WO2005050184A1 - Procede et dispositif pour detecter des defauts dans une plaque de verre - Google Patents

Procede et dispositif pour detecter des defauts dans une plaque de verre Download PDF

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Publication number
WO2005050184A1
WO2005050184A1 PCT/JP2004/017022 JP2004017022W WO2005050184A1 WO 2005050184 A1 WO2005050184 A1 WO 2005050184A1 JP 2004017022 W JP2004017022 W JP 2004017022W WO 2005050184 A1 WO2005050184 A1 WO 2005050184A1
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WO
WIPO (PCT)
Prior art keywords
main surface
sight
line
glass plate
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/017022
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Miyake
Satoshi Kanki
Yuki Yoshimura
Kunihiro Hiraoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANO SCOPE Ltd
Nippon Sheet Glass Co Ltd
Original Assignee
NANO SCOPE Ltd
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANO SCOPE Ltd, Nippon Sheet Glass Co Ltd filed Critical NANO SCOPE Ltd
Publication of WO2005050184A1 publication Critical patent/WO2005050184A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings

Definitions

  • the present invention relates to a method and an apparatus for detecting whether or not an edge of a glass plate such as a glass plate for an automobile or a glass substrate for a magnetic disk is chipped.
  • an end face of a glass plate generated by cutting has a sharp edge.
  • the glass plate 21 is chamfered to form an end face 22 having chamfers 22a and 22b.
  • the entire end face 22 is ground and polished to form a smooth curved face 23.
  • grinding or polishing may cause defects such as chips 24 peculiar to glass on the end face 22.
  • a conventional defect detection device includes a camera and a light source, and a glass plate is disposed between the camera and the light source.
  • the light intensity that reaches the camera becomes darker in the image taken by a camera arranged vertically above the main surface of the glass plate, where the main surface and the end surface of the glass plate become darker and edge defects are generated. Adjusted to be brighter. By adjusting the light intensity, the chip can be detected.
  • Patent Document 1 JP 2001-153816 A
  • the conventional defect detection device has the following problems.
  • camera 30 is arranged perpendicular to glass plate 31.
  • the chip 32 exists at the edge of the main surface 3 la opposite to the main surface facing the camera 30, the chip 32 is hidden by the shadow of the translucent end face 33. Therefore, it is difficult to detect the chip 32. This problem becomes more pronounced when the end face 33 is asymmetrically polished with respect to the center plane of the glass plate 31, as shown by the broken line in FIG.
  • a chip 34 exists on the edge of the main surface 31b facing the camera 30.
  • the translucent end face 33 exists behind the chip 34.
  • the present invention has been made in view of such conventional problems, and an object of the present invention is to enable high-precision detection of chips on a glass plate even when the end surface is in a ground glass state. It is to provide a method and a device.
  • One embodiment of the present invention includes a first main surface, a second main surface, an end surface between the first main surface and the second main surface, and an end surface between the first main surface and the second main surface.
  • a glass plate having a first edge between the first and second edges and a second edge between the second main surface and the end surface, it is detected whether the first and second edges have chips.
  • the method includes: a first imaging unit having a first line of sight for detecting the first edge; a second imaging unit having a second line of sight for detecting the second edge; And a second illumination means, wherein the first imaging means is arranged so that the first line of sight is inclined toward the edge with respect to a normal to the first main surface, and the first illumination means is provided.
  • the second imaging means is arranged so that the second line of sight is inclined toward the first main surface with respect to the normal line, and the second illuminating means is arranged near the second main line.
  • the method includes arranging the second line of sight near the second main surface with respect to an extension of the second line of sight emitted from a position where there is no chip on the surface.
  • Another aspect of the present invention includes a first main surface, a second main surface, an end surface between the first main surface and the second main surface, and a first main surface and a second main surface.
  • a glass plate having a first edge between an end face and a second edge between the second main face and the end face, it is detected whether or not there is a chip on the first and second edges.
