WO2005015655A1 - Procede d'application d'un empilement barriere de films minces sur un dispositif a microstructures, et dispositif pourvu d'un tel empilement - Google Patents

Procede d'application d'un empilement barriere de films minces sur un dispositif a microstructures, et dispositif pourvu d'un tel empilement Download PDF

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Publication number
WO2005015655A1
WO2005015655A1 PCT/NL2004/000563 NL2004000563W WO2005015655A1 WO 2005015655 A1 WO2005015655 A1 WO 2005015655A1 NL 2004000563 W NL2004000563 W NL 2004000563W WO 2005015655 A1 WO2005015655 A1 WO 2005015655A1
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WO
WIPO (PCT)
Prior art keywords
layer
organic
inorganic
liquid
thin film
Prior art date
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Ceased
Application number
PCT/NL2004/000563
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English (en)
Inventor
Wlodek Stanislaw Mischke
Ferdinandus Josephus Honoré VAN ASSCHE
Franciscus Cornelius Dings
Rik Theodoor Vangheluwe
Wilhelmus Mathijs Marie Kessels
Mauritius Cornelis Maria Van De Sanden
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OTB Group BV
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OTB Group BV
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Publication date
Application filed by OTB Group BV filed Critical OTB Group BV
Publication of WO2005015655A1 publication Critical patent/WO2005015655A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • This invention relates to a method for applying a thin film barrier stack to a device with microstructures, such as, for instance, an OLED, wherein the thin ilm barrier stack forms a barrier to at least moisture and oxygen, and wherein the stack is built up from a combination of organic and inorganic layers.
  • a method is known, for instance, from US 6,413,645 or DE 196 03 746 Al.
  • Devices to which the thin film barrier stacks are applied can be, for instance, OLED's, which are described, for instance, in US 6,582,888 Bl.
  • a relatively thick levelling layer is applied over the device in order to facilitate the application of consecutive layers forming the actual barrier against oxygen and moisture.
  • this smoothing layer should have a considerable thickness.
  • the disadvantage of first having to apply a thick levelling layer over the device is that moisture and oxygen may still penetrate to the device from the side and that air inclusions may arise between the active layers of the device and the relatively thick levelling layer.
  • such thick polymeric levelling layers easily give rise to delamination, which results in loss of the device.
  • the object of the invention is to provide a method for manufacturing an encapsulation layer for a device which is provided with microstructures, wherein the encapsulation layer comprises a thin film barrier stack which is built up from a combination of organic and inorganic layers and wherein the above-described disadvantages of the known encapsulation layers are solved.
  • the invention provides a method of the type described in the opening paragraph hereof, which is characterized in that a first organic intermediate layer is applied, wherein the organic intermediate layer is applied in liquid form, wherein the viscosity of the organic intermediate layer liquid is so low that grooves, hollows and like narrow cavities are at least partly filled up with the organic liquid under the influence of capillary forces while other parts of the device are only covered with a thin layer of the organic liquid, such that a layer of variable thickness is formed.
  • a thin organic layer is applied in liquid form and the cavities fill up at least partly with the organic liquid under the influence of capillary forces while the other parts of the device are only covered with a very thin layer of the organic liquid.
  • the amount of liquid applied is such that the thickness of the thin layer covering the said other parts is smaller than 0.5 ⁇ m, more preferably smaller than 0.1 ⁇ m.
  • the viscosity of the organic intermediate layer liquid is lower than 100 cP, more preferably lower than 20 cP and even more preferably lower than 10 cP.
  • first a first sealing inorganic layer is applied before the first organic layer is applied.
  • the functional layers of the device are already protected from moisture and oxygen by the first sealing inorganic layer, so that if there might be any air inclusion present in the first organic layer after all, this would be much less harmful to the functional layers of the device.
  • the undercut regions, the grooves, hollows or like cavities have been partly filled up, the device will already have a more level surface, so that an inorganic layer to be subsequently applied will obtain a more stable structure and hence will form a better sealing.
  • an organic layer in liquid form of low viscosity When subsequently, in the same manner as described above, once more an organic layer in liquid form of low viscosity is applied, a still further smoothing of the microstructures is obtained and an inorganic layer to be subsequently applied will have even more stable and better sealing properties.
  • the organic liquid can be applied, for instance, by means of spin coating, spraying, dipping, condensation, inkjet printing or wedge coating.
  • the organic liquid may be strongly diluted in a solvent in order to obtain a low viscosity.
  • a viscosity comparable to that of water, so that the capillary forces will in fact lead to local layer thickness differences in the organic layer.
  • the polymerization or hardening can take place in a known manner by means of UV irradiation, electron or ion irradiation, thermally, chemically, or in a like manner.
  • the first sealing layer can be a ceramic conformal layer. It is also possible, however, to apply a non-conformal layer.
  • the inorganic layers, among which the first inorganic sealing layer may be manufactured from transparent and non-transparent ceramic materials, such as metal nitrides, metal oxides, metal oxynitrides, metal carbides, metal oxyborides or combinations thereof. Metals to be considered by way of example are aluminum, silicon, boron, zirconium, titanium, hafnium, tantalum, niobium and tungsten.
  • the first encapsulation layer can be applied, for instance, by vacuum deposition, such as, for instance, PVD, PECVD or the like.
  • the organic intermediate layers applied in liquid form can contain polymer, such as, for instance, acrylate, epoxy, fluoropolymer, ppx, organosilicons and the like. Other polymers may also be applied. Other examples are mentioned in the American patent US 6,413,645 Bl, mentioned earlier.
  • the invention further relates to a device provided with microstructures provided with a thin film barrier stack manufactured by a method according to the invention.
  • the device can be an organic light emitting diode (OLED), the OLED being provided with a microstructure comprising mushroom structures.
  • OLED organic light emitting diode
  • Fig. 1 shows a cross section of a portion of an OLED
  • Fig. 2 shows a detail of the photograph shown in Fig. 1.
  • Fig. 1 shows a portion of an OLED device, where a mushroom structure 1 is arranged on a substrate S.
  • the mushroom structure 1 provides undercut regions which make it possible, using a vertical deposition technique, to provide conductive paths on the substrate S which are interrupted in the undercut regions of the mushroom structure.
  • functional layers 2 have been provided, which, in the present case, have light emitting properties. These functional layers 2 are highly sensitive to moisture and oxygen and must therefore be screened from the environment. That is the purpose served by the thin film barrier stack which, in the present exemplary embodiment, is built up from three inorganic layers 3, 5, 7 and two organic layers 4, 6. Specifically in the detail of Fig. 2, it is clearly visible that the polymeric, organic layers 4, 6 do not have the same thickness throughout, but are considerably thicker in the undercut region under the mushroom structure 1.
  • the last-applied layer of the thin film barrier stack is formed by a ceramic layer 7 that is moisture and oxygen tight.
  • Other devices can also be suitably provided with a thin film barrier stack. To be considered in this regard are, for instance, chips, LCD's, and like devices that are provided with microstructures with sharp angles, steep or even negative inclinations and undercut regions.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne un procédé permettant d'appliquer un empilement barrière de films minces sur un dispositif à microstructures tel que, par exemple, une diode électroluminescente organique (OLED). L'empilement barrière, qui forme une barrière contre l'humidité et l'oxygène au moins, est formé par une combinaison de couches organiques et inorganiques et est caractérisé par l'application d'une première couche intermédiaire organique sous forme liquide. La viscosité du liquide de cette couche intermédiaire organique est si faible que ledit liquide remplit au moins partiellement des rainures, creux et cavités étroites analogues sous l'effet de forces capillaires alors que d'autres parties du dispositif ne sont recouvertes que d'une couche mince, ce qui forme une couche d'épaisseur variable.
PCT/NL2004/000563 2003-08-12 2004-08-11 Procede d'application d'un empilement barriere de films minces sur un dispositif a microstructures, et dispositif pourvu d'un tel empilement Ceased WO2005015655A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1024090A NL1024090C2 (nl) 2003-08-12 2003-08-12 Werkwijze voor het aanbrengen van een dunne-film-afsluitlaagsamenstel op een device met microstructuren, alsmede een device voorzien van een dergelijk dunne-film-afsluitlaagsamenstel.
NL1024090 2003-08-12

