WO2004003962A3 - Thermal sprayed yttria-containing coating for plasma reactor - Google Patents

Thermal sprayed yttria-containing coating for plasma reactor Download PDF

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Publication number
WO2004003962A3
WO2004003962A3 PCT/US2003/018502 US0318502W WO2004003962A3 WO 2004003962 A3 WO2004003962 A3 WO 2004003962A3 US 0318502 W US0318502 W US 0318502W WO 2004003962 A3 WO2004003962 A3 WO 2004003962A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal sprayed
plasma reactor
containing coating
sprayed yttria
yttria
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/018502
Other languages
French (fr)
Other versions
WO2004003962A2 (en
Inventor
Robert J O'donnell
John E Daugherty
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Priority to AU2003238006A priority Critical patent/AU2003238006A1/en
Priority to JP2004517642A priority patent/JP2005531157A/en
Priority to KR1020117000086A priority patent/KR101107542B1/en
Priority to EP03737030A priority patent/EP1518255B1/en
Priority to KR1020047021152A priority patent/KR101030935B1/en
Priority to AT03737030T priority patent/ATE545148T1/en
Publication of WO2004003962A2 publication Critical patent/WO2004003962A2/en
Publication of WO2004003962A3 publication Critical patent/WO2004003962A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32467—Material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Plasma Technology (AREA)

Abstract

Components of semiconductor processing apparatus comprise thermal sprayed yttria-containing coatings that provide erosion, corrosion and/or corrosion-erosion resistance in plasma atmospheres. The coatings can protect substrates from physical and/or chemical attack.
PCT/US2003/018502 2002-06-27 2003-06-12 Thermal sprayed yttria-containing coating for plasma reactor Ceased WO2004003962A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU2003238006A AU2003238006A1 (en) 2002-06-27 2003-06-12 Thermal sprayed yttria-containing coating for plasma reactor
JP2004517642A JP2005531157A (en) 2002-06-27 2003-06-12 Thermally sprayed yttria-containing coating for plasma reactors to improve productivity
KR1020117000086A KR101107542B1 (en) 2002-06-27 2003-06-12 Thermal sprayed yttria-containing coating for plasma reactor
EP03737030A EP1518255B1 (en) 2002-06-27 2003-06-12 Thermal sprayed yttria-containing coating for plasma reactor
KR1020047021152A KR101030935B1 (en) 2002-06-27 2003-06-12 Thermal Spray Yttria-Containing Coatings for Plasma Reactors
AT03737030T ATE545148T1 (en) 2002-06-27 2003-06-12 THERMALLY SPRAYED COATING CONTAINING YTTRIUM OXIDE FOR PLASMA REACTORS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/180,504 2002-06-27
US10/180,504 US7311797B2 (en) 2002-06-27 2002-06-27 Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor

Publications (2)

Publication Number Publication Date
WO2004003962A2 WO2004003962A2 (en) 2004-01-08
WO2004003962A3 true WO2004003962A3 (en) 2004-04-01

Family

ID=29778939

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/018502 Ceased WO2004003962A2 (en) 2002-06-27 2003-06-12 Thermal sprayed yttria-containing coating for plasma reactor

Country Status (9)

Country Link
US (2) US7311797B2 (en)
EP (1) EP1518255B1 (en)
JP (2) JP2005531157A (en)
KR (2) KR101030935B1 (en)
CN (1) CN1663017A (en)
AT (1) ATE545148T1 (en)
AU (1) AU2003238006A1 (en)
TW (1) TWI328411B (en)
WO (1) WO2004003962A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9012030B2 (en) 2002-01-08 2015-04-21 Applied Materials, Inc. Process chamber component having yttrium—aluminum coating

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* Cited by examiner, † Cited by third party
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