WO2004019385A3 - Support de garniture et procede de garniture selective de plages conductrices d'un tel support - Google Patents

Support de garniture et procede de garniture selective de plages conductrices d'un tel support Download PDF

Info

Publication number
WO2004019385A3
WO2004019385A3 PCT/FR2003/050042 FR0350042W WO2004019385A3 WO 2004019385 A3 WO2004019385 A3 WO 2004019385A3 FR 0350042 W FR0350042 W FR 0350042W WO 2004019385 A3 WO2004019385 A3 WO 2004019385A3
Authority
WO
WIPO (PCT)
Prior art keywords
support
coating
conductive tracks
selective
track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FR2003/050042
Other languages
English (en)
Other versions
WO2004019385A2 (fr
Inventor
Christophe Bureau
Francois Perruchot
Christophe Kergueris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alchimer SA
Original Assignee
Alchimer SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alchimer SA filed Critical Alchimer SA
Priority to JP2004530316A priority Critical patent/JP2005536733A/ja
Priority to EP03792451A priority patent/EP1532665A2/fr
Priority to AU2003276378A priority patent/AU2003276378A1/en
Priority to CA002496131A priority patent/CA2496131A1/fr
Priority to US10/525,833 priority patent/US7247226B2/en
Publication of WO2004019385A2 publication Critical patent/WO2004019385A2/fr
Publication of WO2004019385A3 publication Critical patent/WO2004019385A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/02—Electrolytic coating other than with metals with organic materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

La présente invention concerne un support de garniture comprenant une pluralité de plages conductrices (12) associées à un plot d'adressage commun (18) et à des moyens de sélection d'au moins une plage à garnir par voie électrochimique parmi la pluralité de plages. Conformément à l'invention, les moyens de sélection comportent des moyens (20) de décalage d'une tension de polarisation, connectés entre le plot d'adressage commun et au moins une plage adresser. Application à la garniture de plages conductrices.
PCT/FR2003/050042 2002-08-26 2003-08-26 Support de garniture et procede de garniture selective de plages conductrices d'un tel support Ceased WO2004019385A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004530316A JP2005536733A (ja) 2002-08-26 2003-08-26 コーティング支持体ならびにそのような支持体上への導電性トラックの選択的コーティング方法
EP03792451A EP1532665A2 (fr) 2002-08-26 2003-08-26 Support de garniture et procede de garniture selective de plages conductrices d un tel support
AU2003276378A AU2003276378A1 (en) 2002-08-26 2003-08-26 Coating support and method for the selective coating of conductive tracks on one such support
CA002496131A CA2496131A1 (fr) 2002-08-26 2003-08-26 Support de garniture et procede de garniture selective de plages conductrices d'un tel support
US10/525,833 US7247226B2 (en) 2002-08-26 2003-08-26 Coating support and method for the selective coating of conductive tracks on one such support

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0210566A FR2843828A1 (fr) 2002-08-26 2002-08-26 Support de garniture et procede de garniture selective de plages conductrices d'un tel support
FR02/10566 2002-08-26

Publications (2)

Publication Number Publication Date
WO2004019385A2 WO2004019385A2 (fr) 2004-03-04
WO2004019385A3 true WO2004019385A3 (fr) 2004-04-08

Family

ID=31198302

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2003/050042 Ceased WO2004019385A2 (fr) 2002-08-26 2003-08-26 Support de garniture et procede de garniture selective de plages conductrices d'un tel support

Country Status (7)

