WO2004113041A3 - Verfahren zum herstellen eines keramik-metall-substrates - Google Patents

Verfahren zum herstellen eines keramik-metall-substrates Download PDF

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Publication number
WO2004113041A3
WO2004113041A3 PCT/DE2004/001012 DE2004001012W WO2004113041A3 WO 2004113041 A3 WO2004113041 A3 WO 2004113041A3 DE 2004001012 W DE2004001012 W DE 2004001012W WO 2004113041 A3 WO2004113041 A3 WO 2004113041A3
Authority
WO
WIPO (PCT)
Prior art keywords
producing
ceramic
metal substrate
metal
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2004/001012
Other languages
English (en)
French (fr)
Other versions
WO2004113041A2 (de
Inventor
Juergen Schulz-Harder
Kurt Mitteregger
Karl Exel
Juergen Weisser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Curamik Electronics GmbH
Original Assignee
Curamik Electronics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics GmbH filed Critical Curamik Electronics GmbH
Priority to JP2006515661A priority Critical patent/JP5047615B2/ja
Priority to EP04732932A priority patent/EP1634326A2/de
Priority to US10/560,525 priority patent/US20060183298A1/en
Publication of WO2004113041A2 publication Critical patent/WO2004113041A2/de
Publication of WO2004113041A3 publication Critical patent/WO2004113041A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Die Erfindung bezieht sich auf ein neuartiges Verfahren zum Herstellen eines Metall­-Keramik-Substrates, bei dem (Verfahren) auf wenigstens einer Oberflächenseite einer Keramikschicht mindestens ein Metallbereich aufgebracht wird.
PCT/DE2004/001012 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates Ceased WO2004113041A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006515661A JP5047615B2 (ja) 2003-06-16 2004-05-14 セラミック金属基板の製造方法
EP04732932A EP1634326A2 (de) 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates
US10/560,525 US20060183298A1 (en) 2003-06-16 2004-05-14 Method for manufacturing a ceramic/metal substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10327360A DE10327360B4 (de) 2003-06-16 2003-06-16 Verfahren zum Herstellen eines Keramik-Metall-Substrates
DE10327360.3 2003-06-16

Publications (2)

Publication Number Publication Date
WO2004113041A2 WO2004113041A2 (de) 2004-12-29
WO2004113041A3 true WO2004113041A3 (de) 2005-02-24

Family

ID=33495108

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/001012 Ceased WO2004113041A2 (de) 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates

Country Status (5)

Country Link
US (1) US20060183298A1 (de)
EP (1) EP1634326A2 (de)
JP (1) JP5047615B2 (de)
DE (1) DE10327360B4 (de)
WO (1) WO2004113041A2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005022160A1 (de) * 2005-05-13 2006-11-16 Daimlerchrysler Ag Ölpumpe mit integrierter Stromregeleinrichtung
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
ES2436775T3 (es) * 2007-02-28 2014-01-07 Ceramtec Gmbh Procedimiento para la producción de una pieza constructiva mediando utilización de una introducción asimétrica de energía a lo largo de la línea de separación o de rotura nominal
DE102008001229A1 (de) 2007-04-25 2008-10-30 Ceramtec Ag Chip-Resistor-Substrat
DE102009015520A1 (de) * 2009-04-02 2010-10-07 Electrovac Ag Metall-Keramik-Substrat
JP5537081B2 (ja) 2009-07-28 2014-07-02 浜松ホトニクス株式会社 加工対象物切断方法
US9035163B1 (en) 2011-05-10 2015-05-19 Soundbound, Inc. System and method for targeting content based on identified audio and multimedia
DE102012102611B4 (de) * 2012-02-15 2017-07-27 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102012104903B4 (de) * 2012-05-10 2023-07-13 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat
DE102013105528B4 (de) * 2013-05-29 2021-09-02 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
WO2017108950A1 (de) * 2015-12-22 2017-06-29 Heraeus Deutschland Gmbh Verfahren zur herstellung eines metall-keramik substrates mit picolaser
JP6853455B2 (ja) * 2017-02-23 2021-03-31 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
WO2018210786A1 (en) * 2017-05-16 2018-11-22 Heraeus Deutschland GmbH & Co. KG Ceramic-metal substrate with low amorphous phase
TWI651193B (zh) * 2017-12-06 2019-02-21 李宜臻 金屬陶瓷積層散熱基板之製造方法、及包含該金屬陶瓷積層散熱基板之電子裝置及發光二極體
CN111684584A (zh) * 2018-02-01 2020-09-18 康宁股份有限公司 用于卷形式的电子封装和其他应用的单一化基材
WO2019222330A2 (en) * 2018-05-17 2019-11-21 Corning Incorporated Singulated electronic substrates on a flexible or rigid carrier and related methods
US20210212214A1 (en) * 2018-05-23 2021-07-08 Sumitomo Bakelite Co., Ltd. Method of manufacturing circuit board
US20200368804A1 (en) * 2019-05-24 2020-11-26 Trusval Technology Co., Ltd. Manufacturing process for heat sink composite having heat dissipation function and manufacturing method for its finished product
KR102923078B1 (ko) 2021-01-21 2026-02-06 주식회사 엘엑스세미콘 인쇄회로용 기판의 제조방법
CN116904913A (zh) * 2023-08-01 2023-10-20 江苏富乐华半导体科技股份有限公司 一种dcb的铜片氧化方法

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US3556366A (en) * 1969-05-01 1971-01-19 Teletype Corp Methods of severing materials employing a thermal shock
US5626777A (en) * 1993-03-02 1997-05-06 Hoechst Ceramtec Ag Process for producing dividable plates of brittle material with high accuracy and apparatus for receiving and precision-grinding the end faces of a plate
US6207221B1 (en) * 1997-03-01 2001-03-27 Jürgen Schulz-Harder Process for producing a metal-ceramic substrate and a metal-ceramic substrate
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components

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JP2001176820A (ja) * 1999-12-15 2001-06-29 Hitachi Cable Ltd 基板の加工方法及びその加工装置
JP3404352B2 (ja) * 2000-03-29 2003-05-06 京セラ株式会社 多数個取りセラミック配線基板
JP4886937B2 (ja) * 2001-05-17 2012-02-29 リンテック株式会社 ダイシングシート及びダイシング方法
KR100701013B1 (ko) * 2001-05-21 2007-03-29 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단방법 및 장치
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556366A (en) * 1969-05-01 1971-01-19 Teletype Corp Methods of severing materials employing a thermal shock
US5626777A (en) * 1993-03-02 1997-05-06 Hoechst Ceramtec Ag Process for producing dividable plates of brittle material with high accuracy and apparatus for receiving and precision-grinding the end faces of a plate
US6207221B1 (en) * 1997-03-01 2001-03-27 Jürgen Schulz-Harder Process for producing a metal-ceramic substrate and a metal-ceramic substrate
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components

Also Published As

Publication number Publication date
JP5047615B2 (ja) 2012-10-10
DE10327360A1 (de) 2005-01-05
DE10327360B4 (de) 2012-05-24
JP2006527666A (ja) 2006-12-07
WO2004113041A2 (de) 2004-12-29
EP1634326A2 (de) 2006-03-15
US20060183298A1 (en) 2006-08-17

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