WO2004054755A2 - Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture - Google Patents
Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture Download PDFInfo
- Publication number
- WO2004054755A2 WO2004054755A2 PCT/FR2003/003688 FR0303688W WO2004054755A2 WO 2004054755 A2 WO2004054755 A2 WO 2004054755A2 FR 0303688 W FR0303688 W FR 0303688W WO 2004054755 A2 WO2004054755 A2 WO 2004054755A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- opening
- gripping
- shutter
- arms
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/08—Protective coverings for parts of machine tools; Splash guards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
- B23Q7/043—Construction of the grippers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
Definitions
- the invention relates to a device allowing a gripping, through a transfer station opening for a semiconductor wafer processing installation, of at least one semiconductor wafer adopting the shape of a disc, housed in a semiconductor plate container located on a first side of said opening, from a space located on a second side of said opening opposite the first side, said device comprising:
- a movable shutter able to move between a first position for closing said opening, and a second position for releasing said opening allowing access to the interior of the container
- the prior art teaches such devices.
- the container On one side of the transfer openings are the container (s), more precisely one container per transfer opening, and on the other side of the transfer openings are the equipment for processing the semiconductor wafers housed in said containers and a plate handling robot making it possible to grasp a semiconductor plate located in a container on one side of the opening on which the container is fixed, to orient the latter, and / or in particular to bring this plate on the appropriate equipment on the other side of the opening.
- the manipulator robot is fixed to the structure carrying or protecting the equipment.
- each opening is provided with a mechanism generally called a shutter making it possible to remove the lid closing the container of semiconductor plates, the interior of the container, as well as the space in which the manipulator robot and the processing equipment are located being subject to determined cleanliness and purity constraints; thus, once the closed container is fixed on the transfer opening, the shutter of the transfer opening is associated with the lid of the container, unlocks the latter, and removes it in order to allow access to the interior of the container.
- container simultaneously releasing the transfer opening; the manipulator robot fixed in the space of the processing equipment can then access the semiconductor plates housed inside all the containers that can be in communication with the space of the processing equipment via their respective transfer openings.
- the present invention overcomes these drawbacks and provides other advantages. More specifically, it relates to a device allowing a gripping, through a transfer station opening for installation for processing semiconductor wafers, of at least one semiconductor wafer adopting the shape of a disc, housed in a semiconductor plate container located on a first side of said opening, from a space located on a second side of said opening opposite to the first side, said device comprising:
- a movable shutter able to move between a first position for closing said opening, and a second position for releasing said opening allowing access to the interior of the container
- said device being characterized in that it comprises:
- the device according to the invention comprises means for orienting said at least one semiconductor plate cooperating with said gripping means and said means for moving said gripping means in order to allow modification of the orientation of said at least one semiconductor plate.
- This characteristic allows the device according to the invention to orient a plate input, in particular with a view to aligning its locating notch, the orientation consisting in allowing the rotation of the plate in its plane around its axis of symmetry perpendicular to the plane of the plate.
- said means for moving said gripping means from said space located on the second side of the opening towards the first side, or vice versa comprise means for transferring a semiconductor plate from one side of said opening to the other side.
- This feature allows the device according to the invention to advantageously give it the ability to move a semiconductor plate from the container to the processing equipment, or vice versa.
- said gripping means comprise a first and a second movable arm, capable of adopting at least a first position in which they are substantially parallel, and a second position in which they form one relative to the another a specific angle so that they determine a support plane of the semiconductor plate.
- said means for gripping the plate comprise at least three rollers linked to three of the ends of said first and second arms by means of a connection comprising a degree of freedom in rotation, so that said at least three rollers distribute around the semiconductor plate when the first and second arms are placed in said second position of the movable arms.
- said first and second movable arms are in a plane substantially parallel to the plane of the opening when they are placed in said first position of the movable arms, and in a plane perpendicular to the plane of the opening when they are placed in said second position of the mobile arms.
- said means for moving said gripping means from the space located on the second side of the opening towards the first side where the container is located, or vice versa, comprise a third arm carrying said gripping means at one of its ends, and in that said means for connecting the means for moving said gripping means to the shutter comprise an articulation of the third arm on said shutter at its other end so that said gripping means can be move to either side of the opening.
