WO2005015692A1 - Contact et connecteur - Google Patents

Contact et connecteur Download PDF

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Publication number
WO2005015692A1
WO2005015692A1 PCT/JP2004/011343 JP2004011343W WO2005015692A1 WO 2005015692 A1 WO2005015692 A1 WO 2005015692A1 JP 2004011343 W JP2004011343 W JP 2004011343W WO 2005015692 A1 WO2005015692 A1 WO 2005015692A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
electronic component
protrusion
slit
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/011343
Other languages
English (en)
Japanese (ja)
Inventor
Fumio Kurotori
Takaji Ishikawa
Tadao Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2005512969A priority Critical patent/JPWO2005015692A1/ja
Publication of WO2005015692A1 publication Critical patent/WO2005015692A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit

Definitions

  • the present invention relates to a contact that contacts an electronic component and a connector.
  • contacts that come into contact with electronic components there are a spring contact and a plate spring contact.
  • the spring-type contact includes a contact portion that contacts the electronic component, and a spring portion that expands and contracts according to a pressing force on the contact portion.
  • the electronic component include a printed circuit board and a probe card having electrodes for transmitting and receiving signals, and a semiconductor device (IC) in which IC terminals are arranged in a plane.
  • IC semiconductor device
  • These electronic components are used in semiconductor testing equipment. For example, it is also used as a device interface device for relay connection with a wafer prober device or IC handler device.
  • the required number of contact pins varies depending on the type of device under test and the number of devices to be measured simultaneously. For example, more than 20,000 pins may be required.
  • the panel contact is a plate-shaped contact having elasticity, and is a contact that is bent by the elasticity of the contact when pressed by an electronic component.
  • the spring-type contact has a problem in that the structure is complicated and the cost is high, especially when used for a connector for a semiconductor chip which requires a large number of contacts.
  • the load and contact pressure per contact are small.
  • each board panel contact is curved, so that it is necessary to maintain good insulation between the board panel contacts.
  • an electronic component and a contact a tip outside the contour for transmitting and receiving an electric signal, and contacting the electronic component;
  • a holding portion for extending the tip portion in a predetermined rotation direction when the tip portion is pressed by the electronic component, and the tip portion is provided to extend from the holding portion.
  • the extending portion is provided on an opposing surface of the extending portion substantially opposite to the electronic component, along one width direction perpendicular to the extending direction of the extending portion, from one end to the other end in the width direction of the extending portion.
  • the ridgeline on the electronic component side of the cross section in a plane perpendicular to the direction is a curve, the center of the ridge bulges toward the electronic component side from the end of the ridgeline, and has a first protrusion that contacts the electronic component. Provide contacts.
  • the ridge on the electronic component side in a cross section in a plane perpendicular to the extending direction is a curve in which the center of the ridge bulges toward the electronic component from the end of the ridge. You can. Further, the contact is provided from one end to the other end in the width direction of the extension portion in parallel with the first protrusion on the opposite surface of the extension portion, and is opposed to the electronic component having a cross section perpendicular to the width direction.
  • the ridge line may be a curved line, and may further include a second projection that contacts the electronic component when the tip rotates.
  • the second protrusion is preferably provided at a position closer to the holding portion than the first protrusion.
  • the first protrusion is configured such that the distance between the second protrusion and the electronic component is larger than the distance between the first protrusion and the electronic component.
  • a second projection is provided.
  • the contact is provided on the opposing surface of the extending portion at a position farther from the holding portion than the first protrusion.
  • the first projection is configured such that the distance between the third projection and the electronic component is larger than the distance between the first projection and the electronic component.
  • a third protrusion is provided.
  • a connector that comes into contact with an electronic component, the tip portion being in contact with the electronic component, the tip portion being extended, and the tip portion being pressed by the electronic component.
  • a plurality of contacts having a holding portion for rotating the tip portion in a predetermined rotation direction, a substrate for holding the plurality of contacts, and a plurality of slits for passing the contacts are provided at the same pitch.
  • the substrate has a plurality of contacts arranged at predetermined intervals in the vertical direction in which the direction of rotation is projected onto the surface of the substrate, and the substrate is slit in the horizontal direction perpendicular to the vertical direction.
  • the slits are provided so that each slit is provided along the vertical direction, and the adjacent contacts in the horizontal direction pass through different slits.