Publications (1)

Publication Number Publication Date
WO2005015655A1 true WO2005015655A1 (fr) 2005-02-17

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PCT/NL2004/000563 Ceased WO2005015655A1 (fr) 2003-08-12 2004-08-11 Procede d'application d'un empilement barriere de films minces sur un dispositif a microstructures, et dispositif pourvu d'un tel empilement

Country Status (3)

Country Link
NL (1) NL1024090C2 (fr)
TW (1) TW200511623A (fr)
WO (1) WO2005015655A1 (fr)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006036393A3 (fr) * 2004-09-23 2006-10-05 3M Innovative Properties Co Film polymere protege
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US7342356B2 (en) 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
USRE40531E1 (en) 1999-10-25 2008-10-07 Battelle Memorial Institute Ultrabarrier substrates
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
USRE40787E1 (en) 1999-10-25 2009-06-23 Battelle Memorial Institute Multilayer plastic substrates
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
CN1846988B (zh) * 2005-04-06 2012-04-04 富士胶片株式会社 阻气性薄膜和使用其的有机器件
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8955217B2 (en) 1999-10-25 2015-02-17 Samsung Display Co., Ltd. Method for edge sealing barrier films
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
CN108539047A (zh) * 2018-05-11 2018-09-14 昆山国显光电有限公司 薄膜封装结构、显示屏及其制造方法、显示装置
CN109728165A (zh) * 2019-01-04 2019-05-07 京东方科技集团股份有限公司 一种显示背板及其制作方法、显示装置
US10950821B2 (en) 2007-01-26 2021-03-16 Samsung Display Co., Ltd. Method of encapsulating an environmentally sensitive device

