WO2004032571A3 - Lichtquellenmodul mit leuchtdioden sowie verfahren zu dessen herstellung - Google Patents

Lichtquellenmodul mit leuchtdioden sowie verfahren zu dessen herstellung Download PDF

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Publication number
WO2004032571A3
WO2004032571A3 PCT/DE2003/003189 DE0303189W WO2004032571A3 WO 2004032571 A3 WO2004032571 A3 WO 2004032571A3 DE 0303189 W DE0303189 W DE 0303189W WO 2004032571 A3 WO2004032571 A3 WO 2004032571A3
Authority
WO
WIPO (PCT)
Prior art keywords
source module
light source
production
emitting diodes
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2003/003189
Other languages
English (en)
French (fr)
Other versions
WO2004032571A2 (de
Inventor
Patrick Kromotis
Guenter Waitl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to EP03773459.7A priority Critical patent/EP1547166B1/de
Priority to JP2004540508A priority patent/JP2006501657A/ja
Priority to CN038233940A priority patent/CN1735974B/zh
Priority to US10/529,718 priority patent/US7456500B2/en
Publication of WO2004032571A2 publication Critical patent/WO2004032571A2/de
Anticipated expiration legal-status Critical
Publication of WO2004032571A3 publication Critical patent/WO2004032571A3/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Led Device Packages (AREA)

Abstract

Die Erfindung betrifft ein Lichtquellemodul mit mehreren LEDs, die über eine Isolierschicht (3) mit einem Metallträger (4) verbunden sind. Zum Schutz vor mechanischen Einwirkungen und zur Reflektorbildung sind die LEDs von einem Rahmen (10) umgeben, welcher durch Dehnfugen (13) in mehrere Teile segmentiert ist, damit durch Temperaturschwankungen auftretende Spannungen abgefangen werden.
PCT/DE2003/003189 2002-09-30 2003-09-24 Lichtquellenmodul mit leuchtdioden sowie verfahren zu dessen herstellung Ceased WO2004032571A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP03773459.7A EP1547166B1 (de) 2002-09-30 2003-09-24 Lichtquellenmodul sowie verfahren zu dessen herstellung
JP2004540508A JP2006501657A (ja) 2002-09-30 2003-09-24 光源モジュールならびに該光源モジュールを製作するための方法
CN038233940A CN1735974B (zh) 2002-09-30 2003-09-24 光源模块及其制造方法
US10/529,718 US7456500B2 (en) 2002-09-30 2003-09-24 Light source module and method for production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10245945.2 2002-09-30
DE10245945A DE10245945A1 (de) 2002-09-30 2002-09-30 Lichtquellenmodul sowie Verfahren zu dessen Herstellung

Publications (2)

Publication Number Publication Date
WO2004032571A2 WO2004032571A2 (de) 2004-04-15
WO2004032571A3 true WO2004032571A3 (de) 2005-04-21

Family

ID=31984359

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/003189 Ceased WO2004032571A2 (de) 2002-09-30 2003-09-24 Lichtquellenmodul mit leuchtdioden sowie verfahren zu dessen herstellung

Country Status (7)

Country Link
US (1) US7456500B2 (de)
EP (1) EP1547166B1 (de)
JP (1) JP2006501657A (de)
CN (1) CN1735974B (de)
DE (1) DE10245945A1 (de)
TW (1) TWI233701B (de)
WO (1) WO2004032571A2 (de)