  • the depth of the slit in the direction perpendicular to the substrate surface is substantially the same as the height of the contact holding portion in the direction perpendicular to the substrate surface.
  • the substrate may have a groove having substantially the same shape as the slit on the surface, and the slit may be stored in the groove.
  • the substrate includes an upper substrate, a lower substrate, an upper slit portion, a lower slit portion, and an outer contour holding portion, and the upper substrate and the lower substrate accommodate the upper slit portion and the lower slit portion.
  • the upper slit portion and the lower slit portion are accommodated and held so as to sandwich the contact holding portion in the vertical direction, and the contour outside holding portion is provided with a plurality of contacts arranged and fixed at predetermined intervals, A plurality of contacts may be inserted into and exposed from the slits of the upper slit portion and the lower slit portion, and the contacts may be guided by the slits.
  • the contact holding unit may be divided for each row of the contact or a unit of a plurality of rows.
  • the connector may be attached and fixed to one of the electrical connection partners.
  • a device interface device used for a relay connection for exchanging electric signals between a semiconductor test apparatus and a device under test.
  • a device interface device characterized in that a plurality of connectors are mounted to transmit and receive electric signals.
  • the device interface device includes a common interface unit commonly used for a plurality of types of devices under test, and a type corresponding unit that can be exchanged corresponding to the type of the device under test.
  • a connector according to the second embodiment described above may be provided between the device and the type corresponding unit.
  • a semiconductor test apparatus for testing a device under test, comprising a test head for transmitting and receiving signals to and from the device under test, wherein the device interface according to the third aspect is provided.
  • a semiconductor test apparatus wherein the apparatus is provided between a test head and a device under test.
  • the device interface device includes a common interface unit commonly used for a plurality of types of devices under test, and a type corresponding unit that can be exchanged according to the type of the device under test. May be connected to the test head, and the connector of the second embodiment may be provided between the common interface unit and the product type corresponding unit.
  • the present invention it is possible to provide a contact that is connected with high reliability, low load, and low contact pressure. Further, it is possible to provide a connector that maintains good insulation between a plurality of contacts.
  • FIG. 10A is a diagram illustrating an example of the configuration of the semiconductor test apparatus 400.
  • the semiconductor test apparatus 400 includes a pattern generation unit 410, a waveform shaping unit 412, a test head 600, a device interface device 500, a socket 700, an IC handler device, and a determination unit 414.
  • the pattern generator 410 generates a test pattern to be supplied to the device under test 200, It is supplied to the socket 700 of the IC handler device via the shape shaping section 412, the test head 600 and the device interface device 500, and is supplied to the device under test 200.
  • the device interface device 500 is used for a relay connection for transmitting and receiving an electric signal between the semiconductor test device 400 and the device under test 200, and transmits and receives electric signals by mounting a plurality of connectors 100.
  • the pattern generating section 410 generates an expected value signal corresponding to the signal output from the device under test 200 and supplies the generated expected value signal to the determining section 414.
  • the waveform shaping unit 412 shapes the test pattern into a predetermined waveform, generates a predetermined amplitude at a predetermined timing, and forms a predetermined amplitude waveform with the test head.
  • the device under test 200 transmits and receives signals to and from the semiconductor test apparatus 400 while being electrically connected to the socket 700.
  • the determination unit 414 receives an output signal output from the device under test 200 according to the test pattern via the device interface device 500 and the test head 600, and performs comparison at a predetermined timing based on the expected value signal. Then, the quality of the device under test 200 is determined based on the obtained comparison result.
  • FIG. 10 (b) is a diagram showing a configuration of the device interface device 500.
  • the device interface device includes a common interface section 510, a plurality of connectors 100, and a product type correspondence section 520 as shown in the configuration example of FIG.
  • the common interface unit 510 is a part that does not depend on the type of the device under test and is commonly used.
  • the plurality of connectors 100 are electrically connected by a detachable connector so that the common interface unit 510 and the product type corresponding unit 520 can be separated.
  • the type corresponding unit 520 is a part that is exchanged according to the type of the device under test.
  • the end is connected to the socket 700, and is electrically and mechanically connected to the IC handler device.
  • the test head electrically / mechanically connects the device interface device 500 to exchange signals and perform other operations.