- said first, second and third arms are articulated together so that they are able to move, in cooperation with the articulation of the third arm on the shutter, in a plane perpendicular to the plane of said opening.
- said means for moving said gripping means comprise means for coupling between one of said first or second arm and said third arm so that a movement of the third arm results in an induced movement of the first or second arm with which it is coupled .
- said coupling means are arranged to so that they confer on the displacement means of said gripping means an ability to move the semiconductor plate in a direction perpendicular to the plane of the opening.
- said first, second and third arms are placed in a plane substantially parallel to the plane of the opening in said first position of the first and second arms, and on the upper edge of said shutter.
- said first, second and third arms are also arranged, in said first position of the first and second arms, in a space delimited between the two planes of the two external faces of the shutter, respectively.
- the device according to the invention comprises means for automatically deploying that of said first or second arm which is not coupled to said third arm by said coupling means, to pass from the first to the second position of the movable arms during movement of said third arm out of the plane parallel to the plane of the opening.
- said automatic deployment means comprise a return spring, placed in the compressed state in said first position of the first and second arms.
- said orientation means comprise a roller for driving in friction rotation on the peripheral part of said at least one semiconductor plate.
- said drive roller is associated with said shutter, and the device according to the invention comprises means for moving said drive roller between at least two positions, one called active in which the roller is protruding and capable of driving said semiconductor plate in rotation, and the other in which said roller is at least partially retracted and allows movement of the means for moving the gripping means from the first side of said shutter to the second side or vice versa.
- the device according to the invention comprises means for blocking said means for moving the gripping means and said gripping means in said first position of the mobile arms.
- said means for blocking said means for moving the gripping means and said gripping means are coupled with said means for moving the drive roller in rotation by the peripheral part of said at least one semiconductor plate , so that the movement of the drive roller causes the displacement of the locking means.
- the device according to the invention comprises means making it possible to detect the position of a semiconductor plate in said container, and further comprises means for measuring the thickness of the semiconductor plate .
- FIG. 1 represents a perspective view of an exemplary transfer station comprising an exemplary embodiment of a gripping device according to the invention in a first position.
- FIG. 2 represents in enlarged perspective a first view of detail A of the example of the gripping device according to the invention represented in FIG. 1.
- Figure 3 shows in enlarged perspective a second detailed view of the example of the gripping device according to the invention shown in Figure 1, in a second position.
- FIG. 4 represents a top view of the detail of FIG. 2.
- FIG. 5 represents a top view of the detail of FIG. 3.
- the semiconductor wafer transfer station 10 shown in FIG. 1 has been intentionally isolated from the wafer processing installation (not shown), in order to simplify the representation, and is seen from the side of the space in which the processing tools (not shown) of the plates are arranged.
- the gripping device 12 allows a gripping, through an opening 13 of the transfer station 10, of at least one semiconductor plate adopting the shape of a disc and housed in a container 14 of plates of semiconductor located on a first side 15 of the opening 13 and which has been fixed thereto, from a space 16 located on a second side 17 of the opening 13 opposite the first side 15, the semiconductor plate or plates respectively being advantageously arranged in a known manner in the container 14 according to parallel planes perpendicular to the plane of the opening 13.
- the device 12 comprises: - a movable shutter 1, also called a racket, capable of move between a first position, as shown in FIG. 1, for closing the opening 13, and a second position (not shown) for releasing the opening 13 allowing access to the interior of the container,
- - Gripping means 2 of at least one semiconductor plate able to partially penetrate into the container 14 under the plate to be taken, and advantageously between at least two successive plates (not shown), and to grasp a plate semiconductor by its peripheral part 19,
- the shutter 1 or racket, the displacement means 18 thereof, and more generally the transfer station 10 will not be described in greater detail here since they are known to those skilled in the art.
- the container 14 of semiconductor wafers is of a known type and of standard shape capable of being associated with the openings of the transfer stations.
- the shutter 1 is a member of generally parallelepiped shape and is pressed against the opening 13 in its first position in which it is capable of unlocking the door of the container 14 and, in its movement towards the second position, of releasing the opening 13. To release the opening 13, the shutter first moves backwards in the space 16, then performs in this space a downward movement in a plane parallel to the opening 13.
- the shutter 1 has as shown, a thickness of a few millimeters or even a few centimeters in which are housed the known mechanisms for releasing (not shown) the door of the container 14, and generally extends over a surface slightly greater than that of the opening 13.
