WO2004019385A3 - Support de garniture et procede de garniture selective de plages conductrices d'un tel support - Google Patents
Support de garniture et procede de garniture selective de plages conductrices d'un tel support Download PDFInfo
- Publication number
- WO2004019385A3 WO2004019385A3 PCT/FR2003/050042 FR0350042W WO2004019385A3 WO 2004019385 A3 WO2004019385 A3 WO 2004019385A3 FR 0350042 W FR0350042 W FR 0350042W WO 2004019385 A3 WO2004019385 A3 WO 2004019385A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- support
- coating
- conductive tracks
- selective
- track
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/02—Electrolytic coating other than with metals with organic materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/525,833 US7247226B2 (en) | 2002-08-26 | 2003-08-26 | Coating support and method for the selective coating of conductive tracks on one such support |
| AU2003276378A AU2003276378A1 (en) | 2002-08-26 | 2003-08-26 | Coating support and method for the selective coating of conductive tracks on one such support |
| JP2004530316A JP2005536733A (ja) | 2002-08-26 | 2003-08-26 | コーティング支持体ならびにそのような支持体上への導電性トラックの選択的コーティング方法 |
| CA002496131A CA2496131A1 (fr) | 2002-08-26 | 2003-08-26 | Support de garniture et procede de garniture selective de plages conductrices d'un tel support |
| EP03792451A EP1532665A2 (fr) | 2002-08-26 | 2003-08-26 | Support de garniture et procede de garniture selective de plages conductrices d un tel support |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR02/10566 | 2002-08-26 | ||
| FR0210566A FR2843828A1 (fr) | 2002-08-26 | 2002-08-26 | Support de garniture et procede de garniture selective de plages conductrices d'un tel support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2004019385A2 WO2004019385A2 (fr) | 2004-03-04 |
| WO2004019385A3 true WO2004019385A3 (fr) | 2004-04-08 |
Family
ID=31198302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FR2003/050042 Ceased WO2004019385A2 (fr) | 2002-08-26 | 2003-08-26 | Support de garniture et procede de garniture selective de plages conductrices d'un tel support |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7247226B2 (fr) |
| EP (1) | EP1532665A2 (fr) |
| JP (1) | JP2005536733A (fr) |
| AU (1) | AU2003276378A1 (fr) |
| CA (1) | CA2496131A1 (fr) |
| FR (1) | FR2843828A1 (fr) |
| WO (1) | WO2004019385A2 (fr) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2851258B1 (fr) * | 2003-02-17 | 2007-03-30 | Commissariat Energie Atomique | Procede de revetement d'une surface, fabrication d'interconnexion en microelectronique utilisant ce procede, et circuits integres |
| US7820026B2 (en) * | 2005-04-13 | 2010-10-26 | Applied Materials, Inc. | Method to deposit organic grafted film on barrier layer |
| US20090056994A1 (en) * | 2007-08-31 | 2009-03-05 | Kuhr Werner G | Methods of Treating a Surface to Promote Metal Plating and Devices Formed |
| US20090225585A1 (en) * | 2007-12-27 | 2009-09-10 | Hawkins J Adrian | Self-Contained Charge Storage Molecules for Use in Molecular Capacitors |
| FR2927169B1 (fr) * | 2008-02-05 | 2013-01-11 | Commissariat Energie Atomique | Procede de fonctionnalisation de la surface d'un pore |
| US8927775B2 (en) | 2008-07-14 | 2015-01-06 | Esionic Es, Inc. | Phosphonium ionic liquids, salts, compositions, methods of making and devices formed there from |
| US8586798B2 (en) * | 2008-07-14 | 2013-11-19 | Esionic Es, Inc. | Heat transfer medium, phosphonium ionic liquids, and methods of making |
| US8907133B2 (en) | 2008-07-14 | 2014-12-09 | Esionic Es, Inc. | Electrolyte compositions and electrochemical double layer capacitors formed there from |
| US20110089557A1 (en) * | 2009-10-19 | 2011-04-21 | Jeng-Jye Shau | Area reduction for die-scale surface mount package chips |
| WO2012005723A1 (fr) | 2010-07-06 | 2012-01-12 | Zettacore, Inc. | Procédés de traitement des surfaces de cuivre pour améliorer l'adhérence à des substrats organiques utilisés dans les cartes de circuit imprimé |
| JP6450989B2 (ja) * | 2014-05-22 | 2019-01-16 | 前田建設工業株式会社 | チェックシート作成システム、及びチェックシート作成方法 |
| US10336606B2 (en) * | 2016-02-25 | 2019-07-02 | Nxp Usa, Inc. | Integrated capacitive humidity sensor |
| CN109542153B (zh) * | 2018-12-06 | 2023-12-01 | 艾恩格电气(珠海)有限公司 | 一种具有欧姆压降自动补偿功能的快速扫描电路 |
| WO2025238687A1 (fr) * | 2024-05-13 | 2025-11-20 | Ntt株式会社 | Procédé de formation d'un film de polymère conducteur |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0038244A1 (fr) * | 1980-04-11 | 1981-10-21 | COMMISSARIAT A L'ENERGIE ATOMIQUE Etablissement de Caractère Scientifique Technique et Industriel | Procédé de dépôt par électropolymérisation de films minces organiques sur des surfaces conductrices de l'électricité, en particulier sur des surfaces métalliques, et films minces ainsi obtenus |