  • the socket 700 shown in FIG. 10A corresponds to a probe needle of a probe card in the case of a wafer prober device.
  • ZIF Zero insertion Force
  • FIG. 1 is a diagram showing an example of the connector 100 according to the embodiment of the present invention. However, the display of many contacts 60 described later is omitted.
  • the connector 100 is used, for example, in a test device for testing a semiconductor device, and transfers signals between the semiconductor device and the semiconductor test device 400.
  • the connector 100 includes the substrate 10, the slit portion 40, and a plurality of contacts (see FIG. 2) provided on the substrate 10.
  • the board 10 is a housing structure that holds and fixes the slit portion 40 from above and below, and includes an upper board 12, a lower board 14 fitted to the upper board 12, and the upper board 12 and the lower board 14. It is composed of a contour holding part (see Fig. 2) provided between them to hold a plurality of contacts, and holds a plurality of contacts.
  • the upper substrate 12 is, for example, a substrate provided on the semiconductor device side
  • the lower substrate 14 is, for example, a substrate provided on the test apparatus side.
  • the relative positions of the upper substrate 12 and the lower substrate 14 are determined by the positioning holes 16.
  • the upper substrate 12 has a positioning hole 16 that penetrates the upper substrate 12, the lower substrate 14 has a projection that fits into the positioning hole 16, and the projection is fitted into the positioning hole 16. Thereby, the upper substrate 12 and the lower substrate 14 are fitted.
  • the substrate 10 holds a plurality of contacts so as to be arranged at predetermined intervals in the vertical and horizontal directions on the surface of the substrate 10. Further, the substrate 10 is provided with through holes 26 and 56 (see FIG. 3) corresponding to the outer shape of the slit portion 40. In addition, the through hole exposes the contact holding portion. Further, the substrate 10 has, for example, four mounting holes shown in FIG. 1 at four corners as a structure to be fixed to the test apparatus side. The connector 100 is attached and fixed to one of the electrical connection partners through the attachment hole.
  • a plurality of slits 48 for allowing a plurality of contacts provided on the substrate 10 to pass therethrough are provided at the same pitch in a blind shape.
  • the substrate 10 holds a plurality of contacts by a contact holding portion, and each contact passes through the slit 48 and is Connect with Further, the substrate 10 preferably holds a plurality of contacts at substantially the same interval as the pitch of the slits 48.
  • FIG. 2 is a view showing an example of a cross section of the connector 100.
  • FIG. 2 shows a cross section taken along the line AA ′ shown in FIG.
  • the substrate 10 has the contact holding unit 20 provided between the upper substrate 12 and the lower substrate 14.
  • the contact holding unit 20 may be divided into a plurality of blocks.
  • the slit portion 40 includes an upper slit portion 42 and a lower slit portion 44.
  • the upper substrate 12 has a through hole having substantially the same shape as the upper slit portion 42, and stores the upper slit portion 42.
  • the lower substrate 14 has a through hole having substantially the same shape as the lower slit portion 44. Then, store the lower slit part 44.
  • the contact holding section 20 is provided between the upper slit section 42 and the lower slit section 44. For example, on the surface of the lower slit portion 44 on the contact holding portion 20 side, a plurality of protrusions 46 that fit with the contact holding portion 20 are provided.
  • a plurality of protrusions 22 that fit with the lower slits 44 are provided on the surface of the lower side of the contact holding parts 20 on the side of the lower slits 44.
  • the contact holding portion 20 is arranged at a predetermined position with respect to the lower slit portion 44.
  • the contact 60 includes a fixing portion held by the contact holding portion 20, a holding portion extending from the fixing portion to the electronic component side, and an extension extending from the holding portion. And a tip portion that comes into contact with the electronic component.
  • the holding portion of the contact 60 is formed of an elastic material, and rotates the tip in a predetermined rotation direction when the tip is pressed by the electronic component.
  • the contact holding unit 20 arranges the plurality of contacts 60 at predetermined intervals in the vertical direction in which the rotation direction is projected on the surface of the substrate 10, and slits the horizontal direction perpendicular to the vertical direction. G so that they are arranged at approximately the same pitch as the pitch of 48. That is, the plurality of contacts 60 are provided continuously at predetermined pitches in the vertical direction and the horizontal direction, respectively, and the contacts 60 provided in a line in the vertical direction pass through the same slit 48. Contacts with electronic components.
  • each slit 48 is provided along the vertical direction, and the adjacent contacts 60 in the horizontal direction are separated by passing through different slits 48. With such a configuration, even when the contact 60 is pressed by the electronic component, it is possible to prevent the adjacent contact 60 in the lateral direction from being short-circuited. Also, since the slit 48 force is provided along the vertical direction that projects the rotation direction of the contact 60, each contact 60 can rotate according to the pressing of the electronic component, and the contact 60 It can be in contact with electronic components with contact pressure.