  • An apparatus for performing the above is provided. The apparatus is arranged on a first main surface side of the glass plate, has a first line of sight for detecting chipping of the first edge, and a first imaging unit, and a first main surface side of the glass plate.
  • a second imaging means arranged at a second position and having a second line of sight for detecting chipping of the second edge; a first illuminating means arranged at a second main surface side of the glass plate; A second lighting means disposed on the second main surface side; Prepare.
  • the first line of sight is inclined toward the edge with respect to a normal to the first main surface, and the first illuminating means enters the glass plate from the first main surface.
  • the second main surface is disposed near the second main surface with respect to an extension of the first line of sight emitted from a position where there is no chip on the second main surface, and the second line of sight is relative to the normal line.
  • the second illuminating means is incident on the glass plate from the first main surface and is emitted from a position of the second main surface where there is no chip. It is arranged near the second main surface with respect to an extension of the second line of sight.
  • Arranging the two reflecting members in the field of view of the imaging means so as to have a line of sight and a second line of sight for detecting a chip on the edge of the second main surface of the glass plate; and Arranging the first imaging means so that one line of sight is inclined toward the edge with respect to a normal to the first main surface; and Arranging the second main surface near the second main surface with respect to an extension of the first line of sight which enters the glass plate from a surface and is emitted from a position where there is no chip on the second main surface of the glass plate. Disposing the first imaging unit so that the second line of sight is inclined toward the first main surface with respect to the normal line. And an extension of the second line of sight that is incident on the first main surface force and exits from a position on the second main surface of the glass plate where there is no chipping. And disposing it near the second main surface.
  • the two reflecting members inclined with respect to the first main surface, and the light is incident on the glass plate from the first main surface and emitted from a position of the second main surface of the glass plate where there is no chip.
  • First illuminating means arranged near the second main surface with respect to an extension of the first line of sight, and a second main surface of the glass plate which is incident on the glass plate from the first main surface.
  • a second illumination unit disposed near the second main surface with respect to an extension of the second line of sight emitted from a position where there is no chip on the surface.
  • a glass plate having a first edge between an end face and a second edge between the second main face and the end face, it is detected whether or not the first and second edges have chips.
  • Provide an apparatus for performing The apparatus includes one imaging unit, a first line of sight where the imaging unit detects the first edge chip, and a second line of sight that detects the second edge chip.
  • Two reflecting members disposed in a field of view of the imaging means, wherein the first and second lines of sight are inclined with respect to the first main surface; and (1) Main surface force Arranged near the second main surface with respect to an extension of the first line of sight that enters the glass plate and exits from a position where there is no chip on the second main surface of the glass plate.
  • second lighting means disposed near the second main surface.
  • a glass plate having a first edge between an end face and a second edge between the second main face and the end face, it is detected whether or not the first and second edges have chips.
  • An apparatus for performing the above is provided.
  • the apparatus includes a first imaging unit for obliquely photographing the first edge of the glass plate, a second imaging unit for obliquely photographing the second edge of the glass plate, and a first illumination for emitting light. Means, only when there is a chip on the first edge, light rays from the first lighting means strike the glass plate.
  • the first illuminating means arranged to pass through to the first imaging means, and the second illuminating means for emitting light, and the second illuminating means is provided only when the second edge has a chip.
  • FIG. 1 is a schematic diagram of an optical system of a glass sheet defect detection device according to a first embodiment of the present invention.
  • FIG. 2 is a block diagram of the defect detection device of FIG. 1.
  • FIG. 3 is an explanatory view showing incident light and outgoing light in the vicinity of an end face of a glass plate.
  • FIG. 4 is an explanatory diagram showing an arrangement of a second camera and a second light source.
  • FIG. 5 is an explanatory diagram showing an arrangement of a first camera and a first light source.
  • FIG. 6 is an explanatory diagram showing an incident angle and an outgoing angle of a light beam passing through a chipped edge.
  • FIG. 7 is an explanatory diagram showing an incident angle and an outgoing angle of a light beam passing through an edge having no chip.
  • FIG. 8 is a schematic diagram of an optical system of a glass sheet defect detection device according to a second embodiment of the present invention.