| EP0821987A1 (fr) * | 1995-03-01 | 1998-02-04 | Sumitomo Metal Industries Co., Ltd. | Procede de regulation de la cristallisation de composes organique et composant a semi-conducteur pour la modulation de la cristallisation dans ledit procede |
| US6036834A (en) * | 1996-10-03 | 2000-03-14 | Commissariat A L'energie Atomique | Process and devices for the electrolytic formation of a deposit on a chosen group of electrodes |
| WO2000057467A1 (fr) * | 1999-03-22 | 2000-09-28 | Gemplus | Procede de fabrication de puces de circuits integres |
| US6137183A (en) * | 1997-10-24 | 2000-10-24 | Seiko Epson Corporation | Flip chip mounting method and semiconductor apparatus manufactured by the method |
| US6140144A (en) * | 1996-08-08 | 2000-10-31 | Integrated Sensing Systems, Inc. | Method for packaging microsensors |
| US6144023A (en) * | 1997-06-06 | 2000-11-07 | Commissariat A L'energie Atomique | Electrode support comprising at least one electrode covered by a deposit and system for reading this support |
| US6326936B1 (en) * | 1997-07-22 | 2001-12-04 | Thin Film Electronics Asa | Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2672738A1 (fr) | 1991-02-12 | 1992-08-14 | Commissariat Energie Atomique | Contact pour connecteur electrique protege par un film de polymere et son procede de fabrication. |
| FR2672661B1 (fr) | 1991-02-12 | 1993-08-27 | Commissariat Energie Atomique | Piece metallique recouverte d'un film lubrifiant et son procede de fabrication. |
| FR2764384B1 (fr) * | 1997-06-06 | 1999-07-16 | Commissariat Energie Atomique | Traitement de surface d'un substrat limitant sa fluorescence naturelle |
| US6022583A (en) | 1997-12-16 | 2000-02-08 | Nordson Corporation | Method of encapsulating a wire bonded die |
-
2002
- 2002-08-26 FR FR0210566A patent/FR2843828A1/fr active Pending
-
2003
- 2003-08-26 EP EP03792451A patent/EP1532665A2/fr not_active Withdrawn
- 2003-08-26 AU AU2003276378A patent/AU2003276378A1/en not_active Abandoned
- 2003-08-26 CA CA002496131A patent/CA2496131A1/fr not_active Abandoned
- 2003-08-26 WO PCT/FR2003/050042 patent/WO2004019385A2/fr not_active Ceased
- 2003-08-26 JP JP2004530316A patent/JP2005536733A/ja active Pending
- 2003-08-26 US US10/525,833 patent/US7247226B2/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0038244A1 (fr) * | 1980-04-11 | 1981-10-21 | COMMISSARIAT A L'ENERGIE ATOMIQUE Etablissement de Caractère Scientifique Technique et Industriel | Procédé de dépôt par électropolymérisation de films minces organiques sur des surfaces conductrices de l'électricité, en particulier sur des surfaces métalliques, et films minces ainsi obtenus |
| EP0821987A1 (fr) * | 1995-03-01 | 1998-02-04 | Sumitomo Metal Industries Co., Ltd. | Procede de regulation de la cristallisation de composes organique et composant a semi-conducteur pour la modulation de la cristallisation dans ledit procede |
| US6140144A (en) * | 1996-08-08 | 2000-10-31 | Integrated Sensing Systems, Inc. | Method for packaging microsensors |
| US6036834A (en) * | 1996-10-03 | 2000-03-14 | Commissariat A L'energie Atomique | Process and devices for the electrolytic formation of a deposit on a chosen group of electrodes |
| US6144023A (en) * | 1997-06-06 | 2000-11-07 | Commissariat A L'energie Atomique | Electrode support comprising at least one electrode covered by a deposit and system for reading this support |
| US6326936B1 (en) * | 1997-07-22 | 2001-12-04 | Thin Film Electronics Asa | Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means |
| US6137183A (en) * | 1997-10-24 | 2000-10-24 | Seiko Epson Corporation | Flip chip mounting method and semiconductor apparatus manufactured by the method |
| WO2000057467A1 (fr) * | 1999-03-22 | 2000-09-28 | Gemplus | Procede de fabrication de puces de circuits integres |
Non-Patent Citations (1)
| Title |
|---|
| FIACCABRINO G C ET AL: "ARRAY OF INDIVIDUALLY ADDRESSABLE MICROELECTRODES", SENSORS AND ACTUATORS B, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. B19, no. 1/3, 1 April 1994 (1994-04-01), pages 675 - 677, XP000449927, ISSN: 0925-4005 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2496131A1 (fr) | 2004-03-04 |
| US20060103018A1 (en) | 2006-05-18 |
| US7247226B2 (en) | 2007-07-24 |
| JP2005536733A (ja) | 2005-12-02 |
| AU2003276378A8 (en) | 2004-03-11 |
| WO2004019385A2 (fr) | 2004-03-04 |
| EP1532665A2 (fr) | 2005-05-25 |
| AU2003276378A1 (en) | 2004-03-11 |
| FR2843828A1 (fr) | 2004-02-27 |
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