- the gripping means 2 comprise a first 6 and a second 7 movable arms, capable of adopting at least a first position in which they are substantially parallel as shown in Figure 4, and a second position in which they form relative to each other a specific angle as shown in Figure 5, so that they determine a support plane of the semiconductor plate 11.
- the gripping means 2 of the plate also advantageously comprise three double rollers 21 linked to three of the ends of the first 6 and second 7 arms by means of a connection comprising a degree of freedom in rotation, as shown in FIGS. 3 and 5 , so that the three double rollers 21 are distributed around the semiconductor plate 11 when the first and second arms are placed in the second position of the movable arms 6, 7 determining a support plane of the semiconductor plate 11 as shown in Figure 5.
- the first 6 arms has at each of its ends two rollers 21 support in free rotation
- the second arm 7 articulated on the first 6 arms to the 'one of its ends comprises at its other end two rollers 21 support in free rotation.
- each roller 21 advantageously adopts a frustoconical base on which the lower peripheral part of the plate rests, surmounted by a cylindrical part with circular section intended to serve as a rotary stop for the plate between the rollers 21.
- the three rotary rollers 21 are doubled in order to ensure correct static balance of the plate gripped despite the presence of a notch 60 or locating means on the peripheral part 19 of the plates 11.
- the displacement means 3 of the gripping means 2, from the space 16 located on the second 17 side of the opening 13 towards the first 15 side where the container 14 is located, or vice versa advantageously comprise a third 8 bearing arms the gripping means 6, 7 at one 22 of its ends, and the connecting means 4 of the displacement means 3 to the shutter 1 comprise an articulation 23 of the third 8 arms on the shutter 1 at its other 24 end so that the gripping means 6, 7 can move on either side of the opening as will be explained later.
- the first 6, second 7, and third 8 arms are articulated together so that they are able to move, in cooperation with the articulation 23 of the third 8 arms on the shutter 1, in a plane perpendicular to the plane of l opening 13, and the displacement means 3 of the gripping means 6, 7 comprise coupling means (not shown) between the first 6 arms and the third 8 arms so that a displacement of the third arm results in an induced displacement of the first arm with which it is coupled.
- the coupling means for example a belt transmission (not shown), are arranged inside the arm 8 so that they give the displacement means 3 gripping means 6, 7 an ability to move the plate 11 of semiconductor in a direction perpendicular to the plane of the opening, for example by means of a transmission ratio of 2/1 for the belt transmission between the arms 6 and 8.
- the first 6 and second 7 movable arms folded against each other are in a plane substantially parallel to the plane 61 of the opening, and on the upper edge 62 of the shutter, advantageously in a space 63 delimited between the two planes 64 and 65 of the two external faces 25 and 26 of the shutter 1, respectively, and when they are placed in the second position of the movable arms, these same arms are are arranged in a plane perpendicular to the plane of the opening, this thanks to the articulation 23 in rotation of the arm 8 whose axis of rotation is parallel to the plane 61 of the opening 13 or to the planes 64, 65 of the shutter 1, as shown in Figure 4.
- the gripping device 12 shown further comprises means 27 for automatic deployment of the second 7 arm not coupled in rotation to the third 8 arm, but articulated in rotation on the first 6 arms, to pass from the first to the second position of the mobile arms during a movement of the third 8 arms out of the space between the planes 64 and 65 parallel to the plane 61 of the opening.
- These automatic deployment means advantageously consist of a return spring 27, for example a leaf spring as shown in FIG.
- the second arm 7 can move away from the first 6 by pivoting in turn around its articulation 28 on the first 6 arms under the effect of the relaxation of the spring 27 until it comes against a stop (not shown), preferably adjustable, for example a notice stop, so that the three groups of rollers 21 are placed in the position for receiving or gripping a semiconductor plate according to the angle ⁇ of determined opening as a function of the diameter of the plates to be gripped and of the chosen cord defined between the two groups of rollers 21 of the arm 6 in order to obtain sufficient static and dynamic balance of the plate.
- a stop preferably adjustable, for example a notice stop
- connection means 4 of the third arm 8 to the shutter 1 therefore comprise a connection 23 of the arm 8 and of the shutter comprising a degree of freedom in rotation 23 along an axis parallel to the opening face 13 and perpendicular to the planes for storing the semiconductor plates 11 in the container 14.