Country Link
US (1) US7247226B2 (fr)
EP (1) EP1532665A2 (fr)
JP (1) JP2005536733A (fr)
AU (1) AU2003276378A1 (fr)
CA (1) CA2496131A1 (fr)
FR (1) FR2843828A1 (fr)
WO (1) WO2004019385A2 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2851258B1 (fr) * 2003-02-17 2007-03-30 Commissariat Energie Atomique Procede de revetement d'une surface, fabrication d'interconnexion en microelectronique utilisant ce procede, et circuits integres
US7820026B2 (en) * 2005-04-13 2010-10-26 Applied Materials, Inc. Method to deposit organic grafted film on barrier layer
US20090056994A1 (en) * 2007-08-31 2009-03-05 Kuhr Werner G Methods of Treating a Surface to Promote Metal Plating and Devices Formed
US20090225585A1 (en) * 2007-12-27 2009-09-10 Hawkins J Adrian Self-Contained Charge Storage Molecules for Use in Molecular Capacitors
FR2927169B1 (fr) * 2008-02-05 2013-01-11 Commissariat Energie Atomique Procede de fonctionnalisation de la surface d'un pore
US8927775B2 (en) 2008-07-14 2015-01-06 Esionic Es, Inc. Phosphonium ionic liquids, salts, compositions, methods of making and devices formed there from
US8907133B2 (en) 2008-07-14 2014-12-09 Esionic Es, Inc. Electrolyte compositions and electrochemical double layer capacitors formed there from
US8846246B2 (en) * 2008-07-14 2014-09-30 Esionic Es, Inc. Phosphonium ionic liquids, compositions, methods of making and electrolytic films formed there from
US20110089557A1 (en) * 2009-10-19 2011-04-21 Jeng-Jye Shau Area reduction for die-scale surface mount package chips
EP2591645B1 (fr) 2010-07-06 2018-09-05 Namics Corporation Procédés de traitement des surfaces de cuivre pour améliorer l'adhérence à des substrats organiques utilisés dans les cartes de circuit imprimé
JP6450989B2 (ja) * 2014-05-22 2019-01-16 前田建設工業株式会社 チェックシート作成システム、及びチェックシート作成方法
US10336606B2 (en) * 2016-02-25 2019-07-02 Nxp Usa, Inc. Integrated capacitive humidity sensor
CN109542153B (zh) * 2018-12-06 2023-12-01 艾恩格电气(珠海)有限公司 一种具有欧姆压降自动补偿功能的快速扫描电路
WO2025238687A1 (fr) * 2024-05-13 2025-11-20 Ntt株式会社 Procédé de formation d'un film de polymère conducteur

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0038244A1 (fr) * 1980-04-11 1981-10-21 COMMISSARIAT A L'ENERGIE ATOMIQUE Etablissement de Caractère Scientifique Technique et Industriel Procédé de dépôt par électropolymérisation de films minces organiques sur des surfaces conductrices de l'électricité, en particulier sur des surfaces métalliques, et films minces ainsi obtenus
EP0821987A1 (fr) * 1995-03-01 1998-02-04 Sumitomo Metal Industries Co., Ltd. Procede de regulation de la cristallisation de composes organique et composant a semi-conducteur pour la modulation de la cristallisation dans ledit procede
US6036834A (en) * 1996-10-03 2000-03-14 Commissariat A L'energie Atomique Process and devices for the electrolytic formation of a deposit on a chosen group of electrodes
WO2000057467A1 (fr) * 1999-03-22 2000-09-28 Gemplus Procede de fabrication de puces de circuits integres
US6137183A (en) * 1997-10-24 2000-10-24 Seiko Epson Corporation Flip chip mounting method and semiconductor apparatus manufactured by the method
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
US6144023A (en) * 1997-06-06 2000-11-07 Commissariat A L'energie Atomique Electrode support comprising at least one electrode covered by a deposit and system for reading this support
US6326936B1 (en) * 1997-07-22 2001-12-04 Thin Film Electronics Asa Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2672738A1 (fr) 1991-02-12 1992-08-14 Commissariat Energie Atomique Contact pour connecteur electrique protege par un film de polymere et son procede de fabrication.
FR2672661B1 (fr) 1991-02-12 1993-08-27 Commissariat Energie Atomique Piece metallique recouverte d'un film lubrifiant et son procede de fabrication.
FR2764384B1 (fr) * 1997-06-06 1999-07-16 Commissariat Energie Atomique Traitement de surface d'un substrat limitant sa fluorescence naturelle
US6022583A (en) 1997-12-16 2000-02-08 Nordson Corporation Method of encapsulating a wire bonded die

