WO2004019663A3 - Structures laminees et procede d'essai electrique desdites structures - Google Patents

Structures laminees et procede d'essai electrique desdites structures Download PDF

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Publication number
WO2004019663A3
WO2004019663A3 PCT/US2003/026874 US0326874W WO2004019663A3 WO 2004019663 A3 WO2004019663 A3 WO 2004019663A3 US 0326874 W US0326874 W US 0326874W WO 2004019663 A3 WO2004019663 A3 WO 2004019663A3
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
thin
electrical testing
laminate structures
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/026874
Other languages
English (en)
Other versions
WO2004019663A2 (fr
Inventor
Mark Dhaenens
Scott Mckee
William Zidar
Todd Bingham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Park Aerospace Corp
Original Assignee
Park Electrochemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Park Electrochemical Corp filed Critical Park Electrochemical Corp
Priority to AU2003262924A priority Critical patent/AU2003262924A1/en
Publication of WO2004019663A2 publication Critical patent/WO2004019663A2/fr
Publication of WO2004019663A3 publication Critical patent/WO2004019663A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé d'essai permettant de détecter des défauts dans une structure mince laminée adaptée pour être utilisée dans un certain nombre d'applications différentes, y compris la fabrication de cartes à circuit imprimé capacitives. On procède à l'essai sur la feuille mince laminée immédiatement après la lamination mais avant la formation de multiples panneaux à partir de la feuille. L'invention concerne également une feuille mince laminée construite de manière que les deux couches conductrices soient électriquement isolées l'une de l'autre le long des bords périphériques de la feuille.
PCT/US2003/026874 2002-08-26 2003-08-26 Structures laminees et procede d'essai electrique desdites structures Ceased WO2004019663A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003262924A AU2003262924A1 (en) 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40629302P 2002-08-26 2002-08-26
US60/406,293 2002-08-26

Publications (2)

Publication Number Publication Date
WO2004019663A2 WO2004019663A2 (fr) 2004-03-04
WO2004019663A3 true WO2004019663A3 (fr) 2004-04-01

Family

ID=31946964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/026874 Ceased WO2004019663A2 (fr) 2002-08-26 2003-08-26 Structures laminees et procede d'essai electrique desdites structures

Country Status (2)

Country Link
AU (1) AU2003262924A1 (fr)
WO (1) WO2004019663A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5802471A (en) * 1994-12-28 1998-09-01 Ntt Mobile Communications Network, Inc. Mobile communication system, automatic call receiving method, and mobile station
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6134433A (en) * 1996-12-09 2000-10-17 Telefonaktiebolaget L M Ericsson (Publ) System and method of forwarding data calls in a radio telecommunications network
US6256513B1 (en) * 1997-01-07 2001-07-03 Matsushita Electric Industrial Co., Ltd. Multimedia terminal device
US6370394B1 (en) * 1997-04-30 2002-04-09 Nokia Mobile Phones Limited System and a method for transferring a call and a mobile station
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5802471A (en) * 1994-12-28 1998-09-01 Ntt Mobile Communications Network, Inc. Mobile communication system, automatic call receiving method, and mobile station
US6134433A (en) * 1996-12-09 2000-10-17 Telefonaktiebolaget L M Ericsson (Publ) System and method of forwarding data calls in a radio telecommunications network
US6256513B1 (en) * 1997-01-07 2001-07-03 Matsushita Electric Industrial Co., Ltd. Multimedia terminal device
US6370394B1 (en) * 1997-04-30 2002-04-09 Nokia Mobile Phones Limited System and a method for transferring a call and a mobile station
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Also Published As

Publication number Publication date
WO2004019663A2 (fr) 2004-03-04
AU2003262924A8 (en) 2004-03-11
AU2003262924A1 (en) 2004-03-11

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