- An electric motor 29 makes it possible to control the rotation of the arm 8 in both directions of rotation around the articulation 23.
- a brake 9 is subject to the 'axis of the motor 29 so as to block this axis, and therefore the arm 8, in a position determined; such a brake system makes it possible to avoid enslaving the motor 29 continuously; the brake 9 may include jaws engaged on an axis linked in rotation to the axis of the motor 29, these jaws being controlled by electromagnetic means; the brake system is provided with an encoder in order to know the position of the arm 8. When the brake is applied, the arm is immobilized in a chosen position, and when the brake is not activated the arm 8 is free.
- the orientation means 20 advantageously comprise a roller 30 for frictionally rotating on the peripheral part 19 of the semiconductor plate 11.
- the drive roller 30 is associated with the shutter 1, and the device 12 advantageously comprises means 31 for moving the drive roller 30 between at least two positions, one called active in which the roller is protruding and suitable in rotating the semiconductor plate 11 as shown in FIG. 3, and the other in which the roller 30 is at least partially retracted and thus allows movement of the displacement means 3 on the first side of the shutter towards the second side or vice versa.
- the retractable roller 30 is for example movable in translation along an axis 66 parallel to the axis 67 of the articulation 23 of the arm 8 and disposed on top of the shutter 1.
- An electric motor 32 associated with an encoding system by any known means makes it possible to drive the roller 30 in rotation
- an electric motor 37 associated with an encoding system according to any known means makes it possible to move the roller 30 along its axis of translation via a rack and pinion system for example, knowing the position of the roller 30 on its axis 66 of movement.
- the orientation of a semiconductor plate 11 gripped by the gripping means is done as follows: the roller 30 is brought into the high position along its axis 66 of displacement in translation thanks to the motor 37; arm 8 thanks to the motor
- the device 12 comprises means 33 for detecting the orientation mark of the plate, for example an optoelectronic sensor 68, emitting a light beam and detecting the reflection of this beam on the plate, except when this beam passes through the notch 60 or the orientation mark of the plate.
- the sensor 68 will be placed, for example next to the roller 30 on a support 34 thereof so as to follow the movements of the roller 30 in translation, and under the path of the plate in its rotational movement in view of its orientation.
- the arm 8 is moved by means of the motor 29 to release the plate from contact with the roller 30 and thus allow a retraction of the latter in whole or in part in the shutter 1 thanks to the motor 37 and to the pinion system - rack for example.
- the roller 30 retracted into the shutter at least in part, it no longer constitutes an obstacle to the movement of the arm 8 which can then move on either side of the opening 13 for the transfer of the plate 11 capture.
- the orientation means 20 of the plate in position against the roller 30 must take account of the subsequent rotation of the plate 11 after orientation, this due to the movement of the arms 6 and 8 for its placement or replacement in the container 14.
- the device shown in the figures comprises blocking means 35 of the displacement means 3 and gripping means 2 in the first position of the movable arms.
- these blocking means of the displacement means and gripping means are advantageously coupled with the displacement means 31 of the drive roller 30, so that the displacement of the roller causes the displacement of the locking means 35
- the locking means are for example composed of a lever 38 articulated for example substantially in its middle 41 on the shutter 1, and one end 40 of which is integral with the roller 30, more particularly with its support 34 movable in translation, by via a link 42 with at least one degree of freedom in rotation and in the example a degree of freedom in translation, and the other end 39 of which is free and projecting above the upper surface 69 of the shutter 1 when the roller 30 is fully or partially retracted in the shutter.
- the positions of the connections 41, 42 of the lever 38 on the shutter 1 and on the support 34 of the roller 30, respectively, are defined so that: when the roller 30 is in the high drive position of the plate 11 in rotation, the free end 39 of the lever 38 is sufficiently retracted in the shutter so that it does not hinder the positioning of the plate 11 against the roller 30, and when the roller 30 is in whole or in part retracted into the shutter 1 so that the arms are folded one against the other above the shutter, the free end 39 of the lever 38 protrudes above the shutter and through it so that the latter constitutes a stop at the first 6 and second arm 7, when the third arm 8 engages a rotational movement thanks to the motor 29 aiming to bring the arm 7 against the stop, as shown in FIG. 4.
- the motor 29 continues its rotation so as to compress the spring 27 placed between the first and second arms until the two arms 6, 7 reach the first position described above, namely that they are folded against each other, advantageously in a space corresponding substantially to the thickness of the shutter 1; in this position, the gripping means cannot grasp a plate, and this position corresponds to a rest position of the device 12, for example during which the door of the container 14 is open or closed.
- the device 12 shown advantageously comprises means making it possible to detect the presence and the position of a semiconductor plate in the container 14, and to count the plates, and may also comprise means for measuring the thickness of the semiconductor plate by any known means.
- the arm 6 can in fact comprise at one of its ends 43 a light beam emitter 44, for example a light-emitting diode, and in the region of its other end 45 a receiver 46 for this beam, for example a phototransistor.
- the arm 6 must have a clearance 47 allowing the interception, by the semiconductor plates located in the container, of the light beam emitted by the emitting diode 44, when the shutter 1 moves vertically, causing in its displacement the means of gripping comprising the arm 6, this as will be explained later.
- the device 12 shown advantageously comprises means 48 for detecting the presence of a semiconductor plate on the gripping means 2, consisting for example of an optical system comprising two distinct light beam emitters 49, for example two diodes electroluminescent, and two separate receivers 50 corresponding to these beams, for example two phototransistors, respectively.
- means 48 for detecting the presence of a semiconductor plate on the gripping means 2 consisting for example of an optical system comprising two distinct light beam emitters 49, for example two diodes electroluminescent, and two separate receivers 50 corresponding to these beams, for example two phototransistors, respectively.
- the device 12 as shown in Figures 3 to 5 is inserted in a shutter of any known type, being in the form of a hollow parallelepiped, for example as shown in Figure 1, for which the part has been replaced conventional upper by a rigid cover 55 of suitable shape to close the top of the shutter and serving as a rigid support structure for the displacement means 3 of the gripping means 2, the connecting means 4 to the shutter 1 of the means of displacement 3, and the orientation means, as described above, and shown more particularly in FIG. 3.
- the location of these components, their dimensions, are determined so that the latter can assume the respective functions assigned to them as described above and fit into the free space of the shutter.
- the support 34 of the orientation means will advantageously pass through the rigid cover 55 by means of a passage light, as well as the articulation axis 23 of the arm 8.
- All the maneuvering accessories, such as the motors 29, 37, the brake 9, of the device 12 according to the invention can advantageously be fixed under the cover 55, and therefore being embedded in the shutter, only protruding above the cover the displacement and gripping arms of the semiconductor plate, the stop 39 and the retractable orientation means.
- a container 14 containing semiconductor plates 11 is brought by a conveyor (not shown) and pressed against the opening 13 of the transfer station on the first side 15 thereof,
- the shutter or racket 1 is placed against the door (not shown) of the container 14 on the second side 17 opposite the first 15, in the first position in order to open the latter by unlocking the door and holding her against him,
- the shutter is then released in a known manner, by means of displacement 18, of the opening 13 while moving away from the latter in a direction substantially perpendicular to the opening, then in a vertical movement towards the second position to free the opening and access to the plates located inside the container; during these steps the arms 6, 7, 8 are folded over the shutter against the stop 39 which is erected, the roller 30 being retracted in the shutter,
- the shutter can "sweep" all of the plates so that the detection means 44, 46 of the presence and the position of a semiconductor plate in the container 14 can go into action and perform a location of all the plates present in the container; for this, the arm 8 approaches the arm 6 towards the plates contained in the container without touching them but so that the means 44, 46 for detecting the plates can be operational, that is to say intercepting a cord of the plates, - a plate 11 can then be gripped by the gripping means 2, as follows: the shutter moves back in order to allow deployment of the gripping arms by a movement of the arm 8 towards the interior of the container, then the arms 6, 7 penetrate into the container under the plate to be gripped, the arm 7 being entirely released under the effect of the relaxation of the spring 27, the three groups of rotary support rollers 21 being in position to support a plate 11; once the arms 6 and 7 are in position under the plate to be gripped and the brake 9 actuated, the shutter rises in order to place the plate in abutment between and
- the gripped plate can then be oriented as follows: the arm 8 removes the gripped plate from the container 14 after deactivation of the brake 9, and the roller 30 is lifted above the shutter in order to be placed in the high position d orientation of the plate, and the stop 39 linked is thereby lowered; arm 8 brings at the same time the part peripheral of the plate in contact with the roller 30 by means of the motor 29, then the brake 9 is for example activated and the orientation of the plate is effected by means of the motor 32 of the roller 30 and the detection means 33 of the reference mark orientation of the plate, the oriented plate can either be put back into the container 14, or transferred into the space 16 on the side opposite that of the container, in order to undergo a treatment; for this, the arm 8 spreads the plate of the roller 30 after deactivation of the brake 9 so that it is retracted at least in part, so as to clear the passage of the arm 8 if necessary and of the plate above the shutter, in doing so, the stop 39 being partly raised but leaving free the passage of the plate 11 above the shutter; in fact,
- the device according to the invention may include means for identifying a plate, constituted for example in a known manner by a camera and means for identifying the plates (not shown).