  • the depth of the slit 48 in the direction perpendicular to the surface of the substrate 10 is preferably substantially the same as the height of the holding portion of the contact 60 in the direction perpendicular to the surface of the substrate 10. In other words, the slit 48 has a shape substantially covering the holding portion of each contact 60, and can exert a force S for preventing the contacts 60 adjacent in the lateral direction from contacting each other.
  • the lower substrate 14 has a protrusion 18 on the surface facing the upper substrate 12 to be fitted in the positioning hole 16.
  • the relative position of the upper substrate 12 with respect to the lower substrate 14 is determined by fitting the projection 18 into the positioning hole 16.
  • the upper slit portion 42 may have a through hole through which the projection 18 penetrates.
  • the relative position of the upper slit 42 with respect to the lower substrate 14 is determined by the projection 18 penetrating through the through hole.
  • the lower substrate 14 may further include a projection 24 that fits with the lower slit 44.
  • the lower slit portion 44 has a fitting hole that fits with the protrusion 24.
  • the relative position of the lower slit portion 44 with respect to the lower substrate 14 is determined by fitting the protrusion 24 into the fitting hole. With such a configuration, the relative position between the substrate 10 and the slit portion 40 can be determined.
  • FIG. 3 is a diagram illustrating the relationship between the respective constituent members of the connector 100.
  • a number of contacts 60 provided in the contact holding unit 20 are omitted.
  • the upper substrate 12 has the through-hole 26 for storing the upper slit portion 42, and stores the upper slit portion 42 in the through-hole 26.
  • the upper slit 42 has a through hole 50 through which the projection 18 of the lower substrate 14 passes.
  • the contact holding section 20 is fitted and mounted on the lower slit section 44.
  • the contact holding section 20 can be divided into a plurality of blocks as shown in FIG. For example, the contact holding unit 20 is divided for each row of the contacts 60 or for each of a plurality of rows.
  • the lower slit portion 44 has a plurality of slits 48 through which the contact passes to the test apparatus side.
  • An engagement portion 52 for engaging with the side substrate 14 and a fitting hole 82 are provided.
  • the slit 48 of the lower slit portion 44 is provided at a position corresponding to the slit 48 of the upper slit portion 42, and forms a through-hole passing through the slit portion 40.
  • the lower substrate 14 has a through hole 56 for storing the lower slit portion 44, and stores the lower slit portion 44 in the through hole 56.
  • the through hole 56 is provided with a projection 54 that engages with the engagement portion 52 of the lower substrate 14.
  • the relative position of the lower slit portion 44 with respect to the lower substrate 14 is determined by the engagement of the projection 54 with the engagement portion 52 and the engagement of the projection 24 with the fitting hole 82.
  • the contact holding portion 20 includes a plurality of contacts 60 arranged and fixed at predetermined intervals, and the plurality of contacts 60 are inserted into the slits 48 of the upper slit portion 42 and the lower slit portion 44 and are exposed from the slits 48, The contact 60 is guided by the slit 48.
  • FIG. 4 shows an example of an enlarged view of the lower slit portion 44.
  • FIG. 4 is an enlarged view of a portion B of the lower slit portion 44 shown in FIG.
  • the lower slit portion 44 has, on the surface facing the contact holding portion 20, a projection 46 continuously provided in the vertical direction at substantially the same pitch as the pitch of each block of the contact holding portion 20.
  • the projections 46 are also provided continuously at the same pitch as the slits 48 in the horizontal direction.
  • the slits 48 are provided between the protrusions 46 provided continuously in the lateral direction, and allow the contacts 60 to pass therethrough.
  • FIG. 5 shows one block of the contact holding unit 20 divided into a plurality of blocks.
  • One block of the contact holding portion 20 has the protruding portion 22 for fitting with the lower slit portion 44 as described above.
  • the protrusions 22 are fitted with a plurality of protrusions 46 (see FIG. 4) provided continuously in the lateral direction.
  • the protrusion 22 is inserted into a recess formed by the protrusion 46 adjacent in the vertical direction.
  • the contact holding unit 20 is formed by a plurality of blocks provided continuously in the vertical direction.
  • the plurality of blocks are fitted with respective protrusions 46 provided continuously in the vertical direction.
  • each block of the contact holding portion 20 are inserted into a plurality of recesses formed continuously in the lateral direction by the protrusions 46 of the lower slit portion 44. Thereby, each block of the contact holding section 20 is placed at a predetermined position of the lower slit section 44.
  • Each block of the contact holding unit 20 holds a plurality of contacts 60 at positions corresponding to the plurality of slits 48. With such a configuration, it is possible to easily hold a plurality of contacts 60 to be continuously provided on the substrate 10 at predetermined positions.
  • FIG. 6 shows an example of the configuration of the contact 60.
