WO2003037565A3 - Polishing pads and manufacturing methods - Google Patents

Polishing pads and manufacturing methods Download PDF

Info

Publication number
WO2003037565A3
WO2003037565A3 PCT/US2002/034618 US0234618W WO03037565A3 WO 2003037565 A3 WO2003037565 A3 WO 2003037565A3 US 0234618 W US0234618 W US 0234618W WO 03037565 A3 WO03037565 A3 WO 03037565A3
Authority
WO
WIPO (PCT)
Prior art keywords
properties
pads
manufacturing methods
area
polishing pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/034618
Other languages
French (fr)
Other versions
WO2003037565A2 (en
Inventor
West Inc Thomas
Thomas West
Donald P Dietz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomas West Inc
Original Assignee
Thomas West Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas West Inc filed Critical Thomas West Inc
Priority to AU2002350031A priority Critical patent/AU2002350031A1/en
Publication of WO2003037565A2 publication Critical patent/WO2003037565A2/en
Publication of WO2003037565A3 publication Critical patent/WO2003037565A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mechanical planarization of substrates and pads for polishing substrates. One embodiment of the method includes the steps of providing a polymer sheet having a substrate contacting area, heating the area a sufficient amount, and applying a sufficient amount of mechanical pressure to the area during at least a portion of the heating step to achieve the desired properties for the material.
PCT/US2002/034618 2001-10-29 2002-10-29 Polishing pads and manufacturing methods Ceased WO2003037565A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002350031A AU2002350031A1 (en) 2001-10-29 2002-10-29 Polishing pads and manufacturing methods

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US34096201P 2001-10-29 2001-10-29
US60/340,962 2001-10-29
US10/020,081 2001-12-11
US10/020,081 US20030083003A1 (en) 2001-10-29 2001-12-11 Polishing pads and manufacturing methods

Publications (2)

Publication Number Publication Date
WO2003037565A2 WO2003037565A2 (en) 2003-05-08
WO2003037565A3 true WO2003037565A3 (en) 2003-10-23

Family

ID=26692984

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/034618 Ceased WO2003037565A2 (en) 2001-10-29 2002-10-29 Polishing pads and manufacturing methods

Country Status (3)

Country Link
US (1) US20030083003A1 (en)
AU (1) AU2002350031A1 (en)
WO (1) WO2003037565A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CA2519942A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI385050B (en) * 2005-02-18 2013-02-11 Nexplanar Corp Customized polishing pads for cmp and methods of fabrication and use thereof
US20070049169A1 (en) * 2005-08-02 2007-03-01 Vaidya Neha P Nonwoven polishing pads for chemical mechanical polishing
US7458885B1 (en) * 2007-08-15 2008-12-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
FR2673574A1 (en) * 1991-03-06 1992-09-11 Delamare Pierre Method of manufacturing polishing discs and discs obtained thereby
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US20010000772A1 (en) * 1999-02-04 2001-05-03 Kramer Stephen J. Method and apparatus for uniformly planarizing a microelectronic substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046729A (en) * 1975-06-02 1977-09-06 Ppg Industries, Inc. Water-reduced urethane coating compositions
US4171391A (en) * 1978-09-07 1979-10-16 Wilmington Chemical Corporation Method of preparing composite sheet material
US4511605A (en) * 1980-09-18 1985-04-16 Norwood Industries, Inc. Process for producing polishing pads comprising a fully impregnated non-woven batt
US4342805A (en) * 1980-09-18 1982-08-03 Norwood Industries, Inc. Simulated leather sheet material
US4376148A (en) * 1980-09-18 1983-03-08 Norwood Industries, Inc. Impregnated non-woven sheet material with ionically solubilized resin
US4496624A (en) * 1982-07-14 1985-01-29 Norwood Industries, Inc. Fibrous web impregnated with coagulated polyurethane and polyolefin admixture
JPS62140769A (en) * 1985-12-16 1987-06-24 Toyo Cloth Kk Manufacture of abrasive cloth
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US6287185B1 (en) * 1997-04-04 2001-09-11 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
JPH11216663A (en) * 1998-02-03 1999-08-10 Sony Corp Polishing pad, polishing apparatus and polishing method
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
FR2673574A1 (en) * 1991-03-06 1992-09-11 Delamare Pierre Method of manufacturing polishing discs and discs obtained thereby
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US20010000772A1 (en) * 1999-02-04 2001-05-03 Kramer Stephen J. Method and apparatus for uniformly planarizing a microelectronic substrate

Also Published As

Publication number Publication date
US20030083003A1 (en) 2003-05-01
WO2003037565A2 (en) 2003-05-08
AU2002350031A1 (en) 2003-05-12

Similar Documents

Publication Publication Date Title
WO2008017472A3 (en) Method for the production of a porous, ceramic surface layer
EP1364702A3 (en) Process for producing array plate for biomolecules having hydrophilic and hydrophobic regions
WO2005095087A3 (en) Reinforced resinous article and method of making the reinforced resinous article
WO2004035496A3 (en) Article having nano-scaled structures and a process for making such article
WO2005108108A8 (en) Security element and methods for the production thereof
WO2003068672A3 (en) Fabrication of ultra-shallow channels for microfluidic devices and systems
EP1361023A3 (en) Polishing articles for electrochemical mechanical polishing of substrates
WO2006074665A3 (en) A method of producing a microfluidic device and microfluidic devices
WO2003032380A1 (en) Device and method for processing substrate
WO2003052776A3 (en) Method for the production of an electrically conductive resistive layer and heating and/or cooling device
WO2002079876A3 (en) Lithographic template
WO2002071150A3 (en) Lithographic template
RU2003112617A (en) METHOD FOR MAKING A SEALING DEVICE (OPTIONS)
WO2008076390A3 (en) Dry adhesives and methods for making dry adhesives
WO2003092041A3 (en) Method for fabricating a soi substrate a high resistivity support substrate
WO2004043849A3 (en) Method for production of a component with a micro-joint and component produced by said method
EP1115153A3 (en) Semiconductor substrate and process for its production
HK1049978A1 (en) A method and apparatus using printer means for manufacturing an item
ATE421766T1 (en) PRODUCTION PROCESS FOR MIXED SUBSTRATES AND STRUCTURE PRODUCED THEREFROM
WO2008108413A1 (en) Microstructure apparatus and method for production of microstructure apparatus
WO2003036748A3 (en) Continuous production of catalyst coated membranes
WO2003009349A3 (en) Methods and compositions for chemical mechanical polishing substrates covered with at least two dielectric materials
WO2003037565A3 (en) Polishing pads and manufacturing methods
WO2009006284A3 (en) Semiconductor die having a redistribution layer
WO2005072938A3 (en) Composite products and methods of forming such products

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VC VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP