WO2004108566A3 - Transporteur d'elements en forme de plaque - Google Patents

Transporteur d'elements en forme de plaque Download PDF

Info

Publication number
WO2004108566A3
WO2004108566A3 PCT/KR2004/001338 KR2004001338W WO2004108566A3 WO 2004108566 A3 WO2004108566 A3 WO 2004108566A3 KR 2004001338 W KR2004001338 W KR 2004001338W WO 2004108566 A3 WO2004108566 A3 WO 2004108566A3
Authority
WO
WIPO (PCT)
Prior art keywords
plate
shaped member
conveying system
pressurized fluid
shaped members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2004/001338
Other languages
English (en)
Other versions
WO2004108566A2 (fr
Inventor
Dong-Heon Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2004108566A2 publication Critical patent/WO2004108566A2/fr
Publication of WO2004108566A3 publication Critical patent/WO2004108566A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

L'invention concerne un système de transport pouvant transporter des éléments en forme de plaque minces et larges tels que les LCP, PDP, et El organiques, sans générer de poussière ou sans détériorer les éléments en forme de plaque, et destiné à améliorer la performance du système de transport de la demande internationale du déposant de la présente invention (Demande internationale coréenne No. 0339716 'Système de transport d'éléments en forme de plaques et dispositif de lavage') par application de la technologie du 'Système de transport d'éléments en forme de plaques et dispositif de lavage' pour laquelle le déposant de cette invention a déposé une demande internationale le 30 mars 2004 (Demande internationale No. 6-1-2004-0005158-13), et à étendre l'utilisation du système. L'utilisation du système de transport d'éléments en forme de plaques de l'invention, permettant de transporter un élément en forme de plaque, consiste à installer un matériau poreux comprenant une partie plate sur le corps principal dans lequel est injecté un fluide pressurisé, et à obturer l'espace entre plusieurs matériaux poreux à l'aide d'une plaque horizontale pour former une couche de fluide pressurisé à travers les matériaux poreux et une autre couche de fluide sous pression entre la plaque d'étanchéité horizontale et l'élément en forme de plaque, de manière que le poids de l'élément en forme de plaque puisse être supporté de façon uniforme par le fluide pressurisé dans une zone de grande dimension. L'élément en forme de plaque peut ensuite être transporté verticalement, ou incliné sans contact avec le dispositif flottant, sa partie inférieure étant appuyée sur le transporteur.
PCT/KR2004/001338 2003-06-05 2004-06-04 Transporteur d'elements en forme de plaque Ceased WO2004108566A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2003-0036538 2003-06-05
KR1020030036538A KR20040105325A (ko) 2003-06-05 2003-06-05 판상부재의 반송장치

Publications (2)

Publication Number Publication Date
WO2004108566A2 WO2004108566A2 (fr) 2004-12-16
WO2004108566A3 true WO2004108566A3 (fr) 2005-03-10

Family

ID=33509618

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2004/001338 Ceased WO2004108566A2 (fr) 2003-06-05 2004-06-04 Transporteur d'elements en forme de plaque

Country Status (2)

Country Link
KR (1) KR20040105325A (fr)
WO (1) WO2004108566A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100833881B1 (ko) * 2007-02-20 2008-06-02 세메스 주식회사 기판 이송 장치
KR100847093B1 (ko) * 2007-03-19 2008-07-18 에프엔에스테크 주식회사 기판 이송장치
US9114935B2 (en) * 2011-08-12 2015-08-25 Kawasaki Jukogyo Kabushiki Kaisha Plate member conveying apparatus and method of conveying plate member

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010050424A (ko) * 1999-09-10 2001-06-15 이동헌 판상부재의 반송장치
JP2001213517A (ja) * 1999-11-24 2001-08-07 Daiichi Shisetsu Kogyo Kk 板状部材の搬送装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010050424A (ko) * 1999-09-10 2001-06-15 이동헌 판상부재의 반송장치
JP2001213517A (ja) * 1999-11-24 2001-08-07 Daiichi Shisetsu Kogyo Kk 板状部材の搬送装置

Also Published As

Publication number Publication date
KR20040105325A (ko) 2004-12-16
WO2004108566A2 (fr) 2004-12-16

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