  • FIG. 9 is a schematic diagram of an optical system of a glass sheet defect detection device according to a third embodiment of the present invention.
  • FIG. 10 is a partially enlarged view of a chamfered glass plate.
  • FIG. 11 is a partially enlarged view of a glass plate having a polished end face.
  • FIG. 12 is a perspective view of a glass plate having a chip on an edge.
  • FIG. 13 is an explanatory view of a first conventional technique for detecting chipping of a glass plate.
  • FIG. 14 is an explanatory view of a second conventional technique for detecting a chip on a glass plate.
  • the defect detection device 40 of the first embodiment inspects whether or not there is a chip on the edge of the end face 41c of the glass plate 41.
  • the end surface 41c of the glass plate 41 is a normal ground surface and is translucent (slid glass state).
  • the chipped portion has a clear mirror surface.
  • the defect detection device 40 detects chipping by utilizing the fact that the refraction of light is different between the end face 41c and the chipped portion.
  • Glass plate Reference numeral 41 denotes, for example, a glass substrate for a magnetic disk having a first main surface 41a and a second main surface 4lb parallel to each other.
  • the defect detection device 40 includes a first camera 42 as a first imaging unit, a second camera 43 as a second imaging unit, a first light source 44 as a first illumination unit, and a second illumination unit as a second illumination unit. And a second light source 45.
  • the first and second cameras 42 and 43 are arranged on the first main surface 41a side of the glass plate 41.
  • the first and second light sources 44 and 45 are arranged on the second main surface 41b side of the glass plate 41.
  • the first camera 42 and the second camera 43 are CCD cameras, and the first light source 44 and the second light source 45 are point light sources, line light sources, or surface light sources configured by semiconductor laser diodes or the like. is there.
  • the first line of sight 51 (the direction of the first camera 42) for detecting the chip on the edge of the glass plate 41 on the first main surface 41 a side is a main line passing through the edge on the first main surface 41 a side. It is inclined toward the end surface 41c with respect to the normal 53 of the surface 41a.
  • the first light source 44 is incident on the glass plate 41 from the first main surface 41a and is extended from the extension line 51a of the first line of sight 51, which is emitted from a position where there is no chip on the second main surface 41b. It is located near the main surface 41b. That is, the first light source 44 is arranged in a space defined by the extension line 51a and the second main surface 41b.
  • a second line of sight 52 (the direction of the second camera 43) for detecting a chip on the edge of the glass plate 41 on the second main surface 41b side is a point excluding the edge of the first main surface 41a. It is inclined to the first principal surface 4 la side with respect to the passing normal line 54.
  • the second light source 45 receives a second line of sight 52a from the first main surface 41a, which is incident on the glass plate 41 and is emitted from a position where there is no chip on the second main surface 41b, with respect to an extension line 52a of the second line of sight 52. It is located near the main surface 41b. That is, the second light source 45 is arranged in a space defined by the extension line 52a and the second main surface 41b.
  • the defect detection device 40 includes an image display device 47 that generates and displays images corresponding to video signals output from the first camera 42 and the second camera 43, respectively.
  • a defect discriminating device 48 is provided for discriminating whether or not there is a chip on the glass plate 41 based on the image generated by the image display device 47.
  • the defect discriminating device 48 discriminates whether or not the bright spot included in the image is caused by a chip, and displays the discrimination result to notify the worker.
  • FIG. 3 shows the light power incident on the first main surface 41 a of the glass plate 41 at an incident angle ⁇ 1.
  • the optical path when exiting from lb at an incident angle ⁇ 1 is shown.
  • the shift amount s is represented by the following equation.
  • the optical path length in the glass plate 41 is L, and the thickness of the glass plate 41 is t.
  • the direction of light may be opposite to the direction indicated by the arrow in FIG. That is, the arrow in FIG. 1 can be understood as a light incident path, a light output path, or “the line of sight of the camera”.
  • incident and outgoing refer to the line of sight of the camera, that is, the first line of sight 51 that is the line of sight of the first camera 42 and the second line of sight 52 that is the line of sight of the second camera 43.
