-14 2011-01-26 レドニウム テクノロジー プロプライアタリー リミティド ランプ及びランプの製造方法
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US7163327B2 (en) * 2002-12-02 2007-01-16 3M Innovative Properties Company Illumination system using a plurality of light sources
WO2004088761A1 (de) * 2003-04-02 2004-10-14 Lucea Ag Lichtemittierendes paneel
EP1465256A1 (de) * 2003-04-03 2004-10-06 Micro Photonics Technology Methode zur Herstellung einer Lichtquelle und die daraus resultierende Lichtquelle
EP1467415B1 (de) * 2003-04-08 2019-06-12 Lumileds Holding B.V. Verbesserte LED Effizienz durch photonischen Kristall
US20070001177A1 (en) * 2003-05-08 2007-01-04 Koninklijke Philips Electronics N.V. Integrated light-emitting diode system
EP1623153A1 (de) * 2003-05-15 2006-02-08 Lucea AG Lichtquelle
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7012279B2 (en) 2003-10-21 2006-03-14 Lumileds Lighting U.S., Llc Photonic crystal light emitting device
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
US20050205883A1 (en) 2004-03-19 2005-09-22 Wierer Jonathan J Jr Photonic crystal light emitting device
WO2005100016A2 (de) * 2004-04-16 2005-10-27 Lucea Ag Lichtemittierendes paneel und optisch wirksame folie
EP1735845A2 (de) * 2004-04-16 2006-12-27 Lucea AG Gehäuse für led-chip und lichtquelle
DE102004019137A1 (de) * 2004-04-16 2005-11-17 Trilux-Lenze Gmbh + Co Kg Leuchtenfeld
JP2005310892A (ja) * 2004-04-19 2005-11-04 Nippon Seiki Co Ltd 発光装置
US8188503B2 (en) * 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
US7442964B2 (en) 2004-08-04 2008-10-28 Philips Lumileds Lighting Company, Llc Photonic crystal light emitting device with multiple lattices
TWI255377B (en) * 2004-11-05 2006-05-21 Au Optronics Corp Backlight module
CN100483024C (zh) * 2004-11-09 2009-04-29 李学霖 发光二极管灯散热结构
US7270446B2 (en) * 2005-05-09 2007-09-18 Lighthouse Technology Co., Ltd Light module with combined heat transferring plate and heat transferring pipes
US7595453B2 (en) * 2005-05-24 2009-09-29 M/A-Com Technology Solutions Holdings, Inc. Surface mount package
US8163575B2 (en) 2005-06-17 2012-04-24 Philips Lumileds Lighting Company Llc Grown photonic crystals in semiconductor light emitting devices
KR20070000835A (ko) * 2005-06-28 2007-01-03 엘지.필립스 엘시디 주식회사 백라이트 유닛
US8163580B2 (en) * 2005-08-10 2012-04-24 Philips Lumileds Lighting Company Llc Multiple die LED and lens optical system
CN100365485C (zh) * 2005-08-31 2008-01-30 友达光电股份有限公司 直下式背光模块
JP4483757B2 (ja) * 2005-09-30 2010-06-16 セイコーエプソン株式会社 有機ｅｌ装置及び光学装置
US20070081339A1 (en) * 2005-10-07 2007-04-12 Chung Huai-Ku LED light source module with high efficiency heat dissipation
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
KR100649327B1 (ko) * 2006-03-09 2006-11-28 조경준 공중전화 부스용 조명등 장치
DE202006004774U1 (de) * 2006-03-25 2007-07-26 Mücke, Daniel Anzeigegerät, insbesondere LED-Display
KR100755615B1 (ko) * 2006-04-14 2007-09-06 삼성전기주식회사 발광 다이오드를 이용한 액정 표시 장치의 백라이트
US9335006B2 (en) * 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
JP4978053B2 (ja) * 2006-05-02 2012-07-18 日亜化学工業株式会社 発光装置及び照明装置
WO2007147278A2 (de) * 2006-06-21 2007-12-27 Gerhard Staufert Led-lichtquelle und verfahren
KR100796522B1 (ko) * 2006-09-05 2008-01-21 삼성전기주식회사 전자소자 내장형 인쇄회로기판의 제조방법
DE102006046301A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Optisches Element, strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines optischen Elements