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JP2006066513A (ja) * 2004-08-25 2006-03-09 Rohm Co Ltd 発光装置および表示装置
JP2006120691A (ja) * 2004-10-19 2006-05-11 Matsushita Electric Ind Co Ltd 線状光源装置
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置
JP2006222358A (ja) * 2005-02-14 2006-08-24 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP2007329394A (ja) * 2006-06-09 2007-12-20 Hitachi Lighting Ltd 光源モジュール、光源モジュールの製造方法および液晶表示装置
CN100485925C (zh) * 2006-07-07 2009-05-06 启萌科技有限公司 发光二极管模组
CN100499119C (zh) * 2006-07-07 2009-06-10 启萌科技有限公司 发光二极管模组
US7621752B2 (en) * 2007-07-17 2009-11-24 Visteon Global Technologies, Inc. LED interconnection integrated connector holder package
US8125784B2 (en) * 2008-08-13 2012-02-28 Continental Automative Systems, Inc. Seal apparatus and method of manufacturing the same
DE102008049188A1 (de) * 2008-09-26 2010-04-01 Osram Opto Semiconductors Gmbh Optoelektronisches Modul mit einem Trägersubstrat und einer Mehrzahl von strahlungsemittierenden Halbleiterbauelementen und Verfahren zu dessen Herstellung
TWI421982B (zh) * 2008-11-21 2014-01-01 先進封裝技術私人有限公司 半導體導線元件及其製造方法
EP2228841A1 (de) * 2009-03-09 2010-09-15 Ledon Lighting Jennersdorf GmbH LED-Modul mit verbesserter Lichtausgabe
US8350500B2 (en) * 2009-10-06 2013-01-08 Cree, Inc. Solid state lighting devices including thermal management and related methods
US8264155B2 (en) * 2009-10-06 2012-09-11 Cree, Inc. Solid state lighting devices providing visible alert signals in general illumination applications and related methods of operation
US8157412B2 (en) * 2009-12-01 2012-04-17 Shin Zu Shing Co., Ltd. Light emitting diode substrate assembly
DE202010007032U1 (de) * 2010-04-09 2011-08-09 Tridonic Jennersdorf Gmbh LED-Modul für Strahler
US20110254030A1 (en) * 2010-04-15 2011-10-20 Perkinelmer Elcos Gmbh Liquid reflector
CN203260631U (zh) * 2010-07-01 2013-10-30 西铁城控股株式会社 Led光源装置
US8322882B2 (en) * 2010-09-22 2012-12-04 Bridgelux, Inc. Flexible distributed LED-based light source and method for making the same
US9461023B2 (en) 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
US8652860B2 (en) 2011-01-09 2014-02-18 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
DE102011105010A1 (de) * 2011-06-20 2012-12-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
WO2013002588A2 (ko) 2011-06-28 2013-01-03 Lee Hyeong Gon 엘이디용 회로기판원판, 회로기판, 엘이디유닛, 조명기구 및 제조방법
TWI497668B (zh) * 2011-07-27 2015-08-21 矽品精密工業股份有限公司 半導體封裝件及其製法
DE102012217521A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP6276557B2 (ja) * 2013-10-25 2018-02-07 シチズン電子株式会社 Ｌｅｄ発光装置
US9859480B2 (en) * 2015-08-20 2018-01-02 Nichia Corporation Light emitting device and method of manufacturing light emitting device
JP6611036B2 (ja) * 2015-09-10 2019-11-27 パナソニックＩｐマネジメント株式会社 発光装置及び照明用光源
CN108352433B (zh) * 2015-10-29 2021-09-21 京瓷株式会社 发光元件搭载用基板和发光装置
JP7197765B2 (ja) 2018-08-03 2022-12-28 日亜化学工業株式会社 発光装置
EP3780092B1 (de) 2019-06-14 2023-03-01 Shenzhen Goodix Technology Co., Ltd. Chipgehäusestruktur und elektronische vorrichtung
US20220057060A1 (en) * 2020-08-21 2022-02-24 Lumileds Llc Multi-color lighting device
US12191285B2 (en) * 2021-11-10 2025-01-07 Infineon Technologies Ag Optical projection device having a grid structure
DE102022205568A1 (de) 2022-06-01 2023-12-07 Continental Automotive Technologies GmbH Anzeigevorrichtung und Fortbewegungsmittel
DE102022205566A1 (de) * 2022-06-01 2023-12-07 Continental Automotive Technologies GmbH Anzeigevorrichtung und Fortbewegungsmittel

Citations (3)

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Publication number Priority date Publication date Assignee Title
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
JPH06140673A (ja) * 1992-10-23 1994-05-20 Nippon Telegr & Teleph Corp <Ntt> 光素子の実装法
JP2001085748A (ja) * 1999-09-14 2001-03-30 Matsushita Electric Works Ltd 発光装置

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JPH0525604A (ja) 1991-07-15 1993-02-02 Nkk Corp 溶融めつき設備における合金化制御装置
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JP2901506B2 (ja) 1994-10-24 1999-06-07 スタンレー電気株式会社 Ｌｅｄドットマトリクス表示ユニット
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DE10051159C2 (de) 2000-10-16 2002-09-19 Osram Opto Semiconductors Gmbh LED-Modul, z.B. Weißlichtquelle
JP3614776B2 (ja) * 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
TW473951B (en) * 2001-01-17 2002-01-21 Siliconware Precision Industries Co Ltd Non-leaded quad flat image sensor package
US6547249B2 (en) * 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
DE10229067B4 (de) 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung

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Publication number Priority date Publication date Assignee Title
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
JPH06140673A (ja) * 1992-10-23 1994-05-20 Nippon Telegr & Teleph Corp <Ntt> 光素子の実装法
JP2001085748A (ja) * 1999-09-14 2001-03-30 Matsushita Electric Works Ltd 発光装置

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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 20 10 July 2001 (2001-07-10) *

Also Published As

Publication number Publication date
JP2006501657A (ja) 2006-01-12
WO2004032571A2 (de) 2004-04-15
US7456500B2 (en) 2008-11-25
EP1547166A2 (de) 2005-06-29
CN1735974B (zh) 2010-05-05
TW200411958A (en) 2004-07-01
TWI233701B (en) 2005-06-01
EP1547166B1 (de) 2015-03-04
US20060138441A1 (en) 2006-06-29
CN1735974A (zh) 2006-02-15
DE10245945A1 (de) 2004-04-08

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