  • the angles of the first line of sight 51 and the second line of sight 52 with respect to the normal line of the first main surface 41a of the glass plate 41 are represented by “angle of line of sight” t,, ⁇ , or ⁇ (FIG. 3). —See Figure 7).
  • the emission angle of the line of sight of the camera changes at that position. Using the change in the angle, the defect detection device 40 detects a chip.
  • a dotted line 52a shown in FIG. 4 is an extension of the second line of sight 52 that enters the glass plate 41 from the first main surface 41a and exits from a position where there is no chip on the second main surface 41b. It is sometimes called the line of sight 52a when there is no chipping.
  • the solid line 52b is an extension of the second line of sight 52 refracted by the chip 62 on the end face 41c of the second main surface 41b, and may be referred to as the line of sight 52b refracted by the chip.
  • a dotted line 51a shown in FIG. 5 is an extension of the first line of sight 51 that enters the glass plate 41 from a position where there is no chip on the first main surface 41a and exits from the second main surface 41b. Vision when there is no chip Sometimes called line 51a.
  • the solid line 51b is an extension of the first line of sight 51 bent by the chip 61 on the end face 41c of the second main surface 41b, and may be referred to as the line of sight 51b bent by the chip.
  • the mosses 61 and 62 often have a curved surface like the inner surface of a bivalve. Therefore, microscopically, the angles of the lines of sight 51 and 52 differ depending on the position of the surface of the chip.
  • the inclination angle of the typical surface of the force ie, the inclination angle of the chip
  • ⁇ the inclination angle of the typical surface of the force
  • the second light source 45 is disposed closer to the second main surface 41b than the line of sight 52a when there is no chip, and If there is a chip 62 in 41b, the second line of sight 52 is refracted by the chip 62, and the line of sight 52b refracted by the chip 62 looks at the second light source 45.
  • the second force lens 43 can catch light (bright light) having a high light intensity passing through the chip 62, and the second main surface 41b The chip 62 on the end face 41c of the target is detected.
  • the light refracted by the chip 61 (the line of sight 51b) is emitted from the second main surface 41b into the air at an angle (refraction angle ⁇ 2) represented by the following equation.
  • n is the refractive index of the glass plate 41.
  • the first light source 44 is disposed near the second main surface 41b away from the line of sight 5la when there is no chip. Therefore, if there is a chip 61 on the main surface 41a, the first line of sight 51 is refracted by the chip 61, and the line of sight 51b refracted by the chip 61 looks at the first light source 44.
  • the first camera 42 can capture light (bright light) having a high light intensity passing through the chip 61, and the first main surface 41a The chip 61 on the end face 41c of is detected.
  • the predetermined angle (line of sight) An angle 51) and a position where the first light source 44 is arranged will be described with reference to FIGS.
  • the refractive index n of the glass plate 41 is 1.52.
  • the chip on the end face 41c of the glass plate 41 has a surface like the inner face of a bivalve. Therefore, the direction of the surface of the chip is not constant, but a representative surface having the largest area will be considered.
  • the chip 61 is located at the edge of the glass plate 41 on the first principal surface 41a side.
  • the first camera 42 is tilted toward the end face 41c with respect to the normal to the first main face 41a.
  • the light incident on the glass plate 41 from the second principal surface 41b side is generated inside the glass plate 41 as shown in FIG. It is necessary to advance at an angle of ⁇ .
  • the degree of polishing may vary between the upper side and the lower side of the end face 41c (see FIG. 6).
  • the width d shown in FIG. 6 is about 10% of the thickness t of the glass plate 41 from experience. Therefore, the angle
  • the typical surface tilt angle ⁇ is 0 °-30 °, and is particularly about 10 °.
  • the first light source 44 is set to a higher position than the line of sight 51 a (see FIG. 5), which is an extension of the line of sight 51 and has no chip.