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JPH0711247A (ja) * 1993-06-28 1995-01-13 Idemitsu Kosan Co Ltd 有機ｅｌ素子の封止方法およびこの封止方法により得られた発光装置
US5650692A (en) * 1996-01-11 1997-07-22 Planar Systems, Inc. Electroluminescent device construction employing polymer derivative coating
EP0809420A1 (fr) * 1995-02-06 1997-11-26 Idemitsu Kosan Company Limited Dispositif emetteur de lumiere en plusieurs couleurs et procede de production de ce dispositif
EP1139453A2 (fr) * 2000-03-27 2001-10-04 Sel Semiconductor Energy Laboratory Co., Ltd. Dispositif luminescent et procédé de production
US20010054867A1 (en) * 2000-03-30 2001-12-27 Hirofumi Kubota Organic electroluminescence display panel and method of manufacturing the same
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US20030085654A1 (en) * 2001-11-02 2003-05-08 Seiko Epson Corporation Electro-optical apparatus, manufacturing method thereof, and electronic instrument
WO2003061346A1 (fr) * 2002-01-15 2003-07-24 Seiko Epson Corporation Structure d'etancheite a film fin possedant une propriete de barriere pour un element electronique, dispositif d'affichage, equipement electronique et procede de fabrication d'un element electronique

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0711247A (ja) * 1993-06-28 1995-01-13 Idemitsu Kosan Co Ltd 有機ｅｌ素子の封止方法およびこの封止方法により得られた発光装置
EP0809420A1 (fr) * 1995-02-06 1997-11-26 Idemitsu Kosan Company Limited Dispositif emetteur de lumiere en plusieurs couleurs et procede de production de ce dispositif
US5650692A (en) * 1996-01-11 1997-07-22 Planar Systems, Inc. Electroluminescent device construction employing polymer derivative coating
EP1139453A2 (fr) * 2000-03-27 2001-10-04 Sel Semiconductor Energy Laboratory Co., Ltd. Dispositif luminescent et procédé de production
US20010054867A1 (en) * 2000-03-30 2001-12-27 Hirofumi Kubota Organic electroluminescence display panel and method of manufacturing the same
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US20030085654A1 (en) * 2001-11-02 2003-05-08 Seiko Epson Corporation Electro-optical apparatus, manufacturing method thereof, and electronic instrument
WO2003061346A1 (fr) * 2002-01-15 2003-07-24 Seiko Epson Corporation Structure d'etancheite a film fin possedant une propriete de barriere pour un element electronique, dispositif d'affichage, equipement electronique et procede de fabrication d'un element electronique
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Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7727601B2 (en) 1999-10-25 2010-06-01 Vitex Systems, Inc. Method for edge sealing barrier films
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US8955217B2 (en) 1999-10-25 2015-02-17 Samsung Display Co., Ltd. Method for edge sealing barrier films
USRE40531E1 (en) 1999-10-25 2008-10-07 Battelle Memorial Institute Ultrabarrier substrates
USRE40787E1 (en) 1999-10-25 2009-06-23 Battelle Memorial Institute Multilayer plastic substrates
US9839940B2 (en) 2002-04-15 2017-12-12 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
WO2006036393A3 (fr) * 2004-09-23 2006-10-05 3M Innovative Properties Co Film polymere protege
US7468211B2 (en) 2004-09-23 2008-12-23 3M Innovative Properties Company Protected polymeric film
JP2008513256A (ja) * 2004-09-23 2008-05-01 スリーエム イノベイティブ プロパティズ カンパニー 保護されたポリマーフィルム
US7342356B2 (en) 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
CN1846988B (zh) * 2005-04-06 2012-04-04 富士胶片株式会社 阻气性薄膜和使用其的有机器件
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US10950821B2 (en) 2007-01-26 2021-03-16 Samsung Display Co., Ltd. Method of encapsulating an environmentally sensitive device
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9362530B2 (en) 2008-12-22 2016-06-07 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US8904819B2 (en) 2009-12-31 2014-12-09 Samsung Display Co., Ltd. Evaporator with internal restriction
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
CN108539047A (zh) * 2018-05-11 2018-09-14 昆山国显光电有限公司 薄膜封装结构、显示屏及其制造方法、显示装置
CN109728165A (zh) * 2019-01-04 2019-05-07 京东方科技集团股份有限公司 一种显示背板及其制作方法、显示装置
CN109728165B (zh) * 2019-01-04 2021-09-21 京东方科技集团股份有限公司 一种显示背板及其制作方法、显示装置
US11258016B2 (en) 2019-01-04 2022-02-22 Ordos Yuansheng Optoelectronics Co., Ltd. Display backplane, method for preparing the same, and display device

Also Published As

Publication number Publication date
TW200511623A (en) 2005-03-16
NL1024090C2 (nl) 2005-02-15

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