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US20090086491A1 (en) 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US7897980B2 (en) * 2006-11-09 2011-03-01 Cree, Inc. Expandable LED array interconnect
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US20080123340A1 (en) * 2006-11-27 2008-05-29 Mcclellan Thomas Light device having LED illumination and electronic circuit board in an enclosure
KR20080057881A (ko) * 2006-12-21 2008-06-25 엘지전자 주식회사 인쇄회로기판, 이를 포함하는 발광 장치 및 그 제조 방법
DE102006061941A1 (de) * 2006-12-29 2008-07-03 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung und Verfahren zum Betrieb einer optoelektronischen Anordnung
EP1998101B2 (de) * 2007-05-30 2019-09-25 OSRAM GmbH Beleuchtungsvorrichtung
JP4533405B2 (ja) * 2007-05-31 2010-09-01 株式会社 日立ディスプレイズ 照明装置およびこの照明装置を用いた液晶表示装置
JP4474441B2 (ja) * 2007-06-29 2010-06-02 株式会社沖データ 発光パネル、表示装置及び光源装置
TW200904316A (en) * 2007-07-13 2009-01-16 Kai-Yu Lin Heat-dissipation structure of luminous device
US8033684B2 (en) * 2007-08-31 2011-10-11 The Boeing Company Starry sky lighting panels
US7857484B2 (en) * 2007-08-31 2010-12-28 The Boeing Company Lighting panels including embedded illumination devices and methods of making such panels
US7994524B1 (en) 2007-09-12 2011-08-09 David Yaunien Chung Vertically structured LED array light source
DE102007046348A1 (de) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement mit Glasabdeckung und Verfahren zu dessen Herstellung
WO2009061352A1 (en) * 2007-11-08 2009-05-14 Innovations In Optics, Inc Led illumination system
US9135837B2 (en) * 2007-11-16 2015-09-15 Intellectual Discovery Co., Ltd. Illumination assembly having multiple reflective cavities each with a single emitter
DE102008011153B4 (de) * 2007-11-27 2023-02-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Anordnung mit mindestens zwei lichtemittierenden Halbleiterbauelementen
WO2009119461A1 (ja) 2008-03-26 2009-10-01 島根県 半導体発光モジュールおよびその製造方法
WO2009138374A1 (de) 2008-05-13 2009-11-19 Siemens Aktiengesellschaft Led-anordnung
US7845829B2 (en) * 2008-05-20 2010-12-07 Abl Ip Holding Llc Enclosures for LED circuit boards
CN101608774B (zh) * 2008-06-20 2011-03-30 富准精密工业(深圳)有限公司 发光二极管照明装置及制造方法
KR101448153B1 (ko) * 2008-06-25 2014-10-08 삼성전자주식회사 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자
WO2010017831A1 (de) * 2008-08-11 2010-02-18 Osram Gesellschaft mit beschränkter Haftung Konversions led
US8915610B2 (en) 2008-08-11 2014-12-23 Rohm Co., Ltd. Lighting device
US8132935B2 (en) * 2008-09-01 2012-03-13 Samsung Led Co., Ltd. Light emitting module
WO2010044499A1 (en) * 2008-10-17 2010-04-22 Ki-Geon Lee Radiating heat apparatus for circuit board, led lamp having thereof, lighting apparatus euipped with led lamp thereon
TW201020460A (en) * 2008-11-26 2010-06-01 Ling Chyuan Fa Ing Yonq Ltd Heat-dissipation structure of LED
CN101749686B (zh) * 2008-12-03 2012-03-14 富准精密工业(深圳)有限公司 发光二极管灯具
US20100226139A1 (en) 2008-12-05 2010-09-09 Permlight Products, Inc. Led-based light engine
JP5146356B2 (ja) * 2009-02-24 2013-02-20 豊田合成株式会社 発光装置及びその製造方法
US20100225215A1 (en) * 2009-03-03 2010-09-09 Han-Ming Lee Multi-chip cup semi-conductor lamp
CH701423B1 (de) * 2009-07-10 2015-02-13 Christoph Liebetrau Ur Brain Gmbh High-Power-LED-Flachleuchte.