  • the contact 60 is formed of a long flat plate member made of a conductive material, and has an electronic component side tip 68, an electronic component side holding portion 64, a fixing portion 62, a test device side holding portion 66, and a test device side tip 86.
  • the electronic component side tip 68 is provided at a position closer to the electronic component than the surface of the substrate 10 and comes into contact with the electronic component.
  • the electronic component is a printed circuit board, it comes into contact with the pattern electrode of the printed circuit board.
  • the electronic component side holding portion 64 is provided to extend from the electronic component side distal end portion 68 to the fixing portion 62, and when the electronic component presses the distal end portion 68, the electronic component side distal end portion 68 is determined in advance. Rotate in the direction of rotation.
  • the electronic component side holding section 64 and the test apparatus side holding section 66 are preferably provided obliquely with respect to the pressing direction of the electronic component, and are preferably formed of an elastic material. Further, the electronic component side holding section 64 is provided through the slit 48 of the upper slit section 42, and the test apparatus side holding section 66 is provided through the slit 48 of the lower slit section 44.
  • the fixing part 62 is held or fixed by the contact holding part 20.
  • the contact holding section 20 has a through hole for holding the contact 60, and the fixing section 62 is held by the through hole.
  • a plurality of contacts 60 may be formed by integral molding.
  • the fixing portion 62 is preferably provided in parallel with the pressing direction of the electronic component. As a result, the plurality of contacts 60 are positioned in a line by the contact holding unit 20 and are aligned and held.
  • the contacts 60 can be arranged at a narrow pitch corresponding to the interval between the slits 48, so that the contacts 60 can be arranged with high density.
  • the test apparatus side holding section 66 is provided to extend from the fixed section 62 to the test apparatus side tip section 86. Further, the test device side tip 86 comes into contact with the test device side electrode surface at a position facing the back surface of the substrate 10. Further, the test apparatus side tip section 86 may have the same shape as the electronic component side tip section 68 described with reference to FIGS.
  • FIG. 7 is a diagram illustrating an example of the electronic component-side distal end portion 68.
  • FIG. 7A is a perspective view of the electronic component side front end portion 68
  • FIG. 7B is a cross-sectional view of the electronic component side front end portion 68 on a plane perpendicular to the width direction of the extension portion 70.
  • the electronic component-side tip portion 68 extends perpendicularly to the extension direction of the extension portion 70 on an extension portion 70 provided by extending from the electronic component-side holding portion 64 and on a facing surface of the extension portion 70 substantially facing the electronic component.
  • the one end force in the width direction of the extending portion 70 also has a first projection 72 provided over the other end.
  • the first protrusion 72 has a curved ridge on the electronic component side in a cross section in a plane perpendicular to the width direction of the extension 70, and the center of the ridge is a ridge. Bulges toward the electronic component side from the end of the. Further, the first protrusion 72 protrudes toward the electronic component from the extension 70, and comes into contact with the electronic component.
  • the ridge line of the first protrusion 72 may have a part of the outer circumference of a circle or may have a part of the outer circumference of an ellipse.
  • the cross section of the first protrusion 72 in a plane perpendicular to the width direction of the extension 70 may be asymmetrical in the left-right direction.
  • contact 60 makes contact with the electronic component at the curved surface of first projection 72. For this reason, the contact area between the contact 60 and the electronic component can be reduced, and the contact pressure per unit area can be increased, so that the electrical connection can be performed with high reliability. Even when the contact pressure between the contact 60 and the electronic component is reduced, the same connection reliability as when the contact pressure is large can be obtained. Therefore, the contact pressure between the connector having a large number of contacts and the electronic component can be reduced, and the connector and the electronic component can be easily attached and detached.
  • the contact 60 by reducing the contact area between the contact 60 and the electronic component, wiping can be performed effectively. Therefore, foreign matter such as an oxide film adhered to the electric power of the electronic component can be easily removed.
  • the contact 60 when the contact 60 is pressed down and the electronic component side tip 68 moves due to the contact between the contact 60 and the electronic component on a curved surface, the electronic component contacts the electronic component sequentially at different locations of the first protrusion 72. . Therefore, foreign matter is removed by wiping In this case, the first protruding portions 72 that are in contact with the electronic component can be made different from each other, and the connection reliability can be improved.
  • FIG. 8 is a view showing another example of the electronic component-side distal end portion 68.
  • FIG. 8A is a perspective view of the electronic component-side tip portion 68