- the camera can for example be positioned in the upper part of the transfer station 10 so as to observe the identifier of the plate which can be brought into reading range by the camera by means of the shutter 1 in its vertical displacement, and of the arm 8.
- the example of the method given above is not limiting of the possibilities of methods which can be implemented by means of the device according to the invention. Other methods can of course be envisaged depending on the processing needs of the semiconductor wafers.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2003296827A AU2003296827A1 (en) | 2002-12-13 | 2003-12-12 | Device for gripping a semiconductor plate through a transfer opening, using the closure of the opening |
| EP03813172A EP1610927A2 (fr) | 2002-12-13 | 2003-12-12 | Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43351602P | 2002-12-13 | 2002-12-13 | |
| US60/433,516 | 2002-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2004054755A2 true WO2004054755A2 (fr) | 2004-07-01 |
| WO2004054755A3 WO2004054755A3 (fr) | 2004-10-21 |
Family
ID=32595207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FR2003/003688 Ceased WO2004054755A2 (fr) | 2002-12-13 | 2003-12-12 | Dispositif permettant la prehension d'une plaque de semi-conducteur a travers une ouverture de transfert, utilisant l'obturateur de l'ouverture |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7244088B2 (fr) |
| EP (1) | EP1610927A2 (fr) |
| AU (1) | AU2003296827A1 (fr) |
| WO (1) | WO2004054755A2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130240759A1 (en) * | 2012-03-19 | 2013-09-19 | Varian Semiconductor Equipment Associates, Inc. | Method and Apparatus for Clamping and Cooling a Substrate for ION Implantation |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4606388B2 (ja) * | 2006-06-12 | 2011-01-05 | 川崎重工業株式会社 | 基板移載装置の搬送系ユニット |
| US20070297885A1 (en) * | 2006-06-27 | 2007-12-27 | Jean Michel Processe | Product designed to be used with handling system |
| US7740437B2 (en) | 2006-09-22 | 2010-06-22 | Asm International N.V. | Processing system with increased cassette storage capacity |
| US7585142B2 (en) * | 2007-03-16 | 2009-09-08 | Asm America, Inc. | Substrate handling chamber with movable substrate carrier loading platform |
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2003
- 2003-12-12 US US10/734,723 patent/US7244088B2/en not_active Expired - Fee Related
- 2003-12-12 WO PCT/FR2003/003688 patent/WO2004054755A2/fr not_active Ceased
- 2003-12-12 AU AU2003296827A patent/AU2003296827A1/en not_active Abandoned
- 2003-12-12 EP EP03813172A patent/EP1610927A2/fr not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130240759A1 (en) * | 2012-03-19 | 2013-09-19 | Varian Semiconductor Equipment Associates, Inc. | Method and Apparatus for Clamping and Cooling a Substrate for ION Implantation |
| US9520264B2 (en) * | 2012-03-19 | 2016-12-13 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for clamping and cooling a substrate for ion implantation |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004054755A3 (fr) | 2004-10-21 |
| AU2003296827A1 (en) | 2004-07-09 |
| AU2003296827A8 (en) | 2004-07-09 |
| US20050063797A1 (en) | 2005-03-24 |
| US7244088B2 (en) | 2007-07-17 |
| EP1610927A2 (fr) | 2006-01-04 |
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