WO2011019856A1 (en) * 2009-08-12 2011-02-17 Edward Stoneham Versatile sealed led lamp
US8360604B2 (en) * 2009-09-30 2013-01-29 Cree, Inc. Light emitting diode (LED) lighting systems including low absorption, controlled reflectance enclosures
US8684556B2 (en) * 2009-09-30 2014-04-01 Cree, Inc. Light emitting diode (LED) lighting systems including low absorption, controlled reflectance and diffusion layers
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US8511851B2 (en) * 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
US8672516B2 (en) * 2010-09-30 2014-03-18 GE Lighting Solutions, LLC Lightweight heat sinks and LED lamps employing same
US10024510B2 (en) * 2010-10-26 2018-07-17 Steven G. Hammond Flexible light emitting diode lighting process and assembly
FR2970060B1 (fr) 2010-11-08 2014-11-21 Valeo Vision Dispositif d'eclairage et/ou de signalisation de vehicule automobile
USD721339S1 (en) 2010-12-03 2015-01-20 Cree, Inc. Light emitter device
US8564000B2 (en) 2010-11-22 2013-10-22 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
USD712850S1 (en) 2010-11-18 2014-09-09 Cree, Inc. Light emitter device
USD707192S1 (en) 2010-11-18 2014-06-17 Cree, Inc. Light emitting device
US8575639B2 (en) 2011-02-16 2013-11-05 Cree, Inc. Light emitting devices for light emitting diodes (LEDs)
US8624271B2 (en) 2010-11-22 2014-01-07 Cree, Inc. Light emitting devices
US9300062B2 (en) 2010-11-22 2016-03-29 Cree, Inc. Attachment devices and methods for light emitting devices
US9490235B2 (en) 2010-11-22 2016-11-08 Cree, Inc. Light emitting devices, systems, and methods
US9000470B2 (en) 2010-11-22 2015-04-07 Cree, Inc. Light emitter devices
USD706231S1 (en) 2010-12-03 2014-06-03 Cree, Inc. Light emitting device
RU2571087C2 (ru) * 2010-12-16 2015-12-20 Конинклейке Филипс Электроникс Н.В. Узел, основанный на сид
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
USD702653S1 (en) 2011-10-26 2014-04-15 Cree, Inc. Light emitting device component
US8809880B2 (en) 2011-02-16 2014-08-19 Cree, Inc. Light emitting diode (LED) chips and devices for providing failure mitigation in LED arrays
US8455908B2 (en) 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
WO2013001430A1 (en) 2011-06-30 2013-01-03 Koninklijke Philips Electronics N.V. Led-based embedded lighting device
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
USD700584S1 (en) 2011-07-06 2014-03-04 Cree, Inc. LED component
US20130048885A1 (en) * 2011-08-31 2013-02-28 Phoseon Technology, Inc. Lighting module having a common terminal
USD705181S1 (en) 2011-10-26 2014-05-20 Cree, Inc. Light emitting device component
KR20140097284A (ko) 2011-11-07 2014-08-06 크리,인코포레이티드 고전압 어레이 발광다이오드(led) 장치, 기구 및 방법
US9735198B2 (en) 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
JP2014036107A (ja) * 2012-08-08 2014-02-24 Toshiba Lighting & Technology Corp 発光モジュール及び照明装置
US20140048824A1 (en) * 2012-08-15 2014-02-20 Epistar Corporation Light-emitting device
DE102012109819A1 (de) * 2012-10-15 2014-04-17 Bruck Gmbh & Co Kg Beleuchtungssystem
USD739565S1 (en) 2013-06-27 2015-09-22 Cree, Inc. Light emitter unit
USD740453S1 (en) 2013-06-27 2015-10-06 Cree, Inc. Light emitter unit
US9865185B2 (en) * 2013-08-15 2018-01-09 Bitro Group, Inc. LED matrix lighting device
CN104009147A (zh) * 2014-06-12 2014-08-27 上海虔敬节能环保科技有限公司 一种led多功能封装结构及其封装工艺
USD823492S1 (en) 2016-10-04 2018-07-17 Cree, Inc. Light emitting device
RU174281U1 (ru) * 2016-11-22 2017-10-09 Егор Евгеньевич Нилов Осветительное устройство
