WO2004053932A3 - Radiateur interieur-exterieur - Google Patents

Radiateur interieur-exterieur Download PDF

Info

Publication number
WO2004053932A3
WO2004053932A3 PCT/US2003/038067 US0338067W WO2004053932A3 WO 2004053932 A3 WO2004053932 A3 WO 2004053932A3 US 0338067 W US0338067 W US 0338067W WO 2004053932 A3 WO2004053932 A3 WO 2004053932A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
out heat
supporting
internal structure
provide structural
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/038067
Other languages
English (en)
Other versions
WO2004053932A2 (fr
Inventor
Roger Dugas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xanoptix Inc
Original Assignee
Xanoptix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xanoptix Inc filed Critical Xanoptix Inc
Priority to AU2003291202A priority Critical patent/AU2003291202A1/en
Publication of WO2004053932A2 publication Critical patent/WO2004053932A2/fr
Publication of WO2004053932A3 publication Critical patent/WO2004053932A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Machine Tool Units (AREA)

Abstract

L'invention concerne un radiateur comportant une surface externe fenêtrée et une structure interne soutenant la surface externe afin d'en faciliter le transfert thermique, et conférant au radiateur sa rigidité structurale.
PCT/US2003/038067 2002-12-09 2003-12-01 Radiateur interieur-exterieur Ceased WO2004053932A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003291202A AU2003291202A1 (en) 2002-12-09 2003-12-01 Inside-out heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/314,721 US20040108101A1 (en) 2002-12-09 2002-12-09 Inside-out heat sink
US10/314,721 2002-12-09

Publications (2)

Publication Number Publication Date
WO2004053932A2 WO2004053932A2 (fr) 2004-06-24
WO2004053932A3 true WO2004053932A3 (fr) 2004-08-12

Family

ID=32468546

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/038067 Ceased WO2004053932A2 (fr) 2002-12-09 2003-12-01 Radiateur interieur-exterieur

Country Status (3)

Country Link
US (1) US20040108101A1 (fr)
AU (1) AU2003291202A1 (fr)
WO (1) WO2004053932A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD543953S1 (en) * 2003-09-02 2007-06-05 Cubic Wafer, Inc. Wing portion of a butterfly-style inside-out heat sink
US7578337B2 (en) * 2005-04-14 2009-08-25 United States Thermoelectric Consortium Heat dissipating device
US7814965B1 (en) 2005-10-27 2010-10-19 United States Thermoelectric Consortium Airflow heat dissipation device
US7992625B1 (en) 2006-08-18 2011-08-09 United States Thermoelectric Consortium Fluid-operated heat transfer device
US20070097652A1 (en) * 2005-10-31 2007-05-03 Camdeor Technology Co., Ltd. Heat dissipator for a surveillance camera
US8141620B1 (en) 2007-02-26 2012-03-27 United States Thermoelectric Consortium (USTC) Method for conditioning a cooling loop of a heat exchange system
US8490419B2 (en) * 2009-08-20 2013-07-23 United States Thermoelectric Consortium Interlocked jets cooling method and apparatus
US9217838B2 (en) * 2012-12-11 2015-12-22 Finisar Corporation Heat sink retention in an optical component

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4746479A (en) * 1983-12-29 1988-05-24 Nippon Soken, Inc. Method of manufacturing a block-type heat exchange element
US4897712A (en) * 1987-02-07 1990-01-30 Suddeutsche Kuhlerfabrik Julius Fr. Behr Gmbh & Co. Kg Heat sink, particulary for the cooling of electronic elements
US4926242A (en) * 1984-10-03 1990-05-15 Sumitomo Electric Industries, Ltd. Aluminum-silicon alloy heatsink for semiconductor devices
US4934864A (en) * 1988-12-09 1990-06-19 Mauldin Herbert N Asphalt paver
US5213153A (en) * 1991-03-20 1993-05-25 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5668822A (en) * 1994-08-05 1997-09-16 Mitsubishi Denki Kabushiki Kaisha Integrated semiconductor laser device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5652461A (en) * 1992-06-03 1997-07-29 Seiko Epson Corporation Semiconductor device with a convex heat sink
US6501652B2 (en) * 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
US6196302B1 (en) * 1999-03-16 2001-03-06 Wen-Hao Chuang Heat sink with multi-layer dispersion space
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4746479A (en) * 1983-12-29 1988-05-24 Nippon Soken, Inc. Method of manufacturing a block-type heat exchange element
US4926242A (en) * 1984-10-03 1990-05-15 Sumitomo Electric Industries, Ltd. Aluminum-silicon alloy heatsink for semiconductor devices
US4897712A (en) * 1987-02-07 1990-01-30 Suddeutsche Kuhlerfabrik Julius Fr. Behr Gmbh & Co. Kg Heat sink, particulary for the cooling of electronic elements
US4934864A (en) * 1988-12-09 1990-06-19 Mauldin Herbert N Asphalt paver
US5213153A (en) * 1991-03-20 1993-05-25 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5668822A (en) * 1994-08-05 1997-09-16 Mitsubishi Denki Kabushiki Kaisha Integrated semiconductor laser device

Also Published As

Publication number Publication date
US20040108101A1 (en) 2004-06-10
AU2003291202A1 (en) 2004-06-30
WO2004053932A2 (fr) 2004-06-24
AU2003291202A8 (en) 2004-06-30

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