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0038244A1 (fr) * 1980-04-11 1981-10-21 COMMISSARIAT A L'ENERGIE ATOMIQUE Etablissement de Caractère Scientifique Technique et Industriel Procédé de dépôt par électropolymérisation de films minces organiques sur des surfaces conductrices de l'électricité, en particulier sur des surfaces métalliques, et films minces ainsi obtenus
EP0821987A1 (fr) * 1995-03-01 1998-02-04 Sumitomo Metal Industries Co., Ltd. Procede de regulation de la cristallisation de composes organique et composant a semi-conducteur pour la modulation de la cristallisation dans ledit procede
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
US6036834A (en) * 1996-10-03 2000-03-14 Commissariat A L'energie Atomique Process and devices for the electrolytic formation of a deposit on a chosen group of electrodes
US6144023A (en) * 1997-06-06 2000-11-07 Commissariat A L'energie Atomique Electrode support comprising at least one electrode covered by a deposit and system for reading this support
US6326936B1 (en) * 1997-07-22 2001-12-04 Thin Film Electronics Asa Electrode means, comprising polymer materials, with or without functional elements and an electrode device formed of said means
US6137183A (en) * 1997-10-24 2000-10-24 Seiko Epson Corporation Flip chip mounting method and semiconductor apparatus manufactured by the method
WO2000057467A1 (fr) * 1999-03-22 2000-09-28 Gemplus Procede de fabrication de puces de circuits integres

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
FIACCABRINO G C ET AL: "ARRAY OF INDIVIDUALLY ADDRESSABLE MICROELECTRODES", SENSORS AND ACTUATORS B, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. B19, no. 1/3, 1 April 1994 (1994-04-01), pages 675 - 677, XP000449927, ISSN: 0925-4005 *

Also Published As

Publication number Publication date
CA2496131A1 (fr) 2004-03-04
US7247226B2 (en) 2007-07-24
JP2005536733A (ja) 2005-12-02
AU2003276378A8 (en) 2004-03-11
US20060103018A1 (en) 2006-05-18
AU2003276378A1 (en) 2004-03-11
WO2004019385A2 (fr) 2004-03-04
FR2843828A1 (fr) 2004-02-27
EP1532665A2 (fr) 2005-05-25

Similar Documents

Publication Publication Date Title
WO2004097838A3 (fr) Systeme de circuit-memoire et procede de production correspondant
AU5054499A (en) Coating
AU2681299A (en) Aqueous coating compositions, coated substrate and method related thereto
AU1578997A (en) Multi-layer non-identical catalyst on metal substrate by electrophoretic deposition
CA2311601A1 (fr) Procede de production de glycerol par des organismes de recombinaison
AU4723199A (en) Method for forming corrosion resistant coating on an alloy surface
CA2328388A1 (fr) Procede permettant de former par electrodeposition un revetement composite a deux couches
WO2003036735A3 (fr) Dispositifs programmables a gestion des couches de surface et procede de fabrication
MX255924B (es) Metodo para revestir superficies de substratos con polimeros de temperatura de solucion critica inferior (tsci).
AU2002367718A1 (en) Molehole embedded 3-d crossbar architecture used in electrochemical molecular memory device
AU5173598A (en) Method for coating substrates
MXPA02001097A (es) Composiciones de recubrimiento que tienen una mejor resistencia a las raspaduras, sustratos recubiertos, y metodos relacionados con lo mismo.
AU2001252126A1 (en) Method for producing multilayer paint coatings on electrically conductive substrates
AU2003298529A1 (en) Stochastic assembly of sublithographic nanoscale interfaces
AU2003214999A1 (en) Topcoat compositions, coated substrates and method
FR2771852B1 (fr) Procede de transfert selectif d'une microstructure, formee sur un substrat initial, vers un substrat final
AU2002249249A1 (en) Functional surface display of polypeptides
AU2003283590A1 (en) Coatings
WO2002004710A3 (fr) Article comprenant un revetement electrodepose qui ne s'ecaille pas et procede de formation d'un revetement par electrodeposition
AU2003276378A1 (en) Coating support and method for the selective coating of conductive tracks on one such support
EP0905231A3 (fr) Procédé pour améliorer la stabilité et/ou la durée de stockage de différents supports
CA2262003A1 (fr) Methode d'augmentation de la conductivite de la polyaniline
PL343513A1 (en) Process for coating substrates having polar surfaces with polyurethane latexes
WO2002070147A3 (fr) Appareil et procedes pour electrodeposition continue de flans de forçage et/ou de substrats metalliques embobines
AU5079299A (en) Polyimide precursor solid residuum

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003792451

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2496131

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2004530316

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2003792451

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2006103018

Country of ref document: US

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 10525833

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 10525833

Country of ref document: US