US10690302B1 (en) 2019-02-27 2020-06-23 BrooksCo, LLC Flexible and cuttable LED sheet
WO2021243463A1 (en) * 2020-06-03 2021-12-09 Vuereal Inc. Color conversion solid state device
US11460173B1 (en) 2021-01-05 2022-10-04 BrooksCo, LLC LED backlight system and mounting system

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194383A (ja) * 1982-05-07 1983-11-12 Sumitomo Electric Ind Ltd 連続組立発光ダイオ−ド
JPS61145877A (ja) * 1984-12-19 1986-07-03 Mitsubishi Electric Corp Ｌｅｄアレイヘツド
JPS6486573A (en) * 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US5278432A (en) * 1992-08-27 1994-01-11 Quantam Devices, Inc. Apparatus for providing radiant energy
JPH088463A (ja) * 1994-06-21 1996-01-12 Sharp Corp 薄型ｌｅｄドットマトリックスユニット
US5698866A (en) * 1994-09-19 1997-12-16 Pdt Systems, Inc. Uniform illuminator for phototherapy
WO1999057951A1 (en) * 1998-04-30 1999-11-11 Telefonaktiebolaget Lm Ericsson (Publ) A printed circuit board and a method of processing printed circuit boards
DE19926746A1 (de) * 1999-06-11 2000-12-21 Osram Opto Semiconductors Gmbh Mehrfachanordnung von mit LEDs bestückten Leiterplatten und Steckverbinder für die Verbindung von Leiterplatten
EP1081771A2 (de) * 1999-09-03 2001-03-07 Hewlett-Packard Company Lichtemittierende Vorrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119174A (en) * 1990-10-26 1992-06-02 Chen Der Jong Light emitting diode display with PCB base
US5785418A (en) * 1996-06-27 1998-07-28 Hochstein; Peter A. Thermally protected LED array
CH689339A5 (de) * 1998-02-12 1999-02-26 Staufert Gerhard Konfektionierbares LED-Leuchpaneel.

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194383A (ja) * 1982-05-07 1983-11-12 Sumitomo Electric Ind Ltd 連続組立発光ダイオ−ド
JPS61145877A (ja) * 1984-12-19 1986-07-03 Mitsubishi Electric Corp Ｌｅｄアレイヘツド
JPS6486573A (en) * 1987-07-17 1989-03-31 Oshima Denki Co Light emitting device
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
US5278432A (en) * 1992-08-27 1994-01-11 Quantam Devices, Inc. Apparatus for providing radiant energy
JPH088463A (ja) * 1994-06-21 1996-01-12 Sharp Corp 薄型ｌｅｄドットマトリックスユニット
US5698866A (en) * 1994-09-19 1997-12-16 Pdt Systems, Inc. Uniform illuminator for phototherapy
WO1999057951A1 (en) * 1998-04-30 1999-11-11 Telefonaktiebolaget Lm Ericsson (Publ) A printed circuit board and a method of processing printed circuit boards
DE19926746A1 (de) * 1999-06-11 2000-12-21 Osram Opto Semiconductors Gmbh Mehrfachanordnung von mit LEDs bestückten Leiterplatten und Steckverbinder für die Verbindung von Leiterplatten
EP1081771A2 (de) * 1999-09-03 2001-03-07 Hewlett-Packard Company Lichtemittierende Vorrichtung

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 008, no. 036 (E - 227) 16 February 1984 (1984-02-16) *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 343 (E - 456) 19 November 1986 (1986-11-19) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 317 (E - 789) 19 July 1989 (1989-07-19) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 05 31 May 1996 (1996-05-31) *

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EP1451872B1 (de) 2007-03-07
ATE356532T1 (de) 2007-03-15
WO2003023857A2 (de) 2003-03-20
DE50209685D1 (de) 2007-04-19
CN1586006A (zh) 2005-02-23
JP2005502214A (ja) 2005-01-20
CN100477210C (zh) 2009-04-08
US20040233671A1 (en) 2004-11-25
US7055987B2 (en) 2006-06-06
EP1451872A2 (de) 2004-09-01

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