  • FIG. 8B is a cross-sectional view of the first protrusion 72 in a plane perpendicular to the extending direction of the extending portion.
  • the electronic component side leading end 68 is substantially opposed to the extended portion 70 provided by extending from the electronic component side holding portion 64 and the electronic component of the extended portion 70.
  • a first protrusion 72 is provided along the width direction perpendicular to the extension direction of the extension portion 70 and provided at one end and the other end in the width direction of the extension portion 70.
  • the first projection 72 has a curved ridge line on the electronic component side in a cross section in a plane perpendicular to the width direction of the extending portion 70, and a central portion of the ridge bulges toward the electronic component from an end of the ridge line. .
  • the first protrusion 72 protrudes from the extension 70 toward the electronic component, and comes into contact with the electronic component.
  • the ridge line on the electronic component side of the cross section of the first projection 72 on the plane perpendicular to the direction of extension of the extension section 70 is a curve as shown in FIG.
  • the center of the ridge bulges toward the electronic component from the end of the ridge.
  • the ridge line of the cross section of the extending portion 70 in a plane perpendicular to the extending direction of the extending portion 70 may have a central portion bulging toward the electronic component from an end of the ridge line.
  • FIG. 9 is a diagram showing still another example of the electronic component-side tip portion 68.
  • FIG. 9A is a perspective view of the electronic component-side distal end portion 68
  • FIG. 9B is a cross-sectional view of the electronic component-side distal end portion 68 on a plane perpendicular to the width direction of the extension portion 70.
  • the electronic component-side distal end portion 68 extends substantially from the electronic component-side holding portion 64, and substantially faces the electronic component of the extending portion 70.
  • On the opposing surface there is a first protrusion 72 provided along the width direction perpendicular to the stretching direction of the stretching portion 70 and one end in the width direction of the stretching portion 70 and the other end.
  • the first protrusion 72 has a curved ridge line on the electronic component side in a cross section in a plane perpendicular to the width direction of the extending portion 70, and a central portion of the ridge bulges toward the electronic component from an end of the ridge line. I have.
  • the first protrusion 72 protrudes toward the electronic component from the extension 70, and Contact with goods.
  • the electronic component-side tip portion 68 in this example further includes a second projection 74, a third projection 76, a fourth projection 78, and a fifth projection 80.
  • the second protrusion 74—the fifth protrusion 80 is provided in parallel with the first protrusion 72 on the facing surface of the extension 70 facing the electronic component, from one end to the other end of the extension 70 in the width direction. Provided across.
  • the second projection 74 and the fifth projection 80 have a curved ridge line facing the electronic component in a section perpendicular to the width direction of the extending portion 70.
  • the fifth protrusion 80 has substantially the same shape as the first protrusion 72.
  • the second protrusion 74 is provided adjacent to the first protrusion 72 at a position closer to the electronic component side holding portion 64 than the first protrusion 72
  • the fourth protrusion 78 is The second protrusion 72 is provided adjacent to the second protrusion 72 at a position closer to the electronic component side holding portion 64 than the second protrusion 74.
  • the third protrusion 76 is provided adjacent to the first protrusion 72 at a position farther from the electronic component side holding portion 64 than the first protrusion 72
  • the fifth protrusion 80 is The third protrusion 76 is provided at a position farther from the electronic component side holding portion 64 than the third protrusion 76 and adjacent to the third protrusion 76.
  • the second projection 74—the fifth projection 80 and the electronic component are connected.
  • the force S is preferably such that the first protrusion 72 to the fifth protrusion 80 are provided such that the distance is greater than the distance between the first protrusion 72 and the electronic component.
  • the second protrusion 74 and the fourth protrusion 78 are provided so that the distance between the fourth protrusion 78 and the electronic component is larger than the distance between the second protrusion 74 and the electronic component.
  • the third protrusion 76 and the fifth protrusion 80 are provided such that the distance between the fifth protrusion 80 and the electronic component is larger than the distance between the third protrusion 76 and the electronic component. Is preferred.
  • the first protrusion 72 When connecting the electronic component side tip portion 68 and the electronic component, for example, first, the first protrusion 72 first contacts the electronic component. Then, when the electronic component presses the electronic component side distal end portion 68, the electronic component side distal end portion 68 rotates in the rotation direction. At this time, the electrodes of the electronic component can be wiped by the first protrusions 72 to remove foreign matter. Next, the second protrusion 74 contacts the electronic component and is electrically connected to the electrode from which the foreign matter has been removed. As described above, according to the configuration of the present example, the function of performing wiping is provided by providing the plurality of protrusions.