  • the line of sight 51 a see FIG. 5
  • the angle of inclination of the line of sight 51 of the first camera 42 toward the end surface 41c (the angle of incidence ⁇ of the first line of sight 51) is set within a range of 3 ° to 30 ° with respect to the normal, and the first light source 44 is It is desirable to dispose on the line of sight where the emission angle ⁇ of the line of sight 51 satisfies the condition 2.
  • the line of sight 51 passes through the end face 41c depending on the difference d (see FIG. 6) in the cutting allowance between the upper side and the lower side of the end face 41c. Light quantity may not be obtained, which is not preferable.
  • the angle ⁇ is larger than 30 °, the line of sight 51b may deviate from the light source 44, which is not preferable.
  • the second camera 43 is tilted by a predetermined angle toward the end face 41c with respect to the normal line of the second line of sight 52.
  • the predetermined angle (the angle of the line of sight 52) and the position at which the second light source 45 is arranged are the same as in the case of the first camera 42 and the first light source 44 described above. That is, in order to detect chips having various chip inclination angles ⁇ , it is desirable to install the second camera 43 and the second light source 45 so as to satisfy the conditions 1 and 2.
  • the first line of sight 51 (the line of sight of the first camera 42) for detecting the chip on the edge of the first main surface 41a of the glass plate 41 is moved to the end surface 41c side with respect to the normal line of the main surface 41a.
  • the first light source 44 is tilted, and the first light source 44 is disposed near the second main surface 41b, away from the line of sight 5 la when there is no chip. Therefore, when the chip 61 is present on the first main surface 41a, the first line of sight 51 is refracted by the chip 61, and the line of sight 51b refracted by the chip 61 comes to see the first light source 44. Accordingly, the first camera 42 can capture bright light having a high light intensity that has passed through the chip 61. Therefore, the chip 61 on the end face 41c of the first main face 41a can be detected without being affected by the translucent end face 41c.
  • the second line of sight (the line of sight of the second camera 43) 52 for detecting chipping of the edge on the second main surface 41 b side of the glass plate 41 is moved with respect to the normal to the first main surface 41 a.
  • the second light source 45 is closer to the main surface 41b with respect to an extension of the second line of sight 52 (line of sight 52a) emitted from a position of the main surface 41b where there is no chip. It has been arranged. Therefore, when the force 62 is present on the second main surface 41b, the second line of sight 52 is refracted by the chip 62, and the line of sight 52b refracted by the chip 62 comes to see the second light source 45. Accordingly, the second camera 43 can capture bright light having high light intensity that has passed through the chip 62. Therefore, the chip 62 on the end face 41c of the second main face 41b can be detected without being affected by the translucent end face 41c.
  • the chip having various chip inclination angles ⁇ existing on the end face 41c on the first main surface 41a side is provided. 61 can be detected.
  • the system unit can be configured as a comparator.
  • a plurality of defect detection devices 40 are prepared, the optical system units of these devices are arranged along the transport direction of the glass plate 41, and chips on the end face 41c are detected by the plurality of defect detection devices 40. At this time, the space for disposing each optical system unit can be reduced.
  • the optical system of the defect detection device 40A of the second embodiment includes one camera 70 as imaging means, two mirrors 73 and 74 as reflecting members, and a first light source 44 as first lighting means. And a second light source 45 as a second lighting means.
  • the camera 70 is a CCD camera similar to the cameras 42 and 43 of the first embodiment, and is arranged on the first main surface 41a side of the glass plate 41.
  • the two mirrors 73 and 74 are arranged on the first main surface 41a side of the glass plate 41, and the two light sources 44 and 45 are arranged on the second main surface 41b side.
  • the mirrors 73 and 74 are arranged in the field of view of the camera 70.
  • the mirror 73 makes a first line of sight 71 for detecting the chip 61 on the first main surface 41a of the glass plate 41
  • the mirror 74 makes a second line of sight 72 for detecting the chip 62 on the second main surface 41b.
  • the camera 70 and the two mirrors 73 and 74 are arranged on the first principal surface 41a side of the glass plate 41, and the two light sources 44 and 45 are arranged on the second principal surface 41b side.