  • a projection and a projection having a function of electrically connecting to the electronic component can be provided, so that the reliability of the connection can be further improved. Further, by providing a plurality of protrusions continuously as in this example, even when the angles of the plurality of contacts 60 vary, the function of performing the above-described wiping by any of the protrusions is provided. As a result, the reliability of the connection can be further improved. As a result, good electrical contact can be obtained even at a low contact pressure.
  • the structure of the tip 68 on the electronic component side shown in FIGS. 6 to 9 may be applied to the tip 86 on the test apparatus side.
  • wiping can be effectively performed at both upper and lower contact points even if the contact pressure is small, so that the same connection reliability as when the contact pressure is large can be obtained, and the electronic contact can be provided on both the upper and lower surfaces. Parts can also be connected.
  • the shape of the electronic component side tip portion 68 and the electronic component side holding portion 64 shown in FIG. 6 may be formed so as to be vertically symmetrical.
  • the block of the contact holding unit 20 shown in FIG. 5 may have a configuration in which a plurality of rows of the force contacts 60 shown in the specific structural example of the block unit in which the contacts 60 are arranged in a line are formed in the block unit.
  • the arrangement directions of the electronic component side tip portions 68 of the contacts 60 shown in FIG. 5 are all arranged in the same direction, the arrangement of the contacts 60 corresponding to the odd-numbered rows of slits 48 shown in FIG. The installation direction and the arrangement direction of the contacts 60 corresponding to the even-numbered rows of slits 48 may be reversed.
  • the lateral force can be offset by the vertical pressing force.
  • a device for relay connection between a prober device or an IC handler device and a test head of a semiconductor test device connected to the device This is effective when a large number of connectors 100 are used as in an interface device.
  • the slit 48 shown in FIG. 1 is a specific example in which the slit is formed to be long in the horizontal direction, the slit may be formed in the vertical direction.
  • the upper slit part 42, the lower slit part 44, and the contact holding part 20 are formed so as to correspond to the vertical slit.
  • FIGS. 10 and 11 there is an embodiment in which a number of connectors 100 are arranged between the common interface unit 510 and the product type correspondence unit 520.
  • the connector 100 of the present application can arrange a large number of contacts 60 at a high pitch with a narrow pitch, and can make a highly reliable connection with a low load. More practical implementation is possible.
  • the connector 100 of the present application is applied between an electrode provided on one substrate surface of a probe card of a wafer prober device and a substrate surface on a device interface device side provided to face the substrate surface. By doing so, it is possible to arrange a large number of pins at high density, and to reduce the pressing stress on the probe card.
  • the upper substrate 12 and the upper slit portion 42 have a split structure
  • the lower substrate 14 and the lower slit portion 44 have a split structure.
  • the upper substrate 12 and the upper slit portion 42 may be integrally formed
  • the lower substrate 14 and the lower slit portion 44 may be integrally formed.
  • FIG. 1 is a view showing an example of a connector 100 according to an embodiment of the present invention.
  • FIG. 2 is a diagram showing an example of a cross section of a connector 100.
  • FIG. 3 is a view for explaining the relationship between respective components of the connector 100.
  • FIG. 4 is a diagram showing an example of an enlarged view of a lower slit portion 44.
  • FIG. 5 is a diagram showing one block of a contact holding unit 20 divided into a plurality of blocks.
  • FIG. 6 is a diagram showing an example of a configuration of a contact 60.
  • FIG. 7 is a diagram showing an example of an electronic component-side distal end portion 68.
  • FIG. 7A is a perspective view of the electronic component-side distal end portion 68
  • FIG. 7B is a cross-sectional view of the electronic component-side distal end portion 68 on a plane perpendicular to the width direction of the extending portion.
  • FIG. 8 is a view showing another example of the electronic component-side tip portion 68.
  • FIG. 8A is a perspective view of the electronic component-side tip portion 68
  • FIG. 8B is a cross-sectional view of the first protrusion 72 in a plane perpendicular to the extending direction of the extending portion.
  • FIG. 9 is a view showing still another example of the electronic component-side tip portion 68.
  • FIG. 9A is a perspective view of the electronic component-side distal end portion 68
  • FIG. 9B is a cross-sectional view of the electronic component-side distal end portion 68 on a plane perpendicular to the width direction of the extending portion 70.
  • FIG. 10 is a diagram showing an example of a configuration of a semiconductor test apparatus 400.
  • FIG. 10A shows an example of the configuration of the semiconductor test apparatus 400
  • FIG. 10B shows the configuration of the device interface apparatus 500.
  • FIG. 11 is a diagram showing an example of a configuration of a common interface unit 510.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)