  • first line of sight 71 corresponds to the first line of sight 51 in FIG. 1
  • second line of sight 72 corresponds to the second line of sight 52 in FIG.
  • the line of sight 71a, line of sight 71b, line of sight 72a, and line of sight 72b correspond to the line of sight 51a, line of sight 51b, line of sight 52a, and line of sight 52b shown in FIG. 1, respectively.
  • the optical system of the defect detection device 40A is arranged on the glass plate 41 without being restricted by the transport direction of the glass plate 41. Can be placed.
  • the optical system of the defect detection device 40B shown in FIG. 9 includes one camera 80 as imaging means, two mirrors 83 and 84 as reflection members, a first light source 44 as first illumination means, and a second light source 44 as first illumination means.
  • a second light source 45 as illumination means is provided.
  • the camera 80 is a CCD camera, and is arranged on the side of the end face 41c of the glass plate 41.
  • the mirror 83 and the second light source 45 are arranged on the first principal surface 41a side of the glass plate 41, and the mirror 84 and the first light source 44 are arranged on the second principal surface 41b side.
  • the mirrors 83 and 84 are arranged in the field of view of the camera 80.
  • Mirror 83 is a chip of the first main surface 41a
  • the mirror 84 makes a second line of sight 82 that detects the chip 62 on the second main surface 41b.
  • the first line of sight 81 and the second line of sight 82 correspond to the first line of sight 51 and the second line of sight 52 in Fig. 1, respectively.
  • the line of sight 81a, line of sight 81b, line of sight 82a and line of sight 82b correspond to line of sight 5la, line of sight 5lb, line of sight 52a and line of sight 52b shown in FIG. 1, respectively.
  • the camera 80 is arranged on the side of the end face 41c of the glass plate 41, the mirror 83 and the second light source 45 are arranged on the first main surface 41a side of the glass plate 41, and the mirror 84 and the second One light source 44 is arranged on the second principal surface 4 lb side.
  • the defect detection device 40B can check whether or not the end face 41c has a chip in one inspection.
  • the method and apparatus of the present invention are applicable not only to a glass substrate for a magnetic disk but also to inspect chips of a glass plate having flat main surfaces parallel to each other. [0065]
  • the method and apparatus of the present invention can be applied to inspect chips of glass sheets having curved main surfaces parallel to each other, such as glass sheets for automobiles and glass sheets for windows of buildings. is there
  • the electrical configuration of the defect detection device of the present invention is not limited to the example of FIG.
  • the defect determination device may determine whether there is a chip based on, for example, output signals from the first camera 42 and the second camera 43, and notify the worker of the determination result by display or sound. .

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Abstract

L'invention porte sur un dispositif (40) destiné à détecter des écailles sur le bord du premier côté de la surface principale (41a) d'une plaque de verre (41) présentant une surface terminale de type verre dépoli (41c) et sur le bord du second côté de la surface principale (41b). Une première caméra (42) permettant d'observer le bord du premier côté de la surface principale (41a) et une seconde caméra (43) permettant d'observer le bord du second côté de la surface principale (41b) sont inclinées par rapport aux perpendiculaires (53, 54) de la plaque de verre. Lorsqu'une écaille se trouve sur le premier côté de la surface principale, une lumière de la première source de lumière (44) est réfractée par l'écaille, la lumière réfractée étant ensuite capturée par la première caméra. Lorsqu'une écaille se trouve sur le second côté de la surface principale, une lumière de la seconde source de lumière (45) est réfractée par l'écaille, cette lumière réfractée étant capturée par la seconde caméra.