Abstract

L'invention concerne un contact capable de maintenir un contact avec une partie électronique au moyen d'une faible pression de contact. La mise en contact est effectuée avec une partie électronique et transmet / reçoit un signal électrique. Le contact comprend une extrémité en pointe, cette dernière étant en contact avec la partie électronique et la partie de maintien s'étendant de l'extrémité en pointe et permettant la rotation de ladite extrémité dans un sens de rotation prédéterminé, lorsque l'extrémité en pointe est pressée par la partie électronique. L'extrémité en pointe présente une partie extension s'étendant de la partie de maintien et une première protubérance disposée à la surface de la partie extension fait face sensiblement à la partie électronique dans la largeur, vertical au sens d'extension de la partie extension, d'une extrémité à l'autre de la largeur de la partie d'extension. La première protubérance présente une ligne de crête courbe, en coupe transversale, dans un plan vertical dans la largeur sur le côté de la partie électronique. La partie centrale de la ligne de crête fait plus saillie vers la partie électronique que l'extrémité de la ligne de crête. La première protubérance est mise en contact avec la partie électronique.
PCT/JP2004/011343 2003-08-07 2004-08-06 Contact et connecteur Ceased WO2005015692A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005512969A JPWO2005015692A1 (ja) 2003-08-07 2004-08-06 コンタクト、及びコネクタ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-288380 2003-08-07
JP2003288380 2003-08-07

Publications (1)

Publication Number Publication Date
WO2005015692A1 true WO2005015692A1 (fr) 2005-02-17

Family

ID=34131509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/011343 Ceased WO2005015692A1 (fr) 2003-08-07 2004-08-06 Contact et connecteur

Country Status (3)

Country Link
JP (1) JPWO2005015692A1 (fr)
TW (1) TWI262311B (fr)
WO (1) WO2005015692A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014055227A1 (fr) * 2012-10-05 2014-04-10 Tyco Electronics Corporation Ensemble de contact électrique
JP2014135171A (ja) * 2013-01-09 2014-07-24 Fujitsu Semiconductor Ltd 接触子及びコンタクタ
JP2017117534A (ja) * 2015-12-21 2017-06-29 本田技研工業株式会社 電気的接続構造体、端子構造体及び車両並びに電気的接続構造体の製造方法
TWI600912B (zh) * 2012-01-17 2017-10-01 精工愛普生股份有限公司 處理器及檢查裝置
US10461461B2 (en) 2017-06-12 2019-10-29 Molex, Llc Multi pole connector for securely coupling terminals and target terminals
WO2024189575A1 (fr) * 2023-03-14 2024-09-19 Te Connectivity Solutions Gmbh Contact électrique avec interface de contact texturée

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JPS6010298Y2 (ja) * 1982-05-07 1985-04-09 株式会社日立製作所 印刷配線板用電気コネクタの雌コンタクト
JPH0878110A (ja) * 1994-08-29 1996-03-22 Whitaker Corp:The 電気コネクタ
JPH08213138A (ja) * 1995-02-03 1996-08-20 Justy:Kk 電子部品用導通検査装置の導体の接続方法および電子 部品用導通検査装置の接続治具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010298Y2 (ja) * 1982-05-07 1985-04-09 株式会社日立製作所 印刷配線板用電気コネクタの雌コンタクト
JPH0878110A (ja) * 1994-08-29 1996-03-22 Whitaker Corp:The 電気コネクタ
JPH08213138A (ja) * 1995-02-03 1996-08-20 Justy:Kk 電子部品用導通検査装置の導体の接続方法および電子 部品用導通検査装置の接続治具

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600912B (zh) * 2012-01-17 2017-10-01 精工愛普生股份有限公司 處理器及檢查裝置
WO2014055227A1 (fr) * 2012-10-05 2014-04-10 Tyco Electronics Corporation Ensemble de contact électrique
CN104704684A (zh) * 2012-10-05 2015-06-10 泰科电子公司 电触头组件
US9543679B2 (en) 2012-10-05 2017-01-10 Tyco Electronics Corporation Electrical contact assembly
CN104704684B (zh) * 2012-10-05 2017-09-05 泰科电子公司 电触头组件
JP2014135171A (ja) * 2013-01-09 2014-07-24 Fujitsu Semiconductor Ltd 接触子及びコンタクタ
JP2017117534A (ja) * 2015-12-21 2017-06-29 本田技研工業株式会社 電気的接続構造体、端子構造体及び車両並びに電気的接続構造体の製造方法
US10128722B2 (en) 2015-12-21 2018-11-13 Honda Motor Co., Ltd. Electrical connection structure, terminal structure, and vehicle
US10461461B2 (en) 2017-06-12 2019-10-29 Molex, Llc Multi pole connector for securely coupling terminals and target terminals
US10734749B2 (en) 2017-06-12 2020-08-04 Molex, Llc Multi pole connector for securely coupling terminals and target terminals
WO2024189575A1 (fr) * 2023-03-14 2024-09-19 Te Connectivity Solutions Gmbh Contact électrique avec interface de contact texturée

Also Published As

Publication number Publication date
TWI262311B (en) 2006-09-21
JPWO2005015692A1 (ja) 2007-10-04
TW200510728A (en) 2005-03-16

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