PCT/JP2004/017022 2003-11-21 2004-11-16 Procede et dispositif pour detecter des defauts dans une plaque de verre Ceased WO2005050184A1 (fr)

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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100791277B1 (ko) * 2006-09-12 2008-01-04 주식회사 케이엔제이 평판 디스플레이 패널 검사장치
JP2007147433A (ja) * 2005-11-28 2007-06-14 Nano Scope Ltd セラミック板の欠陥検出方法と装置
JP2008014697A (ja) * 2006-07-04 2008-01-24 Nikon Corp 表面検査装置
KR101318246B1 (ko) * 2007-02-21 2013-10-16 엘지디스플레이 주식회사 액정표시장치의 불량 판별 장치 및 방법
JP5418983B2 (ja) * 2010-02-26 2014-02-19 旭硝子株式会社 矩形板状物の割れ検査方法及び検査装置
WO2012153718A1 (fr) * 2011-05-12 2012-11-15 コニカミノルタホールディングス株式会社 Procédé pour tester une face d'extrémité de feuille de verre et dispositif pour tester une face d'extrémité de feuille de verre
CN103175569B (zh) * 2011-12-21 2015-07-15 北京兆维电子(集团)有限责任公司 单光源双相机的采集装置
HUE056308T2 (hu) * 2013-03-19 2022-02-28 Hennecke Systems Gmbh Eljárás és rendszer sík félvezetõ tárgyak ellenõrzéséhez
TWI557407B (zh) * 2014-03-05 2016-11-11 晶元光電股份有限公司 晶粒檢測方法
CN107131832B (zh) * 2016-02-29 2019-07-09 深圳市升瑞科仪光电有限公司 Lcd玻璃磨边效果检测方法和装置
CN107843604B (zh) * 2017-12-19 2024-04-05 苏州精濑光电有限公司 一种用于检测双层基板边缘缺陷的装置及检测方法
KR102580389B1 (ko) * 2018-02-13 2023-09-19 코닝 인코포레이티드 유리 시트 검사 장치 및 방법
CN109916910B (zh) * 2019-03-27 2022-02-25 中建材凯盛机器人（上海）有限公司 光伏玻璃边部缺陷检测系统及相应的方法
CN109855672A (zh) * 2019-04-25 2019-06-07 佛山市南海区广工大数控装备协同创新研究院 一种带倒角弧度玻璃板自动检测装置
CN110596138A (zh) * 2019-08-14 2019-12-20 深圳格兰达智能装备股份有限公司 一种ic料条视觉检测及墨点标记设备
JP6755603B1 (ja) * 2019-12-25 2020-09-16 上野精機株式会社 電子部品の処理装置
TWI805931B (zh) * 2020-06-23 2023-06-21 方碼科技有限公司 物件之符碼的讀取方法及其讀取設備

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258231A (ja) * 1991-01-31 1994-09-16 Central Glass Co Ltd 板ガラスの欠点検出装置
JPH07190950A (ja) * 1993-12-24 1995-07-28 Hitachi Electron Eng Co Ltd ガラスディスクの外周欠陥検出装置および外周欠陥検出方法
JPH085563A (ja) * 1994-06-20 1996-01-12 Shirayanagishiki Senkaki Kk 塊状青果物のカメラ選別機に用いる間接照明型多面撮影装置
JP2001208702A (ja) * 2000-01-31 2001-08-03 Nippon Sheet Glass Co Ltd 欠点検査方法及び欠点検査装置
JP2003098122A (ja) * 2001-09-21 2003-04-03 Toshiba Ceramics Co Ltd ガラス基板の外観検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258231A (ja) * 1991-01-31 1994-09-16 Central Glass Co Ltd 板ガラスの欠点検出装置
JPH07190950A (ja) * 1993-12-24 1995-07-28 Hitachi Electron Eng Co Ltd ガラスディスクの外周欠陥検出装置および外周欠陥検出方法
JPH085563A (ja) * 1994-06-20 1996-01-12 Shirayanagishiki Senkaki Kk 塊状青果物のカメラ選別機に用いる間接照明型多面撮影装置
JP2001208702A (ja) * 2000-01-31 2001-08-03 Nippon Sheet Glass Co Ltd 欠点検査方法及び欠点検査装置
JP2003098122A (ja) * 2001-09-21 2003-04-03 Toshiba Ceramics Co Ltd ガラス基板の外観検査装置

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JP2005156254A (ja) 2005-06-16

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